JP2018120732A - Light emitting device and method of manufacturing light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress a resin layer from spreading to the outside of an inorganic layer.SOLUTION: A light emitting portion 152 has an organic layer. An inorganic layer 211 (first inorganic layer) is over the light emitting portion 152. A resin layer 220 is on the inorganic layer 211. The inorganic layer 211 is in contact with the resin layer 220. The inorganic layer 211 comprises alumina (AlO) having a methyl group. The methyl group is present on a surface of the inorganic layer 211 by forming alumina at low temperatures by means of ALD (Atomic Layer Deposition). The resin layer 220 is formed on the inorganic layer 211 by means of a coating process.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a light emitting device and a method for manufacturing the light emitting device.

  In recent years, organic light emitting diodes (OLEDs) have been developed as light emitting devices. The OLED has a first electrode, an organic layer, and a second electrode. The organic layer includes a light emitting layer that emits light by organic electroluminescence. The light emitting layer emits light by a voltage between the first electrode and the second electrode.

  OLEDs are known to be susceptible to moisture. Specifically, the light emission characteristics of an OLED may be degraded by moisture. In order to suppress the influence of moisture, the light emitting part in the OLED may be sealed. Currently, various studies have been made on the structure for sealing the light emitting portion.

  Patent Document 1 describes a sealing layer including a plurality of inorganic layers and a plurality of organic layers. These inorganic layers and organic layers are alternately laminated. The inorganic layer is provided in order to prevent moisture from entering the light emitting portion from the outside. The organic layer is provided to relieve stress inside the inorganic layer and fill defects (for example, cracks or pinholes) generated on the surface of the inorganic layer. In particular, Patent Document 1 describes that the inorganic layer is formed by sputtering, CVD (Chemical Vapor Deposition) or IBAD (Ion Beam Assisted Deposition).

Patent Document 2 describes a sealing layer including an inorganic layer and a resin layer. Patent Document 2 describes that the inorganic layer is SiO ₂ or Al ₂ O ₃ and is formed by vapor deposition, specifically, vacuum vapor deposition, sputtering, or ion plating. Furthermore, Patent Document 2 describes that a resin layer is formed by spray coating a resin coating agent containing a resin monomer or resin oligomer on an inorganic layer and curing the resin monomer or resin oligomer. .

JP 2010-171012 A JP 2012-253036 A

  The inventor examined the structure of the sealing layer, and specifically, examined the formation of the resin layer on the inorganic layer by a coating process (for example, ink jet printing). Moisture easily enters the resin layer. Therefore, it is desirable that the resin layer does not spread outward than the inorganic layer.

  An example of a problem to be solved by the present invention is to prevent the resin layer from spreading outside the inorganic layer.

The invention described in claim 1
A light emitting part having an organic layer;
A first inorganic layer on the light emitting part;
A resin layer on the first inorganic layer;
With
The first inorganic layer is in contact with the resin layer,
The first inorganic layer is a light emitting device made of alumina having a methyl group.

The invention according to claim 8 provides:
Forming a light emitting part having an organic layer;
Forming a first inorganic layer on the light emitting part;
Forming a resin layer on the first inorganic layer;
Including
In the step of forming the first inorganic layer, the first inorganic layer is made of alumina having a methyl group,
In the step of forming the resin layer, the resin layer is in contact with the first inorganic layer, and is a method for manufacturing a light emitting device.

It is a top view which shows the light-emitting device which concerns on embodiment. It is AA sectional drawing of FIG. It is a figure for demonstrating the detail of the coating layer shown in FIG. In embodiment, it is a figure for demonstrating the reason a methyl group exists on the surface of an alumina. It is a figure for demonstrating an example of the manufacturing method of the light-emitting device shown in FIGS. It is a figure which shows the modification of FIG. It is a top view which shows the light-emitting device based on an Example. It is PP sectional drawing of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

  FIG. 1 is a plan view showing a light emitting device 10 according to the embodiment. FIG. 2 is a cross-sectional view taken along the line AA of FIG. FIG. 3 is a diagram for explaining the details of the coating layer 210 shown in FIG. 2.

The outline of the light emitting device 10 will be described with reference to FIGS. 1 to 3. The light emitting device 10 includes a light emitting unit 152, an inorganic layer 211, and a resin layer 220. The light emitting unit 152 has an organic layer. As shown in FIG. 3, the inorganic layer 211 (first inorganic layer) is on the light emitting unit 152. The resin layer 220 is on the inorganic layer 211. The inorganic layer 211 is in contact with the resin layer 220. The inorganic layer 211 is made of alumina (Al ₂ O ₃ ) having a methyl group.

  According to the configuration described above, the resin layer 220 is suppressed from spreading outside the inorganic layer 211. Specifically, the resin layer 220 is a coating film. In other words, the resin layer 220 is formed on the inorganic layer 211 by a coating process, particularly in this embodiment, by inkjet printing. Therefore, immediately after the resin layer 220 is applied on the inorganic layer 211, the resin layer 220 is in a liquid phase, and therefore tends to spread outward. In particular, when the resin layer 220 is formed on the surface having high wettability, the resin layer 220 is likely to spread outward. On the other hand, in the configuration described above, the inorganic layer 211 has a methyl group, that is, a hydrophobic group. As will be described later with reference to FIG. 4, this methyl group is present on the surface of the inorganic layer 211 by forming alumina at a low temperature by ALD (Atomic Layer Deposition). The wettability of the surface of the inorganic layer 211 is small due to the methyl group. Therefore, immediately after the resin layer 220 is applied on the inorganic layer 211, the resin layer 220 is difficult to spread on the surface of the inorganic layer 211. In this way, according to the configuration described above, the resin layer 220 is suppressed from spreading outside the inorganic layer 211.

  Next, details of a planar layout of the light emitting device 10 will be described with reference to FIG. The light emitting device 10 includes a substrate 100, a light emitting unit 152, and a sealing layer 200. The sealing layer 200 includes a coating layer 210 (first coating layer), a resin layer 220, and a coating layer 230 (second coating layer). As will be described later with reference to FIG. 3, the covering layer 210 includes an inorganic layer 211. As will be described later with reference to FIG. 2, the covering layer 210, the resin layer 220, and the covering layer 230 are sequentially stacked from the substrate 100.

  The area of the light emitting unit 152 is smaller than the area of the sealing layer 200, and the entire light emitting unit 152 is inside the sealing layer 200. Therefore, no part of the light emitting unit 152 is exposed from the sealing layer 200. That is, any part of the light emitting portion 152 is sealed with the sealing layer 200.

  The area of the covering layer 210 and the area of the covering layer 230 are both larger than the area of the resin layer 220, and the entire resin layer 220 is inside the covering layer 210 and inside the covering layer 230. Therefore, no part of the resin layer 220 is exposed from the coating layer 210 and the coating layer 230. Furthermore, as will be described later with reference to FIG. 2, the covering layer 210 and the covering layer 230 can be in contact with each other outside the end portion of the resin layer 220.

  In particular, in the example illustrated in FIG. 1, the resin layer 220 is not surrounded by a partition wall for defining the resin layer 220. In other words, in this embodiment, the resin layer 220 can be defined without forming a partition wall for defining the resin layer 220. Specifically, as described above, in the present embodiment, even when the resin layer 220 is formed by a coating process, the resin layer 220 is suppressed from spreading outside the inorganic layer 211 (covering layer 210). . Therefore, the resin layer 220 can be defined without using a partition wall by accurately applying the liquid constituting the resin layer 220.

  Next, the details of the cross-sectional structure of the light emitting device 10 will be described with reference to FIG. The light emitting device 10 includes a substrate 100, a light emitting unit 152, and a sealing layer 200. The sealing layer 200 includes, from the light emitting unit 152, a coating layer 210, a resin layer 220, and a coating layer 230 in this order. As will be described later with reference to FIG. 3, the covering layer 210 includes an inorganic layer 211.

  The substrate 100 has a first surface 102 and a second surface 104. The light emitting unit 152 and the sealing layer 200 are on the first surface 102 of the substrate 100. The second surface 104 is on the opposite side of the first surface 102.

  The light emitting device 10 may be bottom emission or top emission. When the light emitting device 10 is bottom emission, light from the light emitting unit 152 is emitted from the substrate 100 side. Therefore, when the light emitting device 10 is bottom emission, the substrate 100 needs to have translucency. When the light emitting device 10 is top emission, the light from the light emitting unit 152 is emitted from the sealing layer 200 side. Therefore, when the light emitting device 10 is top emission, the sealing layer 200 needs to have translucency.

  The substrate 100 has translucency when the light emitting device 10 is bottom emission, and can be, for example, a glass substrate or a resin substrate. The substrate 100 may or may not have translucency when the light emitting device 10 is top emission, and may be a metal substrate, for example.

  The light emitting unit 152 has an organic layer. The organic layer can emit light by organic electroluminescence (EL).

The covering layer 210 is provided to seal the light emitting unit 152. The covering layer 210 contains an inorganic material, specifically, alumina (Al ₂ O ₃ ) and other inorganic materials, and thus has a low water vapor transmission rate. The alumina and other inorganic materials are alternately laminated. The covering layer 210 prevents moisture from entering the light emitting unit 152.

  The resin layer 220 contains a resin material, specifically, for example, an epoxy resin or an acrylic resin. The resin material of the resin layer 220 has at least one of photocurability and thermosetting. Therefore, the resin layer 220 can be formed by applying an uncured resin on the coating layer 210 and curing the resin with light or heat. In the example shown in FIG. 2, the resin material of the resin layer 220 has already been cured.

  The resin layer 220 is provided in order to prevent the coating layer 210 from being damaged by the movement of the foreign matter covered by the coating layer 210. Specifically, when the coating layer 210 is deposited on the first surface 102 of the substrate 100 in the presence of foreign matter (for example, fine particles), the coating layer 210 may cover the foreign matter. Such foreign matter may move so as to break the coating layer 210 due to an external impact. The resin layer 220 is provided to prevent such movement of foreign matter. That is, the above-described foreign matter is fixed by the resin layer 220, and the covering layer 210 can be prevented from being damaged.

The covering layer 230 is provided to seal the resin layer 220. The covering layer 230 includes an inorganic material, specifically, alumina (Al ₂ O ₃ ) and other inorganic materials, and thus has a low water vapor transmission rate. The alumina and other inorganic materials are alternately laminated. The coating layer 230 prevents moisture from entering the resin layer 220.

  The covering layer 210 is in contact with the first surface 102 of the substrate 100 outside the end of the light emitting unit 152. Therefore, moisture can be prevented from entering the light emitting portion 152 via the space between the substrate 100 and the coating layer 210.

  The covering layer 210 and the covering layer 230 are in contact with each other outside the end of the resin layer 220. Therefore, the end portion of the resin layer 220 is prevented from being exposed to the outside. Therefore, moisture can be prevented from entering the light emitting unit 152 from the outside via the resin layer 220.

  In particular, in the example illustrated in FIG. 2, the end portion of the resin layer 220 is covered with the covering layer 230. In other words, the end portion of the resin layer 220 is not in contact with the partition for defining the resin layer 220. As described with reference to FIG. 1, in this embodiment, the resin layer 220 can be defined without forming a partition wall for defining the resin layer 220. Therefore, the end portion of the resin layer 220 can be covered with the covering layer 230.

  Next, the details of the coating layer 210 will be described with reference to FIG.

  The covering layer 210 includes a plurality of first layers 212 and a plurality of second layers 214. The first layer 212 and the second layer 214 are alternately stacked. In the example illustrated in FIG. 3, the light emitting unit 152 is covered with the protective layer 202, and the covering layer 210 is on the protective layer 202.

Each first layer 212 includes an inorganic material, specifically, alumina (Al ₂ O ₃ ). Each first layer 212 is formed by ALD. In particular, in the present embodiment, ALD for forming the first layer 212 is performed at a low temperature so as not to cause thermal damage to the organic layer of the light emitting unit 152.

  Each second layer 214 includes an inorganic material different from alumina (that is, the inorganic material of the first layer 212). Each second layer 214 is formed by ALD. In particular, in this embodiment, ALD for forming the second layer 214 is performed at a low temperature so as not to cause thermal damage to the organic layer of the light emitting unit 152.

  The inorganic layer 211 is the outermost first layer 212 of the plurality of first layers 212. In other words, the plurality of first layers 212 and the plurality of second layers 214 are stacked such that the outermost first layer 212 (that is, the inorganic layer 211) of the plurality of first layers 212 is in contact with the resin layer 220. Has been. Note that either the first layer 212 or the second layer 214 may be in contact with the protective layer 202.

  FIG. 4 is a diagram for explaining the reason why methyl groups exist on the surface of alumina in the present embodiment.

  A general ALD for forming alumina will be described. First, TMA (trimethylaluminum) is supplied as a precursor to the surface of the substrate. Hydroxyl groups are present on the surface of the substrate. This hydroxy group can be formed by exposing the surface of the substrate to air and then hydroxylating the surface of the substrate. The excess TMA is then purged. By TMA, an Al monolayer having a methyl group is formed on the surface of the substrate. Next, water vapor is supplied to the surface of the substrate. The excess water vapor is then purged. The methyl group bonded to Al is replaced with a hydroxy group by water vapor. Next, the supply of TMA, the purge of excess TMA, the supply of steam and the purge of excess steam are repeated.

  In the present embodiment, alumina (the first layer 212 shown in FIG. 3) has a temperature lower than a general ALD temperature, specifically, in order to prevent thermal damage to the organic layer of the light emitting unit 152. Is formed at 150 ° C. or lower, preferably 100 ° C. or lower. Therefore, in this embodiment, even if water vapor is supplied, the reaction of replacing the methyl group bonded to Al with a hydroxy group is not promoted due to low temperature, as shown in FIG. While replacing the hydroxy groups, other methyl groups remain on the surface of the alumina. Thus, in this embodiment, both a methyl group and a hydroxy group exist on the surface of alumina.

  FIG. 5 is a diagram for explaining an example of a manufacturing method of the light emitting device 10 shown in FIGS. 1 to 3. In this example, the light emitting device 10 is manufactured as follows.

  First, the light emitting unit 152 is formed on the first surface 102 of the substrate 100.

  Next, the coating layer 210 is formed by ALD. Specifically, the first layer 212 and the second layer 214 are alternately stacked by ALD. In order not to cause thermal damage to the organic layer of the light emitting portion 152, the covering layer 210 is formed at a low temperature, specifically, 150 ° C. or lower, preferably 100 ° C. or lower. As described with reference to FIG. 4, methyl groups exist on the surface of each first layer 212 (alumina) by low temperature ALD. Therefore, the surface of each first layer 212 is hydrophobic, and immediately after forming the coating layer 210, the contact angle of water with respect to the surface of the first layer 212 is 30 ° or more, preferably 60 °. That's it.

  Next, as shown in FIG. 5, ink is applied from the inkjet head H to the surface of the inorganic layer 211. The ink contains a resin material. The ink is then dried. Next, the resin material contained in the ink is cured by light or heat. In this way, the resin layer 220 is formed in contact with the inorganic layer 211. That is, in the example shown in FIG. 5, the resin layer 220 is formed by a coating process, more specifically, ink jet printing.

  As described above, immediately after the coating layer 210 is formed, the surface of the inorganic layer 211 is hydrophobic due to the methyl group. Therefore, the ink emitted from the inkjet head H is difficult to spread on the surface of the inorganic layer 211. Thus, according to the present embodiment, the resin layer 220 is suppressed from spreading outside the inorganic layer 211.

  Next, the coating layer 230 is formed by ALD.

  In this way, the light emitting device 10 shown in FIGS. 1 to 3 is manufactured.

  As described above, according to the present embodiment, the resin layer 220 is suppressed from spreading to the outside of the inorganic layer 211.

  FIG. 6 is a diagram showing a modification of FIG. As shown in FIG. 6, the covering layer 210 may include only the first layer 212. In other words, in the example shown in FIG. 6, the covering layer 210 does not include the second layer 214 (FIG. 3). Also in the example illustrated in FIG. 6, the first layer 212 (that is, the inorganic layer 211) is formed by ALD at a low temperature so as not to cause thermal damage to the organic layer of the light emitting unit 152. As described with reference to FIG. 4, methyl groups exist on the surface of the first layer 212 (alumina) by low temperature ALD. Therefore, the surface of the first layer 212 is hydrophobic.

  Also in this modification, the resin layer 220 is suppressed from spreading outside the inorganic layer 211.

  FIG. 7 is a plan view illustrating the light emitting device 10 according to the example. 8 is a cross-sectional view taken along the line PP in FIG. In the present embodiment, the light emitting device 10 functions as a transflective OLED. For the sake of explanation, FIG. 7 does not show the organic layer 120 and the insulating layer 140 shown in FIG. Further, in FIG. 7, the sealing layer 200 is indicated by a broken line for explanation.

An outline of the light emitting device 10 will be described. Similar to the example shown in FIGS. 1 to 3, the light emitting device 10 includes a light emitting unit 152, an inorganic layer 211, and a resin layer 220. The light emitting unit 152 includes the organic layer 120. The inorganic layer 211 (first inorganic layer) is on the light emitting unit 152. The resin layer 220 is on the inorganic layer 211. As described with reference to FIG. 3, the inorganic layer 211 is in contact with the resin layer 220. The inorganic layer 211 is made of alumina (Al ₂ O ₃ ) having a methyl group.

  According to the configuration described above, the resin layer 220 is prevented from spreading outside the inorganic layer 211 in the same manner as in the embodiment.

  Next, details of a planar layout of the light emitting device 10 will be described with reference to FIG. The light emitting device 10 includes a substrate 100, a plurality of first electrodes 110, a plurality of first connection portions 112, a first wiring 114, a plurality of second electrodes 130, a plurality of second connection portions 132, a second wiring 134, and a sealing. Layer 200 is provided.

  The shape of the substrate 100 is a rectangle having a pair of long sides and a pair of short sides when viewed from a direction perpendicular to the first surface 102. However, the shape of the substrate 100 is not limited to this example. The shape of the substrate 100 may be, for example, a circle or a polygon other than a rectangle when viewed from a direction perpendicular to the first surface 102.

  The plurality of first electrodes 110 are spaced apart from each other, and are specifically arranged in a line along the long side of the substrate 100. Each of the plurality of first electrodes 110 extends along the short side of the substrate 100.

  Each of the plurality of first connection portions 112 is connected to each of the plurality of first electrodes 110. In the example shown in FIG. 7, the first connection portion 112 is integrated with the first electrode 110.

  The first wiring 114 is connected to the plurality of first connection portions 112. The first wiring 114 extends along one of the pair of long sides of the substrate 100. An external voltage is supplied to the first electrode 110 via the first wiring 114 and the first connection portion 112.

  Each of the plurality of second electrodes 130 overlaps each of the plurality of first electrodes 110. The plurality of second electrodes 130 are spaced apart from each other, specifically, aligned in a line along the long side of the substrate 100. Each of the plurality of second electrodes 130 extends along the short side of the substrate 100, specifically, along a pair of long sides extending along the short side of the substrate 100 and a long side of the substrate 100. And a pair of short sides extending.

  Each of the plurality of second connection portions 132 is connected to each of the plurality of second electrodes 130.

  The second wiring 134 is connected to the plurality of second connection parts 132. The second wiring 134 extends along the other of the pair of long sides of the substrate 100. An external voltage is supplied to the second electrode 130 via the second wiring 134 and the second connection portion 132.

  The light emitting device 10 includes a light emitting region 150. The light emitting region 150 includes a plurality of light emitting portions 152 and a plurality of light transmitting portions 154. The plurality of light emitting units 152 and the plurality of light transmitting units 154 are alternately arranged along the long side of the substrate 100. As will be described later with reference to FIG. 8, each of the plurality of light emitting portions 152 is defined by an opening 142 of the insulating layer 140. In particular, in the example illustrated in FIG. 7, each light emitting unit 152 extends along the short side direction of the first electrode 110. Each of the plurality of light transmitting portions 154 does not overlap with the light shielding member, specifically, the second electrode 130, and light from the outside can pass through the light transmitting portion 154.

  The area of the light emitting region 150 is smaller than the area of the sealing layer 200, and the entire light emitting region 150 is inside the sealing layer 200. Therefore, no part of the light emitting region 150 is exposed from the sealing layer 200. That is, any part of the light emitting region 150 is sealed with the sealing layer 200.

  Next, the details of the cross section of the light emitting device 10 will be described with reference to FIG. The light emitting device 10 includes a substrate 100, a first electrode 110, an organic layer 120, a second electrode 130, an insulating layer 140, a coating layer 210, a resin layer 220, and a coating layer 230. The substrate 100 has a first surface 102. The first electrode 110, the organic layer 120, the second electrode 130, the insulating layer 140, the coating layer 210, the resin layer 220, and the coating layer 230 are all on the first surface 102 of the substrate 100.

  The substrate 100 has translucency. The substrate 100 includes, for example, glass or resin.

  The first electrode 110 has translucency and conductivity. Specifically, the first electrode 110 includes a material having translucency and conductivity, for example, a metal oxide, for example, ITO (Indium Tin Oxide) and IZO (Indium Zinc Oxide). Contains at least one. Accordingly, light from the organic layer 120 can pass through the first electrode 110.

  The organic layer 120 includes, for example, a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer (EML), an electron transport layer (ETL), and an electron injection layer (EIL). HIL and HTL are connected to the first electrode 110. In this example, holes are injected into the EML from the first electrode 110 through the HIL and HTL, and injected into the EML from the second electrode 130 through the EIL and ETL, and the holes and electrons are recombined in the EML. Emit light.

  The second electrode 130 has a light shielding property, more specifically, a light reflecting property, and further has conductivity. Specifically, the second electrode 130 includes a material having light reflectivity and conductivity, and includes, for example, a metal, specifically, for example, at least one of Al, Ag, and MgAg. Therefore, the light from the organic layer 120 is reflected by the second electrode 130 with hardly passing through the second electrode 130.

The insulating layer 140 has translucency. In one example, the insulating layer 140 includes an organic insulating layer, specifically, polyimide. In another example, the insulating layer 140 includes an inorganic insulating layer, specifically, silicon oxide (SiO ₂ ).

  The insulating layer 140 has an opening 142, and the first electrode 110, the organic layer 120, and the second electrode 130 are stacked inside the opening 142 so as to form the light emitting portion 152. In other words, the insulating layer 140 defines the light emitting portion 152. In the example illustrated in FIG. 8, the organic layer 120 extends over the plurality of light emitting units 152.

  The covering layer 210, the resin layer 220, and the covering layer 230 seal the first electrode 110, the organic layer 120, the second electrode 130, and the insulating layer 140. Specifically, the covering layer 210 covers the first electrode 110, the organic layer 120, the second electrode 130, and the insulating layer 140. The resin layer 220 is located on the coating layer 210. The coating layer 230 covers the resin layer 220 and is in contact with the coating layer 210 outside the resin layer 220. According to such a structure, not only the penetration of moisture from above the light emitting region 150 but also the penetration of moisture from the side of the light emitting region 150 can be blocked.

  The second electrode 130 has an end portion 130a and an end portion 130b, and the insulating layer 140 has an end portion 140a and an end portion 140b. The end part 130a and the end part 140a face the same direction. The end portion 130b and the end portion 140b face the same direction, and are on the opposite sides of the end portion 130a and the end portion 140a, respectively.

  When viewed from a direction perpendicular to the first surface 102, the first surface 102 of the substrate 100 has a plurality of regions 102a, a plurality of regions 102b, and a plurality of regions 102c. Each of the plurality of regions 102a extends from a position overlapping the end portion 130a of the second electrode 130 to a position overlapping the end portion 130b. Each of the plurality of regions 102b extends from a position overlapping the end portion 130a of the second electrode 130 to a position overlapping the end portion 140a of the insulating layer 140 (or from a position overlapping the end portion 130b of the second electrode 130 to the end of the insulating layer 140. (Up to a position overlapping the portion 140b). Each of the plurality of regions 102c extends from a position overlapping one end 140a of one insulating layer 140 of two adjacent insulating layers 140 to a position overlapping the end 140b of the other insulating layer 140.

  The region 102a overlaps with the second electrode 130. Therefore, the light emitting device 10 has the lowest light transmittance in the region overlapping with the region 102a among the regions overlapping with the region 102a, the region 102b, and the region 102c. Yes. The region 102c does not overlap with any of the second electrode 130 and the insulating layer 140. Therefore, the light-emitting device 10 is the highest in the region overlapping with the region 102c among the regions overlapping with the region 102a, the region 102b, and the region 102c. It has light transmittance. The region 102b does not overlap with the second electrode 130 but overlaps the insulating layer 140. Therefore, in the region overlapping with the region 102b, the light emitting device 10 has higher light transmittance in the region overlapping with the region 102a, and The light transmittance is lower than the light transmittance in a region overlapping with the region 102c.

  By making the width d3 of the region 102c wider than the width d2 of the region 102b (d3> d2), the light transmittance of the light emitting device 10 is increased. Specifically, the width d3 of the region 102c is wide. Specifically, when the width 102 is wider than the width d2 of the region 102b, the width of the region having a high light transmittance (that is, the region 102c) is wide. In this case, the light transmittance of the light emitting device 10 is high.

  By making the width d2 of the region 102b narrower than the width d3 of the region 102c (d2 <d3), the light emitting device 10 is prevented from functioning as a color filter. Specifically, when the width d2 of the region 102b is narrow, specifically, when it is narrower than the width d3 of the region 102c, the region where the light emitting device 10 functions as a color filter (that is, a region where light passes through the insulating layer 140). The width of becomes narrower. In this case, the light emitting device 10 is prevented from functioning as a color filter.

  Note that the width d3 of the region 102c may be wider than the width d1 of the region 102a (d3> d1), may be narrower than the width d1 of the region 102a (d3 <d1), or the width of the region 102a. It may be equal to d1 (d3 = d1).

  In one example, the ratio d2 / d1 of the width d2 of the region 102b to the width d1 of the region 102a is 0 or more and 0.2 or less (0 ≦ d2 / d1 ≦ 0.2), and the ratio of the region 102c to the width d1 of the region 102a is The ratio d3 / d1 of the width d3 is not less than 0.3 and not more than 2 (0.3 ≦ d3 / d1 ≦ 2). More specifically, in one example, the width d1 of the region 102a is 50 μm or more and 500 μm or less, the width d2 of the region 102b is 0 μm or more and 100 μm or less, and the width d3 of the region 102c is 15 μm or more and 1000 μm or less. .

  The light emitting device 10 functions as a transflective OLED. Specifically, when light is not emitted from the plurality of light emitting units 152, an object on the first surface 102 side can be seen through from the second surface 104 side in human vision, and an object on the second surface 104 side is visible. It can be seen through from the first surface 102 side. Furthermore, light from the plurality of light emitting units 152 is mainly output from the second surface 104 side, and is hardly output from the first surface 102 side. When light is emitted from the plurality of light emitting units 152, an object on the second surface 104 side can be seen through from the first surface 102 side in human vision.

  In one example, the light emitting device 10 can be used as a high-mount stop lamp for an automobile. In this case, the light emitting device 10 can be attached to the rear window of the automobile. Further, in this case, the light emitting device 10 emits red light, for example.

  Also in this embodiment, the resin layer 220 is suppressed from spreading outside the inorganic layer 211.

  In addition, the use application of the light-emitting device 10 is not limited to the transflective OLED mentioned above. For example, the light emitting device 10 may be a non-transflective illumination or a display.

  As mentioned above, although embodiment and the Example were described with reference to drawings, these are illustrations of this invention and can also employ | adopt various structures other than the above.

DESCRIPTION OF SYMBOLS 10 Light-emitting device 100 Substrate 102 1st surface 102a Region 102b Region 102c Region 104 2nd surface 110 1st electrode 112 1st connection part 114 1st wiring 120 Organic layer 130 2nd electrode 130a End part 130b End part 132 2nd connection part 134 Second wiring 140 Insulating layer 140a End portion 140b End portion 142 Opening 150 Light emitting region 152 Light emitting portion 154 Light transmitting portion 200 Sealing layer 202 Protective layer 210 Covering layer 211 Inorganic layer 212 First layer 214 Second layer 220 Resin layer 230 Coating layer

Claims (12)

A light emitting part having an organic layer;
A first inorganic layer on the light emitting part;
A resin layer on the first inorganic layer;
With
The first inorganic layer is in contact with the resin layer,
The first inorganic layer is a light emitting device made of alumina having a methyl group. The light-emitting device according to claim 1.
Comprising a first coating layer comprising a plurality of inorganic layers laminated together;
The first covering layer is on the light emitting part,
The resin layer is on the first coating layer;
The light emitting device, wherein the first inorganic layer is an outermost inorganic layer of the plurality of inorganic layers. The light-emitting device according to claim 2.
The plurality of inorganic layers of the first coating layer include a plurality of first layers each including alumina, and a plurality of second layers each including an inorganic material different from alumina,
The plurality of first layers and the plurality of second layers are alternately stacked,
The first inorganic layer is a light emitting device that is the first outermost layer of the plurality of first layers. The light emitting device according to claim 2 or 3,
A second coating layer containing an inorganic material;
The second coating layer is a light emitting device on the resin layer. The light-emitting device according to claim 4.
The light emitting device in which the first coating layer and the second coating layer are in contact with each other outside an end portion of the resin layer. The light emitting device according to claim 5.
The light emitting device in which an end portion of the resin layer is covered with the second covering layer. The light emitting device according to any one of claims 4 to 6,
The area of the first coating layer and the area of the second coating layer are both larger than the area of the resin layer. Forming a light emitting part having an organic layer;
Forming a first inorganic layer on the light emitting part;
Forming a resin layer on the first inorganic layer;
Including
In the step of forming the first inorganic layer, the first inorganic layer is made of alumina having a methyl group,
In the step of forming the resin layer, the resin layer is in contact with the first inorganic layer. In the manufacturing method of the light-emitting device according to claim 8,
Forming a first coating layer including a plurality of inorganic layers stacked on each other after forming the light emitting part;
The method for manufacturing a light emitting device, wherein the first inorganic layer is an outermost inorganic layer among the plurality of inorganic layers. In the manufacturing method of the light-emitting device of Claim 8 or 9,
After forming the first inorganic layer, the contact angle of water on the surface of the first inorganic layer is 30 ° or more. In the manufacturing method of the light-emitting device as described in any one of Claim 8-10,
The method for manufacturing a light emitting device, wherein the first inorganic layer is formed at 150 ° C. or lower. In the manufacturing method of the light-emitting device as described in any one of Claim 8-11,
After forming the said resin layer, the manufacturing method of the light-emitting device including the process of forming the 2nd coating layer containing an inorganic material on the said resin layer.

Images