JP2018117135A - Electronic controller - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic controller which has a high-performance heat radiation structure, and no restriction about electronic components applicable to the electronic controller, and which can be easily and inexpensively manufactured with good productivity.SOLUTION: The electronic controller comprises: a housing assembled by engaging and fixing a nonmetal (resin) housing cover 11 on one side to a metal housing base 12 for heat dissipation on the other side; and a circuit board 13 in the housing. The electronic controller has, in the housing, a metal member 15 having one end fixed to the circuit board 13 and the housing base 12 at a given location (i.e., a location on one side in a side direction) by fastening with a screw 16 as fixing means, and having the other end (a local part) put in contact with an electronic component 14 on the circuit board, and having an arcuate shape in the side direction. The electronic controller has a heat radiation structure which achieves the function of the metal member 15 conducting an exothermic heat from the electronic component 14 to the housing base 12 in the housing and efficiently dissipating the heat to the outside. The heat dissipation direction in the housing is arranged taking into account of ensuring a space for a supplementary component on the side of the housing base 12.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic control device having a heat dissipation structure for efficiently radiating heat generated from an electronic component inside a casing on which a circuit board on which the electronic component is mounted is mounted.

  Conventionally, as a well-known technique related to a heat dissipation structure applied to this type of electronic control device, there is “electronic control unit and manufacturing method thereof” (see Patent Document 1) with a simple structure and high heat dissipation.

  In addition, other well-known technologies related to the same heat dissipation structure include “semiconductor module device, method for manufacturing semiconductor module device, flat panel display device, plasma, which improved heat dissipation while maintaining light weight and low cost” Display panel "(see Patent Document 2).

JP 2010-245174 A JP 2009-16626 A

  The technical outline of Patent Document 1 described above is a structure in which a circuit board on which an electronic component is mounted is protected by a casing that is sandwiched from above and below, and an elastically deformable contact piece is provided on the surface of the electronic component or circuit board. The heat generated from the electronic component is transmitted to the housing through the contact piece to radiate heat. For this reason, it is necessary to fix the elastically deformable contact piece to the inside of the housing before mounting the electronic component in the manufacturing process, and when connecting the contact piece to a local part, the contact piece is not fixed accurately. In order to take measures against this, the contact piece must be brought into full contact with the inside of the housing, so that time-consuming assembly must be performed with high accuracy, and productivity (yield) is excellent. In addition to the problem that the cost is likely to increase, the heat dissipation structure has a problem that heat generation from the electronic component is not direct, and the heat dissipation efficiency is not excellent because it is partially released.

  Further, the technical outline of Patent Document 2 is that a groove portion serving as a recess is provided in a housing, and an electronic component disposed with a heat dissipation material in the groove portion is connected to a flexible substrate, and the metal foil and the housing are sandwiched between the heat dissipation materials. Are fixed by screws to transmit heat generated by the electronic component in both directions between the housing and the metal foil to radiate heat. For this reason, although the heat dissipation function is excellent, there is a problem that it takes a lot of time and effort to manufacture in a complicated structure, and the productivity (yield) is not excellent and the cost tends to be high, and the space for replenishing parts is limited and practical. There is a problem that the above restrictions are increased (the size and number of electronic components provided in the grooves of the recesses are easily restricted, and components that are weak against heat generation cannot be provided around because of bidirectional heat dissipation).

  The present invention has been made to solve such problems, and its technical problem is that it has a high-performance heat dissipation structure that can be easily manufactured with high productivity and at low cost without being restricted by applied electronic components. It is to provide an electronic control device.

  In order to solve the above technical problem, the present invention is an electronic control device in which a circuit board on which electronic components are mounted is mounted in a housing, and the housing is a metal housing for heat dissipation on one side. A non-metallic housing cover on the other side with respect to the base is assembled and mounted and fixed, and a position corresponding to a mounting position of the electronic component on the circuit board or a local part in contact with the electronic component is in the housing. A metal member including a fixed member is fixed to a predetermined portion of the circuit board and the housing base by using a fixing means.

  According to the electronic control device of the present invention, the position of the circuit board corresponding to the mounting position of the electronic component or the metal member including the local part in contact with the electronic component is used for the circuit board and the metal housing base for heat dissipation. It is installed in the housing so that it is fixed to a predetermined location, and the heat generated from the electronic component is transmitted to the housing base through the metal member from the position corresponding to the mounting location of the electronic component itself and the circuit board, and efficiently to the outside. Because it has a heat-dissipating structure, the heat-dissipation direction is on the base of the housing, ensuring sufficient space for supplementary parts, and high performance that allows easy, low-cost production with no restrictions on the applicable electronic components. A simple heat dissipation structure.

It is sectional drawing from the side surface which showed the basic structure of the electronic controller which concerns on Example 1 of this invention. It is sectional drawing from the side surface which showed the basic structure of the electronic controller which concerns on Example 2 of this invention. It is sectional drawing from the side surface which showed the basic structure of the electronic controller which concerns on Example 3 of this invention. It is sectional drawing from the side surface which showed the basic structure of the electronic controller which concerns on Example 4 of this invention. It is sectional drawing from the side surface which showed the basic structure of the electronic controller which concerns on Example 5 of this invention. It is a top view from the upper surface direction of the principal part shown in order to demonstrate the attachment to the circuit board of the metal member with which the electronic control apparatus shown in FIG. 5 is equipped. It is sectional drawing from the side surface which showed the basic structure of the electronic controller which concerns on Example 6 of this invention. It is a top view from the upper surface direction of the principal part shown in order to demonstrate the attachment to the circuit board of the metal member with which the electronic control apparatus shown in FIG. 7 is equipped. It is a top view from the upper surface direction of the principal part shown in order to demonstrate the attachment to the circuit board of the metal member with which the electronic control apparatus which concerns on Example 7 of this invention is equipped. It is sectional drawing from the side surface which showed the basic structure of the electronic controller which concerns on Example 8 of this invention.

  In the following, the electronic control device of the present invention will be described in detail with reference to the drawings by giving some examples.

  FIG. 1 is a cross-sectional view from the side showing the basic structure of an electronic control device according to Embodiment 1 of the present invention. This electronic control device is assembled by assembling and fixing a non-metallic (resin) housing cover 11 on the other side to a metal housing base 12 for heat dissipation on one side. In the case, one end of one metal member 15 having an arcuate shape in the side direction including the other end (local part) contacting the electronic component 14 of the circuit board 13 is connected to the circuit board 13 and the case base 12. It is fixed and deployed by fastening using a screw 16 as a fixing means with respect to a predetermined location (one end side location in the side surface direction). Incidentally, the circuit board 13 that is not involved in the attachment of the metal member 15 and the other end side portion in the side surface direction of the housing base 12 are similarly fixed by fastening using the screws 16. In this case, the fixing means is fixed by fastening using a caulking screw, fixing by welding using a welding member, or by inserting an insertion portion formed at one end of the metal member 15 on the circuit board 13. It is good also as fixation which press-fits with respect to the insertion groove formed in the peripheral position.

  In the heat dissipation structure of the electronic control device according to the first embodiment, the metal member 15 having the other end portion that is in direct contact with the circuit board 13 and having one end portion fixed therein is provided in the housing. The function of transmitting heat generated from the electronic component 14 to the housing base 12 by the metal member 15 in the housing and efficiently radiating the outside is obtained. Thus, unlike the case of Patent Document 2 in which the heat dissipation direction is bidirectional, a sufficient space for the supplemental parts can be ensured by setting the heat dissipation direction to the housing base 12 side with respect to the housing. However, it can be easily manufactured with good productivity (yield) and low cost without being restricted, and has sufficient sealing performance (waterproofness).

  FIG. 2 is a cross-sectional view from the side showing the basic structure of the electronic control device according to the second embodiment of the present invention. Compared with the electronic control device having the structure shown in FIG. 1 of the first embodiment, the heat dissipating filler 17 is disposed at a position where the housing base 12 ′ corresponds to the mounting position of the electronic component 14 on the back surface of the circuit board 13. The point which has the convex part which interposes and contacts is different.

  In the heat dissipation structure of the electronic control device according to the second embodiment, the convex portion of the housing base 12 'is bonded with a heat-dissipating adhesive member, except that the metal member 15 equivalent to that in the first embodiment is provided. It has a structure that contacts a position corresponding to the mounting position of the electronic component 14 on the back surface of the circuit board 13 with the heat dissipating filler 17 interposed therebetween. In addition to being transmitted to the base 12 ′, it is also transmitted from the position corresponding to the mounting position of the electronic component 14 on the back surface of the circuit board 13 to the convex portion of the housing base 12 ′ via the heat radiating filler 17. A function to dissipate heat is obtained. Thereby, higher heat dissipation performance than the case of Example 1 is obtained. Further, as in the case of the first embodiment, since the space for the supplementary parts can be sufficiently secured by setting the heat dissipation direction to the housing base 12 ′ side, the applied electronic parts 14 are not restricted and are easy and productive ( (Yield) can be manufactured at a low cost and has a sufficient sealing property (waterproofness).

  FIG. 3 is a cross-sectional view from the side showing the basic structure of an electronic control device according to Embodiment 3 of the present invention. This electronic control device holds the circuit board 13 in the housing with the mounting direction opposite to the front and back so that the electronic component 14 is directed from the top to the bottom as compared to the structure of the first embodiment shown in FIG. The difference is that the other end portion of the metal member 15 whose side is fixed by the screw 16 is in contact with a position corresponding to the mounting position of the electronic component 14 on the back surface of the circuit board 13.

  In the heat dissipation structure of the electronic control device according to the third embodiment, the metal having the other end in contact with the location corresponding to the mounting location of the electronic component 14 on the back surface of the circuit board 13 in the housing and the one end fixed. A member 15 is provided, and heat generated from the electronic component 14 is transmitted from the position corresponding to the mounting position of the electronic component 14 on the back surface of the circuit board 13 to the housing base 12 by the metal member 15 in the housing, and efficiently transmitted to the outside. A function to dissipate heat is obtained. As a result, the heat dissipation performance is somewhat lower than in the case of the first embodiment. In other respects, as in the case of the first embodiment, the heat dissipation direction is set to the housing base 12 side, so that the space for the supplementary parts is reduced. Since sufficient electronic components 14 can be secured, the applied electronic component 14 can be manufactured easily and inexpensively with good productivity (yield), and has sufficient sealing properties (waterproofness).

  FIG. 4 is a side sectional view showing a basic structure of an electronic control device according to Embodiment 4 of the present invention. In this electronic control device, the shape of the metal member 15 ′ in the side surface direction is substantially M-shaped compared to the structure of the third embodiment shown in FIG. 3, and one end of the metal member 15 ′ has a screw 16. The circuit board 13 and the housing base 12 are fixed to one end side in the side surface direction by fastening, and the other end is also fastened using the screw 16 to the other end in the side surface direction of the circuit board 13 and housing base 12. In addition to being fixed to the side part, the top part of the convex part folded back in the uneven part of the middle part is different in that the structure is in contact with the position corresponding to the mounting part of the electronic component 14 on the back surface of the circuit board 13. Yes.

  In the heat dissipation structure of the electronic control device according to the fourth embodiment, the heat dissipation of the metal member 15 ′ that is in contact with the position corresponding to the mounting position of the electronic component 14 on the back surface of the circuit board 13 rather than the metal member 15 in the third embodiment. Since the volume is large, the heat dissipation performance is somewhat higher than in the case of Example 3. In other respects, as in the case of the first embodiment, the space for the supplementary parts can be sufficiently secured by setting the heat radiation direction to the housing base 12 side, so that the applied electronic parts are not restricted and the productivity is simple. (Yield) can be manufactured at a low cost and has a sufficient sealing property (waterproofness). Incidentally, in the heat dissipation structure according to the fourth embodiment, the top of the convex portion of the metal member 15 ′ is directly in contact with the electronic component 14 with the circuit board 13 being mounted in the opposite direction so that the electronic component 14 faces upward from below. 2 (including the case where the heat dissipating filler 17 described in the second embodiment of FIG. 2 is interposed between the top of the convex portion of the metal member 15 ′ and the electronic component 14). it can.

  FIG. 5 is a cross-sectional view from the side showing the basic structure of an electronic control device according to Embodiment 5 of the present invention. Compared with the electronic control device having the structure shown in FIG. 1 of the first embodiment, the other end portion of one metal member 15 having an arcuate shape in the side surface direction disposed in the housing is bonded with heat dissipation. The point of contact with the circuit board 13 through the heat dissipating filler 17 bonded by the member and the tip of the one end side of the metal member 15 fixed by fastening of the screw 16 are bent to The difference is that the bent portion 15a is used for preventing rotation when the metal member 15 is fixed by fastening, and the bent portion 15a is used as a locking portion between the metal member 15 and the circuit board 13.

  FIG. 6 is a plan view from the upper surface direction of the main part shown for explaining the attachment of the metal member 15 provided in the electronic control device of the fifth embodiment to the circuit board 13. Referring to FIG. 5, the bent portion 15 a at the tip end portion on the one end side of the metal member 15 is screw 16 when the one end portion of the metal member 15 is fixed to the circuit board 13 and the housing base 12 by fastening the screw 16. The metal member 15 is prevented from rotating around the screw 16 and moving from the connection portion between the circuit board 13 and the electronic component 14 with respect to the fastening direction of the circuit board 13. It shows a state where it becomes a locking portion that is locked and held with respect to the peripheral edge of the periphery to prevent rotation. Such a bent portion 15a serving as a locking portion for preventing rotation can be applied to the heat dissipation structures of the above-described embodiments and each of the embodiments described later.

  In the heat dissipation structure of the electronic control device according to the fifth embodiment, the housing has the other end portion that is in contact with the circuit board 13 through the heat dissipating filler 17 in the housing, and the one end portion is prevented from rotating and the position accuracy is achieved. One metal member 15 that is well fixed is provided, and heat generated from the electronic component 14 is transmitted to the housing base 12 through the heat dissipating filler 17 by the metal member 15 in the housing to efficiently radiate the outside. Function is obtained. Thereby, the heat dissipation performance equivalent to the case of Example 1 is ensured with high precision. Similarly to the case of the first embodiment, since the space for the supplementary parts can be sufficiently secured by setting the heat dissipation direction to the housing base 12 side, the applied electronic parts are not restricted and the productivity is simple (yield). It can be manufactured at a good and inexpensive price, and has sufficient sealing properties (waterproofness). Incidentally, in the heat dissipation structure according to the fifth embodiment, the mounting direction of the circuit board 13 is reversed so that the electronic component 14 faces downward from above, and the other end of the metal member 15 has the heat dissipation filler 17 interposed therebetween. The present invention can also be applied to a structure in which the back surface of the circuit board 13 is in contact with a position corresponding to the mounting location of the electronic component 14.

  FIG. 7 is a cross-sectional view from the side showing the basic structure of an electronic control unit according to Embodiment 6 of the present invention. Compared with the electronic control device having the structure shown in FIG. 3 of the third embodiment, a plurality of electronic components 14 mounted on the circuit board 13 (here, a total of four parts including schematic parts) are provided. The other end side of the metal member 150 provided in the housing is branched into a plurality of branches (here, four branches including a schematic portion) and extends, and is in contact with a position corresponding to the mounting position of each electronic component. doing.

  FIG. 8 is a plan view from the upper surface direction of the main part shown to explain the attachment of the metal member 150 provided in the electronic control device of Example 6 to the circuit board 13. Referring to FIG. 8, the other end of the metal member 150 whose one end is fixed to the corner of the back surface of the circuit board 13 by fastening the screw 16 is branched into four parts and mounted at different positions on the surface of the circuit board 13. In addition, each of the other end portions is in contact with the position of the back surface of the circuit board 13 corresponding to the mounting location of the four electronic components 14.

  In the heat dissipation structure for the electronic control device according to the sixth embodiment, the housing has the other end portion in contact with the position corresponding to the mounting position of each electronic component 14 on the back surface of the circuit board 13 and the one end portion is fixed. A substantially mountain-shaped metal member 15 is disposed in the side surface direction, and the heat generated from each electronic component 14 by the metal member 15 in the housing corresponds to the mounting location of each electronic component 14 on the back surface of the circuit board 13. A function of transferring heat from the position to the housing base 12 and efficiently radiating the outside is obtained. As a result, the same heat dissipation performance as in the case of Example 3 is obtained, and as in the case of Example 3, the space for the supplementary parts can be sufficiently secured by setting the heat dissipation direction to the housing base 12 side. Therefore, the electronic parts can be manufactured easily and inexpensively with good productivity (yield), and have sufficient sealing properties (waterproofness). Incidentally, in the heat dissipation structure according to the sixth embodiment, the other end of the metal member 150 is in direct contact with each electronic component 14 with the circuit board 13 mounted in the opposite direction so that each electronic component 14 faces upward from the bottom. (In addition, the heat dissipating filler 17 described in Example 2 in FIG. 2 and Example 5 in FIG. 5 may be interposed between each other end of the metal member 150 and each electronic component 14. Including).

  FIG. 9 is a plan view from the upper surface direction of the main part shown for explaining the attachment of the metal member 150 ′ provided in the electronic control device according to the seventh embodiment of the present invention to the circuit board. Compared with the electronic control device having the structure shown in FIG. 7 and FIG. 8 of the sixth embodiment, the electronic component 14 mounted on the surface of the circuit board 13 is provided at predetermined intervals along the end surface direction. And one end portion of the metal member 150 ′ provided in the housing is fastened and fixed by screws 16 in the vicinity of two corners in the end surface direction of the circuit board 13, and the other end side is 3 It differs from the point which branches and extends and contacts the position corresponding to the mounting location of each electronic component 14.

  Also in the heat dissipation structure of the electronic control device according to the seventh embodiment, the housing has the other end portion in contact with the position corresponding to the mounting position of each electronic component 14 on the back surface of the circuit board 13, and one end portion is 2 A single metal member 150 ′ that is stably fixed at a location is provided, and heat generated from each electronic component 14 corresponds to a mounting location of each electronic component 14 on the back surface of the circuit board 13 by the metal member 150 ′ in the housing. A function of transmitting heat from each position to the housing base 12 and efficiently radiating the outside is obtained. As a result, the mounting of the metal member 150 'is more stable than in the case of the sixth embodiment, and the same heat dissipation performance as in the case of the sixth embodiment can be obtained. By providing the body base 12 side, a sufficient space for supplementary parts can be secured, so that the applied electronic parts can be easily and inexpensively manufactured without being restricted, and sufficient sealing performance ( It will be waterproof. Incidentally, also in the heat dissipation structure according to the seventh embodiment, the other end of the metal member 150 ′ is connected to each electronic component 14 with the circuit board 13 being mounted in the opposite direction so that each electronic component 14 faces upward from below. When the structure is in direct contact (further, the heat dissipating filler 17 described in the second embodiment of FIG. 2 and the fifth embodiment of FIG. 5 is interposed between each other end of the metal member 150 ′ and each electronic component 14. It is also possible to apply this method to the above.

  FIG. 10 is a side sectional view showing the basic structure of an electronic control unit according to Embodiment 8 of the present invention. This electronic control device has a configuration in which a plurality (three in this case) of electronic components 14 are mounted on the surface of the circuit board 13 as compared with the structure of the fourth embodiment shown in FIG. A convex metal member 150 ″ disposed in the body has a flat top portion, and is a gap between the inner wall surface of the top portion of the metal member 150 ″ and the back surface of the circuit board 13, and each electronic component 14 is mounted thereon. The difference is that a heat dissipating filler 17 'bonded with a heat dissipating and insulating adhesive member is interposed in a wide connecting space including a position corresponding to the location.

  In the heat dissipation structure of the electronic control device according to the eighth embodiment, the heat dissipating filler 17 has heat dissipation and insulation in the connection space including the position corresponding to the mounting location of each electronic component 14 on the back surface of the circuit board 13 in the housing. A convex metal member 150 ″ having a flat top portion filled and covered with ′ is provided, and heat generated from each electronic component 14 is generated by the metal member 150 ″ in the casing over the entire back surface of the circuit board 13. A function of receiving heat at a flat top portion through the heat dissipating filler 17 'filled so as to include each position corresponding to the mounting position of the mounting position and transmitting it to the housing base 12 for efficient heat dissipation is obtained. . Thereby, the heat dissipation from the whole back surface of the circuit board 13 can be ensured, and the heat dissipation performance is enhanced. Also here, as in the case of the above-described embodiments, since the space for the supplementary parts can be secured sufficiently by setting the heat radiation direction to the housing base 12 side, the applied parts are not restricted and are easily produced. It can be manufactured at a low cost with good performance (yield), and has sufficient sealing properties (waterproofness). Incidentally, in the heat dissipation structure according to Example 8, the mounting direction of the circuit board 13 is reversed so that each electronic component 14 faces upward from below, and the inner wall surface around each electronic component 14 and the top of the metal member 150 ″. (A case where each electronic component 14 is in direct contact with the inner wall surface of the top of the metal member 150 ″ or a case where there is a gap) Can also be applied.

DESCRIPTION OF SYMBOLS 11 Case cover 12 Case base 13 Circuit board 14 Electronic component 15, 15 ', 150, 150', 150 "Metal member 15a Bending part 16 Screw 17, 17 'Filling material for heat dissipation

In order to solve the above technical problem, the present invention provides a circuit board on which a plurality of electronic components are mounted, a metal plate connected to the electronic parts, and a housing in which the circuit board is disposed. In the electronic control device, the housing has a metal base portion and a non-metallic cover portion, the metal plate has a plurality of branch portions formed integrally with the metal plate, and The base portion and the fixed portion are connected, and the plurality of branch portions are respectively connected to the electronic components .

Claims (6)

An electronic control device in which a circuit board on which electronic components are mounted is mounted in a housing,
The case is assembled by attaching and fixing a non-metallic case cover on the other side to a metal case base for heat dissipation on one side,
A metal member including a position corresponding to a mounting position of the electronic component on the circuit board or a local part in contact with the electronic component is fixed to the circuit board and a predetermined position on the casing base in the casing. An electronic control device, which is fixed and deployed using   2. The electronic control device according to claim 1, wherein the metal member has a plurality of portions in contact with the circuit board or the electronic component. 3.   2. The electronic control device according to claim 1, wherein the fixing means is fixed by fastening using a screw or a caulking screw, fixing by welding using a welding member, or the insertion portion formed on a peripheral portion of the metal member. An electronic control device characterized by being either fixed by press-fitting into an insertion groove formed in a circuit board.   2. The electronic control device according to claim 1, wherein a locking portion between the metal member and the circuit board, which is used for preventing rotation when the metal member is fixed by the fixing means, is either the metal member or the circuit board. An electronic control device provided on one side.   The electronic control device according to claim 1, wherein the housing cover is made of resin.   2. The electronic control device according to claim 1, wherein the metal member and a position corresponding to a mounting position of the electronic component on the circuit board or the electronic component are bonded by an adhesive member serving as a heat-dissipating filler. An electronic control device characterized by that.