JP2018101567A - Light source device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a thin type light source device incorporating a lightning circuit having a tall electronic component.SOLUTION: A light source device 100 includes: a semiconductor light-emitting element 132; an electronic component 133; and a mounting substrate 131 having a mounting surface 131a mounted with the electronic component 133. The mounting substrate 131 is provided with a cutout part 139 in at least one part of an outer edge part thereof. At least a part of a body 133a of the electronic component 133 is positioned inside the cutout part 139.SELECTED DRAWING: Figure 2

Description

  The present disclosure relates to a light source device including a semiconductor light emitting element such as an LED (Light Emitting Diode) as a light source.

  Conventionally, a light source device using a semiconductor light emitting element as a light source has been used as an alternative to an incandescent lamp or a fluorescent lamp. Such a light source device generally includes a lighting circuit for lighting a semiconductor light emitting element in a case. The lighting circuit is composed of a plurality of electronic components mounted on a mounting board.

JP 2012-230912 A

  By the way, as one method for reducing the thickness of the light source device, a method for reducing the thickness of the case can be considered. However, if the case is thinned, the internal volume of the case is reduced, and thus there is a possibility that a lighting circuit that has been incorporated in the prior art cannot be incorporated. In particular, there is a high possibility that tall electronic components such as electrolytic capacitors included in the lighting circuit will not fit in the thinned case.

  An object of the present disclosure is to provide a thin light source device having a built-in lighting circuit having a tall electronic component.

  A light source device according to an aspect of the present disclosure includes a semiconductor light emitting element, an electronic component, and a mounting substrate having a mounting surface on which the electronic component is mounted. A cutout portion is provided in at least one of the outer edge portions of the mounting substrate. At least a portion of the body of the electronic component is located in the notch.

  In the light source device according to the present disclosure, a notch is provided in at least one of the outer edges of the mounting substrate, and at least a part of the main body of the electronic component is located in the notch. Therefore, a thin light source device incorporating a lighting circuit having tall electronic components can be provided.

The perspective view which shows the light source device which concerns on embodiment Exploded perspective view showing a light source device according to an embodiment The top view which shows the state which removed the cover of the light source device which concerns on embodiment The top view which shows the mounting substrate of the light source device which concerns on embodiment The top view which shows the heat sink of the light source device which concerns on embodiment The top view which shows the case of the light source device which concerns on embodiment AA line sectional view in FIG. BB sectional view in FIG.

  Hereinafter, an embodiment of a light source device according to the present disclosure will be described with reference to the drawings. Note that all the embodiments disclosed below are examples, and there is no intention to limit the light source device according to the present disclosure.

  Further, in the embodiments disclosed below, an unnecessary detailed description may be omitted. For example, detailed descriptions of already well-known matters and overlapping descriptions of substantially the same configuration may be omitted. This is to facilitate understanding by those skilled in the art by avoiding unnecessarily redundant descriptions.

(overall structure)
FIG. 1 is a perspective view showing a light source device according to an embodiment. As shown in FIG. 1, a light source device 100 according to an embodiment is a disk-shaped LED lamp used as a substitute for a round fluorescent lamp. The light source device 100 is used as, for example, a downlight, a wall light, a spotlight or the like by being attached to a lighting fixture (not shown).

  FIG. 2 is an exploded perspective view showing the light source device according to the embodiment. As shown in FIG. 2, the light source device 100 includes a case 110, a heat sink 120, a light emitting module 130, a cover 140, and the like.

(Case)
The case 110 is made of heat-resistant synthetic resin such as engineering plastic or silicon resin, for example, and includes a bottom plate portion 111, a pair of base portions 112, and a peripheral wall portion 113. Case 110 according to the present embodiment is made of polybutylene terephthalate resin as an example of engineering plastic.

  The bottom plate portion 111 has a substantially circular plate shape, and a plurality of screw holes 115 are provided on the upper surface 114 thereof.

  The pair of base portions 112 are provided at two locations on the outer edge portion of the bottom plate portion 111 so as to face each other with the bottom plate portion 111 interposed therebetween. Each base part 112 has a bottomed cylindrical shape, and a pair of base pins 151 are provided on the bottom part of the cylinder part 112. The pair of base pins 151 provided in one base part 112 and the pair of base pins 151 provided in the other base part 112 are provided so that they protrude in parallel and opposite to each other. .

  The peripheral wall portion 113 is provided on the outer edge portion of the upper surface 114 of the bottom plate portion 111 along the periphery of the bottom plate portion 111. A heat sink 120 is accommodated in the first space 116 surrounded by the peripheral wall portion 113. In addition, a plurality of claw portions 117 are provided on the outer peripheral surface of the peripheral wall portion 113, and one protrusion 118 is provided on the inner peripheral surface of the peripheral wall portion 113.

  The peripheral wall 113 of the case 110 has a dent 113a that is recessed inward at one location. Details of the depression 113a will be described later.

(heatsink)
The heat sink 120 has a substantially circular plate shape and is disposed between the case 110 and the light emitting module 130. More specifically, the case 110 is disposed in a space surrounded by the bottom plate portion 111 of the case 110, the peripheral wall portion 113 of the case 110, and the mounting substrate 131 of the light emitting module 130.

  The upper surface 121 of the heat sink 120 is in surface contact with the mounting substrate 131 of the light emitting module 130 via grease (not shown). The heat sink 120 and the light emitting module 130 are thermally connected via grease interposed therebetween.

  The lower surface 122 of the heat sink 120 is in surface contact with the bottom plate portion 111 of the case 110 via grease (not shown). The heat sink 120 and the case 110 are thermally connected via grease interposed between them.

  The heat sink 120 is made of aluminum, for example. The heat sink 120 is not limited to an aluminum one, but preferably has good thermal conductivity and is lightweight.

  The heat sink 120 is provided with a plurality of through holes 123 that penetrate from the upper surface 121 to the lower surface 122. In addition, two protrusions 124 a and 124 b having different shapes are provided on the upper surface 121 of the heat sink 120.

  Furthermore, a recess 125 having a shape that matches the shape of the protrusion 118 of the case 110 is provided at one place on the outer edge of the heat sink 120. In a state where the heat sink 120 is accommodated in the first space 116 of the case 110, the protrusion 118 of the case 110 and the recess 125 of the heat sink 120 are fitted. Thereby, the play of the heat sink 120 in the first space 116 is suppressed.

  A notch 126 is provided at the outer edge of the heat sink 120. Details of the notch 126 will be described later.

(Light emitting module)
FIG. 3 is a plan view showing a state in which the cover of the light source device according to the embodiment is removed. As shown in FIG. 3, the light emitting module 130 includes a mounting substrate 131, a plurality of semiconductor light emitting elements 132, and a plurality of electronic components 133 and 134.

  The mounting substrate 131 has, for example, a two-layer structure of an insulating layer made of ceramic, a heat conductive resin, or the like and a metal layer made of aluminum or the like, and has a substantially circular plate shape. A plurality of semiconductor light emitting elements 132 and a plurality of electronic components 133 and 134 are mounted on a mounting surface 131 a that is the upper surface of the mounting substrate 131. The mounting substrate 131 is provided with a wiring pattern (not shown) and a plurality of connection terminals 135 and 136 electrically connected to the wiring pattern. Each semiconductor light emitting element 132 and each electronic component 133, 134 are electrically connected to a power supply line 152 connected to each base pin 151 via a wiring pattern and each connection terminal 135, 136.

  A through hole 137 is provided in the mounting substrate 131 at a position corresponding to the through hole 123 of the heat sink 120 (see FIG. 2). The light emitting module 130 and the heat sink 120 are fixed to the case 110 by screwing the screws 161 passed through the through hole 137 and the through hole 123 into the screw holes 115 of the case 110. The light emitting module 130 and the heat sink 120 may be attached to the case 110 using an adhesive or an engagement structure.

  The mounting board 131 is provided with through holes 138 a and 138 b at positions corresponding to the protrusions 124 a and 124 b of the heat sink 120. In a state where the light source device 100 is assembled, the through hole 138a and the protruding portion 124a are fitted, and the through hole 138b and the protruding portion 124b are fitted. By providing two fitting locations, the mounting substrate 131 is prevented from shifting with respect to the heat sink 120. Further, by providing the through holes 138 a and 138 b and the protrusions 124 a and 124 b having different shapes, the mounting substrate 131 is not misoriented with respect to the heat sink 120.

  A cutout 139 is provided on the outer edge of the mounting substrate 131. Details of the notch 139 will be described later.

  Each semiconductor light emitting element 132 is an LED, and is arranged in a matrix with each main emission direction facing the cover 140. The semiconductor light emitting element 132 is not limited to an LED, and may be, for example, an LD (laser diode), an EL element (electric luminescence element), or the like. In addition, the package structure of the semiconductor light emitting device 132 may be any structure such as a shell type, a surface mounted device (SMD) type, a COB (Chip On Board) type, and a power LED type.

  The heat generated in each semiconductor light emitting element 132 is conducted to the heat sink 120 through the mounting substrate 131, further conducted from the heat sink 120 to the case 110, and radiated from the case 110 to the outside. As described above, since the mounting substrate 131 and the heat sink 120 and the heat sink 120 and the case 110 are in surface contact with each other via grease, the light source device 100 has high heat dissipation characteristics.

  In order to electrically insulate the light emitting module 130 and the heat sink 120, an insulating member such as an insulating sheet (not shown) may be interposed between the light emitting module 130 and the heat sink 120.

  The plurality of electronic components 133 and 134 are components for achieving each function of the lighting circuit. As a function of the lighting circuit, there is a function as a rectifier circuit that rectifies AC power supplied from a commercial power source into DC power, and a function as a voltage adjustment circuit that adjusts the voltage value of DC power rectified by the rectifier circuit. .

  The lighting circuit is electrically connected to the base pin 151 and the semiconductor light emitting element 132, receives power from a lighting fixture (not shown) via the base pin 151, and causes the semiconductor light emitting element 132 to emit light.

  The electronic component 133 is the tallest among the plurality of electronic components 133 and 134 in the present embodiment. The electronic component 133 is, for example, an electrolytic capacitor that constitutes a smoothing circuit. Note that examples of the electronic component 134 other than the electronic component 133 include a choke coil, an IC, a noise filter, a resistor, a switching element (such as a transistor), and a coil.

(cover)
The cover 140 includes a circular plate-shaped main body portion 141 and a short cylindrical peripheral wall portion 142 extending rearward from the outer edge portion of the main body portion 141, and has a dish shape as a whole. The shape of the cover 140 is not limited to the above, and may be any shape according to the shape of the case 110.

  The cover 140 is made of a translucent material such as a resin such as acrylic resin, PC (polycarbonate) resin, silicon resin, or glass, and is translucent white. Note that the cover 140 is not limited to being translucent and may be transparent, and the color may be colorless or colored. Furthermore, the surface of the cover 140 may be subjected to light diffusion processing provided with a plurality of irregularities for diffusing outgoing light.

  The cover 140 is attached to the peripheral wall 113 of the case 110 while covering the light emitting module 130. A claw locking portion (not shown) for locking the claw portion 117 provided on the peripheral wall portion 113 of the case 110 is formed on the inner peripheral surface of the peripheral wall portion 142 of the cover 140. The cover 140 is fixed to the case 110 by locking the claw portion 117 of the case 110 to the claw locking portion.

  In the present embodiment, the cover 140 is fixed to the case 110 by a locking structure including the claw portion 117 and the claw locking portion. However, the fixing method may be screwing, adhesion, press-fitting, or the like. A plurality of methods may be combined.

(Main part configuration)
FIG. 4 is a plan view showing a mounting substrate of the light source device according to the embodiment. As shown in FIG. 4, a notch 139 is provided at one place on the outer edge of the mounting substrate 131. The notch 139 is a space for accommodating the electronic component 133.

  FIG. 5 is a plan view showing a heat sink of the light source device according to the embodiment. As shown in FIG. 5, a notch 126 is also provided at one location on the outer edge of the heat sink 120. This notch 126 is also a space for accommodating the electronic component 133.

  The notch 126 is provided at a position overlapping the notch 139 of the mounting substrate 131 when the mounting substrate 131 is aligned with the heat sink 120. The shape of the notch 126 of the heat sink 120 and the notch 139 of the mounting substrate 131 are substantially the same.

  FIG. 6 is a plan view showing a case of the light source device according to the embodiment. As shown in FIG. 6, the peripheral wall 113 of the case 110 has a recess 113 a that is recessed inward at one location. A second space 119 surrounded on three sides by the depression 113a is a space for accommodating the electronic component 133. The second space 119 of the case 110 is provided at a position that overlaps the notch 126 and the notch 139 when the heat sink 120 and the mounting substrate 131 are aligned with the case 110. The shape of the second space 119 of the case 110 and the notch 139 of the mounting substrate 131 are substantially the same.

  In the light source device 100, the tallest electronic component 133 is arranged in the notch 139 of the mounting substrate 131. As a result, the electronic component 133 that is too tall to be mounted on the mounting surface 131a of the mounting board 131 can be embedded. Note that the height of the electronic component 133 means the distance (the dimension indicated by “T” in FIG. 7) from the end surface of the main body 133 a on the side where the lead wire 133 b protrudes to the opposite end surface.

  7 is a cross-sectional view taken along line AA in FIG. 8 is a cross-sectional view taken along line BB in FIG. As shown in FIGS. 7 and 8, the electronic component 133 includes a main body 133a, a pair of lead wires 133b, and a glass tube 133c. The main body 133a has a substantially cylindrical shape. The lead wire 133b extends from one end surface of the main body 133a. The glass tube 133c covers the outer peripheral surface of the main body 133a.

  A part of the main body 133 a of the electronic component 133 is located in the notch 139 of the mounting substrate 131. Further, another part of the main body 133 a of the electronic component 133 is located in the second space 119 of the case 110 and in the notch 126 of the heat sink 120. Since a part of the main body 133a and another part are buried below the mounting surface 131a of the mounting substrate 131, the protruding amount of the electronic component 133 protruding from the mounting surface 131a is suppressed.

  In addition, another part of the electronic component 133 protrudes from the notch 139, the notch 126, and the second space 119. With this configuration, the size of the notch 139 can be reduced, so that a large area of the mounting surface 131a of the mounting substrate 131 can be secured.

  The electronic component 133 is mounted on the mounting substrate 131 in a horizontal posture. Specifically, the electronic component 133 is mounted on the mounting board 131 in a posture in which the longitudinal direction of the main body 133a is parallel to the mounting surface 131a of the mounting board 131. By making the longitudinal direction of the main body 133a parallel to the mounting surface 131a of the mounting substrate 131, it is possible to more effectively suppress the protrusion amount of the electronic component 133 protruding from the mounting surface 131a.

  Note that the posture of the electronic component 133 is not necessarily the posture in which the longitudinal direction of the main body 133a is parallel to the mounting surface 131a of the mounting substrate 131. If a part of the main body 133a of the electronic component 133 is located in the notch 139 of the mounting substrate 131, the protruding amount of the electronic component 133 can be suppressed to some extent. Therefore, for example, a part of the main body 133a may be positioned in the notch 139 of the mounting board 131 in a vertically placed attitude (an attitude in which the longitudinal direction of the main body 133a is parallel to the mounting surface 131a of the mounting board 131).

  Each lead wire 133b is linear and is connected to a connection terminal 135 provided on the mounting surface 131a of the mounting substrate 131 in a posture parallel to the mounting surface 131a of the mounting substrate 131. The connection terminal 135 to which the lead wire 133b is connected is connected to the lead wire 133b by caulking. Note that the method of connecting the lead wire 133b and the connection terminal 135 is not limited to caulking, and may be another method such as soldering.

  Each lead wire 133b is connected to the connection terminal 135 in a state of floating from the mounting surface 131a of the mounting substrate 131. With this configuration, insulation between the lead wire 133b and the wiring pattern provided on the mounting surface 131a is secured.

  With the above configuration, for the electronic component 133 in which at least a part of the main body 133a is located in the notch 139, the height of the portion protruding from the mounting surface 131a of the mounting substrate 131 is reduced. Therefore, if a tall electronic component 133 is selected as an electronic component partially located in the notch 139, the amount of protrusion protruding from the mounting surface 131a of the mounting substrate 131 can be suppressed as the entire lighting circuit. Thereby, the thin light source device 100 having a built-in lighting circuit having the tall electronic component 133 can be realized.

[Modification]
As mentioned above, although the structure of this indication was demonstrated based on embodiment, this indication is not restricted to the said embodiment. In addition, the materials, numerical values, and the like described in the above embodiments are merely examples, and are not limited thereto. Furthermore, it is possible to appropriately change the configuration of the light source device without departing from the scope of the technical idea of the present disclosure.

  For example, a plurality of cutout portions provided on the mounting substrate may be provided, and a configuration in which a part of the electronic component is positioned in each of the cutout portions may be employed. Moreover, the structure which positions each one of several electronic components in one notch part may be sufficient. Furthermore, the structure by which the electronic component is mounted in the surface different from a semiconductor light-emitting device may be sufficient.

  The light source device according to the present disclosure can be widely used in general lighting applications.

DESCRIPTION OF SYMBOLS 100 Light source device 110 Case 111 Bottom plate part 112 Base part 113 Peripheral wall part 113a Depression part 114 Upper surface 115 Screw hole 116 1st space 117 Claw part 118 Protrusion part 119 2nd space 120 Heat sink 121 Upper surface 122 Lower surface 123 Through-hole 124a Protrusion part 124b Protrusion Part 125 hollow part 126 notch part 130 light emitting module 131 mounting substrate 131a mounting surface 132 semiconductor light emitting element 133 electronic component 134 electronic part 135 connection terminal 136 connection terminal 137 through hole 138a through hole 138b through hole 139 notch part 140 cover 141 main body part 142 Peripheral wall

Claims (6)

A semiconductor light emitting device, an electronic component, and a mounting substrate having a mounting surface on which the electronic component is mounted,
At least one of the outer edge portions of the mounting substrate is provided with a notch,
At least a part of the main body of the electronic component is located in the notch. The light source device according to claim 1, wherein the electronic component is mounted on the mounting board in a posture in which a longitudinal direction of the main body is parallel to the mounting surface of the mounting board. The electronic component has a lead wire extending from the main body,
The lead wire is connected to a connection terminal provided on the mounting surface of the mounting substrate in a posture parallel to the mounting surface of the mounting substrate. Light source device. The light source device according to claim 3, wherein the lead wire is connected to the connection terminal in a state of floating from the mounting surface of the mounting substrate. 5. The light source device according to claim 1, wherein the electronic component is mounted on the mounting substrate in a state in which a part of the main body protrudes from the cutout portion. Furthermore, a heat sink arranged to overlap with the mounting substrate,
The outer edge portion of the heat sink is provided with a notch at a position overlapping the notch provided on the mounting substrate,
The electronic component is located in the notch provided in the heat sink at a part different from the part located in the notch provided in the mounting board. The light source device according to any one of 5.

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