JP2018098413A - Transport arrangement device of electronic component and transport arrangement method of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To arrange the lamination direction of internal electrodes in a prescribed direction, without lowering the transportation efficiency of electronic components.SOLUTION: A transport arrangement device of electronic components having laminated multiple ferromagnetic internal electrodes includes a transport mechanism (transport rotor 31) having multiple recesses 31a for housing electronic components 2, and transporting the electronic components 2 housed in the recesses 31a, and a magnetic field application device (magnet 50) for applying a magnetic field to the electronic components 2 under transportation by the transport mechanism, for arranging the lamination direction of the internal electrodes in a prescribed direction. The recess 31a has a space for allowing the housed electronic component 2 to rotate, when applied with a magnetic field, so that the lamination direction of the internal electrodes is arranged in the prescribed direction.SELECTED DRAWING: Figure 5

Description

  The present invention relates to an apparatus and a method for aligning the stacking direction of internal electrodes in a predetermined direction when transporting an electronic component.

  An apparatus for conveying an electronic component having a plurality of laminated internal electrodes therein, such as a laminated ceramic capacitor, is known. As one of such devices, Patent Document 1 discloses that when an electronic component is moving on a component conveyance path provided in a spiral shape in a parts feeder, a magnetic field is applied to the electronic component to rotate it. Thus, there is described an apparatus for aligning the lamination direction of internal electrodes having ferromagnetism in a predetermined direction.

JP 2005-217136 A

  Here, in order to improve the proportion of electronic components in which the internal electrodes are stacked in a predetermined direction, it is necessary to increase the magnetic field applied to the electronic components. However, since the apparatus described in Patent Document 1 is configured to apply a magnetic field when the electronic component is being conveyed on the component conveyance path by vibration, if the applied magnetic field is increased, the conveyance of the electronic component is hindered by the magnetic force. As a result, there arises a problem that the conveyance efficiency is lowered.

  Further, if the magnetic field applied to the electronic component is weakened, the rotation rate of the electronic component is lowered, and the proportion of the electronic component in which the stacking direction of the internal electrodes is aligned in a predetermined direction is reduced.

  SUMMARY OF THE INVENTION The present invention solves the above-described problem and provides an electronic component transport and alignment apparatus that can accurately align the stacking direction of internal electrodes in a predetermined direction without reducing the transport efficiency of the electronic component. It is an object to provide a transport alignment method.

The electronic component transport alignment apparatus according to the present invention,
An electronic component transport and alignment apparatus having a plurality of laminated internal electrodes having ferromagnetism therein,
A plurality of recesses for storing the electronic components, and a transport mechanism for transporting the electronic components stored in the recesses;
A magnetic field applying device that applies a magnetic field to the electronic component being transferred by the transfer mechanism in order to align the stacking direction of the internal electrodes in a predetermined direction;
With
The concave portion has a space that can be rotated so that the stacking direction of the internal electrodes is aligned with the predetermined direction when a magnetic field is applied to the housed electronic component.
It is characterized by that.

  The transport mechanism may be a disk-shaped transport rotor having a plurality of recesses for housing the electronic components and rotating about a central axis.

The electronic component has a rectangular parallelepiped shape,
Even when a magnetic field is applied to the electronic component by the magnetic field application device, the electronic component may be configured to rotate about the rotation axis with an axis parallel to the longitudinal direction of the electronic component as a rotation axis. Good.

Further, a suction mechanism for fixing the electronic component in the recess by suction is further provided,
The suction mechanism may temporarily weaken the suction force when the electronic component housed in the recess passes near the magnetic field application device.

An electronic component transport and alignment method according to the present invention includes:
A method of transporting and aligning electronic components having a rectangular parallelepiped shape having a plurality of laminated internal electrodes having ferromagnetism,
A step of applying a magnetic field to the electronic component in order to align the stacking direction of the internal electrodes in a predetermined direction during transport of the electronic component;
By applying a magnetic field to the electronic component during transportation of the electronic component, the electronic component is rotated about a rotation axis parallel to the longitudinal direction of the electronic component, and the stacking direction of the internal electrodes is set to a predetermined direction. Align,
It is characterized by that.

  According to the electronic component transport alignment apparatus of the present invention, when the electronic component is housed and transported in the recess of the transport mechanism, a magnetic field is applied to the ferromagnetic electronic component so that the stacking direction of the internal electrodes is changed. Since they are aligned in a predetermined direction, even if the magnetic field applied to the electronic component is increased, the conveyance of the electronic component by the conveyance mechanism is not hindered. That is, since the electronic component is transported by the driving force of the transport mechanism while being accommodated in the recess of the transport mechanism, the electronic component is reliably transported by the transport mechanism even when a magnetic field is applied. Thereby, it is possible to accurately align the stacking direction of the internal electrodes in a predetermined direction without reducing the conveyance efficiency of the electronic components.

  Further, according to the method for transporting and aligning electronic components according to the present invention, by applying a magnetic field to the electronic components when transporting the electronic components, the electronic components are rotated about a rotation axis parallel to the longitudinal direction of the electronic components, Since the electrode stacking direction is aligned in a predetermined direction, the electronic component is easy to rotate and it is not necessary to reduce the conveying force of the electronic component. Thereby, it is possible to accurately align the stacking direction of the internal electrodes in a predetermined direction without reducing the conveyance efficiency of the electronic components.

It is a top view which shows typically the structure of the manufacturing apparatus of the electronic component in the 1st Embodiment of this invention. It is a perspective view of an electronic component. It is sectional drawing along the III-III line of the electronic component shown in FIG. It is sectional drawing along the IV-IV line of FIG. It is a figure for demonstrating the arrangement | positioning position of the magnet which is a magnetic field application apparatus, and direction of a magnetic force line in the electronic component manufacturing apparatus in 1st Embodiment. It is a figure for demonstrating the magnitude | size of the recessed part of the conveyance rotor with respect to the magnitude | size of an electronic component. It is sectional drawing along the VII-VII line of FIG. It is sectional drawing along the VIII-VIII line of FIG. It is sectional drawing along the IX-IX line of FIG. It is a figure for demonstrating the manufacturing method of the package body containing an electronic component. It is a figure for demonstrating the arrangement | positioning position of the magnet which is a magnetic field application apparatus, and direction of a magnetic force line in the manufacturing apparatus of the electronic component in 2nd Embodiment.

  Embodiments of the present invention will be described below, and the features of the present invention will be described more specifically.

<First Embodiment>
First, the configuration of the electronic component 2 that is the conveyance target of the electronic component conveyance and alignment apparatus 1 according to the present invention will be described. The electronic component 2 has a plurality of stacked internal electrodes 22 (22a, 22b) therein. The electronic component 2 is, for example, a multilayer ceramic capacitor. However, the electronic component 2 is not limited to the multilayer ceramic capacitor, and may be a thermistor or a piezoelectric component, for example.

  FIG. 2 is a perspective view of the electronic component 2, and FIG. 3 is a cross-sectional view taken along the line III-III of the electronic component 2 shown in FIG. 2.

  As shown in FIGS. 2 and 3, the electronic component 2 includes an electronic component body 20 and a pair of external electrodes 21a and 21b. The pair of external electrodes 21a and 21b are arranged so as to face each other.

  Here, the direction in which the pair of external electrodes 21a and 21b oppose is defined as the length direction L of the electronic component 2, the stacking direction of the internal electrodes 22a and 22b is defined as the thickness direction T, and the length direction L and the thickness direction are defined. A direction perpendicular to any direction of T is defined as a width direction W. As shown in FIG. 2, the length direction L is the longitudinal direction of the electronic component 2, and the width direction W and the thickness direction T are short directions perpendicular to the longitudinal direction.

  The electronic component main body 20 has a rectangular parallelepiped shape as a whole, and includes a first end surface 20e and a second end surface 20f opposed to the length direction L, and a first main surface 20a and a second end surface opposed to the thickness direction T. Main surface 20b, and a first side surface 20c and a second side surface 20d opposite to each other in the width direction W. The electronic component 2 also has a rectangular parallelepiped shape as a whole.

  In the present specification, the “cuboid” includes a rectangular parallelepiped in which corners and ridge lines are rounded. The corner portion is a portion where three surfaces of the electronic component main body 20 intersect, and the ridge line portion is a portion where two surfaces of the electronic component main body 20 intersect. Further, unevenness or the like may be formed on part or all of the main surface, the side surface, and the end surface.

  As shown in FIG. 3, a plurality of first internal electrodes 22 a and a plurality of second internal electrodes 22 b are provided inside the electronic component main body 20.

  The first internal electrodes 22 a and the second internal electrodes 22 b are alternately provided along the thickness direction T via the dielectric ceramic layers 23. The first inner electrode 22a is drawn out to the first end face 20e. The second internal electrode 22b is drawn out to the second end face 20f.

  The first internal electrode 22a and the second internal electrode 22b are made of a conductive material having ferromagnetism, for example, Ni, Co, Fe, or the like. However, the first internal electrode 22a and the second internal electrode 22b may contain a metal material such as Cu, Ag, Pd, or Au in addition to a ferromagnetic conductive material such as Ni, Co, or Fe. Good. That is, the first internal electrode 22a and the second internal electrode 22b may be any material that includes a ferromagnetic material and has ferromagnetism.

In the electronic component main body 20, the portions other than the internal electrodes 22 a and 22 b can be made of a material corresponding to the function of the electronic component 2, for example, resin or ceramic. For example, when the electronic component 2 is a multilayer ceramic capacitor, portions other than the internal electrodes 22a and 22b of the electronic component body 20 can be formed of a dielectric ceramic. For example, BaTiO ₃ or CaTiO ₃ can be used as the dielectric ceramic.

  When the electronic component 2 is a thermistor, portions other than the internal electrodes 22a and 22b of the electronic component body 20 can be formed of semiconductor ceramic. As the semiconductor ceramic, for example, a spinel ceramic can be used.

  When the electronic component 2 is a piezoelectric component, portions other than the internal electrodes 22a and 22b of the electronic component main body 20 can be formed of piezoelectric ceramic. As the piezoelectric ceramic, for example, PZT (lead zirconate titanate) ceramic can be used.

  Hereinafter, an example in which the electronic component 2 is a multilayer ceramic capacitor will be described.

  The first external electrode 21a is formed on the entire first end surface 20e of the electronic component body 20, and from the first end surface 20e, the first main surface 20a, the second main surface 20b, the first It is formed so as to wrap around the side surface 20c and the second side surface 20d. The first external electrode 21a is electrically connected to the first internal electrode 22a.

  The second external electrode 21b is formed on the entire second end surface 20f of the electronic component body 20, and from the second end surface 20f, the first main surface 20a, the second main surface 20b, the first It is formed so as to wrap around the side surface 20c and the second side surface 20d. The second external electrode 21b is electrically connected to the second internal electrode 22b.

  The first external electrode 21a and the second external electrode 21b include, for example, a baked electrode layer and a plating layer formed on the baked electrode layer. The baking electrode layer is made of, for example, a metal such as Cu, Ni, Ag, Pd, or Au, or an alloy containing at least one of these metals, such as an alloy of Ag and Pd. A plating layer can be made into the multiple structure which has a Ni plating layer and a Sn plating layer, for example.

  There are no particular restrictions on the dimensions of the electronic component 2. For example, when the dimension in the length direction L, the dimension in the width direction W, and the dimension in the thickness direction T are expressed as L dimension, W dimension, and T dimension, respectively, L dimension × W Dimensions x T dimensions = 1.6 mm x 0.8 mm x 0.8 mm, 1.0 mm x 0.5 mm x 0.5 mm, 0.6 mm x 0.3 mm x 0.3 mm, 0.4 mm x 0.2 mm x 0 It can be as large as 2 mm.

  Next, the electronic component transport and alignment apparatus 1 according to the first embodiment of the present invention will be described.

  FIG. 1 is a plan view schematically showing the configuration of an electronic component transport and alignment apparatus 1 according to the first embodiment.

  A plurality of electronic components 2 are accommodated in a ball feeder 10 which is a device for supplying the electronic components 2 to the linear feeder 11. The ball feeder 10 sequentially supplies the electronic components 2 to the linear feeder 11 by vibrating.

  The linear feeder 11 conveys the electronic component 2 by vibration and supplies the electronic component 2 to the conveyance rotor 31 that is a conveyance mechanism. In the linear feeder 11, the electronic component 2 is transported in such a manner that the longitudinal direction coincides with the transport direction.

  The transport rotor 31 serving as a transport mechanism has a disk shape that rotates about the central axis C. In the present embodiment, the transport rotor 31 rotates clockwise around the central axis C with a motor (not shown) as a drive source. However, the rotation direction of the transport rotor 31 may be a counterclockwise direction.

  The conveyance rotor 31 includes a plurality of recesses 31a. Each of the plurality of recesses 31 a is provided on the outer peripheral surface of the transport rotor 31. In the present embodiment, the plurality of recesses 31 a are provided at equal intervals along the circumferential direction of the transport rotor 31.

  4 is a cross-sectional view taken along line IV-IV in FIG. As shown in FIG. 4, the recess 31 a is formed so as to penetrate between the upper surface and the lower surface of the transport rotor 31 and open toward the outer peripheral surface.

  A transport stage 32 is provided below the transport rotor 31 as shown in FIG. The conveyance stage 32 closes the lower side of the recess 31a. In other words, the provision of the transport stage 32 prevents the electronic component 2 from falling downward when it is housed in the recess 31 a of the transport rotor 31. The transfer stage 32 is fixed and does not rotate.

  The electronic component 2 is fed from the linear feeder 11 into the recess 31a of the transport rotor 31 at the position P1. As described above, even when the electronic component 2 is transported on the linear feeder 11 in such a manner that the longitudinal direction coincides with the transport direction and is sent from the linear feeder 11 to the recess 31a of the transport rotor 31, the orientation of the electronic component 2 is Kept. Therefore, the longitudinal direction of the electronic component 2 accommodated in the recess 31a coincides with the radial direction of the disc-shaped transport rotor 31.

  When the electronic component 2 is accommodated in the recess 31a, the transport rotor 31 rotates and the recess 31a adjacent in the circumferential direction moves to the position P1. Then, the next electronic component 2 is fed into the recess 31a. By repeating this operation, the electronic components 2 are sequentially accommodated and transported in the plurality of recesses 31a of the transport rotor 31.

  The transport rotor 31 may rotate intermittently so that the recess 31a stops temporarily at the position P1, or may rotate continuously without temporarily stopping.

  The electronic component 2 fed into the recess 31a at the position P1 is transported to the position P6 along the circumferential direction around the central axis C as the transport rotor 31 rotates.

  A guide (not shown) is provided outside the outer periphery of the transport rotor 31 so as to surround the transport rotor 31.

  As shown in FIG. 4, in this embodiment, a linear groove 31 c that opens to the recess 31 a is formed in the transport rotor 31. A suction path 31d is formed by the linear groove 31c and the transport stage 32. The suction path 31d is connected to a suction pump (not shown) through a through hole 32a formed in the transport stage 32.

  The electronic component 2 fed into the recess 31a is fixed in the recess 31a by being sucked by the suction pump through the suction path 31d and the through hole 32a. That is, the suction path 31d, the through hole 32a, and the suction pump constitute a suction mechanism that fixes the electronic component 2 in the recess 31a by suction. The electronic component 2 is conveyed in a state of being fixed in the recess 31a.

  The method for fixing the electronic component 2 is not limited to the method using suction, but may be fixed by another method, for example, a method of electrostatically attracting the electronic component 2.

  A magnet 50 that is a magnetic field applying device is provided at the position P2. The magnet 50 is a permanent magnet such as a neodymium magnet, for example, and applies a magnetic field to the electronic component 2 being transported by the transport rotor 31 to align the stacking direction of the internal electrodes 22a and 22b of the electronic component 2 in a predetermined direction. Is provided. The magnet 50 generates a magnetic field having a magnetic flux density of 1500 mT, for example. In this embodiment, description will be made assuming that the stacking direction of the internal electrodes 22a and 22b of the electronic component 2 is aligned in the horizontal direction.

  FIG. 5 is a side view when the radially inner side is viewed from the radially outer side of the transport rotor 31 at the position P2. The conveyance rotor 31 rotates in the direction of the arrow Y1.

  In the present embodiment, as shown in FIG. 5, a cover 33 that covers the upper portion of the transport rotor 31 is provided above the transport rotor 31 at least at the position P <b> 2, and the magnet 50 is provided in the cover 33. It has been. More specifically, the magnet 50 has an S pole and an N pole so that the magnetic field lines M are output in the vertical direction from the magnet 50 at a position vertically above the position where the electronic component 2 accommodated in the recess 31a passes. They are provided in such a manner that they face each other in the vertical direction. Accordingly, a vertical magnetic field is applied to the electronic component 2 housed in the recess 31a. In FIG. 5, the magnetic lines of force M are indicated by broken lines.

  Each of the plurality of recesses 31a has a space in which the accommodated electronic component 2 can rotate so that the stacking direction of the internal electrodes 22a and 22b is aligned in a predetermined direction.

  In the present embodiment, the length of the diagonal dimension L1 (see FIG. 6) of the surface defined by the width direction W and the thickness direction T of the electronic component 2 is about 700 μm, and the recesses in the circumferential direction of the transport rotor 31 The dimension L3 (see FIG. 6) of 31a is 750 μm. In this case, the dimension L3 of the recess 31a is about 7% larger than the dimension L1 in the diagonal direction of the surface defined by the width direction W and the thickness direction T of the electronic component 2. As a result, the electronic component 2 is reliably rotated without any trouble in the recess 31a, and the stacking direction of the internal electrodes 22a and 22b is aligned in a predetermined direction.

  However, the recessed part 31a should just be a magnitude | size which can rotate the electronic component 2 accommodated, and the dimension is not limited to the dimension mentioned above.

  As described above, a vertical magnetic field is applied to the electronic component 2 housed in the recess 31 a of the transport rotor 31. When the electronic component 2 accommodated in the recess 31a passes under the magnet 50, if the stacking direction of the internal electrodes 22a and 22b is horizontal, the electronic component 2 is conveyed as it is without rotating. On the other hand, when the stacking direction of the internal electrodes 22a and 22b is the vertical direction, the electronic component 2 rotates so that the stacking direction of the internal electrodes 22a and 22b becomes the horizontal direction by the applied magnetic field.

  In the present embodiment, the electronic component 2 rotates about the rotation axis with an axis parallel to the longitudinal direction, that is, the length direction L as a rotation axis. For example, in FIG. 5, the longitudinal direction of the electronic component 2 is a direction perpendicular to the paper surface. Therefore, as in the three electronic components 2 on the left side of FIG. 5, the stacking direction of the internal electrodes 22 a and 22 b is the vertical direction. A certain electronic component 2 rotates in either the clockwise direction or the counterclockwise direction.

  As a result, after the electronic component 2 passes under the magnet 50, the stacked direction of the internal electrodes 22a and 22b is aligned in the horizontal direction, in other words, the main surfaces of the internal electrodes 22a and 22b are aligned in the vertical direction. It is conveyed in the state where

  Here, the above-described suction mechanism is configured so that the electronic component 2 housed in the recess 31a of the transport rotor 31 is sucked through the suction path 31d when passing through the vicinity of the magnet 50 and at least the position vertically below the magnet 50. It is preferable to temporarily weaken the suction force or temporarily stop the suction. By temporarily weakening the attractive force, including temporary suspension of suction, the electronic component 2 can be easily rotated by applying a magnetic field, so that the stacking direction of the internal electrodes 22a and 22b can be more effectively aligned. become.

  In addition, the magnetic field application apparatus which applies a magnetic field to the electronic component 2 is not limited to the magnet 50, An electromagnet, a solenoid, etc. may be used. Further, the arrangement position of the magnetic field application device may be a position vertically below a position where the electronic component 2 accommodated in the recess 31a passes, that is, in the transfer stage 32.

  As described above, in the electronic component transport and alignment apparatus 1 according to the present embodiment, the electronic component 2 is accommodated and transported by the magnet 50 when the electronic component 2 is housed and transported in the concave portion 31a of the transport rotor 31 that rotates about the central axis C. Since the magnetic field is applied to the component 2 so that the stacking direction of the internal electrodes 22a and 22b is aligned in a predetermined direction, the applied magnetic field prevents the electronic component 2 from being conveyed by the rotation of the conveyance rotor 31. There is nothing. Thereby, since the magnetic field applied to the electronic component 2 can be strengthened in order to align the stacking direction of the internal electrodes 22a and 22b in a predetermined direction, the stacking direction of the internal electrodes 22a and 22b can be accurately determined. Can be aligned. In addition, since it is not necessary to reduce the conveying force of the electronic component 2 in order to align the stacking direction of the internal electrodes 22a and 22b in a predetermined direction with high accuracy, the internal electrode 22a is not reduced without reducing the conveying efficiency of the electronic component 2. , 22b can be accurately aligned in a predetermined direction.

  As shown in FIGS. 1 and 7, a direction discriminator 35 is provided at a position P3 at a position advanced in the rotation direction of the transport rotor 31 with respect to the position P2. The direction identifier 35 identifies the stacking direction of the internal electrodes 22 a and 22 b of the electronic component 2. As shown in FIG. 7, the direction discriminator 35 includes a magnetic field generator 35a and a magnetic flux density detector 35b.

  The magnetic field generator 35a is a permanent magnet such as a neodymium magnet. However, the magnetic field generator 35a is not limited to a permanent magnet, and an electromagnet, a solenoid, or the like may be used. The magnetic field generator 35a generates a magnetic field having a magnetic flux density of 1000 mT to 3000 mT, for example.

  The magnetic flux density detector 35b can be configured by a Hall element, for example. The Hall element is preferably held by, for example, an aluminum plate that is a non-magnetic material and covered with a zirconia cover.

  In the present embodiment, the magnetic field generator 35 a is provided in a position vertically above the position in the cover 33 through which the electronic component 2 housed in the recess 31 a of the transport rotor 31 passes. Further, the magnetic flux density detector 35 b is provided at a position in the transport stage 32 that is vertically below the position where the electronic component 2 housed in the recess 31 a of the transport rotor 31 passes. That is, the electronic component 2 accommodated in the recess 31a passes between the magnetic field generator 35a and the magnetic flux density detector 35b.

  The density of the magnetic flux passing through the electronic component 2 from the magnetic field generator 35a to the magnetic flux density detector 35b differs depending on whether the stacking direction of the internal electrodes 22a and 22b is the vertical direction or the horizontal direction. For this reason, by stacking the internal electrodes 22a and 22b of the electronic component 2 by detecting the magnetic flux density when the electronic component 2 passes between the magnetic field generator 35a and the magnetic flux density detector 35b by the magnetic flux density detector 35b. The direction can be identified.

  When the magnetic flux density detector 35b compares the detected magnetic flux density with a predetermined threshold value and determines that the stacking direction of the internal electrodes 22a and 22b of the electronic component 2 is the horizontal direction, the G signal is sent to the control unit shown in FIG. 34, when it is determined that the stacking direction of the internal electrodes 22a and 22b is the vertical direction, an NG signal is output to the control unit 34.

  In the magnetic flux density detector 35b, the position where the magnetic field generator 35a is provided and the strength of the magnetic field generated by the magnetic field generator 35a are adjusted as appropriate so that a magnetic flux density of 10 mT or more and 200 mT or less can be detected.

  In addition, from the viewpoint of more reliably identifying the stacking direction of the internal electrodes 22a and 22b of the electronic component 2, the transport rotor 31 may be made of stainless steel, aluminum, plastic, ceramic, or the like that is a nonmagnetic material. preferable. The transport stage 32 is also preferably made of stainless steel, aluminum, plastic, ceramic, or the like, which is a non-magnetic material. In particular, the transport rotor 31 and the transport stage 32 are preferably made of zirconia having excellent wear resistance.

  As shown in FIGS. 1 and 8, an image pickup unit 36 is provided at a position P <b> 4 at a position advanced in the rotation direction of the transport rotor 31 with respect to the position P <b> 3. As shown in FIG. 8, the imaging unit 36 includes a camera 36a and a ring illumination 36b arranged so as to surround the camera 36a. The camera 36a is provided at a position vertically above the position through which the electronic component 2 accommodated in the recess 31a passes, and images the electronic component 2 irradiated with light by the ring illumination 36b from above. An image obtained by imaging is output to the control unit 34.

  As shown in FIG. 1, a sorting unit 37 is provided at a position P5 at a position advanced in the rotation direction of the transport rotor 31 with respect to the position P4. The sorting unit 37 is connected to the control unit 34 and sorts the electronic component 2 based on an instruction from the control unit 34.

  Specifically, the control unit 34 first matches the stacking direction of the internal electrodes 22a and 22b of the electronic component 2 with a predetermined direction based on the G signal / NG signal output from the magnetic flux density detector 35b. It is determined whether or not. In the present embodiment, it is determined whether or not the stacking direction of the internal electrodes 22a and 22b matches the horizontal direction.

  The control unit 34 also determines whether or not there is an appearance failure in the electronic component 2 based on the image output from the imaging unit 36.

  Here, the electronic component 2 has a shape in which the central portions of the first main surface 20a and the second main surface 20b are swollen more than the peripheral portion by laminating a plurality of internal electrodes 22a and 22b. Yes. On the other hand, the first side surface 20c and the second side surface 20d are not swollen. In this case, the case where light is applied to the first main surface 20a or the second main surface 20b by the ring illumination 36b and the case where light is applied to the first side surface 20c or the second side surface 20d. The appearance of the surface of the electronic component 2 in the image changes.

  However, in this embodiment, when the electronic component 2 passes through the position P1, the magnetic field is applied so that the stacking direction of the internal electrodes 22a and 22b of the electronic component 2 is the vertical direction. Therefore, the electronic component 2 passes through the position P4 with the first side face 20c or the second side face 20d not bulging outward facing upward. Thereby, the condition for irradiating the electronic component 2 with light by the ring illumination 36b can be fixed, and the presence or absence of the appearance defect of the electronic component 2 can be determined based on the image captured under the appropriate light irradiation condition. Can be determined.

  The imaging unit 36 has an image processing function. Based on the image obtained by imaging, it is determined whether or not the electronic component 2 has an appearance defect. If it is determined that there is no appearance defect, the G signal May be output to the control unit 34, and if it is determined that there is an appearance defect, an NG signal may be output to the control unit 34.

  The control unit 34 recognizes the electronic component 2 in which the stacking direction of the internal electrodes 22a and 22b coincides with a predetermined direction and has no appearance defect as a non-defective product. In addition, the control unit 34 certifies the electronic component 2 in which the stacking direction of the internal electrodes 22a and 22b does not coincide with a predetermined direction or the appearance defect exists as a defective product.

  The sorting unit 37 allows the electronic component 2 certified as a non-defective product based on the certification result of the control unit 34 to continue to be conveyed by the conveyance rotor 31, and the electronic component 2 certified as a defective product is transferred to the conveyance rotor 31. Remove from.

  Specifically, the sorting unit 37 continues to suck the electronic component 2 through the suction path 31d when the electronic component 2 certified as a non-defective product passes the position P5. On the other hand, when the electronic component 2 certified as a defective product passes through the position P5, compressed air is sent into the recess 31a via the suction path 31d. Thereby, the electronic component 2 is discharged | emitted from the recessed part 31a. In addition, the electronic component 2 recognized as a defective product is discharged from the recess 31a to a discharge box (not shown).

  That is, at the position P5, the transport stage 32 is provided with a through hole (not shown) connected to the suction path 31d, and this through hole is connected to a pump (not shown). And it is set as the structure which can send in compressed air to the recessed part 31a via 31 d of suction paths with a pump.

  FIG. 9 is a cross-sectional view taken along line IX-IX in FIG. As shown in FIG. 9, at the position P <b> 6, the transport stage 32 is not provided below the transport rotor 31, and a long carrier tape 41 is supplied under the transport rotor 31. Yes.

  FIG. 10 is a side view of the transport rotor 31 and the carrier tape 41 at the position P6. As shown in FIG. 10, the carrier tape 41 is provided with a plurality of receiving holes 41a at predetermined intervals along the longitudinal direction. A bottom tape 43 is disposed under the carrier tape 41.

  As shown in FIGS. 9 and 10, when the recess 31a is positioned at the position P6, the carrier tape 41 is positioned so that the accommodation hole 41a is positioned below the recess 31a. In this state, the negative pressure of the suction path 31 d is released and the electronic component 2 is transferred into the accommodation hole 41 a of the carrier tape 41 by being pushed out by, for example, a pushing pin.

  When the electronic component 2 is accommodated, a positive pressure may be applied to the suction path 31d. Further, the electronic component 2 may be drawn from the carrier tape 41 side by suction or the like.

  Thereafter, the carrier tape 41 moves along the longitudinal direction, the accommodation hole 41a in which the electronic component 2 is not accommodated moves to a position below the concave portion 31a of the position P6, and the electronic component 2 is transferred.

  By repeating the above-described steps, the electronic components 2 are sequentially transferred into the accommodation holes 41a of the carrier tape 41. Thereby, each of the plurality of electronic components 2 is accommodated in the accommodation hole 41a of the carrier tape 41 in a state where the stacking direction of the internal electrodes 22a and 22b faces the horizontal direction.

  Thereafter, as shown in FIG. 10, the cover tape 42 covering the plurality of accommodation holes 41 a is arranged on the carrier tape 41. As a result, the packaging body 3 is manufactured which is a series of taping components including the carrier tape 41, the cover tape 42, and the bottom tape 43, and having a structure in which the electronic component 2 is accommodated in the accommodation hole 41a provided in the carrier tape 41. Is done.

  The packaging body 3 in which the plurality of electronic components 2 are accommodated in the plurality of accommodation holes 41a of the carrier tape 41 in the state where the stacking direction of the internal electrodes 22a and 22b is directed in the horizontal direction by the above-described process. Can do.

<Experimental example>
One million multilayer ceramic capacitors having a length direction L of 1.0 mm, a width direction W of 0.5 mm, and a thickness direction T of 0.5 mm are prepared. A package 3 containing the multilayer ceramic capacitor as the electronic component 2 in the accommodation hole 41a of the tape 41 was manufactured. As the magnet 50 disposed at the position P2, a magnet that generates a magnetic field having a magnetic flux density of 1500 mT was used.

  When the lamination direction of the internal electrodes 22a and 22b of the multilayer ceramic capacitor included in the manufactured package 3 is confirmed, the lamination direction of the internal electrodes 22a and 22b of all 1 million multilayer ceramic capacitors is horizontal. Was confirmed.

<Second Embodiment>
In the electronic component transport and alignment apparatus 1 according to the first embodiment, the magnet 50 is provided so that the stacking direction of the internal electrodes 22a and 22b of the electronic component 2 is aligned in the horizontal direction. In contrast, in the electronic component transport and alignment apparatus 1A according to the second embodiment, the magnet 51 is provided so that the stacking direction of the internal electrodes 22a and 22b of the electronic component 2 is aligned in the vertical direction.

  FIG. 11 is a view for explaining the arrangement position of the magnet 51 and the direction of the lines of magnetic force M in the electronic component transport and alignment apparatus 1A according to the second embodiment. The magnet 51, which is a magnetic field application device, is provided at the position P2 as in the first embodiment. Similarly to FIG. 5, in FIG. 11, the magnetic lines of force M are indicated by broken lines.

  In this embodiment, as shown in FIG. 11, the magnet 51 is provided in the transfer stage 32. More specifically, the magnet 51 includes an S pole and an N pole so that the lines of magnetic force are output in a horizontal direction at a position vertically below the position where the electronic component 2 housed in the recess 31a of the transport rotor 31 passes. Are provided in such a manner that they are opposed to each other in the horizontal direction and in a square direction in the circumferential direction of the transport rotor 31. In this case, a horizontal magnetic field is applied to the electronic component 2 passing over the magnet 51, as shown in FIG.

  For this reason, when the electronic component 2 accommodated in the recess 31a of the transport rotor 31 passes over the magnet 51, the electronic component 2 does not rotate if the stacking direction of the internal electrodes 22a and 22b is the vertical direction. It is conveyed as it is. On the other hand, when the stacking direction of the internal electrodes 22a and 22b is a horizontal direction, the electronic component 2 rotates so that the stacking direction of the internal electrodes 22a and 22b becomes a vertical direction by the applied magnetic field. As a result, after the electronic component 2 passes over the magnet 51, the stacked direction of the internal electrodes 22a, 22b is aligned in the vertical direction, in other words, the main surfaces of the internal electrodes 22a, 22b are aligned in the horizontal direction. It is conveyed in the state where

  Here, as in the first embodiment, when the electronic component 2 housed in the recess 31a of the transport rotor 31 passes over the magnet 51, the suction mechanism performs suction of suction through the suction path 31d. Preferably, the force is temporarily reduced or the suction is temporarily stopped. By temporarily weakening the attractive force, including temporary suspension of suction, the electronic component 2 can be easily rotated by applying a magnetic field, so that the stacking direction of the internal electrodes 22a and 22b can be more effectively aligned. become.

  In addition, the magnetic field application apparatus which applies a magnetic field to the electronic component 2 is not limited to the magnet 51, and may be an electromagnet or a solenoid. In addition, the arrangement position of the magnetic field application device may be a position vertically above a position where the electronic component 2 accommodated in the recess 31a passes, that is, in the cover 33.

  The present invention is not limited to the above embodiment, and various applications and modifications can be made within the scope of the present invention. For example, the arrangement position of the magnets 50 and 51 may be a position before the position where the direction identifier 35 identifies the stacking direction of the internal electrodes 22a and 22b of the electronic component 2, and is limited to the position P1. There is nothing.

  Further, although the transport mechanism has been described as the disk-shaped transport rotor 31 having the concave portion 31 a on the outer peripheral surface and rotating around the central axis C, the transport mechanism is not limited to the transport rotor 31. That is, the transport mechanism may be a mechanism that transports the electronic component 2 in a state where the electronic component 2 is accommodated in the recess, and is a mechanism that transports the electronic component 2 in a linear direction, such as a belt-like mechanism. May be. Even in that case, the same effect as the case of the said embodiment can be acquired by setting it as the structure provided with the requirements of this invention.

DESCRIPTION OF SYMBOLS 1, 1A Electronic component conveyance alignment apparatus 2 Electronic component 3 Package 10 Ball feeder 11 Linear feeder 20 Electronic component main body 21a First external electrode 21b Second external electrode 22a First internal electrode 22b Second internal electrode 23 Dielectric ceramic layer 31 Conveying rotor 31a Concave portion 31c Linear groove 31d Suction path 32 Conveying stage 33 Cover 34 Control unit 35 Direction identifier 35a Magnetic field generator 35b Magnetic flux density detector 36 Imaging unit 36a Camera 36b Ring illumination 37 Sorting unit 41 Carrier Tape 41a Housing hole 42 Cover tape 43 Bottom tape 50, 51 Magnet M Magnetic field line

Claims (5)

An electronic component transport and alignment apparatus having a plurality of laminated internal electrodes having ferromagnetism therein,
A plurality of recesses for storing the electronic components, and a transport mechanism for transporting the electronic components stored in the recesses;
A magnetic field applying device that applies a magnetic field to the electronic component being transferred by the transfer mechanism in order to align the stacking direction of the internal electrodes in a predetermined direction;
With
The concave portion has a space that can be rotated so that the stacking direction of the internal electrodes is aligned with the predetermined direction when a magnetic field is applied to the housed electronic component.
An electronic component transport and alignment apparatus characterized by the above.   2. The electronic component transport alignment apparatus according to claim 1, wherein the transport mechanism is a disk-shaped transport rotor having a plurality of recesses for receiving the electronic components and rotating about a central axis. . The electronic component has a rectangular parallelepiped shape,
When a magnetic field is applied to the electronic component by the magnetic field application device, the electronic component is configured to rotate about the rotation axis with an axis parallel to the longitudinal direction of the electronic component as a rotation axis. The apparatus for transporting and aligning electronic components according to claim 1 or 2. A suction mechanism for fixing the electronic component in the recess by suction;
The suction mechanism temporarily weakens the suction force when the electronic component accommodated in the recess passes near the magnetic field application device. The electronic component conveyance alignment apparatus as described. A method of transporting and aligning electronic components having a rectangular parallelepiped shape having a plurality of laminated internal electrodes having ferromagnetism,
By applying a magnetic field to the electronic component during transportation of the electronic component, the electronic component is rotated about a rotation axis parallel to the longitudinal direction of the electronic component, and the stacking direction of the internal electrodes is set to a predetermined direction. Align,
A method for conveying and aligning electronic components.

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