JP2018092998A5 - - Google Patents

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Publication number
JP2018092998A5
JP2018092998A5 JP2016233367A JP2016233367A JP2018092998A5 JP 2018092998 A5 JP2018092998 A5 JP 2018092998A5 JP 2016233367 A JP2016233367 A JP 2016233367A JP 2016233367 A JP2016233367 A JP 2016233367A JP 2018092998 A5 JP2018092998 A5 JP 2018092998A5
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JP
Japan
Prior art keywords
circuit board
reinforcing
board according
reinforcing member
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016233367A
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English (en)
Japanese (ja)
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JP6855226B2 (ja
JP2018092998A (ja
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Priority to JP2016233367A priority Critical patent/JP6855226B2/ja
Priority claimed from JP2016233367A external-priority patent/JP6855226B2/ja
Publication of JP2018092998A publication Critical patent/JP2018092998A/ja
Publication of JP2018092998A5 publication Critical patent/JP2018092998A5/ja
Application granted granted Critical
Publication of JP6855226B2 publication Critical patent/JP6855226B2/ja
Active legal-status Critical Current
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JP2016233367A 2016-11-30 2016-11-30 回路基板及び電子機器 Active JP6855226B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016233367A JP6855226B2 (ja) 2016-11-30 2016-11-30 回路基板及び電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016233367A JP6855226B2 (ja) 2016-11-30 2016-11-30 回路基板及び電子機器

Publications (3)

Publication Number Publication Date
JP2018092998A JP2018092998A (ja) 2018-06-14
JP2018092998A5 true JP2018092998A5 (cg-RX-API-DMAC7.html) 2019-12-26
JP6855226B2 JP6855226B2 (ja) 2021-04-07

Family

ID=62566406

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016233367A Active JP6855226B2 (ja) 2016-11-30 2016-11-30 回路基板及び電子機器

Country Status (1)

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JP (1) JP6855226B2 (cg-RX-API-DMAC7.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119325180B (zh) * 2023-07-17 2025-10-10 庆鼎精密电子（淮安）有限公司 电路板及其制造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000068328A (ja) * 1998-08-21 2000-03-03 Olympus Optical Co Ltd フリップチップ実装用配線基板
JP2011210755A (ja) * 2010-03-29 2011-10-20 Panasonic Corp 実装基板
JP5445340B2 (ja) * 2010-06-10 2014-03-19 富士通株式会社 基板補強構造、基板組立体、及び電子機器
JP5132801B1 (ja) * 2011-07-14 2013-01-30 株式会社東芝 テレビジョン受像機、及び電子機器
JP5845792B2 (ja) * 2011-10-07 2016-01-20 株式会社村田製作所 電子部品
JP2014130865A (ja) * 2012-12-28 2014-07-10 Keihin Corp 多層回路基板及び多層回路基板を備えた電子機器

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