JP2018080977A - Manufacturing method of radiation detection device, radiation detection device and radiation detection system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology that suppresses image quality degradation in a radiation detection device using a scintillator.SOLUTION: A manufacturing method of a radiation detection device comprising a scintillator having columnar crystals placed on a substrate and a protection film covering the scintillator is provided, and the scintillator includes an abnormal growth part which protrudes more than other parts in a surface of the scintillator. The manufacturing method comprises: a flattening step that flattens the scintillator by applying pressure at least the abnormal growth part of the scintillator through an adhesion prevention part using a flattening member; and a forming step that forms the protection film after the flattening step, and a material having smaller surface energy than the surface energy of the material used in the surface of the protection film is used in the surface of the adhesion prevention part.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing a radiation detection apparatus, a radiation detection apparatus, and a radiation detection system.

  2. Description of the Related Art Radiation detection apparatuses that combine a scintillator that converts radiation into light and a photoelectric conversion element that detects light converted by the scintillator are widely used. When manufacturing a scintillator having columnar crystals, some columnar crystals may grow abnormally, and an abnormally grown portion that protrudes more than other portions may be formed on the surface of the scintillator. Since the abnormally grown portion is thicker than the other portions, there is a possibility that the characteristics are different from other portions such as the amount of light converted from radiation. Therefore, when an abnormally grown portion is formed on the surface of the scintillator, characteristics such as light emission amount and sharpness may vary within the surface of the scintillator. Patent Document 1 discloses that after the scintillator is formed, pressure is applied from the surface of the scintillator to flatten the surface of the scintillator where the abnormally grown portion is formed. Patent Document 2 shows that after forming a protective film that protects the scintillator from mechanical stress and moisture so as to cover the surface of the scintillator, the surface of the scintillator in which the abnormally grown portion is formed is flattened. ing.

JP 2011-2472 A JP 2003-66196 A

  In the configurations shown in Patent Documents 1 and 2, when flattened using a flattening member such as a flat plate in order to flatten the surface of the scintillator in which the abnormally grown portion is formed, the abnormally grown portion that has been crushed is There is a possibility of adhering to the flattening member and detaching from the surface of the scintillator. When the abnormal growth part is detached from the scintillator, the scintillator surface is thin or there is no part of the scintillator, and the characteristics such as the amount of light emission and sharpness can vary within the surface of the scintillator. There is sex. When the characteristics of the scintillator vary in the plane of the scintillator, the image quality of the obtained image can be deteriorated.

  An object of the present invention is to provide a technique for suppressing deterioration in image quality in a radiation detection apparatus using a scintillator.

  In view of the above problems, a method for manufacturing a radiation detection apparatus according to an embodiment of the present invention includes a scintillator having a columnar crystal disposed on a substrate, and a protective film that covers the scintillator. Then, the scintillator includes an abnormal growth portion that protrudes more than other portions on the surface of the scintillator, and pressurizes at least the abnormal growth portion of the scintillator using a flattening member via the adhesion preventing portion, A planarization step of planarizing the scintillator, and a step of forming a protective film after the planarization step, wherein the surface energy of the adhesion preventing portion is smaller than the surface energy of the material used for the surface of the protective film A material having the following is used.

  By the above means, a technique for suppressing deterioration in image quality in a radiation detection apparatus using a scintillator is provided.

Sectional drawing which shows the manufacturing method of the radiation detection apparatus which concerns on embodiment of this invention. Sectional drawing which shows the modification of the manufacturing method of FIG. Sectional drawing which shows the modification of the manufacturing method of FIG. The figure which shows the structural example of the radiation detection system using the radiation detection apparatus of this invention.

  Hereinafter, specific embodiments of a method for manufacturing a radiation detection apparatus, a radiation detection apparatus, and a radiation detection system according to the present invention will be described with reference to the accompanying drawings. Note that, in the following description and drawings, common reference numerals are given to common configurations over a plurality of drawings. Therefore, a common configuration is described with reference to a plurality of drawings, and a description of a configuration with a common reference numeral is omitted as appropriate. The radiation in the present invention includes a beam having energy of the same degree or more, such as X-rays, β-rays, γ-rays, etc., which are beams formed by particles (including photons) emitted by radiation decay, such as X It can also include rays, particle rays, and cosmic rays.

  With reference to Fig.1 (a)-(e), the structure and manufacturing method of the radiation detection apparatus by embodiment of this invention are demonstrated. 1A to 1E are cross-sectional views illustrating a method for manufacturing a radiation detection apparatus according to an embodiment of the present invention. In this embodiment, the process of forming the scintillator for converting the radiation which injects into a radiation detection apparatus into light among the manufacturing methods of a radiation detection apparatus is demonstrated in detail.

  First, as shown in FIG. 1A, a scintillator 102 is formed on a substrate 101. In the present embodiment, a plurality of photoelectric conversion elements for detecting light converted from radiation by the scintillator 102 are arranged on the surface of the substrate 101 where the scintillator 102 is formed. Therefore, the substrate 101 can be called a sensor panel. In addition, a protective layer (not shown) that protects the photoelectric conversion elements is formed on the surface of the substrate 101 on which the scintillator 102 is arranged so as to cover the plurality of arranged photoelectric conversion elements. Further, in the peripheral portion of the region where the photoelectric conversion element is arranged at the end of the substrate 101, a drive electrode (not shown) for driving the photoelectric conversion element connected to the external circuit or generated by the photoelectric conversion element Extraction electrodes (not shown) for taking out signals are arranged respectively. Since a wiring for connecting the external circuit and the drive electrode and the extraction electrode is provided in the peripheral portion of the substrate 101 where the drive electrode and the extraction electrode are disposed, as shown in FIG. It does not have to be formed.

  In the present embodiment, cesium iodide (CsI) is used as the material of the scintillator 102. CsI formed on the substrate 101 by vapor deposition can be a columnar crystal in which the crystal grows in a columnar shape. In addition, for example, thallium (Tl), sodium (Na), or the like is added to CsI as an activator. By adding a small amount of Tl or Na to CsI, visible light emission of CsI becomes possible. The material of the scintillator 102 is not limited to CsI, and for example, a material mainly containing an alkali halide may be used. In the scintillator containing an alkali halide as a main component, crystals grow in a columnar shape as in the scintillator made of CsI.

  In this embodiment, a radiation detection apparatus having a configuration in which the scintillator 102 is formed directly on the substrate 101 on which the photoelectric conversion element is arranged is shown. However, the configuration of the radiation detection apparatus is not limited to this. Absent. For example, a substrate using aluminum or carbon on which a scintillator is formed and a sensor panel on which a photoelectric conversion element is formed may be bonded so that the scintillator and the photoelectric conversion element face each other. In this case, a reflection layer for reflecting light converted from radiation by the scintillator may be provided between the substrate on which the scintillator is formed and the scintillator.

  When a columnar crystal is formed by vapor deposition of CsI as the scintillator 102, an abnormally grown portion in which the crystal grows abnormally in the film or surface of the scintillator 102 as compared with other portions as shown in FIG. 103 may be formed. The abnormal growth portion 103 has columnar shapes such as impurities remaining on the surface of the substrate 101 such as impurities, dust and scratches, and foreign matter caused by material bumping when heating the vapor deposition material (CsI in this embodiment). Generated by abnormal growth of crystals. The abnormally grown portion 103 protrudes more than other portions on the surface of the scintillator 102 and is thicker than a portion where normal crystal growth has occurred. For this reason, there is a possibility that the conversion efficiency from radiation to light is different from other parts. For example, there is a possibility that the amount of light converted from radiation is larger than that of the portion other than the abnormal growth portion 103. In addition, the crystal growth direction and crystal structure may be different from those of other parts. For this reason, there is a possibility that the conversion efficiency from radiation to light is different from other parts, and the converted light may be scattered or refracted in a direction different from other parts. As a result, the abnormally grown portion 103 is formed in the scintillator 102, and there is a possibility that characteristics such as the light emission amount and the sharpness vary in the plane of the scintillator 102. When the characteristics in the surface of the scintillator 102 vary, the image quality of the detected radiation image may be deteriorated.

  In the present embodiment, the surface of the scintillator 102 where the abnormally grown portion 103 is formed is flattened in order to suppress variation in characteristics within the surface of the scintillator 102. First, as shown in FIG. 1B, the adhesion preventing portion 104 is formed so as to cover the surface of the scintillator 102 where the abnormally grown portion 103 is formed. When the abnormal growth portion 103 is crushed by the flattening member 105 described later, the adhesion preventing portion 104 adheres to the flattening member 105 and the scintillator 102 of the abnormal growth portion 103 is detached from the surface of the scintillator 102. It has a function to suppress separation.

In order to suppress adhesion of the scintillator 102, a material having a small surface energy is used for the adhesion preventing unit 104. Specifically, using a material in which the surface energy of the adhesion preventing unit 104 is smaller than the surface energy of the protective film 107 formed to protect the scintillator 102 from moisture in the atmosphere or mechanical stress, The adhesion preventing part 104 is formed. That is, a material having a surface energy smaller than that of the material used for the surface of the protective film 107 can be used for the surface of the adhesion preventing unit 104. For example, a material having a surface energy of 20 mN / m (20 mJ / m ² ) or less may be used for the adhesion preventing unit 104. Materials having a surface energy of 20 mN / m or less include polytetrafluoroethylene (PTFE), tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer (PFA), tetrafluoroethylene / hexafluoropropylene copolymer (FEP), tetra Fluoropolymers containing fluorine in the constituent molecules such as fluoroethylene / ethylene copolymer (ETFE), polyvinylidene fluoride (PVDF), polychlorotrifluoroethylene (PCTFE), chlorotrifluorethylene / ethylene copolymer (ECTFE) Is mentioned. For example, PTFE has a surface energy of about 19 mN / m, and PFA and FEP each have a surface energy of about 18 mN / m.

  The adhesion preventing unit 104 does not need to have a function as a protective film that protects the scintillator 102 from moisture in the atmosphere only by suppressing the scintillator 102 from adhering to the planarization member 105. In order to function as a protective film, a film thickness of several μm or more, for example, about 50 to 70 μm may be required, but the adhesion preventing unit 104 may be formed thin on the surface of the scintillator 102. The film thickness of the adhesion preventing unit 104 may be, for example, 1 μm or less, or 500 nm or less. Further, the film thickness of the adhesion preventing unit 104 may be about 10 nm to 100 nm. Since it is not necessary to increase the film thickness of the adhesion preventing unit 104, the cost and tact time required for the material for forming the adhesion preventing unit 104 can be minimized.

  After forming the adhesion preventing portion 104, as shown in FIG. 1C, the scintillator 102 having the abnormally grown portion 103 formed on the surface is pressurized through the adhesion preventing portion 104 using the flattening member 105. A flattening step for flattening is performed. By applying pressure using the flattening member 105, the abnormal growth portion 103 is crushed and the surface of the scintillator 102 is flattened. Since the adhesion preventing portion 104 having a small surface energy is disposed between the scintillator 102 and the flattening member 105, the scintillator 102 of the abnormally growing portion 103 is removed when the flattening member 105 is separated from the surface of the scintillator 102 after pressing. It becomes difficult to adhere to the planarizing member 105. Accordingly, it is possible to suppress the abnormal growth portion 103 from being detached from the scintillator 102 after the abnormal growth portion 103 is crushed by the flattening member 105.

  The flattening member 105 used for the pressurization includes a hard plate-like member having a flat surface, such as a glass plate, a metal plate such as aluminum or stainless steel, a carbon plate, acrylic, polyimide, polyetheretherketone (PEEK), or the like. A hard resin plate or the like can be used. Among them, a glass plate, a metal plate such as aluminum, stainless steel, and the like can easily obtain a flat surface and are relatively inexpensive. Therefore, it is easy to use as the flattening member 105 as compared with other members. is there.

  The pressurization using the flattening member 105 only needs to uniformly pressurize the surface of the scintillator 102. For example, after the flattening member 105 is installed, a method of applying pressure using a roller, or a plurality of points (for example, distributed at equal distances on the back surface of the flattening member 105 (the surface opposite to the surface facing the scintillator 102)) 9 points) may be used at the same time. Further, the planarizing member 105 may be a roller-shaped member using the above-described material. By moving the roller-like flattening member 105 while maintaining an appropriate pressure on the surface of the scintillator 102, the surface of the scintillator 102 is flattened.

  Here, when the scintillator 102 is flattened by the flattening member 105, the adhesion preventing unit 104 only needs to be disposed on at least the abnormal growth portion 103 in the scintillator 102. As will be described later, for example, the adhesion preventing unit 104 may be formed on the abnormal growth unit 103 and may not be formed at a place other than the abnormal growth unit 103. Further, for example, the adhesion preventing portion 104 may not be formed on the scintillator 102 but may be disposed on a portion of the planarizing member 105 that presses at least the abnormal growth portion 103.

  Using the above steps, as shown in FIG. 1D, the scintillator 102 having the flattened portion 106 crushed by the abnormal growth portion 103 being pressed is formed. When the surface of the scintillator 102 is flattened, the adhesion preventing unit 104 is disposed between the abnormal growth portion 103 of the scintillator 102 and the flattening member 105, so that the scintillator 102 of the abnormal growth portion 103 is attached to the surface of the scintillator 102. Detachment from is suppressed. As a result, a flattened scintillator 102 can be obtained, and variations in characteristics within the surface of the scintillator 102 are suppressed. As a result, deterioration of the image quality of the radiation image detected by the radiation detection apparatus using the flattened scintillator 102 is suppressed.

  After flattening the surface of the scintillator 102, CsI used in the scintillator 102 in this embodiment exhibits deliquescent properties. Therefore, as shown in FIG. 1E, a protective film 107 that protects the scintillator 102 from moisture in the atmosphere. Form. The protective film 107 can protect the scintillator 102 from mechanical stress. As the material of the protective film 107, an olefin resin, a polyimide resin, an acrylic resin, an epoxy resin, or the like containing a polyparaxylylene resin such as polyparachloroxylylene can be used. Polyparaxylylene resin such as polyparachloroxylylene is about 30 mN / m, polyimide resin is about 40-50 mN / m, acrylic resin is about 35-40 mN / m, and epoxy resin is about 50 mN / m. Each has energy. For this reason, in this embodiment, the surface energy of the protective film 107 is larger than the surface energy of the adhesion preventing unit 104. In the method disclosed in Patent Document 2, the surface of the scintillator is flattened after forming the protective film. For this reason, a part of the scintillator adheres to the protective film having a relatively large free energy, and a part of the protective film adheres to the flattening member, so that a part of the scintillator is detached from the surface of the scintillator. there is a possibility. However, in this embodiment, since it is less necessary to perform a planarization process after the formation of the protective film 107, it is difficult to think that the scintillator 102 is attached to and detached from the protective film 107. Here, the magnitude relationship between the surface energies of the adhesion preventing unit 104 and the protective film 107 can be evaluated by evaluating wettability such as the contact angle of water droplets on the surfaces of the adhesion preventing unit 104 and the protective film 107. .

  After the formation of the protective film 107, the drive electrode and readout electrode formed on the substrate 101 are connected to an external circuit. By using these steps, a radiation detection apparatus in which the adhesion preventing unit 104 is disposed between the scintillator 102 and the protective film 107 is completed.

First Embodiment Next, a first embodiment of the present invention will be described with reference to FIGS. First, the substrate 101 was prepared. On the substrate 101, a plurality of photoelectric conversion elements and a protective layer for protecting the plurality of photoelectric conversion elements are formed. In addition, a drive electrode for driving the photoelectric conversion element and an extraction electrode for extracting a signal generated by the photoelectric conversion element are formed on the periphery (end) of the substrate 101, respectively.

  Next, a scintillator 102 having a columnar crystal structure was formed on the surface of the substrate 101 on which the photoelectric conversion element is arranged. The scintillator 102 was formed by vapor deposition using thallium-added cesium iodide (CsI: Tl) as a material. In the scintillator 102, it was visually confirmed that a plurality of abnormally grown portions 103 as shown in FIG.

  The center part of the scintillator 102 formed on another substrate was cut out using the same vapor deposition method as described above, and the film thickness was measured. As a result, the film thickness was 600 μm. Also in this sample, formation of the abnormally grown portion 103 where the columnar crystals grew abnormally was confirmed. This sample was observed using a scanning electron microscope (SEM). When the abnormal growth portion 103 was observed, the film thickness of the abnormal growth portion 103 was about 700 μm.

  Next, as shown in FIG. 1B, an adhesion preventing portion 104 was formed so as to cover the scintillator 102. As a material for the adhesion preventing unit 104, a fluororesin was used. In this example, Novec manufactured by 3M Japan Ltd. was used as the fluororesin. This fluororesin has a surface energy of about 10 to 15 mN / m. The adhesion preventing part 104 was formed by coating the surface of the scintillator 102 on which the abnormally growing part 103 was formed with a fluororesin dissolved in a solvent and then drying using a spray coating method. In this example, the surface energy of the formed adhesion preventing portion 104 was 13.6 mN / m. In this embodiment, the adhesion preventing portion 104 is formed on the entire surface of the scintillator 102.

  After the formation of the adhesion preventing portion 104, as shown in FIG. 1C, the abnormally grown portion 103 is crushed through the adhesion preventing portion 104 by the flattening member 105 using a glass plate having a flat surface, and a scintillator is formed. 102 was flattened. When flattening, the flattening member 105 installed on the scintillator 102 was pressed with a roller to flatten the entire surface of the scintillator 102.

  Thereafter, the flattening member 105 was removed from the scintillator 102, and the scintillator 102 having the flattened portion 106 in which the abnormal growth portion 103 was flattened as shown in FIG. 1D was obtained. At this time, no adhesion of the scintillator 102 such as the abnormal growth portion 103 to the portion of the flattening member 105 that contacts the scintillator 102 via the adhesion prevention portion 104 is found, and the abnormal growth portion 103 is not detached from the scintillator 102 and is flattened. It has been confirmed that. Further, when the shape of the abnormally grown portion 103 was observed by SEM, it was confirmed that the flattened portion 106 was flattened at the top of the abnormally grown portion 103 and had the same height as the surface of the other scintillator 102. It was. Even after the top of the abnormal growth portion is flattened, the abnormal growth portion 103 is formed by the difference in the size of each columnar crystal or the top portion being crushed as shown in FIG. The flattened portion 106 can be distinguished from other portions of the scintillator 102.

  Thereafter, as shown in FIG. 1E, a protective film 107 for protecting the scintillator 102 from moisture in the atmosphere was formed. For the protective film 107, a hot-melt resin containing the above-described material was used. After the formation of the protective film 107, a radiation detection apparatus in which a drive electrode and a readout electrode formed on the substrate 101 are connected to an external circuit and the like, and an adhesion preventing unit 104 is disposed on the abnormal growth unit 103 of the scintillator 102. completed.

Second Embodiment A second embodiment of the present invention will be described with reference to FIGS. In the first embodiment described above, the adhesion preventing portion 104 is formed on the scintillator 102. However, in this embodiment, the flattening member 105 in which the adhesion preventing portion 204 is arranged on the portion in contact with the surface of the scintillator 102, The scintillator 102 in which the abnormal growth portion 103 was formed was flattened.

  First, as shown in FIG. 2A, the scintillator 102 including the abnormally grown portion 103 was formed on the substrate 101 using the same process as that of FIG. Further, as shown in FIG. 2B, a flat surface formed on the surface in contact with the surface of the scintillator 102 is an adhesion prevention unit 204 using the same material as the adhesion prevention unit 104 used in the first embodiment. Preparation member 105 was prepared. The adhesion preventing unit 204 may be disposed on a portion of the surface of the planarizing member 105 that contacts the surface of the scintillator 102 that presses the abnormal growth unit 103. In the present embodiment, as shown in FIG. 2B, the adhesion preventing unit 204 is uniformly disposed on the surface of the flattening member 105 that contacts the surface of the scintillator 102.

  Next, as shown in FIG. 2C, the surface of the scintillator 102 where the abnormal growth portion 103 is formed is pressurized using the flattening member 105 where the adhesion preventing portion 204 is formed. Crushed.

  Thereafter, the flattening member 105 was removed from the scintillator 102, and the scintillator 102 having the flattened portion 106 obtained by flattening the abnormal growth portion 103 as shown in FIG. 2D was obtained. At this time, no adhesion of the scintillator 102 such as the abnormal growth portion 103 to the portion of the adhesion preventing portion 204 arranged on the flattening member 105 in contact with the scintillator 102 was found. Further, the scintillator 102 has a shape as shown in FIG. 2D, and the abnormal growth portion 103 is not detached from the scintillator 102, the flattening portion 106 is formed, and the surface of the scintillator 102 is flattened. It could be confirmed.

  Thereafter, a protective film 107 was formed in the same manner as in the first embodiment. Furthermore, the radiation detection apparatus was completed by connecting a driving circuit, a reading circuit board, and the like to an external circuit.

Third Embodiment A third embodiment of the present invention will be described with reference to FIGS. In the first embodiment described above, the adhesion preventing portion 104 is formed on the entire surface of the scintillator 102, but in this embodiment, the adhesion preventing portion 304 is formed only in the abnormal growth portion 103 and its peripheral portion of the scintillator 102, The scintillator 102 in which the abnormal growth portion 103 was formed was flattened.

  First, as shown in FIG. 3A, the scintillator 102 including the abnormally grown portion 103 was formed on the substrate 101 by using the same process as that of FIG. Next, as shown in FIG. 3B, the abnormal growth portion 103 of the scintillator 102 and the adhesion preventing portion 304 were formed in the peripheral portion thereof. It is sufficient that the adhesion preventing unit 304 is formed on at least the abnormal growth unit 103 in the scintillator 102. The adhesion preventing portion 304 was formed by spraying a fluororesin dissolved in a solvent to the abnormal growth portion 103 using the spray coating method as in the first embodiment. Compared to the first embodiment described above, since the area for forming the adhesion preventing portion 304 is small, the amount of material used to form the adhesion preventing portion 304 can be reduced.

  For example, the position where the adhesion preventing unit 304 is formed may be detected by visually observing the scintillator 102 in which the abnormal growth unit 103 is formed. Further, for example, the position where the adhesion preventing unit 304 is formed may be detected by imaging the scintillator 102 using a camera and detecting the abnormal growth unit 103 by image recognition. Thereafter, the fluororesin is sprayed manually or automatically based on the detected coordinate information of the abnormal growth portion 103 to form the adhesion preventing portion 304 on the abnormal growth portion 103.

  Next, in the same way as in the first embodiment, as shown in FIG. 3C, the flattening member 105 is used to press the abnormal growth portion 103 by pressing the scintillator 102 where the abnormal growth portion 103 is formed. I crushed it. Thereafter, the flattening member 105 was removed, and a scintillator 102 having a flattened portion 106 in which the top of the abnormally grown portion 103 was flattened as shown in FIG. 3D was obtained.

  Also in the present example, as in the first and second examples described above, no adhesion of the scintillator 102 such as the abnormally grown portion 103 to the planarizing member 105 was found. Further, the scintillator 102 has a shape as shown in FIG. 3D. The abnormal growth portion 103 is not detached from the scintillator 102, the flattening portion 106 is formed, and the surface of the scintillator 102 is flattened. It could be confirmed.

  Thereafter, a protective film 107 was formed in the same manner as in the first embodiment. After the formation of the protective film 107, a radiation detection apparatus in which a drive electrode and a readout electrode formed on the substrate 101 are connected to an external circuit and the like, and an adhesion preventing unit 104 is disposed on the abnormal growth unit 103 of the scintillator 102. completed. At this time, the adhesion preventing unit 104 is disposed between all the abnormally grown portions 103 formed in the scintillator 102 and the protective film 107, thereby further suppressing the detachment of the scintillator 102 of the abnormally grown portion 103. It becomes possible.

Comparative Example As a comparative example, the surface of the scintillator 102 on which the abnormally grown portion 103 was formed was flattened using the flattening member 105 without providing the adhesion preventing portion 104. A radiation detection apparatus was produced in the same manner as in the first embodiment except that the adhesion preventing unit 104 was not formed.

  When the abnormal growth portion 103 was crushed by the flattening member 105, a part of the abnormal growth portion 103 adhered to the flattening member 105. As the scintillator 102 of the abnormal growth portion 103 was detached from the surface of the scintillator 102, a plurality of steps were confirmed on the surface of the scintillator 102.

  In this embodiment, when the surface of the scintillator 102 having the abnormal growth portion 103 is flattened using the flattening member 105, the scintillator 102 is crushed by the flattening member 105 at least above the abnormal growth portion 103. An adhesion preventing unit 104 is provided. It was shown that by arranging the adhesion preventing portion 104 having a small surface energy, the abnormal growth portion 103 can be prevented from adhering to the planarizing member 105 and being detached from the scintillator 102 when the abnormal growth portion 103 is crushed. By flattening the scintillator 102 of the abnormally grown portion 103 generated on the surface of the scintillator 102 without removing it, variation in characteristics within the surface of the scintillator 102 is suppressed. By suppressing the variation in the characteristics of the scintillator 102, it is possible to suppress the deterioration of the image quality of the radiation image detected in the radiation detection apparatus using the flattened scintillator 102.

  As mentioned above, although embodiment and the Example which concern on this invention were shown, it cannot be overemphasized that this invention is not limited to these Embodiment and Example, In the range which does not deviate from the summary of this invention, embodiment mentioned above The embodiments can be appropriately changed and combined.

  Hereinafter, a radiation detection system incorporating the radiation detection apparatus 6040 using the flattened scintillator 102 will be described as an example with reference to FIG. X-rays 6060 generated by an X-ray tube 6050 serving as a radiation source pass through the chest 6062 of the patient or subject 6061 and enter the radiation detection apparatus 6040 of the present invention. This incident X-ray includes information inside the body of the patient or subject 6061. In the radiation detection apparatus 6040, the scintillator 102 emits light in response to the incidence of the X-ray 6060, and this is photoelectrically converted by the photoelectric conversion element to obtain electrical information. This information is converted into digital data, image-processed by an image processor 6070 as a signal processing unit, and can be observed on a display 6080 as a display unit of a control room.

  Further, this information can be transferred to a remote place by a transmission processing unit such as a network 6090 such as a telephone, a LAN, and the Internet. In this way, it can be displayed on a display 6081 which is a display unit such as a doctor room in another place, and a doctor in a remote place can make a diagnosis. In addition, this information can be recorded on a recording medium such as an optical disk, and can also be recorded on a film 6110 serving as a recording medium by the film processor 6100.

101: substrate, 102: scintillator, 103: convex part, 104, 204, 304: adhesion preventing part, 105: flattening member, 106: flattening part, 107: protective film

Claims (13)

A scintillator having a columnar crystal disposed on a substrate, and a protective film that covers the scintillator, and a method for manufacturing a radiation detection apparatus,
The scintillator includes an abnormally grown portion that protrudes more than other portions on the surface of the scintillator,
A flattening step of flattening the scintillator by pressurizing at least the abnormally grown portion of the scintillator using a flattening member via an adhesion preventing portion;
Forming the protective film after the planarization step,
A manufacturing method characterized in that a material having a surface energy smaller than the surface energy of the material used for the surface of the protective film is used for the surface of the adhesion preventing part.   The manufacturing method according to claim 1, wherein a surface energy of the adhesion preventing portion is smaller than a surface energy of the protective film.   The surface energy of the said adhesion prevention part is 20 mN / m or less, The manufacturing method of Claim 2 characterized by the above-mentioned.   The manufacturing method according to claim 1, wherein the adhesion preventing portion includes a fluororesin.   The manufacturing method according to any one of claims 1 to 4, further comprising a step of forming the adhesion preventing portion on at least the abnormally grown portion of the scintillator before the planarization step. Method.   The manufacturing method according to claim 5, wherein the adhesion preventing portion is formed using a spray coating method. The step of forming the adhesion preventing portion includes
Detecting the abnormally grown portion of the scintillator;
Forming the adhesion prevention part on the detected abnormal growth part;
The manufacturing method of Claim 5 or 6 characterized by the above-mentioned.   5. The manufacturing method according to claim 1, wherein the adhesion preventing portion is disposed at least in a portion of the flattening member that pressurizes the abnormally growing portion.   9. A plurality of photoelectric conversion elements for detecting light converted from radiation by the scintillator is disposed on a surface of the substrate on which the scintillator is formed. The manufacturing method as described in.   The manufacturing method according to claim 1, wherein the scintillator is formed using a vapor deposition method. A scintillator having a columnar crystal disposed on a substrate, an adhesion preventing unit, and a protective film covering the scintillator and the adhesion preventing unit,
The scintillator includes an abnormal growth part,
The adhesion preventing portion is disposed on at least the abnormal growth portion of the scintillator,
A radiation detecting apparatus, wherein a material having a surface energy smaller than a surface energy of a material used for the surface of the protective film is used for the surface of the adhesion preventing unit.   The radiation detection apparatus according to claim 11, wherein a surface energy of the adhesion preventing unit is smaller than a surface energy of the protective film. The radiation detection apparatus according to claim 11 or 12,
A signal processing unit for processing a signal from the radiation detection device;
A radiation detection system comprising:

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