JP2018078333A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2018078333A5 JP2018078333A5 JP2018004933A JP2018004933A JP2018078333A5 JP 2018078333 A5 JP2018078333 A5 JP 2018078333A5 JP 2018004933 A JP2018004933 A JP 2018004933A JP 2018004933 A JP2018004933 A JP 2018004933A JP 2018078333 A5 JP2018078333 A5 JP 2018078333A5
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting element
- translucent member
- light
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000006243 chemical reaction Methods 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 6
- 239000007788 liquid Substances 0.000 claims 5
- 239000000463 material Substances 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- 230000001070 adhesive Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
Claims (6)
発光素子の第1の面と前記波長変換部材の第2の面とを向かい合わせ、前記発光素子の前記第1の面と前記波長変換部材の前記第2の面との間に接着剤を配置して、前記波長変換部材の上に前記発光素子を固定する工程と、 A first surface of the light emitting element and a second surface of the wavelength conversion member are faced to each other, and an adhesive is disposed between the first surface of the light emitting element and the second surface of the wavelength conversion member. And fixing the light emitting element on the wavelength conversion member,
前記発光素子の側面の一部と、前記波長変換部材の前記第2の面のうち前記発光素子が固定された領域より外側の一部とを覆うように、透光性部材を形成する工程と、 Forming a translucent member so as to cover a part of the side surface of the light emitting element and a part of the second surface of the wavelength conversion member outside the region where the light emitting element is fixed; ,
前記透光性部材の外面を覆うように、被覆部材を形成する工程と、 Forming a covering member so as to cover the outer surface of the translucent member;
を含む、発光装置の製造方法。 A method for manufacturing a light emitting device, comprising:
前記波長変換部材の上に液状樹脂材料を配置すること、及び、 Disposing a liquid resin material on the wavelength conversion member; and
前記液状樹脂材料を硬化させて前記透光性部材にすることを含む、請求項1に記載の発光装置の製造方法。 The method for manufacturing a light-emitting device according to claim 1, comprising curing the liquid resin material to form the translucent member.
前記透光性部材を形成する工程は、 The step of forming the translucent member includes:
前記透光性部材となる液状樹脂材料を前記発光素子の前記第1の辺と前記波長変換部材との境界に沿って配置することを含む、請求項1〜3のいずれか1項に記載の発光装置の製造方法。 The liquid resin material to be the light transmissive member is disposed along a boundary between the first side of the light emitting element and the wavelength conversion member. Manufacturing method of light-emitting device.
前記透光性部材を形成する工程は、 The step of forming the translucent member includes:
前記透光性部材となる液状樹脂材料が前記発光素子の前記第2の辺の一部と接触することを含む、請求項1〜4のいずれか1項に記載の発光装置の製造方法。 The manufacturing method of the light-emitting device of any one of Claims 1-4 including that the liquid resin material used as the said translucent member contacts with a part of said 2nd edge | side of the said light emitting element.
前記透光性部材を形成する工程は、 The step of forming the translucent member includes:
前記透光性部材となる液状樹脂材料が、前記発光素子の第3の辺の一部を被覆し、かつ、前記第3の辺の端部となる前記発光素子の角部に達しないことを含む、請求項1〜5のいずれか1項に記載の発光装置の製造方法。 The liquid resin material that becomes the translucent member covers a part of the third side of the light emitting element and does not reach the corner of the light emitting element that becomes the end of the third side. The manufacturing method of the light-emitting device of any one of Claims 1-5 containing.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015076137 | 2015-04-02 | ||
JP2015076137 | 2015-04-02 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016242397A Division JP6278101B2 (en) | 2015-04-02 | 2016-12-14 | Light emitting device |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2018078333A JP2018078333A (en) | 2018-05-17 |
JP2018078333A5 true JP2018078333A5 (en) | 2018-11-22 |
JP6724933B2 JP6724933B2 (en) | 2020-07-15 |
Family
ID=57358595
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016048776A Active JP6065135B2 (en) | 2015-04-02 | 2016-03-11 | Light emitting device |
JP2016242397A Active JP6278101B2 (en) | 2015-04-02 | 2016-12-14 | Light emitting device |
JP2018004933A Active JP6724933B2 (en) | 2015-04-02 | 2018-01-16 | Method for manufacturing light emitting device |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016048776A Active JP6065135B2 (en) | 2015-04-02 | 2016-03-11 | Light emitting device |
JP2016242397A Active JP6278101B2 (en) | 2015-04-02 | 2016-12-14 | Light emitting device |
Country Status (3)
Country | Link |
---|---|
JP (3) | JP6065135B2 (en) |
CN (1) | CN106058006B (en) |
TW (2) | TWI727512B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7208478B2 (en) | 2018-09-28 | 2023-01-19 | 日亜化学工業株式会社 | Light emitting device and manufacturing method thereof |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6575828B2 (en) | 2015-07-22 | 2019-09-18 | パナソニックIpマネジメント株式会社 | Light emitting device and light emitting module |
CN109983589B (en) * | 2015-12-29 | 2022-04-12 | 亮锐控股有限公司 | Flip chip LED with side reflector and phosphor |
JP7011143B2 (en) * | 2016-11-30 | 2022-01-26 | 日亜化学工業株式会社 | Manufacturing method of light emitting device |
JP6776855B2 (en) * | 2016-12-06 | 2020-10-28 | 日亜化学工業株式会社 | Light emitting device |
US10522728B2 (en) | 2017-01-26 | 2019-12-31 | Maven Optronics Co., Ltd. | Beveled chip reflector for chip-scale packaging light-emitting device and manufacturing method of the same |
KR20180090006A (en) * | 2017-02-02 | 2018-08-10 | 서울반도체 주식회사 | Light emitting diode unit |
DE102017107226A1 (en) | 2017-04-04 | 2018-10-04 | Osram Opto Semiconductors Gmbh | Method for producing a plurality of radiation-emitting semiconductor components and radiation-emitting semiconductor component |
DE102017107234A1 (en) * | 2017-04-04 | 2018-10-18 | Osram Opto Semiconductors Gmbh | Method for producing a plurality of radiation-emitting semiconductor components and radiation-emitting semiconductor component |
JP6729525B2 (en) * | 2017-09-14 | 2020-07-22 | 日亜化学工業株式会社 | Method for manufacturing light emitting device |
JP6806023B2 (en) * | 2017-09-29 | 2020-12-23 | 日亜化学工業株式会社 | Light emitting device |
JP6806042B2 (en) | 2017-11-28 | 2021-01-06 | 日亜化学工業株式会社 | Light emitting device |
DE102017128717B4 (en) * | 2017-12-04 | 2023-03-09 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Process for producing an optoelectronic component |
CN110010745A (en) * | 2017-12-25 | 2019-07-12 | 日亚化学工业株式会社 | The manufacturing method of light emitting device and light emitting device |
US10461231B2 (en) | 2018-02-27 | 2019-10-29 | Lumens Co., Ltd. | Method for fabricating LED package |
KR102527384B1 (en) | 2018-03-09 | 2023-04-28 | 삼성전자주식회사 | Light emitting diode package and method for manufacturing the same |
JP6760321B2 (en) * | 2018-03-20 | 2020-09-23 | 日亜化学工業株式会社 | Light emitting device and manufacturing method of light emitting device |
JP7037052B2 (en) * | 2018-04-20 | 2022-03-16 | 日亜化学工業株式会社 | Light emitting device and manufacturing method of light emitting device |
JP2019201089A (en) * | 2018-05-15 | 2019-11-21 | マブン オプトロニックス カンパニー リミテッドMaven Optronics Co., Ltd. | Oblique angle chip reflector of chip scale packaging light emission device and manufacturing method of the same |
CN110794614B (en) * | 2018-08-03 | 2022-10-25 | 日亚化学工业株式会社 | Light emitting module |
JP7174231B2 (en) * | 2018-09-25 | 2022-11-17 | 日亜化学工業株式会社 | Light-emitting device manufacturing method and light-emitting device |
JP7299492B2 (en) * | 2018-10-15 | 2023-06-28 | 日亜化学工業株式会社 | Light-emitting device and light-emitting module |
JP7007598B2 (en) * | 2018-12-14 | 2022-02-10 | 日亜化学工業株式会社 | Manufacturing method of light emitting device, light emitting module and light emitting device |
US11594662B2 (en) | 2019-07-31 | 2023-02-28 | Nichia Corporation | Light-emitting device |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3303162B2 (en) * | 1998-11-30 | 2002-07-15 | 日本特殊陶業株式会社 | Semiconductor device and manufacturing method thereof |
JP2001144423A (en) * | 1999-11-15 | 2001-05-25 | Matsushita Electric Ind Co Ltd | Packaging method of work with bump and packaging structure |
JP4180537B2 (en) * | 2003-10-31 | 2008-11-12 | シャープ株式会社 | Optical element sealing structure, optical coupler, and optical element sealing method |
JP2005311321A (en) * | 2004-03-22 | 2005-11-04 | Sharp Corp | Semiconductor device and its manufacturing method, and liquid crystal module/semiconductor module provided with the semiconductor device |
US8029152B2 (en) * | 2005-03-24 | 2011-10-04 | Kyocera Corporation | Package for light-emitting device, light-emitting apparatus, and illuminating apparatus |
JP2008186946A (en) * | 2007-01-29 | 2008-08-14 | Toshiba Corp | Optical semiconductor device and its manufacturing method |
JP4957394B2 (en) * | 2007-06-04 | 2012-06-20 | 株式会社村田製作所 | Ceramic electronic component and method for manufacturing the same |
JP5294579B2 (en) * | 2007-06-28 | 2013-09-18 | 株式会社豊田中央研究所 | Ceramic sensor |
US20110024890A1 (en) * | 2007-06-29 | 2011-02-03 | Stats Chippac, Ltd. | Stackable Package By Using Internal Stacking Modules |
JP2010114141A (en) * | 2008-11-04 | 2010-05-20 | Sharp Corp | Light reception/light emission integrated type semiconductor device, and electronic equipment |
JP5521325B2 (en) * | 2008-12-27 | 2014-06-11 | 日亜化学工業株式会社 | Light emitting device and manufacturing method thereof |
JP5326705B2 (en) * | 2009-03-17 | 2013-10-30 | 日亜化学工業株式会社 | Light emitting device |
JP5572013B2 (en) * | 2010-06-16 | 2014-08-13 | スタンレー電気株式会社 | Light emitting device and manufacturing method thereof |
JP5680472B2 (en) * | 2011-04-22 | 2015-03-04 | シチズンホールディングス株式会社 | Manufacturing method of semiconductor light emitting device |
JP5777952B2 (en) * | 2011-06-28 | 2015-09-09 | シチズン電子株式会社 | Light emitting device and manufacturing method thereof |
WO2013005646A1 (en) * | 2011-07-01 | 2013-01-10 | シチズンホールディングス株式会社 | Method for manufacturing semiconductor light-emitting element |
KR20130081515A (en) * | 2012-01-09 | 2013-07-17 | 삼성전자주식회사 | A substrate for a led package and manufacturing method of a led package |
JP6149487B2 (en) * | 2012-11-09 | 2017-06-21 | 日亜化学工業株式会社 | LIGHT EMITTING DEVICE MANUFACTURING METHOD AND LIGHT EMITTING DEVICE |
JP6476567B2 (en) * | 2013-03-29 | 2019-03-06 | 日亜化学工業株式会社 | Light emitting device |
JP2014207349A (en) * | 2013-04-15 | 2014-10-30 | パナソニック株式会社 | Light-emitting device and manufacturing method thereof |
-
2016
- 2016-03-11 JP JP2016048776A patent/JP6065135B2/en active Active
- 2016-04-01 CN CN201610202510.6A patent/CN106058006B/en active Active
- 2016-04-01 TW TW108142587A patent/TWI727512B/en active
- 2016-04-01 TW TW105110633A patent/TWI681569B/en active
- 2016-12-14 JP JP2016242397A patent/JP6278101B2/en active Active
-
2018
- 2018-01-16 JP JP2018004933A patent/JP6724933B2/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7208478B2 (en) | 2018-09-28 | 2023-01-19 | 日亜化学工業株式会社 | Light emitting device and manufacturing method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2018078333A5 (en) | ||
JP2014236175A5 (en) | ||
US10396255B2 (en) | Light emitting component | |
JP6392654B2 (en) | Optical sensor device | |
JP2015109252A5 (en) | ||
JP2017501589A5 (en) | ||
JP2015008237A5 (en) | ||
JP2014063723A5 (en) | Display device | |
JP2017199933A5 (en) | ||
JP2016058563A5 (en) | ||
JP2019201206A5 (en) | ||
JP2012253014A5 (en) | Light emitting device and method for manufacturing light emitting device | |
JP2016174148A5 (en) | ||
JP2013247371A5 (en) | ||
JP2013016469A5 (en) | ||
JP2014056815A5 (en) | ||
JP2017183578A5 (en) | ||
JP2006202962A5 (en) | ||
JP2015119011A5 (en) | ||
JP2012063764A5 (en) | ||
JP2011505071A5 (en) | ||
JP2014017474A5 (en) | ||
JP2009540615A5 (en) | ||
JP2018181668A5 (en) | ||
JP2015102844A5 (en) |