JP2018067698A5 - - Google Patents

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Publication number
JP2018067698A5
JP2018067698A5 JP2016207423A JP2016207423A JP2018067698A5 JP 2018067698 A5 JP2018067698 A5 JP 2018067698A5 JP 2016207423 A JP2016207423 A JP 2016207423A JP 2016207423 A JP2016207423 A JP 2016207423A JP 2018067698 A5 JP2018067698 A5 JP 2018067698A5
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JP
Japan
Prior art keywords
soldering
substrate
hole
heat transfer
evaluation method
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JP2016207423A
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English (en)
Japanese (ja)
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JP6843341B2 (ja
JP2018067698A (ja
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Priority to JP2016207423A priority Critical patent/JP6843341B2/ja
Priority claimed from JP2016207423A external-priority patent/JP6843341B2/ja
Publication of JP2018067698A publication Critical patent/JP2018067698A/ja
Publication of JP2018067698A5 publication Critical patent/JP2018067698A5/ja
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Publication of JP6843341B2 publication Critical patent/JP6843341B2/ja
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JP2016207423A 2016-10-23 2016-10-23 半田付け評価方法およびその装置 Active JP6843341B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016207423A JP6843341B2 (ja) 2016-10-23 2016-10-23 半田付け評価方法およびその装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016207423A JP6843341B2 (ja) 2016-10-23 2016-10-23 半田付け評価方法およびその装置

Publications (3)

Publication Number Publication Date
JP2018067698A JP2018067698A (ja) 2018-04-26
JP2018067698A5 true JP2018067698A5 (cg-RX-API-DMAC7.html) 2019-11-21
JP6843341B2 JP6843341B2 (ja) 2021-03-17

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Family Applications (1)

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JP2016207423A Active JP6843341B2 (ja) 2016-10-23 2016-10-23 半田付け評価方法およびその装置

Country Status (1)

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JP (1) JP6843341B2 (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7018795B2 (ja) * 2018-03-23 2022-02-14 三菱電機株式会社 溶融はんだの入熱量評価方法および計測基板ならびにフローはんだ付け装置
JP7196478B2 (ja) * 2018-09-10 2022-12-27 株式会社デンソー スリーブはんだ付け装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6141461U (ja) * 1984-08-13 1986-03-17 日立電子株式会社 自動はんだ付けロボツト
JPS61156896A (ja) * 1984-12-28 1986-07-16 三菱電機株式会社 半田付け方法
JPH0560711A (ja) * 1991-09-04 1993-03-12 Fujitsu Ltd 銅粉充填の欠陥検査方法

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