JP2018056148A - レーザモジュールおよびレーザ加工装置 - Google Patents

レーザモジュールおよびレーザ加工装置 Download PDF

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Publication number
JP2018056148A
JP2018056148A JP2015022851A JP2015022851A JP2018056148A JP 2018056148 A JP2018056148 A JP 2018056148A JP 2015022851 A JP2015022851 A JP 2015022851A JP 2015022851 A JP2015022851 A JP 2015022851A JP 2018056148 A JP2018056148 A JP 2018056148A
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JP
Japan
Prior art keywords
laser
light
optical system
light beam
laser elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2015022851A
Other languages
English (en)
Japanese (ja)
Inventor
正人 河▲崎▼
Masato Kawasaki
正人 河▲崎▼
一樹 久場
Kazuki Kuba
一樹 久場
山本　達也
Tatsuya Yamamoto
達也 山本
西前　順一
Junichi Nishimae
順一 西前
小島　哲夫
Tetsuo Kojima
哲夫 小島
野田　進
Susumu Noda
進 野田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2015022851A priority Critical patent/JP2018056148A/ja
Priority to PCT/JP2016/050990 priority patent/WO2016129323A1/fr
Publication of JP2018056148A publication Critical patent/JP2018056148A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0239—Combinations of electrical or optical elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/42—Arrays of surface emitting lasers

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Laser Beam Processing (AREA)
JP2015022851A 2015-02-09 2015-02-09 レーザモジュールおよびレーザ加工装置 Pending JP2018056148A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2015022851A JP2018056148A (ja) 2015-02-09 2015-02-09 レーザモジュールおよびレーザ加工装置
PCT/JP2016/050990 WO2016129323A1 (fr) 2015-02-09 2016-01-14 Module laser et appareil d'usinage laser

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015022851A JP2018056148A (ja) 2015-02-09 2015-02-09 レーザモジュールおよびレーザ加工装置

Publications (1)

Publication Number Publication Date
JP2018056148A true JP2018056148A (ja) 2018-04-05

Family

ID=56615096

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015022851A Pending JP2018056148A (ja) 2015-02-09 2015-02-09 レーザモジュールおよびレーザ加工装置

Country Status (2)

Country Link
JP (1) JP2018056148A (fr)
WO (1) WO2016129323A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020194625A1 (fr) * 2019-03-27 2020-10-01 三菱電機株式会社 Dispositif laser et appareil de traitement laser
JP2021522489A (ja) * 2018-04-24 2021-08-30 ベクトン・ディキンソン・アンド・カンパニーＢｅｃｔｏｎ， Ｄｉｃｋｉｎｓｏｎ Ａｎｄ Ｃｏｍｐａｎｙ 修正されたビームプロファイルを有する多重レーザシステムおよびその使用方法
JP2021525970A (ja) * 2018-06-05 2021-09-27 イマジン・オプチック 高ピークパワーレーザパルス生成方法および高ピークパワーレーザパルス生成システム
JP7585987B2 (ja) 2021-06-14 2024-11-19 株式会社島津製作所 光源装置、加工装置、および検査方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106785895A (zh) * 2016-11-30 2017-05-31 中国科学院半导体研究所 一种基于光子晶体激光器合束的装置
US11822125B2 (en) 2018-09-18 2023-11-21 Mitsubishi Electric Corporation Multiplexing optical system
CN112260064A (zh) * 2020-10-21 2021-01-22 中国科学院半导体研究所 一种光束缩束装置及其方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1117268A (ja) * 1997-06-23 1999-01-22 Res Dev Corp Of Japan 半導体レーザーアレイ装置
JP2002026466A (ja) * 2000-07-11 2002-01-25 Toyota Central Res & Dev Lab Inc 集光光学系及びレーザ加工機用光源
JP3786658B2 (ja) * 2003-12-22 2006-06-14 住友電工ハードメタル株式会社 長距離伝送用光学系
WO2007007766A1 (fr) * 2005-07-13 2007-01-18 The Furukawa Electric Co., Ltd. Dispositif d'irradiation de lumiere et procede de soudage
JP2007275908A (ja) * 2006-04-03 2007-10-25 Nippon Sharyo Seizo Kaisha Ltd レーザ加工装置
JP5430217B2 (ja) * 2009-05-07 2014-02-26 キヤノン株式会社 面発光レーザアレイ
EP2478602B1 (fr) * 2009-08-20 2014-12-10 Koninklijke Philips N.V. Dispositif laser avec distribution d'intensité configurable
US9415465B2 (en) * 2011-10-20 2016-08-16 Nippon Steel and Sumitomo Metal Corporation Laser processing apparatus and laser processing method

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021522489A (ja) * 2018-04-24 2021-08-30 ベクトン・ディキンソン・アンド・カンパニーＢｅｃｔｏｎ， Ｄｉｃｋｉｎｓｏｎ Ａｎｄ Ｃｏｍｐａｎｙ 修正されたビームプロファイルを有する多重レーザシステムおよびその使用方法
JP2021525970A (ja) * 2018-06-05 2021-09-27 イマジン・オプチック 高ピークパワーレーザパルス生成方法および高ピークパワーレーザパルス生成システム
JP7289323B2 (ja) 2018-06-05 2023-06-09 イマジン・オプチック 高ピークパワーレーザパルス生成方法および高ピークパワーレーザパルス生成システム
WO2020194625A1 (fr) * 2019-03-27 2020-10-01 三菱電機株式会社 Dispositif laser et appareil de traitement laser
JPWO2020194625A1 (ja) * 2019-03-27 2021-04-30 三菱電機株式会社 レーザ装置およびレーザ加工機
JP7585987B2 (ja) 2021-06-14 2024-11-19 株式会社島津製作所 光源装置、加工装置、および検査方法

Also Published As

Publication number Publication date
WO2016129323A1 (fr) 2016-08-18

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