JP2018050103A - 半導体装置およびセキュリティシステム - Google Patents
半導体装置およびセキュリティシステム Download PDFInfo
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Abstract
Description
図の例では、アドレス1の動作情報は、高温で動作されたとき「0」であるが、室温および低温で動作されたとき「1」である。また、アドレス5の動作情報は、低温で動作されたとき「1」であるが、室温および高温で動作されたとき「0」である。さらにアドレスCの動作情報は、低温で動作されたとき「0」であるが、室温および高温で動作されたとき「1」である。
200:半導体装置
210:入出力部
220:制御部
230:コード生成用回路
240:不揮発性記憶部
242:コード情報
Claims (16)
- 複数の動作環境で動作させたときに同じ結果を生じる安定情報、および前記複数の動作環境で動作させたときに異なる結果を生じる不定情報を含む固有情報を生成する生成手段と、
前記固有情報に含まれる前記不定情報を識別する識別情報と検出する検出手段と、
前記固有情報および前記識別情報を不揮発性の記憶領域に記憶する記憶手段と、
前記固有情報および前記識別情報を読出し、読み出した固有情報および識別情報を外部へ出力可能な読出し手段と、
を有する半導体装置。 - 半導体装置はさらに、前記記憶手段に記憶された前記固有情報および前記識別情報を消去する消去手段を含む、請求項1に記載の半導体装置。
- 前記消去手段は、外部からの要求に応答して前記固有情報および前記識別情報を消去する、請求項2に記載の半導体装置。
- 前記読出し手段は、前記消去手段により前記固有情報および前記識別情報が消去された後に、外部から固有情報の要求があったとき、前記生成手段により生成された固有情報を外部へ出力する、請求項1に記載の半導体装置。
- 前記記憶手段は、コンフィギュレーションレジスタに設定されたアドレスに従い前記固有情報および前記識別情報を記憶する、請求項1ないし4いずれか1つに記載の半導体装置。
- 前記複数の動作環境は、異なる環境温度での動作を含む、請求項1に記載の半導体装置。
- 前記複数の動作環境は、異なる電源電圧での動作を含む、請求項1に記載の半導体装置。
- 前記生成手段は、複数の動作環境で動作可能な回路を含み、当該回路は、nビットの固有情報を生成し、前記検出手段は、nビットの中から前記不定情報のビット位置を識別する、請求項1に記載の半導体装置。
- 前記安定情報は、前記複数の動作環境で動作されたとき全てが「0」または「1」のいずれかであり、前記不定情報は、前記複数の動作環境で動作されたとき「0」と「1」とを含む、請求項1ないし4いずれか1つに記載の半導体装置。
- 前記生成手段は、テストモードのときに複数の動作環境で動作される、請求項1ないし5いずれか1つに記載の半導体装置。
- 前記生成手段は、一対のインバータを有するn組のインバータ回路と、一対のインバータの出力電圧を比較するn組の比較回路と、n組の比較回路の比較結果に基づくnビットの固有情報を生成する生成部とを含み、一対のインバータのゲートには、インバータに供給される電圧の1/2の電圧が供給される、請求項1に記載の半導体装置。
- 請求項1ないし12いずれか1つに記載の半導体装置と、当該半導体装置と接続可能なホスト装置とをシステムであって、
ホスト装置は、
半導体装置から受け取った前記固有情報および前記識別情報を格納する格納手段と、
前記固有情報および前記識別情報に基づき半導体装置の認証を行う認証手段とを含む、システム。 - 前記認証手段は、前記識別情報に基づき前記固有情報の中から前記安定情報を抽出し、抽出された安定情報に基づき半導体装置の認証を行う、請求項12に記載のシステム。
- ホスト装置は、前記固有情報および前記識別情報を格納した後、半導体装置に対して前記固有情報および前記識別情報の削除を要求する手段を含む、請求項12または13に記載のシステム。
- 前記認証手段は、前記抽出された安定情報を変化させる手段を含む、請求項13に記載のシステム。
- 前記変化させる手段は、前記抽出された安定情報にランダム性を与える、請求項15に記載のシステム。
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JP2016182782A JP6471130B2 (ja) | 2016-09-20 | 2016-09-20 | 半導体装置およびセキュリティシステム |
CN201710754786.XA CN107844715B (zh) | 2016-09-20 | 2017-08-29 | 半导体装置及安全系统 |
KR1020170114748A KR102037576B1 (ko) | 2016-09-20 | 2017-09-07 | 반도체 장치 및 보안 시스템 |
TW106130790A TWI645703B (zh) | 2016-09-20 | 2017-09-08 | 半導體裝置及安全系統 |
US15/710,358 US10554422B2 (en) | 2016-09-20 | 2017-09-20 | Semiconductor device and security system |
US16/725,345 US11075770B2 (en) | 2016-09-20 | 2019-12-23 | Semiconductor device and security system |
US16/725,486 US11070384B2 (en) | 2016-09-20 | 2019-12-23 | Semiconductor device and security system |
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Cited By (3)
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JP2020188345A (ja) * | 2019-05-13 | 2020-11-19 | 三菱重工業株式会社 | 制御基板、制御装置、情報配信システム及び復号方法 |
JP7305592B2 (ja) | 2020-03-30 | 2023-07-10 | キオクシア株式会社 | メモリシステム、メモリデバイス、及びメモリシステムの制御方法 |
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KR20180031568A (ko) | 2018-03-28 |
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US11070384B2 (en) | 2021-07-20 |
US20180083788A1 (en) | 2018-03-22 |
US20200136842A1 (en) | 2020-04-30 |
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US20200136841A1 (en) | 2020-04-30 |
US11075770B2 (en) | 2021-07-27 |
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