JP2018048279A - Resin composition for wiring boards, prepreg, laminate and wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide resin composition for wiring boards that has an increased working speed and excellent handleability when applied to the production of a thin wiring board by sand blast.SOLUTION: A resin composition for wiring boards has a breaking energy of 0.0001-0.001 J/mmper unit volume after curing, and an elastic modulus of 8000 MPa or more.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a resin composition for a wiring board, a prepreg, a laminated board, and a wiring board.

  2. Description of the Related Art In recent years, electronic devices such as portable information communication device terminals have been rapidly reduced in size and functionality, and a thin and highly functional semiconductor device is required. If the wiring board used in the semiconductor device is thinned, it is directly connected to the thinning of the semiconductor device, and the conductor path length in the wiring board can be shortened, which is advantageous for high functionality. Therefore, it is required to make the wiring board material as thin as possible. At the same time, by reducing the size of the via hole that connects the conductor layers in the wiring board, it is possible to increase the number of via holes per unit area. The density of the electric circuit in the wiring board can be increased. Therefore, an easy method for forming small-diameter vias is required.

  As a method for forming a small diameter via, there are known a method in which an insulating material is burned off using a laser and a method in which an opening is obtained by a photolithography process using a photosensitive insulating resin (for example, see Patent Documents 1 and 2). .

At present, a CO ₂ laser is most commonly used for forming (drilling) a via hole. For theoretical reasons, the hole diameter is limited to about 50 μm. To further reduce the via diameter, it is indispensable to apply a YAG laser or excimer laser as described in Patent Document 1. is there. However, these laser devices are much more expensive than CO ₂ laser devices. In the first place, since the laser cannot open multiple holes at the same time, there is a possibility that the tact time at the time of forming multiple holes becomes very long.

  On the other hand, via formation using a photosensitive insulating resin does not require an expensive apparatus because a general photolithography process is applied. Further, since multiple holes can be opened simultaneously, the tact time is not affected by the number of holes, and the drilling time can be shortened extremely. However, glass cloth cannot be applied to via formation using a photosensitive insulating resin, and the amount of inorganic filler that can be contained is limited, so that it is difficult to keep the thermal expansion coefficient low. Therefore, as described in Patent Document 2, since it is necessary to use together with other low thermal expansion materials, it is difficult to apply to thin wiring boards.

  In addition, in these methods, smear (machining waste) is generated inside and in the vicinity of the via, so a desmear (removal of scrap) step is essential. However, as the via becomes smaller in diameter, Difficulty rises due to reasons around the liquid. From the above, there is a problem as an easy method for forming a small diameter via on each thin wiring board.

  On the other hand, drilling methods using sandblast have also existed for a long time. A portion other than the portion to be drilled is covered with a dedicated dry film resist, and air is mixed with abrasive grains to grind the material to drill holes (see, for example, Patent Document 3). The device is cheap compared to YAG lasers, etc., the tact time does not depend on the number of holes, glass cloth can be processed, so low thermal expansion material can be applied, and smears are difficult to accumulate in the hole due to the processing principle, Many problems of the method using a laser or a photosensitive insulating resin can be solved. In recent years, vias having relatively small diameters can be opened with the progress of blasting apparatuses.

Japanese Patent Laid-Open No. 2004-235202 JP 2014-225671 A JP 2004-160649 A

  However, there are not many processing results of thin wiring boards using the sand blasting method, and it has not been clarified what is the optimal resin composition for wiring boards for sand blasting. Therefore, as a result of intensive studies, the present inventors have found that it is important to increase the processing speed of the laminate because the dry film resist must be thinned when processing the small diameter via by sandblasting. . At the same time, it was found that it is important to ensure good handling because the wiring board is extremely thin.

  Accordingly, the present invention provides a resin composition for a wiring board that has improved processing speed and good handling properties when applied to the manufacture of a thin wiring board using a sandblast method, and a prepreg and a laminate using the same. And it aims at providing a wiring board.

  The present invention has been made in view of such a situation, and as a result of intensive studies, the present inventors have found a resin composition for a wiring board that can solve all of the above problems, and have completed the present invention. .

That is, the present invention has the following aspects.
[1] A resin composition for wiring boards having a fracture energy per unit volume after curing of 0.0001 to 0.001 J / mm ³ and an elastic modulus of 8000 MPa or more.
[2] A prepreg obtained by impregnating a glass cloth with the resin composition for a wiring board according to [1].
[3] A laminate obtained by laminating a plurality of the prepregs according to [2].
[4] The laminated plate according to [3], which has a thickness of 20 to 100 μm.
[5] A wiring board formed by forming wiring on the laminated board according to [3] or [4].

  According to the present invention, when applied to the production of a thin wiring board using a sandblasting method, the processing speed is improved and the handling property is good, and the prepreg and laminate using the same A board and a wiring board can be provided.

It is a figure for demonstrating the calculation method of fracture energy and an elasticity modulus. It is sectional drawing which shows typically one Embodiment of the formation method of wiring.

  Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the drawings as necessary. However, the present invention is not limited to the following embodiments. Further, the dimensional ratios in the drawings are not limited to the illustrated ratios.

In the present specification, the fracture energy and elastic modulus per unit volume can be determined as follows. First, a resin plate having a thickness (h) of 1.2 mm is produced using the resin composition for a wiring board, and a test piece is produced by cutting it into a size of width (b) 2.9 mm and length 45 mm with a dicer or the like. The test piece breaks under the conditions of a distance between fulcrums (L) of 25 mm, a test speed of 1 mm / min, and a temperature of 20 to 25 ° C. (Here, when the maximum load is recorded, the load decreases to 3/4 of the maximum load. The bending stress (σ) and bending strain (ε) are calculated from the obtained bending load (F) and bending deflection (s), and the stress-strain curve (S- S curve) is obtained. The calculation formulas for bending stress (σ) and bending strain (ε) are σ = (3FL) / (2bh ² ) and ε = (6hs) / L ² . Here, as shown in FIG. 1, the area of the obtained SS curve is the fracture energy per unit volume, and the slope of the rising tangent is the elastic modulus.

  In addition, regarding the production of the resin plate, as long as it can be produced without voids in the test piece, the method is not particularly defined, and various methods can be adopted. For example, a prepreg produced using a resin composition for a wiring board is put in a plastic bag, and the plastic bag is thoroughly massaged with the mouth of the plastic bag closed to collect semi-cured resin powder. It may be put into a mold and pressed and hardened by a heating press to obtain a resin plate. Alternatively, for example, the resin composition for a wiring board is coated on a support (for example, PET) at an arbitrary thickness using a bar coater or the like, and heated to a temperature at which the resin composition for a wiring board is not cured. After removing the material, put the coated material in a plastic bag, rub it well with the mouth of the plastic bag closed, collect the semi-cured resin powder, put it into the mold of the Teflon (registered trademark) sheet, and heat it. The resin plate may be obtained by pressing with a press. There is no restriction | limiting in particular as a support body, A general purpose thing can be used, Moreover, there is no restriction | limiting in particular also as the application | coating method, What is necessary is just to apply | coat using a normal desktop coating machine. In addition, it is preferable that the resin board used for the measurement of the fracture energy per unit volume after hardening and an elasticity modulus is produced by the method as described in an Example.

  It should be noted that the method for producing the laminated plate is not particularly defined, and various methods can be adopted. For example, after impregnating a glass cloth with a resin composition for a wiring board used for the laminate, a plurality of prepregs obtained by semi-curing (B-stage) by heating are stacked, and copper foil is disposed on one or both sides thereof And you may obtain by melt | dissolving the copper foil layer of the copper clad laminated board obtained by carrying out lamination | stacking formation with the heating-pressing press with a copper etching liquid.

The breaking energy per unit volume of the cured product of the resin composition for wiring boards of this embodiment is 0.0001 to 0.001 J / mm ³ . When the fracture energy is less than 0.0001 J / mm ³ , the resin composition for a wiring board is liable to be cracked or cracked by various external forces when handling the laminated board, which is not preferable. On the other hand, if the fracture energy exceeds 0.001 J / m ³ , the resin composition for a wiring board is hardly crushed during sandblasting, which is not preferable because the processing speed decreases. This breaking energy is preferably 0.00015 to 0.0008 J / mm ³ and more preferably 0.0002 to 0.0006 J / mm ³ from the viewpoint of further improving the handleability and processing speed.

  The elastic modulus of the cured product of the resin composition for wiring boards of this embodiment is 8000 MPa or more. When the elastic modulus is less than 8000 MPa, an extremely thin laminated board is easily bent, and it becomes difficult to handle the laminated board and the wiring board, and to insert and remove the magazine board. This elastic modulus is preferably 9000 MPa or more, and more preferably 10,000 MPa or more, from the viewpoint of further improving the handleability by suppressing the deflection. The upper limit of the elastic modulus is not particularly limited, but can be, for example, 15000 MPa or less.

The reason why the resin composition for a wiring board of the present embodiment exhibits the above-described effect by satisfying the above-mentioned predetermined requirements is not necessarily clear, but the present inventors speculate as follows.
By making the fracture energy below the predetermined value, it can be efficiently broken when the sandblast abrasive grains collide, and by having the fracture energy above the predetermined value, it prevents breakage and cracking when handling laminates be able to. Furthermore, by setting the elastic modulus to a predetermined value or more at the same time, even if the laminated plate is made extremely thin, the deflection can be kept small, and the handleability is excellent.

  Here, the resin composition for a wiring board is not particularly limited as long as it has the predetermined fracture energy and elastic modulus, and various kinds of compositions can be used. For example, an amine compound having at least two primary amino groups in the molecular structure, an amine compound having an acidic substituent, and a maleimide compound having at least two N-substituted maleimide groups in the molecular structure or reaction At least one phosphorus-containing compound selected from a phosphonium salt and a phosphine-Lewis acid complex; at least one thermosetting resin selected from an epoxy resin or a cyanate resin. An inorganic filler; and a composition further comprising at least one selected from the group consisting of thermoplastic elastomers. In particular, when an amine compound having at least two primary amino groups in the molecular structure and a maleimide compound having at least two N-substituted maleimide groups in the molecular structure, a good glass transition temperature (Tg), Computers and information devices that can produce printed wiring boards with high thermal expansion, high modulus, copper foil adhesion, desmear resistance, high density and high multilayer, and process large amounts of data at high speed It can be suitably used for a wiring board of an electronic device such as a terminal, which is preferable.

  The prepreg can be obtained by impregnating a glass cloth with a resin composition for a wiring board. As the glass cloth, E glass, T glass, D glass, or the like having any thickness can be suitably used according to the actual application.

  The laminated board of this embodiment can be produced by the method described above. The laminate may be provided with a copper foil on one side or both sides. The thickness of the laminate excluding the copper foil is preferably 20 to 100 μm. When this thickness is less than 20 μm, the deflection becomes too large, and it tends to be difficult to handle the laminate alone. On the other hand, when the thickness exceeds 100 μm, a small-diameter via tends to be difficult to open. This thickness is more preferably 25 to 80 μm, and further preferably 30 to 60 μm, from the viewpoint of suppressing the deflection and improving the handleability.

  The laminated board of this embodiment can be used suitably as a buildup layer in a wiring board. A conventionally known method can be adopted as a method for forming the wiring on the laminate, but the wiring can be formed by the method shown in FIG.

  First, as shown to Fig.2 (a), the laminated body 3 provided with the support base material 1 and the conductor layer 2 formed on the support base material 1 is prepared (preparation process). The laminate 3 is obtained, for example, by laminating a conductor on the support base 1.

  The support base material 1 includes, for example, a substrate 4 and a plurality of metal foil layers 5 a and 5 b formed on the substrate 4. The substrate 4 may be FR-4 (glass epoxy resin base material), FR-5 (heat resistant glass epoxy base material), SUS (stainless steel) base material, or the like. The metal foil layer 5 may be composed of two or more metal foil layers, and at least two layers of the plurality of metal foil layers can be physically separated from each other. The metal foil layer 5 is preferably formed of a peelable copper foil. The thickness of the layer of the peelable copper foil layer farthest from the substrate 4 is extremely thin, so that the time can be shortened when finally etching out. The support substrate 1 is preferably made by attaching a peelable copper foil to FR-4 or FR-5, but may be a SUS plate having a metal foil layer formed by plating.

  The conductor layer 2 is made of, for example, copper. The conductor layer 2 may be, for example, a wiring patterned on the support substrate 1, and may be a pad, a dummy pattern, or the like. The formation method of the conductor layer 2 is not specifically limited, For example, the metal foil layer (peelable copper foil layer) 5 may be used as a seed layer and may be formed by a plating process.

  Following the preparation step, as shown in FIG. 2B, the build-up layer 6 is formed on the support substrate 1 so as to cover the conductor layer 2 using the laminate of the present embodiment (build-up). Layer forming step). The buildup layer 6 is formed by, for example, vacuum pressing a laminated plate on the support base material 1.

  Following the buildup layer forming step, as shown in FIG. 2C, a resin layer (primer resin layer for plating process) 7 is formed on the buildup layer 6 (resin layer forming step). The resin layer 7 is formed by laminating, for example. The resin used for the resin layer 7 is preferably a polyfunctional epoxy resin because it has little influence on the physical properties of the buildup layer 6 and has good adhesion to the electroless plating.

  Following the resin layer forming step, as shown in FIG. 2C, a first dry film resist layer 8 is formed on the resin layer 7 (first dry film resist layer forming step). The first dry film resist layer 8 can be formed by a known method such as roll lamination or vacuum lamination. Lamination may be performed, for example, at 0 to 180 ° C. under conditions of 0.001 N or higher and a roll speed of 0.01 mm / s or higher.

  From the viewpoint of achieving both resolution and sandblast resistance, the thickness of the first dry film resist layer 8 is preferably 35 μm or less, and the first dry film resist layer 8 is preferably carboxyl. Alkali-soluble resin containing cellulose having carboxyl group or acrylic resin having carboxyl group, photopolymerizable compound containing monofunctional compound or polyfunctional compound having ethylenically unsaturated group, urethane (meth) acrylate compound, and photopolymerization initiator It is formed with the photosensitive resin composition containing this.

  Following the first dry film resist layer forming step, as shown in FIG. 2D, a predetermined region that is a part of the first dry film resist layer 8 is made active light L using, for example, an exposure mask 9. (Exposure process). Here, the predetermined region is a region where an opening is to be formed in the first dry film resist layer 8. The exposure method may be a direct drawing method using a UV laser instead of the method using the exposure mask 9.

  Following the exposure step, as shown in FIG. 2 (e), the unexposed region of the first dry film resist layer 8 after exposure (region where the actinic ray L was blocked by the exposure mask 9 in the exposure step). Is removed to form the opening 10 (opening forming step). The opening 10 is formed at a position corresponding to a region where IVH (Inner Via Hole) is to be formed in the buildup layer 6.

  The method of removing the unexposed area of the first dry film resist layer 8 is not particularly limited, and examples thereof include a method of removing by shower development or mist development using a developer, a method of removing by sand blasting, and the like. From the viewpoint of simplifying the process by omitting the shower development or mist development, washing and drying steps with a developer, a method of removing by a sandblast method is preferable. Sand blasting is performed, for example, under the same conditions as sand blasting in an IVH forming process described later.

  Following the opening forming step, as shown in FIG. 2F, IVH11 is formed on the buildup layer 6 by using a sandblasting method (IVH forming step).

In the IVH forming step, the first dry film resist layer 8 having the opening 10 serves as a mask, and the abrasive grains (polishing agent) are sprayed to form the build-up layer 6 at a position corresponding to the opening 10. To cut. The conditions for sandblasting are not particularly limited. Examples of the abrasive grains include fine particles such as glass beads, SiC, SiO ₂ , Al ₂ O ₃ , and ZrO. The average particle diameter of the abrasive grains may be, for example, 2 to 100 μm. The abrasive grains are preferably Al ₂ O ₃ fine particles (alumina powder) having an average particle size of 30 μm or less. The amount of abrasive grains injected is preferably such that the abrasive grains are not clogged with IVH.

The diameter of IVH11 is 50 μm or less, and the electric circuit (wiring) in the wiring board can be densified, so that it is preferably 40 μm or less, more preferably 30 μm or less. When the diameter of the IVH 11 is 50 μm or less, the density of the electric circuit (wiring) in the wiring board is increased, and the increase in the number of the buildup layers 6 is suppressed, which is more than the conventional IVH formation by the CO ₂ laser. Cost is lower.

  After the IVH forming step, for example, the first dry film resist layer 8 remaining on the resin layer 7 without being scraped off by sandblasting is removed (first dry film resist layer removing step). Examples of the removal method of the first dry film resist layer 8 include a removal method using an alkaline aqueous solution.

  After the first dry film resist layer removing step, a seed layer is formed on the resin layer 7, the inner wall of the IVH 11, and the conductor layer 2 (seed layer forming step). The seed layer is preferably made of copper. The seed layer is formed by, for example, electroless copper plating. The thickness of the seed layer is not particularly limited.

  After the seed layer forming step, a third dry film resist layer is formed on the seed layer (third dry film resist layer forming step). The third dry film resist layer is formed by the same material and method as the first dry film resist layer 8, for example. It does not matter whether or not the third dry film resist layer has sandblast resistance.

  After the third dry film resist layer forming step, a predetermined region of the third dry film resist layer is exposed in the same manner as the first dry film resist layer 8, and then the third dry film resist layer is not yet formed. Remove the exposed area.

  Subsequently, wiring is formed in the IVH 11 and on the seed layer on which the third dry film resist layer is not formed (wiring forming step). The wiring is preferably made of copper. The wiring is formed by, for example, electrolytic copper plating.

  After the wiring formation step, the third dry film resist layer is removed (third dry film resist layer removal step). The third dry film resist layer can be removed by the same method as that for the first dry film resist layer 8.

  After the third dry film resist layer removing step, the seed layer corresponding to the region where the wiring is not laminated is removed (seed layer removing step). An example of a method for removing the seed layer is an etching process.

  Multiple layers may be formed by repeating the build-up layer forming step to the seed layer removing step described above. That is, two or more buildup layers 6 may be formed and the plurality of buildup layers 6 may be electrically connected by wiring.

  EXAMPLES Next, although an Example demonstrates this invention, the scope of the present invention is not limited to these Examples. In addition, the performance of the resin plates or laminates obtained in the following examples was measured and evaluated by the following methods.

<Measurement of fracture energy and elastic modulus per unit volume>
A resin plate having a thickness (h) of 1.2 mm is cut into a width (b) of 2.9 mm and a length of 45 mm with a dicer or the like to make a test piece. Using an Instron 5948 type testing machine, the test piece breaks under the conditions of a distance between fulcrums (L) of 25 mm, a test speed of 1 mm / min, and a temperature of 20 to 25 ° C. (Here, the maximum load is recorded and then the maximum load is recorded. A three-point bending test is performed until the load drops to 3/4 of the load, and the bending stress (σ) and bending strain (ε) are obtained from the bending load (F) and bending deflection (s). And a stress-strain curve (SS curve) is obtained. The calculation formulas for bending stress (σ) and bending strain (ε) are σ = (3FL) / (2bh2) and ε = (6hs) / L2. Here, as shown in FIG. 1, the area of the obtained SS curve was defined as the fracture energy per unit volume, and the slope of the rising tangent was defined as the elastic modulus.

<Evaluation of workability>
First, a dry film layer for sandblasting having an opening of φ80 μm was formed on the surface of the laminate. The process is as follows.
A sandblasting dry film SB-3050 (manufactured by Hitachi Chemical Co., Ltd.) is roll-laminated on the surface of the laminate under the conditions of a temperature of 80 ° C., a pressure of 0.4 MPa, and a speed of 1.0 m / min. Using a parallel exposure machine and a negative mask, UV light is irradiated to 115 mJ / cm ^{2 on} the surface other than the part where the opening is to be formed. Using a spray developing machine, develop 100 holes or more of φ80 μm openings in a dry film with a 1.0 wt% Na ₂ CO ₃ aqueous solution at intervals of 300 μm or more. Curing is promoted by irradiation with 1000 mJ / cm ² of UV light.
Next, a hole was formed in the laminate using a sandblasting apparatus. The process is as follows.
A laminated board on which a dry film layer for sandblasting having an opening is formed is set in a sandblasting apparatus ELP-1TR (manufactured by Elfotec). Alumina # 600 abrasive grains having an average particle diameter of 20 μm are sprayed from a nozzle having a diameter of 5 mm at a distance of 100 mm from the substrate surface at an injection pressure of 0.15 MPa. At that time, the supply of abrasive grains is set to 3 rpm by the number of rotations of the supply roller, the nozzle is reciprocated through a width of 130 mm at a moving speed of 8 m / min, and the laminate is carried at a speed of 20 mm / min. After passing through a hole with a hole of φ80 μm twice, the hole processing is stopped, the laminated board is taken out, and the dry film is removed. Twenty holes were randomly measured with a depth meter to measure the depth of the holes processed in the laminate, and the average was used as an index of workability. It can be said that the larger this value, the faster the processing speed, that is, the higher the workability.

<Evaluation of handleability>
A stack of 20 200 mm × 200 mm laminates is prepared beside the transport roller. Transport roller diameter 50mm, transport roller width 1mm, roller interval 50mm, roller shaft pitch maximum 45mm, transport speed 2.0mm / s, move the transport roller, pick up the laminate one by one, put it on the transport roller Yuki was collected and stacked one by one after being transported for 5 m. At that time, the laminated board was checked for damage (cracks and cracks) and whether it was dropped or caught by the transport roller, and used as an index for handling. In addition, although the board | substrate conveyance equipment of the laminated board manufacturing field was utilized this time, if there is the same conveyance roller, there will be no designation | designated in particular in a conveyance equipment.

(Example 1, Comparative Examples 1-3)
<Preparation of varnish>
The following components (d), (e), (f), (g), and (x) are mixed in the mixing ratio shown in Table 1 (parts by mass; only component (g) is vol%), A varnish having a resin content of 65% by mass was prepared using methyl ethyl ketone.
[(D) Thermosetting resin]
(D-1) Dicyclopentadiene type epoxy resin [made by Nippon Kayaku Co., Ltd .; trade name: XD-1000]
(D-2) Biphenyl aralkyl type epoxy resin [manufactured by Nippon Kayaku Co., Ltd .; trade name: NC-3000H]
[(E) Thermoplastic elastomer]
(E-1) Tuftec H1043: Hydrogenated styrene-butadiene copolymer resin [trade name, manufactured by Asahi Kasei Corporation]
[(F) Phosphorus-containing compound]
(F-1) Triphenylphosphine triphenylborane [made by Hokuko Chemical Co., Ltd .; trade name: TPP-S]
[(G) Inorganic filler]
(G-1) Fused silica (manufactured by Admatechs Co., Ltd .: trade name: SC2050-KNK)
[(X) Modified silicone]
Production Example 1: Compound (x-1)
In a reaction vessel with a capacity of 2 liters that can be heated and cooled, equipped with a thermometer, a stirrer, and a moisture quantifier with a reflux condenser, X-22-161A: 30.4 g and 2,2-bis (4- (4 -Maleimidophenoxy) phenyl) propane: 192.0 g, p-aminophenol: 7.3 g, 3,3'-diethyl-4,4'-diaminodiphenylmethane: 20.3 g and propylene glycol monomethyl ether: 375.0 g And reacted at 100 ° C. for 3 hours to obtain a compound (x-1) -containing solution.
Production Example 2: Compound (x-2)
In a reaction vessel with a capacity of 2 liters that can be heated and cooled, equipped with a thermometer, a stirrer, and a moisture meter with a reflux condenser, X-22-161B: 26.8 g and 3,3′-diethyl-4,4 '-Diaminodiphenylmethane: 301.0 g, p-aminophenol: 7.2 g, bis (4-maleimidophenyl) methane: 22.4 g and propylene glycol monomethyl ether: 536.3 g were reacted at 100 ° C for 3 hours. To obtain a compound (x-2) -containing solution.
Production Example 3: (x-3)
In a reaction vessel with a volume of 2 liters that can be heated and cooled, equipped with a thermometer, a stirrer, and a moisture quantifier with a reflux condenser, X-22-161B: 39.5 g and 3,3′-diethyl-4,4 '-Diaminodiphenylmethane: 211.7 g, p-aminophenol: 5.0 g, bis (4-maleimidophenyl) methane: 13.7 g and propylene glycol monomethyl ether: 405.0 g were added and reacted at 100 ° C. for 3 hours. To obtain a compound (x-3) -containing solution.
<Materials used in Production Examples 1 to 3>
[(A) Amine compound having at least two primary amino groups in the molecular structure]
(A-1) Both-ends diamine-modified siloxane [manufactured by Shin-Etsu Chemical Co., Ltd .; trade name: X-22-161A]
(A-2) Both-end diamine-modified siloxane [manufactured by Shin-Etsu Chemical Co., Ltd .; trade name: X-22-161B]
(A-3) 3,3′-diethyl-4,4′-diaminodiphenylmethane [manufactured by Nippon Kayaku Co., Ltd .; trade name: KAYAHARD AA]
[(B) Amine compound having acidic substituent]
p-aminophenol (manufactured by Kanto Chemical Co., Inc.)
[(C) Maleimide compound having at least two N-substituted maleimide groups]
2,2-bis (4- (4-maleimidophenoxy) phenyl) propane [manufactured by Daiwa Kasei Kogyo Co., Ltd .; trade name: BMI-4000]

<Production of laminated plate>
Next, the varnish was impregnated and applied to an E glass cloth having a thickness of 0.1 mm and dried by heating at 160 ° C. for 10 minutes to obtain a prepreg having a resin content of 48 mass%. Four prepregs were stacked, 9 μm electrolytic copper foils were placed one above the other, and pressed at a pressure of 2.5 MPa and a temperature of 240 ° C. for 60 minutes to obtain a copper-clad laminate. Thereafter, the upper and lower copper foils were dissolved and removed with a copper etching solution to obtain a laminate.

<Production of resin plate>
The varnish is applied to a 16 μm polyethylene terephthalate film using a film applicator (PI-1210, manufactured by Tester Sangyo Co., Ltd.) so that the resin thickness after drying is 35 μm, and heated at 160 ° C. for 10 minutes. Drying was performed to obtain a semi-cured resin powder. This resin powder is put into a 1.2 mm thick Teflon (registered trademark) sheet form, the glossy surface of 12 μm electrolytic copper foil is placed up and down, and pressed for 60 minutes at a pressure of 2.0 MPa and a temperature of 240 ° C. After the electrolytic copper foil was removed, a resin plate was obtained.

  Table 2 shows the results of testing and evaluating the obtained laminate and resin plate. In an Example, it has the fracture energy which balances ease of crushing and handling, and can make favorable workability and the handleability of a thin laminated board by setting it as a high elasticity modulus. On the other hand, in the comparative example, it is excellent in workability, but it breaks at the time of handling, or the deflection is large and it is difficult to transport the machine, or the processing speed is slow although it is excellent in handleability, clearly inferior to the example. Yes.

  As described above, according to the present invention, it is possible to manufacture a wiring board having high density wiring with high efficiency while having a very small thickness and less deflection. The wiring board is suitable for a thin and highly functional semiconductor device that can cope with downsizing and high functionality of an electronic device, and has a great industrial utility value.

  DESCRIPTION OF SYMBOLS 1 ... Support base material, 2 ... Conductor layer, 3 ... Laminated body, 4 ... Board | substrate, 5, 5a, 5b ... Metal foil layer, 6 ... Build-up layer, 7 ... Resin layer, 8 ... 1st dry film resist layer 9 ... exposure mask, 10 ... opening, 11 ... IVH.

Claims (5)

A resin composition for wiring boards having a fracture energy per unit volume after curing of 0.0001 to 0.001 J / mm ³ and an elastic modulus of 8000 MPa or more.   A prepreg obtained by impregnating a glass cloth with the resin composition for a wiring board according to claim 1.   A laminate obtained by laminating a plurality of the prepregs according to claim 2.   The laminated board of Claim 3 whose thickness is 20-100 micrometers.   A wiring board formed by forming wiring on the laminated board according to claim 3.

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