JP2018041887A - Dielectric plate sticking method for power module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a dielectric plate sticking method for power module, which allows for accurate placement of a dielectric plate at a predetermined position of a power module.SOLUTION: A dielectric plate sticking method for power module includes a step of holding a power module 1, a step of sucking a dielectric plate 6 by a suction pad 7b while positioning the plate by a first positioning pin 7c, a step of sticking the dielectric plate 6 to one principal surface of the power module 1, by moving one sticking jig 7 closer to one principal surface of the power module 1, while passing the second positioning pin 7f of one sticking jig 7 through the positioning hole 2e of the pallet 2, and a step of sticking the dielectric plate 6 to the other principal surface of the power module 1, by moving the other sticking jig 7 closer to the other principal surface of the power module 1, while inserting the second positioning pin 7f projecting from the positioning hole 2e of the pallet 2 into a positioning hole 7g of the other sticking jig 7.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for attaching an insulating plate for a power module, for example, a method for attaching an insulating plate to each opposing main surface of a power card.

  Generally, a cooling mechanism is provided in the power module in order to release heat of the semiconductor element mounted on the power module. For example, the double-sided cooling type semiconductor device of Patent Document 1 is configured such that an insulating plate and a cooling tube are stacked on a semiconductor element, and heat of the semiconductor element is transmitted to the cooling tube via the insulating plate to dissipate heat. At this time, heat of the semiconductor element is transferred by interposing a heat-dissipating grease between the semiconductor element and the insulating plate and between the insulating plate and the cooling tube.

Japanese Patent No. 4506692

  As in the double-sided cooling type semiconductor device of Patent Document 1, when an insulating plate is stacked on a semiconductor element, it is necessary to accurately arrange the insulating plate at a predetermined position of the power module. However, Patent Document 1 does not disclose how the insulating plate is arranged at a predetermined position of the power module.

  This invention is made | formed in view of such a problem, and implement | achieves the insulating board sticking method for power modules which can arrange | position an insulating board accurately in the predetermined position of a power module.

An insulating plate attaching method for a power module according to one aspect of the present invention is a method of attaching an insulating plate to each of the opposing main surfaces of the power module,
Holding the power module with a pallet so that the main surface of the power module is arranged in a vertical direction;
Using a sticking jig having a suction pad and a first positioning pin, holding the insulating plate by suction with the suction pad while positioning the insulating plate with the first positioning pin;
A step of causing the insulating plate held by the sticking jig to face the main surface of the power module;
Among the sticking jigs arranged so as to sandwich the power module, the second positioning pin provided in one sticking jig is passed through the positioning hole formed in the pallet and the first positioning pin is passed. While bringing the pallet into contact with the pallet and pushing it in the opposite direction, the one attaching jig is brought close to one main surface of the power module, and the insulating plate is attached to one main surface of the power module. Attaching process,
The second positioning pin protruding from the positioning hole of the pallet is inserted into a positioning hole formed in the other sticking jig, and the first positioning pin is brought into contact with the pallet and is opposite to the pallet. While pressing into the other main surface of the power module, the step of adhering the insulating plate to the other main surface of the power module,
Is provided.
Thereby, an insulating board can be accurately affixed on the predetermined position of a power module.

  According to the present invention, the insulating plate can be accurately arranged at a predetermined position of the power module.

It is the fragmentary sectional view which looked at the stage before affixing an insulating board on a power module from the side in the insulating board sticking method for power modules of an embodiment. In the insulating plate affixing method for power modules of an embodiment, it is the fragmentary sectional view which looked at the stage before affixing an insulating plate on a power module from the upper part. It is a perspective view which shows the power module with which an insulating board is affixed. It is a front view which shows the pallet used with the insulating board sticking method for power modules of embodiment. It is a top view which shows the pallet used with the insulating board sticking method for power modules of embodiment. It is a figure which shows typically the insulating plate sticking method for general power modules.

  Hereinafter, specific embodiments to which the present invention is applied will be described in detail with reference to the drawings. However, the present invention is not limited to the following embodiment. In addition, for clarity of explanation, the following description and drawings are simplified as appropriate.

  FIG. 1 is a partial cross-sectional view, as viewed from the side, of a stage before attaching an insulating plate to a power module in the method for attaching an insulating plate for a power module according to the present embodiment. FIG. 2 is a partial cross-sectional view, as viewed from above, of a stage before an insulating plate is attached to the power module in the method for attaching an insulating plate for a power module according to the present embodiment. FIG. 3 is a perspective view showing a power module to which an insulating plate is attached. FIG. 4 is a front view showing a pallet used in the method for attaching an insulating plate for a power module of the present embodiment. FIG. 5 is a top view showing a pallet used in the method for attaching an insulating plate for a power module of the present embodiment. Since each figure is shown in a simplified manner, some parts are omitted. Here, the vertical direction of the pallet is assumed to coincide with the vertical direction (gravity direction).

  In the method for attaching an insulating plate for a power module according to the present embodiment (hereinafter sometimes simply referred to as an attaching method), first, as shown in FIGS. Hold.

  As shown in FIGS. 2 and 3, the power module 1 includes a power card 3 on which a semiconductor element (not shown) is mounted, and a heat spreader 4 is connected to the semiconductor element so that heat can be transferred. It is. The heat spreader 4 is exposed from the main surfaces 3a and 3b of the power card 3, respectively, and is substantially flush with the main surfaces 3a and 3b. A terminal 5 is electrically connected to the semiconductor element, and the terminal 5 protrudes from both surfaces of the power card 3 in the height direction.

  As shown in FIGS. 4 and 5, the pallet 2 holds the main surfaces 3 a and 3 b of the power card 3 in the power module 1 so as to be arranged in the vertical direction of the pallet 2. The pallet 2 includes, for example, left and right support columns 2b that are erected from the base portion 2a. The left and right struts 2b are arranged with a gap in the left-right direction of the pallet 2. The support 2b includes a holding mechanism 2c that holds the power module 1 from the width direction of the power module 1 in a state where the main surfaces 3a and 3b of the power card 3 are arranged in the vertical direction of the pallet 2.

  As shown in FIGS. 2 and 5, the clamping mechanism 2 c includes a clamping part 2 d. The sandwiching portion 2d is, for example, a groove portion formed on a surface of the support column 2b that faces the other support column 2b so as to come into contact with at least a part of the one side surface that faces the power module 1 in the width direction. At least one of the columns 2b can slide in the left-right direction of the pallet 2, and is urged toward the other column 2b by an elastic body (not shown). The thickness in the front-rear direction of the pallet 2 in such a column 2b is set so as not to interfere with the insulating plate 6 when the insulating plate 6 is attached to the power module 1. For example, the power of the power module 1 It is set thinner than the card 3.

  Accordingly, when the power module 1 in a state where the main surfaces 3a and 3b of the power card 3 are arranged in the vertical direction of the pallet 2 is arranged between the opposing sandwiching portions 2d, the power module 1 is removed from the width direction of the power module 1. It is clamped by the clamping part 2d.

  In this way, the power module 1 is held by the pallet 2 in a state where the main surfaces 3 a and 3 b of the power card 3 are arranged in the vertical direction of the pallet 2. At this time, the main surfaces 3a and 3b of the power card 3 in the power module 1 are exposed from between the opposing clamping portions 2d.

  Next, the insulating plate 6 is attached to a predetermined position of the power module 1 using the attaching jig 7. As shown in FIGS. 1 and 2, the sticking jig 7 is arranged so as to sandwich the main surfaces 3 a and 3 b of the power card 3 in the power module 1, that is, sandwich the power module 1 in the front-rear direction of the pallet 2. Has been.

  The sticking jig 7 includes a rotating part 7a, a suction pad 7b, and a first positioning pin 7c. A suction pad 7b, a first positioning pin 7c, and the like are mounted on the rotating portion 7a. The rotating unit 7a can rotate around a rotating shaft 7d extending in the left-right direction of the pallet 2 and can move in the front-rear direction of the pallet 2.

  The suction pad 7b sucks and holds the insulating plate 6. That is, the insulating plate 6 is adsorbed by the suction pad 7b by sucking the air in the suction pad 7b by the pump. The suction surface of the suction pad 7b is exposed from one side of the rotating portion 7a, and when the rotating portion 7a rotates from a state where the suction surface of the suction pad 7b is exposed from the rotating portion 7a toward the upper side of the pallet 2, The power module 1 is exposed from the rotating portion 7a so as to face the main surface 3a or 3b of the power card 3.

  The first positioning pins 7c protrude from the surface where the suction surface of the suction pad 7b in the rotating portion 7a is exposed in a direction substantially orthogonal to the surface so as to correspond to the four corners of the insulating plate 6. And the 1st positioning pin 7c is movable to the direction substantially orthogonal to the surface where the suction surface of the suction pad 7b in the rotation part 7a is exposed. Further, the first positioning pin 7c is urged toward the outside of the rotating portion 7a by the elastic body 7e.

  Such a sticking jig 7 is configured to be positioned at a predetermined position with respect to the power module 1. For example, the front-side sticking jig 7 includes the second positioning pin 7f on the surface where the suction surface of the suction pad 7b in the rotating portion 7a is exposed. The second positioning pin 7f protrudes in a direction substantially orthogonal to the surface from the surface where the suction surface of the suction pad 7b in the rotating portion 7a is exposed.

  The column 2b of the pallet 2 includes a positioning hole 2e into which the second positioning pin 7f of the sticking jig 7 is inserted. The positioning hole 2e penetrates the pallet 2 in the front-rear direction, and the front-side sticking jig 7 or the insulating plate 6 is passed through the second positioning pin 7f of the front-side sticking jig 7. The power module 1 is disposed at a predetermined position.

  The rear sticking jig 7 has a second positioning pin 7f of the front sticking jig 7 protruding from the positioning hole 2e of the column 2b in the pallet 2 on the surface where the suction surface of the suction pad 7b in the rotating portion 7a is exposed. A state in which the positioning hole 7g to be inserted is provided, and the second positioning pin 7f of the front sticking jig 7 protruding from the positioning hole 2e of the support 2b is inserted into the positioning hole 7g of the rear sticking jig 7 Then, the sticking jig 7 on the rear side, that is, the insulating plate 6 is arranged at a predetermined position with respect to the power module 1.

  When the insulating plate 6 is pasted to a predetermined position of the power module 1 using such a pasting jig 7, first, the pasting is performed so that the suction surface of the suction pad 7 b of the pasting jig 7 faces the upper side of the pallet 2. A jig 7 is arranged.

  Next, the insulating plate 6 is arranged on the suction surface of the suction pad 7b so that the four corners of the insulating plate 6 are in contact with the first positioning pins 7c of the sticking jig 7, and the insulating plate 6 is sucked by the suction pad 7b. To do. At this time, the insulating plate 6 is attracted to the suction pad 7b while being positioned by the first positioning pin 7c.

  Next, the sticking jig 7 is rotated in a state where the insulating plate 6 is attracted while being positioned so that the insulating plate 6 faces the main surface 3a or 3b of the power card 3 in the power module 1. Thereby, it will be in the state shown in FIG.1 and FIG.2.

  Next, the sticking jig 7 is moved to the main surface 3a or 3b side of the power card 3 in the power module 1, and the insulating plate 6 is attached to the main surfaces 3a and 3b so as to cover the heat spreader 4 with the insulating plate 6. wear. A heat radiation grease 8 is applied in advance on the heat spreader 4 of the power module 1.

  Here, the sticking jig 7 of the present embodiment is configured to move in the front-rear direction of the pallet 2 in conjunction with the stroke change of one servo cylinder. When the stroke of the servo cylinder decreases, for example, First, the front sticking jig 7 moves.

  When the front-side sticking jig 7 moves to the main surface 3a side of the power card 3 in the power module 1 (that is, the rear side of the pallet 2), the first positioning pins 7c of the front-side sticking jig 7 become the pillars of the pallet 2 The second positioning pin 7f of the front sticking jig 7 is inserted into the pallet 2 into the positioning hole 2e of the column 2b while being in contact with 2b and being pushed in the opposite direction with respect to the power module 1. At this time, while the insulating plate 6 is positioned by the first positioning pins 7c, the front sticking jig 7 is positioned by the fitting structure of the second positioning pins 7f and the positioning holes 2e.

  When the front sticking jig 7 is moved to the main surface 3a side of the power card 3 in the power module 1 from that state, the insulating plate 6 is placed in a predetermined position on the main surface 3a of the power card 3 in the power module 1 to dissipate the heat radiation grease 8. Is pasted through.

  When the stroke of the servo cylinder further decreases, the rear sticking jig 7 moves next. When the rear sticking jig 7 is moved to the main surface 3b side of the power card 3 in the power module 1 (that is, the front side of the pallet 2), the first positioning pin 7c of the rear sticking jig 7 is The second positioning pin 7f of the front sticking jig 7 protruding from the positioning hole 2e of the support 2b of the pallet 2 is inserted into the positioning hole 7g while being pushed in the opposite direction with respect to the power module 1 in contact with the support 2b. Is done. At this time, while the insulating plate 6 is positioned by the first positioning pins 7c, the rear sticking jig 7 is positioned by the fitting structure of the second positioning pins 7f and the positioning holes 7g.

  When the sticking jig 7 on the rear side is moved from the state to the main surface 3b side of the power card 3 in the power module 1, the insulating plate 6 is dissipated into a predetermined position on the main surface 3b of the power card 3 in the power module 1. 8 is pasted.

  Thereafter, when the air of the suction pads 7b of the front and rear sticking jigs 7 is released and the front and rear sticking jigs 7 are moved away from each other, the insulating plate 6 is attached.

  As described above, the attaching method according to the present embodiment positions the insulating plate 6 with the first positioning pin 7c of the attaching jig 7, and the second positioning pin 7f of the attaching jig 7 and the column of the pallet 2. The insulating plate 6 is affixed to the power module 1 while positioning the affixing jig 7 at a predetermined position with respect to the power module 1 with a fitting structure of the positioning hole 2e of 2b or the positioning hole 7g of the affixing jig 7. . Therefore, the insulating plate 6 can be attached to the power module 1 at a predetermined position with high accuracy.

  In addition, for example, as shown in FIG. 6, when the insulating plate 6 is placed on the horizontally placed sticking jig 101 and stuck at a predetermined position of the power module 1, the foreign substance 102 is placed on the sticking jig 101. Is present, bending stress is generated in the insulating plate 6 when the insulating plate 6 is sandwiched between the attaching jig 101 and the power module 1 in order to attach the insulating plate 6 to a predetermined position of the power module 1. There is a possibility that the insulating plate 6 is cracked.

  On the other hand, since the insulating plate 6 is attached to a predetermined position of the power module 1 using the suction pad 7b in the attaching method of the present embodiment, no stress is applied to the insulating plate 6 during attachment. Moreover, since the main surfaces of the power module 1 and the insulating plate 6 are arranged in the vertical direction of the pallet 2 at the time of pasting, there is a low possibility that foreign matter will get on the main surfaces of the power module 1 and the insulating plate 6 at the time of pasting. The bad influence by a foreign material can be suppressed.

  The present invention is not limited to the above-described embodiment, and can be changed as appropriate without departing from the spirit of the present invention.

  For example, in the above-described embodiment, the second positioning pin 7f is provided in the front sticking jig 7, and the positioning hole 7g is provided in the rear sticking jig 7, but when the servo cylinder stroke is reduced. The second positioning pin 7f is provided in the first moving jig 7 and the positioning hole 7g is provided in the second moving jig 7.

  For example, in the above embodiment, the sticking jig 7 is positioned with respect to the power module 1 using the second positioning pin 7f and the positioning hole 2e or the positioning hole 7g. You may position the sticking jig 7 with respect to the power module 1 by 7f and the positioning hole 2e. In this case, the second positioning pin 7f is also provided on the rear sticking jig 7.

  For example, in the above-described embodiment, after the front-side sticking jig 7 is moved, the rear-side sticking jig 7 is moved. However, the order of the movement may be reversed, and may be moved simultaneously. .

DESCRIPTION OF SYMBOLS 1 Power module 2 Pallet, 2a base, 2b support | pillar, 2c Clamping mechanism, 2d Clamping part, 2e Positioning hole 3 Power card, 3a, 3b Main surface 4 Heat spreader 5 Terminal 6 Insulating plate 7 Jig, 7a Rotating part, 7b Suction pad, 7c first positioning pin, 7d rotating shaft, 7e elastic body, 7f second positioning pin, 7g positioning hole 8 heat dissipation grease

Claims (1)

It is a method of attaching an insulating plate to each of the opposing main surfaces of the power module,
Holding the power module with a pallet so that the main surface of the power module is arranged in a vertical direction;
Using a sticking jig having a suction pad and a first positioning pin, holding the insulating plate by suction with the suction pad while positioning the insulating plate with the first positioning pin;
A step of causing the insulating plate held by the sticking jig to face the main surface of the power module;
Among the sticking jigs arranged so as to sandwich the power module, the second positioning pin provided in one sticking jig is passed through the positioning hole formed in the pallet and the first positioning pin is passed. While bringing the pallet into contact with the pallet and pushing it in the opposite direction, the one attaching jig is brought close to one main surface of the power module, and the insulating plate is attached to one main surface of the power module. Attaching process,
The second positioning pin protruding from the positioning hole of the pallet is inserted into a positioning hole formed in the other sticking jig, and the first positioning pin is brought into contact with the pallet and is opposite to the pallet. While pressing into the other main surface of the power module, the step of adhering the insulating plate to the other main surface of the power module,
A method for attaching an insulating plate for a power module.

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