JP2018034405A - Flat plate jig, resin molding device and resin molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flat plate jig for molding a rein for protecting an electronic component arranged on a wafer and a substrate, having a simple structure, without using a release film, a resin molding device and a resin molding method.SOLUTION: There is provided a flat plate jig having a surrounding part 12 for surrounding space on an upper surface with adhering to the upper surface so that a space 28 to which a resin for molding 30 is supplied is formed on the upper surface 22 of a wafer or a substrate 20, and a circumferential part 14 extending along an outer peripheral of the wafer or the substrate from the surrounding part and defining a position of the surrounding part to the wafer or the substrate, a thermoplastic plastic is molded, the resin for molding is supplied to a space surrounded by the upper surface of the wafer and the substrate and an inner peripheral side surface of the surrounding part, a lower surface 24 of the wader or the substrate and the surrounding part is pressed and the upper mold, the surrounding part and the wafer or the substrate are adhered and leakage of a resin for molding 0 is inhibited when the resin for molding is compressed by the upper old 40 and a lower mold 50.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a flat jig used for resin molding of a wafer or a substrate provided with an electronic component to be sealed with a resin, a resin molding apparatus for molding a resin on a wafer or a substrate using the flat jig, and the resin The present invention relates to a resin molding method for molding a resin using a molding apparatus.

  In order to protect electronic components arranged on a wafer or a substrate from the influence of the external environment, sealing with a resin is performed. The resin is usually molded by heating a thermosetting resin in a mold. At that time, a release film is used between the resin and the mold in order to facilitate separation.

  In order to provide the release film in the mold, the resin molding apparatus needs a supply and take-up device for the release film, and also requires a vacuuming device to bring the release film into close contact with the mold. The entire apparatus is complicated and large. Furthermore, since the through-hole for evacuation is formed in the mold, the mold production is complicated and expensive. In addition, since the release film is disposable, the material cost of the release film is high.

  On the other hand, the upper frame portion and the lower frame portion surround the substrate including the electronic components, and the substrate, the upper frame portion and the lower frame portion form a resin space, and the resin is molded in the space. It has been proposed (see Patent Document 1).

Special table 2011-528858 gazette

  However, in the method disclosed in Patent Document 1, the frame itself has a large structure because the substrate is surrounded by the upper frame portion and the lower frame portion. In addition, the upper frame part and lower frame part are combined, and both parts are removed when the substrate is taken out after molding the resin. It becomes. Furthermore, there is no description that the frame disclosed in Patent Document 1 can be removed from the mold without a release film. Rather, after the resin is cured, the resin is cooled in the mold and contracted to be taken out. (Patent Document 1, paragraph 0044).

  Therefore, the present invention provides a flat jig, a resin molding apparatus, and a resin molding method for molding a resin that protects an electronic component arranged on a wafer or a substrate without using a release film with a simple structure. The issue is to provide.

  In order to solve the above problems, a flat plate jig according to the first aspect of the present invention is a substrate provided with a wafer or an electronic component to be sealed with a resin, as shown in FIGS. 3, 6 to 7 and FIG. 20 is a flat jig 10 used for resin molding, and is a space on the upper surface 22 in close contact with the upper surface 22 so as to form a space 28 to which the molding resin 30 is supplied on the upper surface 22 of the wafer or substrate 20. A surrounding portion 12 and a surrounding portion 14 extending from the surrounding portion 12 along the outer periphery of the wafer or substrate 20 and defining the position of the surrounding portion 12 with respect to the wafer or substrate 20. The molding resin 30 is supplied to a space 28 that is molded and surrounded by the upper surface 22 of the wafer or substrate 20 and the inner peripheral side end surface of the surrounding portion 12 of the flat plate jig 10, and the molding resin 30 is connected to the upper mold 40. under When pressurizing with the mold 50, the lower surface 24 of the wafer or substrate 20 and the surrounding portion 12 are pressed so that the upper mold 40, the surrounding portion 12 and the wafer or substrate 20 are in close contact with each other, and the molding resin 30 leaks out. To prevent.

  If comprised in this way, since the upper surface of a wafer or a board | substrate is enclosed by the surrounding part of a flat plate jig, a space will be formed, and resin will be supplied and it will shape | mold by pressurizing between upper molds, resin will be in a flat jig It is removed from the upper mold. Specifically, when the flat plate jig is separated from the upper mold, the resin around the flat plate jig starts to be peeled off, and finally the wafer is pulled away from the upper mold. Therefore, the resin-molded wafer or substrate can be taken out from the mold without using a release film.

  The flat plate jig according to the second aspect of the present invention is the flat plate jig according to the first aspect. For example, as shown in FIG. 10, the periphery of the wafer or the substrate 20 is surrounded by a surface having a continuous peripheral portion 14. If comprised in this way, since the periphery of a wafer or a board | substrate is enclosed by the surface where the peripheral part continued, the position of an surrounding part will be stabilized and manufacture of a flat jig will also become easy.

  The flat plate jig according to the third aspect of the present invention is the flat plate jig according to the first or second aspect. For example, as shown in FIG. 12, the air vent 16 from which air escapes from the inner peripheral side of the surrounding portion 12. Is formed. If comprised in this way, since air will escape from the space enclosed by the surrounding part, a bubble will not mix with resin for shaping | molding.

  The flat plate jig according to the fourth aspect of the present invention is the flat plate jig according to the third aspect, for example, as shown in FIG. 12, connected to the air vent 16 and stores the molding resin 30 flowing through the air vent 16. A resin reservoir 18 is formed. If comprised in this way, even if resin flows through an air vent, since it will be stopped by the resin reservoir, resin will not leak.

  A resin molding apparatus according to a fifth aspect of the present invention is a resin molding apparatus that molds a resin on a wafer or a substrate using the flat plate jig according to any one of the first to fourth aspects. For example, FIG. 3 and FIGS. 6 to 7, a lower mold 50 having a recess 54 for accommodating the wafer or substrate 20; a space 28 is formed between the wafer or substrate 20, and the space 28 is introduced into the space 28. An upper mold 40 having an upper mold surface 48 for pressing the molding resin 30; the upper mold 40 is a flat plate jig holder 46 for pressing the flat plate jig 10 from the upper surface, and the upper mold surface 48 It further has a flat plate jig holder 46 that protrudes in the direction of the lower mold 50 and is movable in a direction in which it is pressed by the elastic member 45.

  With this configuration, by providing the flat plate jig, the resin is removed from the upper mold together with the flat plate jig, and the resin can be taken out of the mold without using a release film. By pressing the flat plate jig, the upper mold, the flat plate jig, and the wafer or substrate are brought into close contact with each other, and the resin is pressurized, so that the resin molding apparatus can be molded without causing the resin to leak.

  The resin molding apparatus according to the sixth aspect of the present invention is the resin molding apparatus according to the fifth aspect. For example, as shown in FIG. 3 and FIGS. The surrounding part 12 is pressed around. Here, “pressing circumferentially” means that the flat plate jig press has a closed shape with a continuous line, and refers to pressing the flat plate jig with the closed shape, and the closed shape is a circle, Any shape including an ellipse, a triangle, a rectangle, and a polygon may be used. If comprised in this way, since a flat plate jig | tool hold | suppresses an surrounding part in the periphery shape, it can hold down uniformly.

  The resin molding apparatus according to the seventh aspect of the present invention is the resin molding apparatus according to the fifth aspect. For example, as shown in FIG. 4, the flat plate jig presser includes a plurality of surrounding portions 12 of the flat plate jig 10. Hold with pin 47. If comprised in this way, since the flat plate jig | tool hold | suppresses an surrounding part with a some pin, it can hold down uniformly with a simple structure.

  The resin molding apparatus according to the eighth aspect of the present invention is the resin molding apparatus according to any one of the fifth to seventh aspects. For example, as shown in FIGS. 10 has a guide 56 that determines the position of 10, and the guide 56 projects in the direction of the upper mold 40 from the lower mold surface 58 on which the wafer or the substrate 20 of the lower mold 50 is placed and is pressed by the elastic member 55. Can move to. If comprised in this way, since the position of a flat plate jig will be decided by a guide, a flat plate jig can be certainly pressed down with a flat plate jig press.

  The resin molding method according to the ninth aspect of the present invention is a resin molding method for molding a resin using the resin molding apparatus according to any of the fifth to eighth aspects as shown in FIGS. A step of placing the wafer or substrate 20 on the lower mold 50; a step of mounting the flat jig 10 on the wafer or substrate 20; a step of placing the molding resin 30 on the wafer or substrate 20; A step of pressing and molding the molding resin 30 with the upper mold 40 and the lower mold 50; a step of removing the wafer or substrate 20 on which the molding resin 30 has been molded from the lower mold 50; And a step of removing the flat plate jig 10 from the taken-out wafer or substrate 20.

  With this configuration, the flat plate jig is mounted on the wafer or substrate, the molding resin is placed on the wafer or substrate, and the molding resin is pressure-molded by the upper mold and the lower mold. The resin is removed from the upper mold together with the flat plate jig. Specifically, when the flat plate jig is separated from the upper mold, the resin around the flat plate jig starts to be peeled off, and finally the wafer is pulled away from the upper mold. Therefore, it becomes a resin molding method which can take out resin from a metal mold, without using a release film.

  According to the flat plate jig of the present invention, the upper surface of the wafer or substrate is surrounded by the surrounding portion of the flat plate jig to form a space, and the resin is supplied and pressed between the upper mold and molded. The resin is removed from the upper mold together with the flat jig, and the resin can be taken out without using a release film. Further, according to the resin molding apparatus of the present invention, the resin can be taken out from the mold without using a release film, and the upper mold, the flat jig, In addition, since the wafer or the substrate is in close contact and the resin is pressurized, the resin can be molded without the resin leaking. Further, according to the resin molding method of the present invention, a flat jig is mounted on the wafer or substrate, the molding resin is placed on the wafer or substrate, and the molding resin is pressure-molded between the upper mold and the lower mold. Therefore, the resin can be taken out from the mold without using a release film.

It is a top view which shows an example of the resin molding apparatus. It is a fragmentary elevation view which shows an example in the case of a resin molding apparatus provided with a granular resin supply unit and a liquid resin supply unit. FIG. 3 is a conceptual cross-sectional view of a compression mold part of a resin molding apparatus, showing a state where a wafer is placed on a lower mold, a flat jig is mounted, and resin is supplied. It is a conceptual diagram which shows the compression molding die part of the resin molding apparatus which used the flat jig holding | pressing pin as a pin, and shows the state which mounted the wafer in the lower metal mold | die. (A) is a conceptual diagram showing a compression molding die portion of a resin molding apparatus in which a flat plate jig presser is an L-shaped claw installed in a lower die, and a state where a wafer and a flat plate jig are placed, (b) ) Shows a state in which the flat plate jig holder is retracted, (c) shows a state in which the flat plate jig holder is moving forward, and (d) shows a state in which the flat plate jig holder is lowered to hold the flat plate jig. In the compression mold part shown in FIG. 3, the lower mold is raised, and the state where the flat plate jig press starts to press the flat plate jig is shown. In the compression mold part shown in FIG. 3 and FIG. 6, the lower mold is raised and the upper mold surface presses the resin. FIG. 8 shows a state where the lower mold is lowered after compression molding of the resin in the compression molding mold portion shown in FIGS. 3, 6 and 7. The place where the wafer after resin molding is taken out in the compression mold part shown in FIGS. 3, 6, 7 and 8 is shown. It is the partial expanded sectional view of the wafer after a resin molding, a flat jig, and resin. It is the partial expanded sectional view of the wafer after resin molding after removing a flat jig, and resin. It is a partial expanded sectional view which shows the flat plate jig which formed the air vent and the resin reservoir. It is a top view which shows an example of the electronic component by which the chip | tip is arrange | positioned on a carrier plate. It is a top view which shows an example of the flat plate jig | tool for circular wafers. It is a top view which shows an example of a board | substrate. It is a top view which shows an example of the flat jig for substrates shown in FIG.

  Embodiments of the present invention will be described below with reference to the drawings. In the drawings, the same or corresponding devices are denoted by the same reference numerals, and redundant description is omitted. Moreover, the upper, lower, left, and right described in the present specification indicate directions in the drawings unless otherwise specified, and the actual directions are not limited.

  FIG. 1 is a plan view of a resin molding apparatus 100 as an embodiment of the present invention. The resin molding apparatus 100 includes an upper mold 40 and a lower mold 50 that mold a molding resin 30 (see FIG. 3 and the like) on the surface of the wafer 20. The upper mold 40 and the lower mold 50 are supported by a molding machine 90, and the lower mold 50 is moved up and down by a drive mechanism (not shown). A loader robot for supplying a wafer for molding a resin to the molds 40 and 50 adjacent to the molding machine 90, that is, the upper mold 40 and the lower mold 50 (hereinafter, also referred to as “molds 40 and 50”). 110 is arranged. The loader robot 110 grips the wafers 20 stored in a supply box 116 such as a FOUP (Front-Opening Unified Pod) at the tip of the arm 112 and supplies them one by one to the molds 40 and 50, that is, to the lower mold 50. Place.

  An unloader robot 140 is disposed adjacent to the molding machine 90 on the side opposite to the loader robot 110. In the present embodiment, the unloader robot 140 grips the resin-molded wafer 26 at the tip of the turning arm 142 and grips the flat plate jig 10. Further, a flat jig supply unit 25 is disposed adjacent to the molding machine 90. The flat plate jig supply unit 25 stores a plurality of flat plate jigs 10. The unloader robot 140 grips one of the flat plate jigs 10 stored in the flat plate jig supply unit 25 at the tip of the arm 142, raises the tip of the arm 142, and turns the arm 142 around the horizontal axis. The flat plate jig 10 is mounted on the wafer 20 placed on the lower mold 50.

  The unloader robot 140 holds the flat jig 10 and holds the resin-molded wafer 26 with the tip of the arm 142. The arm 142 takes out the resin-molded wafer 26 from the molds 40 and 50 and rotates as indicated by broken lines, and the flat plate jig separating unit 27 separates the flat plate jig 10 from the wafer 26. The wafer 26 from which the flat plate jig 10 is separated, that is, the wafer 26 on which resin is formed, is stored in a storage box 146 such as a FOUP. Separation of the flat plate jig 10 and the wafer 26 may be performed by holding the wafer 26 with the unloader robot 140 and lifting the flat plate jig 10 upward with a nail, for example, and removing it by other methods. The separated flat jig 10 is collected in the flat jig collection box 150, pulverized in a separate process, and reused.

  Adjacent to the molding machine 90, a granular resin supply unit 120 for supplying granular resin to the molds 40 and 50 and a liquid resin supply unit 130 for supplying liquid resin are arranged. The resin molding apparatus 100 includes a granular resin supply unit 120 and a liquid resin supply unit 130. As shown in FIG. 2, in order to prevent the units 120 and 130 from interfering with each other, the liquid resin supply unit 130 is preferably mounted on a stand 136 with a pantograph and can be lowered. Both units 120 and 130 have a drive mechanism capable of moving forward and backward, and supply granular resin or liquid resin to the wafer 20 placed on the lower mold 50. The resin molding apparatus 100 may include only either the granular resin supply unit 120 or the liquid resin supply unit 130.

  Next, resin molding using the flat plate jig 10 will be described with reference to FIGS. FIG. 3 shows a state where the wafer 20 is placed on the lower mold 50, the flat jig 10 is mounted on the wafer 20, and the resin 30 is supplied. The lower mold 50 has a circumferential movable guide 56 inside the lower mold 52. The inner periphery of the movable guide 56 is large enough to accommodate the flat jig 10. The lower mold 50 has a die plate 59 inside the movable guide 56. The die plate 59 defines a lower mold surface 58 that pressurizes the wafer 20 or the like as a lower mold. The movable guide 56 is urged upward by an elastic body 55 such as a string spring or an air spring and protrudes from the lower mold surface 58 of the lower mold frame 52 and the die plate 59, but retracts when the tip is pushed. A lower cavity 54 that is a recess surrounded by a movable guide 56 is formed above the die plate 59.

  At this stage, the upper mold 40 is positioned above the lower mold 50, and a gap is formed between the upper mold 40 and the lower mold 50. The upper mold 40 has a circumferential flat plate jig holder 46 inside the upper mold frame 42. The upper mold 40 has an upper receiving plate 44 inside the flat plate jig holder 46, and the lower surface of the upper receiving plate 44 becomes the upper mold surface 48. The flat plate jig holder 46 protrudes from the upper mold surface 48 to the lower mold 50 side. The flat plate jig holder 46 is urged downward by an elastic body 45 such as a string spring or an air spring, and applies a predetermined pressure when pressurizing the flat plate jig 10. Thus, the flat plate jig holder 46 can hold the flat plate jig 10 with a uniform force. The diameter of the flat plate jig holder 46 is large enough to hold the surrounding portion 12 of the flat plate jig 10.

  As shown in FIG. 4, the upper mold 40 may have a plurality of pins 47 as a flat plate jig retainer. The plurality of pins 47 is three or more so as to be pressed with a uniform force, but the number is arbitrary. The plurality of pins 47 are urged by the elastic body 45 to apply a predetermined pressure when the flat plate jig 10 is pressurized. By using the flat plate jig presser as the pin 47, the manufacture becomes easy and the presser can be pressed with a uniform force. The plurality of pins 47 are preferably arranged at equal intervals at positions where the surrounding portion 12 of the flat plate jig 10 is pressed.

  In addition, as shown in FIG. 5, an L-shaped flat jig holder 57 may be attached to the lower mold 50. The L-shaped flat jig holder 57 is arranged such that an L-shaped horizontal bar protrudes from the lower mold 50. As shown in FIG. 5B, when placing the wafer 20 and the flat plate jig 10 on the molds 40 and 50, an L-shape is used so as not to be an obstacle when the wafer 20 and the flat plate jig 10 are placed. The mold plate jig holder 57 is retracted from the center. When the wafer 20 and the flat plate jig 10 are placed on the molds 40 and 50, as shown in FIG. 5 (c), the L-shaped flat plate jig holder 57 advances in the center direction, and FIG. As shown in d), the L-shaped flat plate jig holder 57 descends and presses the flat plate jig 10 from above. Thereafter, the L-shaped flat jig holding member 57 returns to the position shown in FIG. 5B, and the wafer 20 and the flat jig 10 are taken out from the molds 40 and 50. The mechanism for advancing, retreating, raising and lowering the L-shaped flat plate jig holder 57 may be a known configuration such as a pneumatic mechanism, a hydraulic mechanism, and a screw mechanism, and is not particularly limited. Further, it is preferable to hold the flat plate jig 10 with a plurality of L-shaped flat plate jig presses 57. A concave portion 49 is formed on the surface of the upper mold facing the L-shaped flat jig holder 57 so that the L-shaped flat jig holder 57 does not become an obstacle. When the resin 30 and the wafer 20 are pressed by the upper mold surface 48, the L-shaped flat plate jig holder 57 is accommodated in the recess 49.

  The wafer 20 is held by the arm 112 of the loader robot. For example, the wafer 20 is held by sucking air from a suction hole at the tip of the arm. The wafer 20 is transferred from the supply box 116 to the lower cavity 54 in the lower mold 50 and placed on the die plate 59. Next, the flat plate jig 10 held by the arm 142 of the unloader robot 140 is transferred to the lower cavity 54. The outer periphery of the flat plate jig 10 is guided by the movable guide 56 and mounted on the wafer 20 at a predetermined position.

  When the flat plate jig 10 is mounted on the wafer 20 placed on the lower mold 50, the granular resin supply unit 120 or the liquid resin supply unit 130 moves forward and the discharge port is inserted between the molds 40 and 50. A fixed amount of resin 30 is supplied onto the wafer 20. Here, the predetermined amount of resin 30 is an amount that fills the space surrounded by the upper surface 22 of the wafer and the surrounding portion 12 of the flat plate jig 10 when the resin 30 is pressed by the molds 40 and 50. The resin 30 is generally a thermosetting resin.

  As shown in FIG. 6, when the resin 30 is supplied onto the wafer 20, the granular resin supply unit 120 or the liquid resin supply unit 130 moves backward and the lower mold 50 starts to rise. Instead of raising the lower mold 50, the upper mold 40 may be lowered, or both molds 40, 50 may be raised / lowered. As the lower mold 50 is raised, the flat plate jig holder 46 hits the flat plate jig 10. Further, the movable guide 56 hits the upper mold 40. Even if the flat plate jig holder 46 hits the flat plate jig 10 first, the movable guide 56 may hit the upper mold 40 first, or these may hit at the same time. The flat plate jig 10 is pressed toward the wafer 20 by the flat plate jig holder 46 coming into contact with the flat plate jig 10, and the surrounding portion 12 and the upper surface 22 of the wafer are brought into close contact with each other. Further, when the movable guide 56 hits the upper mold 40, the movable guide 56 retracts, and the positions of the flat plate jig 10 and the wafer 20 are held at predetermined positions without hindering the rise of the lower mold 50.

  As shown in FIG. 7, when the lower mold 50 is further raised, the resin 30 and the wafer 20 are pressurized by the upper mold surface 48 and the lower mold surface 58. In the meantime, the flat plate jig 10 is pushed by the flat plate jig holder 46 and the close contact with the upper surface 22 of the wafer is maintained. That is, the lower surface 24 of the wafer 20 is pressed against the lower mold surface 58 and the surrounding portion 12 is pressed by the flat plate jig holder 46 of the upper mold 40, thereby preventing the resin 30 from leaking out. The resin 30 spreads in a space surrounded by the upper surface 22 of the wafer and the surrounding portion 12, and fills the space. Then, pressurization by the upper mold surface 48 and the lower mold surface 58 is maintained for a predetermined time. This time is cure time.

  Here, the details of the flat plate jig 10 will be described with reference to FIG. The flat plate jig 10 has a surrounding portion 12 that is in close contact with the upper surface 22 of the wafer 20, surrounds the space on the upper surface 22, and prevents the supplied resin 30 from leaking. In the present embodiment, the wafer 20 has a disk shape, and the surrounding portion 12 has a hollow disk shape. A peripheral portion 14 extends along the outer periphery of the wafer 20 from the outside of the portion of the surrounding portion 12 that is in close contact with the wafer 20. The peripheral portion 14 surrounds the outer periphery of the wafer 20. That is, in the cross-sectional view of FIG. 10, the flat plate jig 10 has a step, and the wafer 20 is fitted into the step. When the peripheral portion 14 surrounds the periphery of the wafer 20, the position of the flat jig 10 with respect to the wafer 20 is determined. Therefore, the part sealed with the resin 30 is determined. The peripheral portion 14 may be constituted by a continuous surface such as a cylinder, or may be constituted by a comb shape or at least three bars, and the position of the surrounding portion 12 is determined based on the outer periphery of the wafer 20. It only has to be done. Even if the peripheral portion 14 is shorter than the height of the outer periphery of the wafer 20, it is sufficient if the position of the surrounding portion 12 can be determined. The flat jig 10 is formed of a heat-resistant thermoplastic such as PPS (polyphenylene sulfide).

  The upper mold 40 is heated. The heating temperature is a temperature at which the thermosetting resin 30 is solidified, and is usually 125 to 175 ° C. Since the upper mold 40 is heated, the flat plate jig holder 46 is also heated. Therefore, the temperature of the flat jig 10 also rises. The heat-resistant thermoplastic resin used in the flat plate jig 10 does not melt in the temperature range of 125 to 175 ° C. The flat plate jig 10 expands and softens as the temperature rises. As the flat jig 10 expands and softens, the adhesion to the wafer 20 increases. Therefore, when the wafer 20, the flat jig 10 and the resin 30 are pressurized with the upper mold 40 and the lower mold 50, leakage of the resin 30 can be prevented. Further, the flattened jig 10 which has been expanded and softened prevents the local concentration force from acting on the wafer 20 from the molds 40 and 50, thereby preventing the wafer from being damaged.

  Returning to FIG. 8, the description of resin molding using the flat jig 10 will be continued. When the resin 30 is molded on the upper surface 22 of the wafer 20, the lower mold 50 is lowered. When the lower mold 50 is lowered, the flat plate jig 10 is pushed by the flat plate jig holder 46, and the wafer 26 on which the resin is molded is lowered together with the lower mold 50. At this time, the flat plate jig 10 formed of a thermoplastic resin is not attached to the upper mold 40 and is pushed downward by the flat plate jig holder 46, and thus is separated from the upper mold 40. On the other hand, the thermosetting resin 30 is attached to the upper mold 40. However, the upper mold 40 and the flat plate jig 10 are separated from each other around the upper mold 40 and the resin 30 attached. That is, the separated upper die 40 and the flat jig 10 are cracked, and stress concentration occurs at the upper die 40 and the resin 30 adhering portion located at the tip thereof. Therefore, the resin 30 around the flat plate jig 10 begins to peel from the upper mold 40, and finally, the flat plate jig 10 and the resin 30, that is, the wafer 26 are separated from the upper mold 40. Thus, by using the flat plate jig 10, the upper mold 40 and the resin 30 are easily separated. Therefore, even if a release film is not used between the upper mold 40 and the resin 30, the lower mold 50 is lowered, and the flat jig 10 is pushed downward by the flat jig holder 46 so that the flat plate The jig 10 and the resin 30 are separated from the upper mold 40.

  As shown in FIG. 9, when the lower mold 50 finishes descending, the resin-molded wafer 26 and the flat jig 10 are taken out from the lower mold 50 by the unloader robot 140. Then, the wafer 26 and the flat plate jig 10 are transferred to the flat plate jig separation unit 27 by the unloader robot 140 (see FIG. 1), and the flat plate jig 10 is separated. The separated flat plate jig 10 is collected and reused.

  As shown in FIG. 11, in the wafer 26 from which the flat jig 10 is separated, a resin 30 is molded at a predetermined position on the wafer 20 and sealed. Further, since the flat plate jig 10 is brought into close contact with the upper surface 22 of the wafer during resin molding to prevent the resin from leaking, there is no resin dripping and a clean surface can be obtained.

  In addition, as shown in FIG. 12, you may form in the upper surface of the surrounding part 12 of the flat jig 10 the air vent 16 which is a groove | channel connected from an inner peripheral side to an outer peripheral side. When molding the resin, the space 28 surrounded by the upper mold surface 48 of the upper mold 40, the upper surface 22 of the wafer, and the surrounding portion 12 is heated and escapes the expanded air to prevent unnecessarily high pressure. It is possible to prevent bubbles from being mixed with the molded resin. Furthermore, when excess resin 30 is supplied to the space 28, the resin 30 leaks between the upper mold surface 48 and the flat plate jig 10 or between the flat plate jig 10 and the upper surface 22 of the wafer. To prevent that. Further, a resin reservoir 18 connected to the air vent 16 may be formed. The resin reservoir 18 is a portion having a large cross-sectional area in a plane perpendicular to the flow direction, and stores the resin flowing through the air vent 16. By storing the resin in the resin reservoir 18, it is possible to prevent the resin from leaking beyond the flat plate jig 10. A plurality of air vents 16 and resin reservoirs 18 may be formed on the flat plate jig 10.

  As shown in FIG. 13, the flat plate jig 10 and the resin molding apparatus 100 are not limited to the wafer 26 and may be used to mold a resin that protects the electronic component 60 in which chips are arranged on a circular carrier plate. Good.

  As shown in FIG. 14, the flat jig 10 for the circular wafer 20 or the electronic component 60 shown in FIG. 13 has a circular outer periphery and an inner periphery. In the description so far, the wafer 20 has been described as having a disk shape, but is not necessarily limited to the disk shape, and the shape is arbitrary. Similarly, the shapes of the surrounding portion 12, the outer peripheral portion 14, the flat plate jig holder 46, the movable guide 56, and the like are also arbitrary.

  The present invention may be used to mold a resin that protects an electronic component disposed on a resin substrate 70 as shown in FIG. The substrate 70 generally has a rectangular plate shape, but the substrate shape is not limited to a rectangle and is arbitrary. The flat plate jig 80 for the rectangular substrate 70 has a rectangular outer periphery and inner periphery as shown in FIG. The structure, material, usage and advantages of the flat plate jig 80 are the same as those of the flat plate jig 10.

  The flat jig of the present invention has a simple shape, can be mass-produced at low cost by injection molding, and is highly practical. Further, it can be easily mounted on a wafer or a substrate, and a complicated apparatus is unnecessary. By using the flat plate jig of the present invention, a release film becomes unnecessary, and further, omission of the apparatus and simplification of mold manufacturing can be realized. Furthermore, the flat jig of the present invention is formed of a thermoplastic resin, can be reused, and can contribute to resource saving. Also, during resin molding in the mold, it softens and expands, improving the sealing performance and acting as a cushion between the mold and the wafer and substrate to prevent damage to the wafer and substrate Useful.

DESCRIPTION OF SYMBOLS 10 Flat jig 12 Surrounding part 14 Surrounding part 16 Air vent 18 Resin reservoir 20 Wafer or board | substrate 22 Wafer or board | substrate upper surface 24 Wafer or board | substrate lower surface 25 Flat jig supply unit 26 Resin-molded wafer 27 Flat jig separation unit 28 Space 30 (enclosed by upper surface of wafer or substrate and inner peripheral side end surface of surrounding portion) Molding resin 40 Upper mold 42 Upper mold frame 44 Upper receiving plate 45 Elastic member 46 Flat plate jig holder 47 Flat plate jig Holding pin 48 Upper die surface 49 Recess 50 Lower die 52 Lower mold 54 Lower cavity (recess)
55 Elastic member 56 Movable guide 57 L-shaped flat jig holder 58 Lower mold surface 59 Die plate 60 Electronic component 70 in which chip is arranged on carrier plate Resin substrate 80 Flat jig 90 for substrate Molding machine 100 Resin Molding apparatus 110 Loader robot 112 Arm 116 of loader robot Supply box 120 Granule resin supply unit 130 Liquid resin supply unit 136 Table with pantograph 140 Unloader robot 146 Storage box 150 Flat jig recovery box

Claims (9)

A flat jig used for resin molding of a wafer or a substrate provided with electronic parts to be sealed with resin:
An encircling portion that is in close contact with the upper surface and surrounds the periphery of the space on the upper surface so as to form a space for supplying molding resin on the upper surface of the wafer or substrate;
A peripheral portion extending along an outer periphery of the wafer or substrate from the surrounding portion and defining a position of the surrounding portion with respect to the wafer or substrate;
Molded from thermoplastics;
When molding resin is supplied to a space surrounded by the upper surface of the wafer or substrate and the inner peripheral side end surface of the surrounding portion of the flat plate jig, and the molding resin is pressed by the upper mold and the lower mold Further, the lower surface of the wafer or substrate and the surrounding portion are pressed, and the upper mold, the surrounding portion, and the wafer or substrate are brought into close contact with each other to prevent leakage of the molding resin;
Flat jig. Surrounding the periphery of the wafer or substrate with a continuous surface of the periphery;
The flat jig according to claim 1. An air vent was formed through which air escaped from the inner peripheral side of the surrounding portion;
The flat plate jig according to claim 1 or 2. A resin reservoir is formed which is connected to the air vent and stores the molding resin flowing through the air vent;
The flat plate jig according to claim 3. A resin molding apparatus for molding a resin on a wafer or a substrate using the flat jig according to any one of claims 1 to 4.
A lower mold having a recess for accommodating the wafer or substrate;
An upper mold having an upper mold surface that forms a space between the wafer or the substrate and pressurizes the molding resin introduced into the space;
The upper die is a flat plate jig holder that holds the flat plate jig from the upper surface, protrudes from the upper mold surface in the lower mold direction, and is movable in the pressing direction by an elastic member. Having a flat jig holder;
Resin molding equipment. The flat plate jig press holds the surrounding portion of the flat plate jig in a circumferential shape;
The resin molding apparatus according to claim 5. The flat plate jig press holds the surrounding part of the flat plate jig with a plurality of pins;
The resin molding apparatus according to claim 5. The lower mold has a guide for determining the position of the flat jig, and the guide protrudes in the direction of the upper mold from the lower mold surface on which the wafer or substrate of the lower mold is placed, and is elastic. Movable in the direction of pressurization by a member;
The resin molding apparatus of any one of Claims 5 thru | or 7. A resin molding method for molding a resin using the resin molding apparatus according to any one of claims 5 to 8.
Placing the wafer or substrate on the lower mold;
Attaching the flat jig to the wafer or substrate;
Placing a molding resin on the wafer or substrate;
Pressing and molding the molding resin with the upper mold and the lower mold;
Removing the wafer or substrate on which the molding resin is molded from the lower mold;
Removing the flat jig from the wafer or substrate taken out from the lower mold;
Resin molding method.

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