JP2018024078A - Machine tool system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a machine tool system which securely makes surface roughness of a workpiece after lapping in a desired state.SOLUTION: A machine tool system is a machine tool 1 which laps a workpiece W after grinding, and includes a lapping tool 52 which laps the workpiece W, a sensor 100 which detects surface roughness of the workpiece W, and a control device 200 which laps by a lapping tool 52 based on the surface roughness detected by the sensor 100.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a machine tool system.

  It is known to perform lapping in order to make the surface state of the ground workpiece more accurate. Patent Document 1 describes a technique related to constant pressure feed lap processing performed with a constant applied pressure and fixed amount feed lap processing with a constant movement amount. Further, Patent Document 2 describes that the lapping process is terminated when a predetermined cutting amount is reached by moving in a cutting direction with a constant pressure.

JP-A-11-291156 JP 2000-198063 A

  However, in the above-described conventional lapping, the pressure in the constant pressure control or the feed amount in the constant feed control is set so that the surface state of the workpiece at the end of machining becomes a desired state. However, the surface state of the workpiece at the end of processing may not be in a desired state, and may be determined as a defective product in the inspection after processing.

  An object of this invention is to provide the machine tool system which can make the surface roughness of the workpiece after a lapping process into a desired state reliably.

  A machine tool system of the present invention is a lapping machine for lapping a workpiece after grinding, a lapping tool, a sensor for detecting the surface roughness of the workpiece, and a surface roughness detected by the sensor. And a control device for performing lapping with the lapping tool based on the height.

  According to the machine tool system of the present invention, since lapping is performed based on the detected surface roughness of the workpiece, the machine tool system ensures that the surface roughness of the workpiece at the end of lapping is in a desired state. It can be.

It is a top view of the grinding machine in one Embodiment of this invention. It is a figure showing a mode that the surface roughness of a workpiece is detected using a sensor. It is sectional drawing of a detection part. It is a block diagram of a control apparatus.

<First embodiment>
(1. Schematic configuration of machine tool 1)
Hereinafter, an embodiment to which a machine tool system according to the present invention is applied will be described with reference to the drawings. First, a schematic configuration of a machine tool system according to an embodiment of the present invention will be described with reference to FIG.

  As shown in FIG. 1, the machine tool system includes a single machine tool 1 that performs grinding and lapping while rotating a cylindrical workpiece W. The machine tool 1 includes a bed 2, a table 10, a workpiece support device 20, a grindstone table 30, a rotating table 40, a grinding tool 51 and a lapping tool 52, a tourer 60, a coolant supply device 70, a fixed tool. Sizing device 80, air supply device 90, sensor 100, and control device 200.

  The bed 2 is a part that becomes a base of the machine tool 1. The bed 2 is provided with an operation panel 3 into which various parameters relating to processing conditions and the like are input. The table 10 is provided on the bed 2 so as to be movable in the Z-axis direction. The table 10 reciprocates in the Z-axis direction by driving a screw feeder 12 having a Z-axis motor 11.

  The workpiece support device 20 includes a headstock 21 and a tailstock 22. The headstock 21 is fixed on the table 10. The headstock 21 includes a main shaft 23 that rotates about an axis parallel to the Z-axis direction, and a main shaft motor 24 that applies a driving force for rotating the main shaft 23. The headstock 21 rotatably supports one end of the workpiece W by the spindle 23 and rotationally drives the workpiece W by the spindle motor 24. The tailstock 22 is provided on the table 10 at a position facing the headstock 21 and supports the other end of the workpiece W.

  The grinding wheel platform 30 is provided on the bed 2 so as to be movable in the X-axis direction. The grindstone table 30 reciprocates in the X-axis direction by driving a screw feed mechanism 32 having an X-axis motor 31. The turntable 40 is provided on the upper surface of the grindstone table 30. The rotating table 40 is supported by the rotating mechanism 41 so as to be rotatable about the Y axis with respect to the grindstone table 30.

  The grinding tool 51 and the lapping tool 52 are provided at positions that are axially symmetric with respect to the rotation axis of the turntable 40 and are supported by the turntable 40 so as to be rotatable about an axis orthogonal to the Y axis. The grinding tool 51 is a grinding wheel used when grinding the workpiece W. The grinding tool 51 rotates when a driving force is applied from a grinding tool motor 53 fixed to the rotary table 40. The lapping tool 52 is a grinding wheel that is used when lapping the workpiece W that has been ground, and uses finer abrasive grains than the grinding tool 51. The lapping tool 52 rotates when a driving force is applied from a lapping tool motor 54 fixed to the turntable 40.

  The truer 60 is supported by the headstock 21 so as to be rotatable about an axis parallel to the Z axis. The truer 60 is rotated by the driving force applied from the truer motor 61 provided on the headstock 21 to perform truing (shape shaping and sharpening) of the grinding tool 51 and the lapping tool 52.

  The coolant supply device 70 is provided on the bed 2 and supplies coolant to a processing position where grinding and lapping are performed. The sizing device 80 is provided so as to be in contact with the workpiece W on the opposite side of the grinding wheel base 30 with the table 10 interposed therebetween. The sizing device 80 measures the outer diameter of the workpiece W ground by the grindstone table 30.

  The air supply device 90 is provided on the opposite side of the grinding wheel base 30 with the table 10 interposed therebetween. The air supply device 90 is a supply source that supplies air discharged toward the workpiece W. The air supply device 90 is provided with two air supply portions 91 and 92 (see FIG. 2), and the air supplied from the air supply device 90 is discharged from the two air supply portions 91 and 92 to the outside. In the present embodiment, air is supplied from the air supply device 90, but an inert gas or the like that does not affect the processing on the workpiece W may be supplied from the air supply device 90 instead of air. .

  The sensor 100 is provided so as to be movable in the X-axis direction on the opposite side of the grinding wheel base 30 with the table 10 interposed therebetween. The sensor 100 senses the workpiece W, converts an optical signal indicating the surface roughness of the workpiece W into an electrical signal, and transmits the electrical signal to the control device 200.

  The sensing by the sensor 100 is performed in a state where the workpiece W is supported by the workpiece support device 20. Therefore, when the machine tool 1 performs sensing by the sensor 100, when sensing the workpiece W, compared to the case where the workpiece W supported by the workpiece support device 20 needs to be transported to another position. The working efficiency can be improved.

  The control device 200 controls the drive of various motors (Z-axis motor 11, main shaft motor 24, X-axis motor 31, grinding tool motor 53, and lapping tool motor 54) and controls the amount of coolant supplied from the coolant supply device 70. Then, management of the diameter of the workpiece W by the sizing device 80, control related to sensing by the sensor 100, and the like are performed.

(2. Configuration of sensor 100)
Next, the configuration of the sensor 100 will be described with reference to FIGS. As shown in FIG. 2, the sensor 100 includes a main body 110, a detection unit 120, a main body cover 140, a first air discharge unit 150, an air flow path 160, a second air discharge unit 170, and a wind plate. 180.

  As shown in FIG. 3, the main body 110 is formed in a long bar shape, and the detection unit 120 is fixed on one outer surface on the distal end side (right side in FIG. 2) of the main body 110. The detection unit 120 performs sensing of the workpiece W that is a measurement object, and transmits an electrical signal indicating the sensing result to the control device 200. The detection unit 120 includes a substrate 121, a light emitting element 122, a first light receiving element 123 and a second light receiving element 124, a lid part 125, and three lenses 125a to 125c.

  The substrate 121 is made of a semiconductor material (N-type, P-type, bipolar type, etc.), and is mounted on one outer side surface (surface facing downward in FIG. 3) of the main body 110. The light emitting element 122 is a light emitting diode mounted on the substrate 121, and emits light toward the normal direction (downward direction in FIG. 2) of one outer surface of the main body 110. The first light receiving element 123 and the second light receiving element 124 are photodiodes mounted on the substrate 121, and are disposed in the vicinity of the light emitting element 122. The light-emitting element 122, the first light-receiving element 123, and the second light-receiving element 124 are arranged in a straight line along the longitudinal direction of the main body 110 (the left-right direction in FIG. 3), and the light-emitting element 122 includes the first light-receiving element 123 and the first light-receiving element 123. It arrange | positions between the two light receiving elements 124. FIG. The light emitting element 122, the first light receiving element 123, and the second light receiving element 124 arranged on the substrate 121 are partitioned by a partition plate 126. Therefore, the detection unit 120 can efficiently perform light emission from the light emitting element 122 and light reception to the first light receiving element 123 and the second light receiving element 124.

  In this embodiment, the case where a light emitting diode is used as the light emitting element 122 is described as an example. However, instead of the light emitting diode, electroluminescence, a laser element, or the like may be used as the light emitting element 122. In this embodiment, the case where photodiodes are used as the first light receiving element 123 and the second light receiving element 124 has been described as an example. However, instead of the photodiode, a CCD, a CMOS element, or the like is used as the first light receiving element 123. The second light receiving element 124 may be used.

  The lid part 125 covers the substrate 121, the light emitting element 122, the first light receiving element 123, and the second light receiving element 124. The lid 125 holds one lens 125 a to 125 c at a position facing each of the light emitting element 122, the first light receiving element 123, and the second light receiving element 124. The three lenses 125a to 125c may be aspherical lenses, and the lens shape may be changed to adjust the focal position and the focal depth of the lens for easy detection.

  Of the three lenses 125 a to 125 c, the light emitted from the light emitting element 122 is incident on the lens 125 a disposed at a position facing the light emitting element 122. The lens 125a bends the light emitted from the light emitting element 122 and guides the bent light to a specific position P.

  Of the three lenses 125a to 125c, the two lenses 125b and 125c disposed at positions facing the first light receiving element 123 and the second light receiving element 124 bend light incident from a specific position P, and bend the light. The light that has been made is guided to the first light receiving element 123 or the second light receiving element 124.

  Here, when light is emitted from the light emitting element 122, the smaller the surface roughness at the specific position P, the less the light is scattered, so the amount of light detected by the first light receiving element 123 and the second light receiving element 124 becomes larger. . And the control apparatus 200 which received the electrical signal from the sensor 100 has much light quantity which the 1st light receiving element 123 and the 2nd light receiving element 124 detected with respect to the light quantity irradiated from the light emitting element 122 based on the detection value of the sensor 100. When it is determined that, the calculation result indicating that the surface roughness of the site where the sensing is performed is small is output. On the other hand, when it is determined that the amount of light detected by the first light receiving element 123 and the second light receiving element 124 is less than the amount of light emitted from the light emitting element 122, the control device 200 determines that the surface roughness of the site where the sensing is performed is A calculation result indicating that the value is large is output.

  Actually, the incident light at the specific position P and the reflected light from the specific position have a spread, and the incident angle and the reflection angle have a spread of angles. Therefore, the control device 200 determines that the incident angle at the peak position with the strongest intensity in the distribution of incident light is equal to the reflection angle at the peak position with the highest intensity in the distribution of reflected light. When the spread distribution of light and the spread distribution of reflected light are similar, it is determined that the incident angle and the reflection angle are equal.

  Thus, since the detection part 120 can detect the surface roughness of the workpiece W non-contactingly, it can avoid that the workpiece W after grinding is damaged with the sensing by the sensor 100. Furthermore, when the detection unit 120 emits light from one light emitting element 122, the change of reflected light reflected at a specific position P is confirmed by two light receiving elements (first light receiving element 123 and second light receiving element 124). can do. Therefore, the detection unit 120 can measure the surface roughness of the workpiece W with high accuracy.

  In addition, the detection unit 120 arranges the light emitting element 122, the first light receiving element 123, and the second light receiving element 124 on one substrate 121, so that the light emitting element 122, the first light receiving element 123, and the second light receiving element 124 are mutually connected. Can be placed in close proximity. Therefore, the detection unit 120 can reduce the size of the detection unit 120 compared to the case where the light emitting element 122, the first light receiving element 123, and the second light receiving element 124 are formed on separate substrates.

  Returning to FIG. 2, the description of the configuration of the sensor 100 will be continued. The main body cover 140 covers the front end side of the main body 110 and prevents other members and the like from hitting the detection unit 120 directly. An inflow port 141 communicating with the inside and the outside of the main body cover 140 is formed through the upper surface of the main body cover 140. Further, an air supply unit 91 connected to the air supply device 90 is connected to the upper surface of the main body cover 140, and the air discharged from the air supply unit 91 is supplied from the inflow port 141 to the inside of the main body cover 140. .

  On the other hand, a detection port 142 is formed through the lower surface of the main body cover 140 at a position facing the detection unit 120. The detection unit 120 faces the workpiece W, which is a measurement object, via the detection port 142, and light emitted from the detection unit 120 passes through the detection port 142 and enters the workpiece W, and reflected light The light passes through the detection port 142 and enters the detection unit 120. As described above, a detection region A through which light from the detection unit 120 to the workpiece W and from the workpiece W to the detection unit 120 passes is formed between the detection unit 120 and the workpiece W.

  The first air discharge unit 150 is a lower surface of the main body cover 140 and is a nozzle-like part formed around the detection port 142. In the first air discharge unit 150, a plurality of outlets 151 communicating with the inside and the outside of the main body cover 140 are formed to penetrate, and the air supplied from the air supply unit 91 to the inside of the main body cover 140 is a plurality of outlets. It is discharged from 151 toward the workpiece W.

  As described above, the first air discharge unit 150 is formed around the detection port 142 and discharges air toward the workpiece W from the detection unit 120 side. Thereby, the sensor 100 can prevent the scattered foreign matter from adhering to the detection unit 120 and can prevent the mist containing chips and the like from entering the detection region A.

  Further, the plurality of outlets 151 are formed radially so as to spread from the inner side of the main body cover 140 toward the outer side as viewed from the detection unit 120. Therefore, the air discharged from the first air discharge unit 150 is blown toward the workpiece W in a direction away from the detection area A. Thereby, the sensor 100 can prevent the foreign matter blown by the air from the first air release unit 150 from scattering and adhering to the detection unit 120. Further, the sensor 100 can suppress the mist containing chips and the like from entering the detection region A by the air discharged from the first air discharge unit 150. Therefore, the sensor 100 can maintain the detection accuracy when detecting the surface roughness of the workpiece W.

  The air flow path 160 guides the air that has flowed into the main body cover 140 from the air supply device 90 through the air supply unit 91 to the first air discharge unit 150. The air channel 160 is formed between the outer peripheral surface of the main body 110 and the inner peripheral surface of the main body cover 140, and communicates with the first air discharge unit 150. Thereby, the sensor 100 can simplify the structure of the sensor 100, for example compared with the case where the hose etc. which guide air from the air supply part 91 to the 1st air discharge | release part 150 are arrange | positioned inside the main body cover 140. The sensor 100 can be downsized.

  The main body cover 140 is fixed to the outer peripheral surface of the main body 110 at a position farther from the first air discharge portion 150 than the inlet 141, and the space between the outer peripheral surface of the main body 110 and the inner peripheral surface of the main body cover 140 is Sealed by an O-ring 143. As a result, the sensor 100 can prevent the air flowing into the air flow path 160 from leaking from parts other than the first air discharge part 150, so that the air is discharged from the first air discharge part 150 toward the workpiece W. Can be sprayed strongly.

  The second air discharge unit 170 is a nozzle formed integrally with the air supply unit 92 of the air supply device 90. The 2nd air discharge | release part 170 is arrange | positioned between the grindstone base 30 and the sensor 100, and toward the site | part which goes to the detection area A from the grinding position ground by the grinding tool 51 and the lapping tool 52 among the workpieces W. Release air. As a result, the sensor 100 can blow off foreign matters such as coolant adhering to the workpiece W by air discharged from the second air discharge unit 170. Therefore, the sensor 100 can prevent the workpiece W from entering the detection area A in a state where foreign matter is attached. Further, it is possible to prevent the mist containing chips and the like from entering the detection area A. Therefore, the sensor 100 can ensure detection accuracy.

  The wind-cut plate 180 is a plate-like member that partitions the sensor 100 and the second air discharge unit 170 and is fixed to the main body cover 140. The end 180a of the wind cutting plate 180 facing the workpiece W is located closer to the workpiece W than the first air discharge portion 150, and the second air discharge portion 170 moves the workpiece W of the wind cut plate 180 away from the workpiece W. Air is discharged from a position farther from the workpiece W than the facing end 180a.

  In this case, since the air discharged from the second air discharge unit 170 can be prevented from being blown toward the detection area A, the sensor 100 detects foreign matter scattered by the air blown from the second air discharge unit 170. It can suppress adhering to the part 120. Further, since the air discharged from the second air discharge unit 170 is directed to the workpiece W while being guided by the wind cutting plate 180, the second air discharge unit 170 can strongly blow air against the workpiece W. . Therefore, the sensor 100 can easily remove the foreign matter adhering to the workpiece W.

(3. Control device 200)
Next, the control device 200 will be described with reference to FIG. As shown in FIG. 4, the control device 200 includes a spindle control unit 210, a truer control unit 220, a grinding control unit 231 and a lapping control unit 232, a table control unit 240, a grindstone table control unit 250, and a turntable. A control unit 260 and a processing condition determination unit 270 are mainly provided.

  The spindle control unit 210 controls the rotation of the workpiece W (see FIG. 1) by controlling the driving of the spindle motor 24 (see FIG. 1). The truer control unit 220 controls the rotation of the truer 60 (see FIG. 1) by controlling the driving of the truer motor 61 (see FIG. 1). The grinding control unit 231 controls the rotation of the grinding tool 51 (see FIG. 1) by controlling the driving of the grinding tool motor 53 (see FIG. 1). The lapping control unit 232 controls the rotation of the lapping tool 52 by controlling the driving of the lapping tool motor 54 (see FIG. 1).

  The table control unit 240 controls the position and feed speed of the table 10 (see FIG. 1) in the Z-axis direction by performing drive control of the Z-axis motor 11 (see FIG. 1). The wheel head control unit 250 controls the position and feed speed of the wheel head 30 in the X-axis direction by performing drive control of the X-axis motor 31 (see FIG. 1). The turntable control unit 260 controls the rotation of the turntable 40 by controlling the rotation mechanism 41.

  The machining condition determination unit 270 determines conditions for grinding or lapping performed thereafter based on the detection result regarding the surface roughness of the workpiece W obtained from the sensor 100. The table control unit 240 and the grindstone table control unit 250 control the position and feed speed of the table 10 and the grindstone table 30 according to the grinding conditions set in the processing condition determination unit 270. In this way, when grinding the workpiece W until the outer diameter of the workpiece W reaches a desired dimension while moving the grinding tool 51 or the lapping tool 52 relative to the workpiece W, a machining condition determining unit. 270 determines a grinding condition based on the detection result of the sensor 100 so that a desired surface roughness can be obtained after the grinding process is completed while improving efficiency.

(4. Flow of grinding)
Next, the flow of grinding performed using the grinding tool 51 will be described. Here, the case where the cylindrical workpiece W is ground by traverse grinding will be described as an example. When grinding is performed, the wheel head controller 250 controls the rotation mechanism 41 so that the outer peripheral surface of the grinding tool 51 is disposed at a position facing the workpiece W, and rotates the turn table 40.

  In the grinding process, four steps of roughing, intermediate finishing, finishing, and spark-out are sequentially executed. The machine tool 1 rotates the grinding tool 51 in a state where the feed of the grinding wheel base 30 in the X-axis direction is stopped at the time of sparking out. It should be noted that the traverse speed in the Z-axis direction of the table 10 in each step, the number of times of traverse grinding, and the amount of movement (cutting amount) of the grindstone table 30 in the X-axis direction after one traverse grinding is completed, It is predetermined.

  The cutting amount during rough machining is larger than the cutting amount during intermediate finishing, and the cutting amount during intermediate finishing is larger than the cutting amount during finishing. The machine tool 1 rotates the grinding tool 51 in a state where the feed of the grinding wheel base 30 in the X-axis direction is stopped at the time of sparking out. The sizing device 80 measures the outer diameter of the workpiece W after the traverse feed in the Z-axis direction of the table 10 is finished and before the next traverse feed is started.

  Here, since the state of the black skin covering the surface of the workpiece W is not uniform, the surface state of the workpiece W may not be in a desired state even if grinding is performed at a predetermined feed rate. is there. Therefore, the machine tool 1 detects the surface roughness (for example, the maximum height Rz) of the ground part with the sensor 100 in the process of grinding the workpiece W. When the surface roughness detected by the sensor 100 is greater than a predetermined threshold value, the processing condition determination unit 270 determines a grinding condition that causes the surface roughness to be equal to or less than the threshold value, and controls the table control unit 240 and the grinding wheel base. The unit 250 performs control for performing grinding under the conditions determined by the processing condition determining unit 270. Thereby, the machine tool 1 can make the surface state of the workpiece W into a desired state at the end of the grinding process.

(5. Flow of lapping)
The machine tool 1 performs lapping using the lapping tool 52 after grinding using the grinding tool 51 is completed. Accordingly, the turntable control unit 260 controls the rotation mechanism 41 to rotate the turntable 50 by 180 degrees so that the outer peripheral surface of the lapping tool 52 faces the workpiece W.

  The lapping is performed while rotating the workpiece W while feeding the grinding wheel base 30 in the X-axis direction. At the same time, the sensor 100 detects the surface roughness of the lapped portion of the workpiece W, and the machining condition determination unit 270 determines that the surface roughness of the workpiece W has become smaller than a predetermined threshold value. Then, the lapping process by the lapping tool 52 is terminated.

  In the machine tool 1, detection of the surface roughness of the part ground by the grinding tool 51 of the workpiece W and detection of the surface roughness of the part lapped by the lapping tool 52 of the workpiece W are performed in one. Therefore, the sensor 100 can be shared.

(6. Others)
Although the present invention has been described based on the above embodiments, the present invention is not limited to the above embodiments, and various modifications and improvements can be easily made without departing from the spirit of the present invention. Can be inferred.

  For example, in the present embodiment, the machine tool 1 includes one sensor 100, and the single sensor 100 detects the surface roughness of the workpiece W during grinding and the surface roughness of the workpiece W during lapping. The case where the detection is performed has been described. However, the present invention is not limited to this, and the machine tool 1 includes a sensor used for detecting the surface roughness of the workpiece W during grinding and a sensor used for detecting the surface roughness of the workpiece W during lapping. May be provided separately. In this case, the sensor used at the time of lapping uses a detection unit with higher accuracy than the sensor used at the time of grinding, so that the surface roughness of the workpiece W at the end of lapping is more reliably brought close to a desired state. Can do. On the other hand, the sensor used at the time of grinding can suppress the component cost of the sensor used at the time of grinding by using a detection unit having a lower accuracy than the sensor used at the time of lapping.

  Further, in the present embodiment, the case where the present invention is applied to the machine tool 1 capable of performing grinding with the grinding tool 51 and lapping with the lapping tool 52 has been described as an example, but only grinding can be performed. Of course, it is possible to apply the present invention to each of a grinding machine and a lapping machine capable of performing only lapping.

  Moreover, in each said embodiment, although the case where the machine tool was comprised from the one machine tool 1 was demonstrated, it is not restricted to this. For example, a machine tool system includes a plurality of machine tools and an analysis device provided on a network that is external to the plurality of machine tools and connected to the plurality of machine tools, and is controlled in each of the above embodiments. The machining condition determination unit 270 provided in the apparatus 200 may be provided in the analysis apparatus. In this case, for example, the analysis apparatus calculates the value of the surface roughness of the workpiece W ground under a specific machining condition (a specific workpiece W, a specific machine tool, a specific environment (air temperature or humidity), etc.). accumulate. Then, the machining condition determination unit 270 provided in the analysis apparatus analyzes the accumulated data, and determines the optimum machining condition based on the analysis result (trend, occurrence of abnormality, etc.) by the analysis apparatus. Thereby, the machine tool system can make the surface roughness of the workpiece W into a desired state reliably.

(7. Effect)
As described above, the machine tool 1 as a machine tool system to which the present invention is applied performs lapping on the workpiece W after grinding. The machine tool system includes a lapping tool 52 for lapping a workpiece W, a sensor 100 for detecting the surface roughness of the workpiece W, and lapping by the lapping tool 52 based on the surface roughness detected by the sensor 100. And a control device 200 for performing the above.

  According to the machine tool 1 as the machine tool system, the surface roughness of the workpiece W is detected by the sensor 100, and the lapping is performed based on the detected surface roughness of the workpiece W. The surface roughness of the workpiece W at the end of lapping can be surely brought into a desired state.

  In the machine tool system described above, the control device 200 ends lapping when the detected surface roughness becomes smaller than a predetermined threshold value. In this machine tool system, the surface roughness of the workpiece W at the end of lapping can be surely brought into a desired state.

  Furthermore, the above-described machine tool system includes a workpiece support device 20 that rotatably supports the workpiece W, and a grinding tool 51 that grinds the workpiece W supported by the workpiece support device 20. This machine tool system conveys the workpiece W supported by the workpiece support device 20 to another place when the lapping by the lapping tool 52 is performed on the workpiece W that has been ground by the grinding tool 51. The work to do can be made unnecessary. Therefore, the machine tool system can shorten the time required from the end of the grinding process to the start of the lapping process.

  In the above-described machine tool system, the control device 200 detects the surface roughness of the part ground by the grinding tool 51 of the workpiece W and the surface roughness of the part lapped by the lapping tool 52 of the workpiece W. Is detected using one sensor 100.

  The above-described machine tool system detects the surface roughness of the part ground by the grinding tool 51 and the surface roughness of the part lapped by the lapping tool 52 by using one sensor 100, thereby Can be shared.

  The above-described machine tool system includes a plurality of sensors, and the plurality of sensors 100 includes a grinding sensor for detecting the surface roughness of a part ground by the grinding tool 51 of the workpiece W, and a workpiece processing system. A lapping process sensor for detecting the surface roughness of the lapped portion of the lapping tool 52.

  This machine tool system includes a grinding sensor that is a sensor for detecting the surface roughness of the workpiece W during grinding, and a sensor for detecting the surface roughness of the workpiece W during lapping. Since a certain lapping sensor is provided, the surface roughness of the workpiece W after grinding and lapping can be surely brought into a desired state.

  In the machine tool system described above, the sensor 100 is mounted on the substrate 121, the light emitting element that is mounted on the substrate 121 and emits light toward the workpiece W, and is mounted on the substrate 121 in the vicinity of the light emitting element. A first light receiving element 123 capable of receiving the reflected light and a light receiving element as the second light receiving element 124. Since this machine tool system can detect the surface roughness of the workpiece W in a non-contact manner, the workpiece W after grinding can be avoided from being damaged along with the detection of the surface roughness.

  1: machine tool (machine tool system), 20: workpiece support device, 51: grinding tool, 52: lapping tool, 100: sensor, 121: substrate, 122: light emitting element, 123: first light receiving element (light receiving element) 124: second light receiving element (light receiving element), 200: control device, W: workpiece

Claims (6)

A machine tool system for lapping a workpiece after grinding,
A lapping tool for lapping the workpiece;
A sensor for detecting the surface roughness of the workpiece;
A control device for performing lapping with the lapping tool based on the surface roughness detected by the sensor;
A machine tool system comprising:   The machine tool system according to claim 1, wherein the control device ends lapping when the detected surface roughness is smaller than a predetermined threshold value. The machine tool system includes:
A workpiece support device for rotatably supporting the workpiece;
A grinding tool for grinding the workpiece supported by the workpiece support device;
The machine tool system according to claim 1, comprising: The controller is
The detection of the surface roughness of the part ground by the grinding tool of the workpiece and the detection of the surface roughness of the part lapped by the lapping tool of the workpiece use the one sensor. The machine tool system according to claim 3, wherein the machine tool system is performed. The machine tool system includes a plurality of the sensors,
The plurality of sensors are:
A grinding sensor for detecting the surface roughness of the part ground by the grinding tool of the workpiece;
A lapping sensor for detecting the surface roughness of the lapped portion of the workpiece by the lapping tool;
The machine tool system according to claim 3, comprising: The sensor is
A substrate,
A light emitting element mounted on the substrate and emitting light toward the workpiece;
A light receiving element mounted on the substrate in the vicinity of the light emitting element and capable of receiving reflected light from the workpiece;
The machine tool system according to claim 1, further comprising:

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