JP2018022942A - Package and piezoelectric device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package which can omit a process for inspecting a coating state of a conductive adhesive, and to provide a piezoelectric device.SOLUTION: A package (110) has a cavity (113) on which a piezoelectric vibration piece (140) is placed and includes: a first wiring electrode (114a) formed on a bottom surface (113a) of the cavity and electrically connected with the piezoelectric vibration piece through a conductive adhesive (132); a second wiring electrode (114b) which is isolated from the first wiring electrode, formed on the bottom surface arranged side by side with the first wiring electrode, and electrically connected with the piezoelectric vibration piece through the conductive adhesive; and an inspection electrode (115) formed in an area of the bottom surface in a direction intersecting with a direction in which the first wiring electrode and the second wiring electrode are arranged. The inspection electrode includes: a first inspection electrode (115a) electrically connected with the second wiring electrode; and a second inspection electrode (115b) electrically connected with the first wiring electrode.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a package on which a piezoelectric vibrating piece is placed, and a piezoelectric device having the package.

  A piezoelectric device in which a piezoelectric vibrating piece is mounted on a ceramic package and sealed with a lid is known. In mounting the piezoelectric vibrating piece on the package in such a piezoelectric device, first, a conductive adhesive is applied to the package, and then the piezoelectric vibrating piece is bonded to the conductive adhesive.

  In application of the conductive adhesive to the package, the application amount of the conductive adhesive may increase or decrease with respect to a predetermined amount, and the application position may deviate from the predetermined position. In such a case, there is a possibility that the specifications of the crystal impedance (CI) value and impact resistance of the piezoelectric device are not satisfied. For example, Patent Document 1 shows that the CI value is affected by the distance between the excitation electrode and the conductive adhesive. The distance between the excitation electrode and the conductive adhesive is likely to be related to the position and size of the state in which the conductive adhesive is applied to the package. The specification may not be met. In addition, when the application position of the conductive adhesive is greatly deviated, bonding of the conductive adhesive to the piezoelectric vibrating piece becomes insufficient, and the impact resistance of the piezoelectric device is likely to be weakened.

  Therefore, it is inspected whether the conductive adhesive is properly applied to the package after the conductive adhesive is applied to the package. In the inspection of the application of the conductive adhesive to the package, for example, Patent Document 2 shows that the application position of the conductive adhesive is inspected using a camera after the conductive adhesive is applied to the package. ing.

JP2013-21667A JP 2010-124233 A

  However, in this type of inspection, generally, the image information of the inspection object is binarized and compared with a reference to determine the quality of the inspection object. Therefore, as the miniaturization of the piezoelectric device progresses, for example, a pattern that can sharpen the contrast between the conductive adhesive and the background is prepared so that the feature of the image can be easily extracted. It needs to be complicated. These are not preferable because the degree of freedom of design of the piezoelectric device is lowered and the manufacturing throughput is lowered.

  Therefore, an object of the present invention is to provide a package and a piezoelectric device that can omit the inspection process of the application state of the conductive adhesive.

  A package according to a first aspect is a package having a cavity on which a piezoelectric vibrating piece is placed, and is formed on a bottom surface of the cavity and is electrically connected to the piezoelectric vibrating piece through a conductive adhesive. An electrode, a second wiring electrode that is insulated from the first wiring electrode, is formed alongside the first wiring electrode on the bottom surface, and is electrically connected to the piezoelectric vibrating piece via the conductive adhesive; An inspection electrode formed in a region intersecting with the direction in which the first wiring electrode and the second wiring electrode are arranged. The inspection electrode includes a first inspection electrode electrically connected to the second wiring electrode and a second inspection electrode electrically connected to the first wiring electrode.

  A package according to a second aspect is a package having a cavity on which a piezoelectric vibrating piece is placed, and is formed on a bottom surface of the cavity and a hot terminal and a ground terminal, and is formed on the bottom surface through a conductive adhesive. A first wiring electrode electrically connected to the vibration piece, insulated from the first wiring electrode, formed on the bottom surface side by side with the first wiring electrode, and electrically connected to the piezoelectric vibration piece through a conductive adhesive And at least formed in a region intersecting the direction in which the first wiring electrode and the second wiring electrode are arranged on the bottom surface and insulated from the first wiring electrode and the second wiring electrode. An inspection electrode. The first wiring electrode and the second wiring electrode are respectively connected to different hot terminals, and the inspection electrode is connected to the ground terminal.

  In the package according to the third aspect, in the first aspect, the first inspection electrode is formed on the center side of the bottom surface with respect to the first wiring electrode, and the second inspection electrode is formed on the center side of the bottom surface with respect to the second wiring electrode. Is done.

  In a package according to a fourth aspect, in the first aspect, the first inspection electrode is formed on both sides in the direction in which the first wiring electrodes intersect, and the second inspection electrode is formed on both sides in the direction in which the second wiring electrodes intersect. .

  In the package of the fifth aspect, in the first to fourth aspects, the width in the direction in which the first wiring electrode and the second wiring electrode intersect is such that the conductive adhesive is properly applied to the first wiring electrode and the second wiring electrode. When applied, the conductive adhesive is formed to have the same width as the width in the intersecting direction.

  According to a sixth aspect of the package, in the first to fifth aspects, the inspection electrode is formed at a predetermined distance away in a direction intersecting the first wiring electrode and the second wiring electrode. When the conductive adhesive is properly applied to the first wiring electrode and the second wiring electrode, the conductive adhesive is formed shorter than the width in the intersecting direction.

  In the package of the seventh aspect, from the first aspect to the sixth aspect, the cavity has a rectangular planar shape, and the first wiring electrode and the second wiring electrode are at one short side end of the cavity. It is provided.

  A piezoelectric device according to an eighth aspect includes the package according to the first to seventh aspects and a piezoelectric vibrating piece, and the conductive adhesive does not contact the inspection electrode on the first wiring electrode and the second wiring electrode. It is applied as follows.

  According to the package and the piezoelectric device of the present invention, it is possible to omit the inspection process of the application state of the conductive adhesive.

1A is a perspective view of the piezoelectric device 100. FIG. FIG. 4B is a perspective view of the piezoelectric device 100 with the lid 120 removed. 1A is a schematic cross-sectional view of the piezoelectric device 100. FIG. (B) is a top view of the package 110. (C) is a top view of the package 110 to which the conductive adhesive 132 is applied. (A) is a top view of the package 110 in which the poor application example 1 of the conductive adhesive 132 is shown. FIG. 6B is a plan view of the package 110 in which a defective application example 2 of the conductive adhesive 132 is shown. FIG. 6C is a plan view of the package 110 in which a defective application example 3 of the conductive adhesive 132 is shown. FIG. 4A is a top view of the package 210. FIG. FIG. 6B is a top view of the package 310. FIG. 2 is an exploded perspective view of a piezoelectric device 400. FIG. FIG. 3A is a cross-sectional view of the piezoelectric device 400. FIG. FIG. 4B is a top view of the package 410. FIG. FIG.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. It should be noted that the scope of the present invention is not limited to these forms unless otherwise specified in the following description.

(First embodiment)
<Configuration of Piezoelectric Device 100>
FIG. 1A is a perspective view of the piezoelectric device 100. The piezoelectric device 100 mainly includes a package 110, a piezoelectric vibrating piece 140 placed in the package 110, and a lid 120 that seals the piezoelectric vibrating piece 140 in the package 110. The lid 120 is joined to the package 110 via, for example, solder 130. The outer shape of the piezoelectric device 100 is formed in a substantially rectangular parallelepiped shape. In the following description, it is assumed that the X axis extends parallel to the long side of the piezoelectric device 100, the Z axis extends parallel to the short side, and the Y axis extends perpendicular to the X axis and the Z axis.

  FIG. 1B is a perspective view of the piezoelectric device 100 with the lid 120 removed. The package 110 is made of, for example, ceramic, and a cavity 113 that is a space for mounting the piezoelectric vibrating piece 140 is formed inside the package 110. A bonding surface 112 to be bonded to the lid 120 is formed around the cavity 113 on the surface on the + Y axis side of the package 110. Further, a mounting terminal 111a and a mounting terminal 111b are formed on the mounting surface 111c which is the surface on the −Y axis side of the package 110. A first wiring electrode 114 a and a second wiring electrode 114 b are formed on a bottom surface 113 a that is a surface on the −Y axis side in the cavity 113.

  FIG. 1B shows a state where the piezoelectric vibrating piece 140 is placed on the first wiring electrode 114 a and the second wiring electrode 114 b formed in the cavity 113. Excitation electrodes 141 are formed on both main surfaces of the piezoelectric vibrating piece 140, and extraction electrodes 142 are drawn from the excitation electrode 141 to both ends of the −X-axis side of the piezoelectric vibrating piece 140. The excitation electrode 141 formed on the surface on the + Y-axis side of the piezoelectric vibrating piece 140 is electrically connected to the extraction electrode 142 formed on the −Z-axis side end of the −X-axis side of the piezoelectric vibrating piece 140, The excitation electrode 141 formed on the surface on the −Y-axis side of the piezoelectric vibrating piece 140 is electrically connected to the extraction electrode 142 formed on the + Z-axis side end of the −X-axis side of the piezoelectric vibrating piece 140. Yes.

  FIG. 2A is a schematic sectional view of the piezoelectric device 100. 2A includes an AA cross section of FIG. 1A and an AA cross section of the package 110 shown in FIG. 2B described later. The lid 120 is formed by using, for example, Kovar, which is an alloy of iron, nickel, cobalt, and the like, and a nickel plating layer, a gold plating layer, and the like are formed on the surface thereof. 2A shows an example in which the gold metallized pattern 112a is formed on the bonding surface 112 of the package 110, and the cavity 113 is sealed by bonding the gold metallized pattern 112a and the lid 120 via the solder 130. FIG. Has been.

  In FIG. 2A, the first wiring electrode 114a formed on the bottom surface 113a of the cavity 113 is shown. The bottom surface 113a is formed in a substantially rectangular shape, for example. The first wiring electrode 114 a is electrically connected to the extraction electrode 142 via the conductive adhesive 132. The first wiring electrode 114 a is electrically connected to the mounting terminal 111 a via a through electrode 116 a that penetrates the package 110. On the + X axis side of the first wiring electrode 114a on the bottom surface 113a, a second inspection electrode 115b that is insulated from the first wiring electrode 114a is formed. The second inspection electrode 115b is electrically connected to the mounting terminal 111b via a connection electrode 117b formed on the bottom surface 113a and a through electrode 116b penetrating the package 110. The piezoelectric vibrating piece 140 is placed in the cavity 113 by applying the conductive adhesive 132 on the first wiring electrode 114a so as not to contact the second inspection electrode 115b.

  FIG. 2B is a top view of the package 110. On the bottom surface 113a of the cavity 113 of the package 110, a first wiring electrode 114a and a second wiring electrode 114b that are electrically connected to the extraction electrode 142 of the piezoelectric vibrating piece 140 are formed side by side in the Z-axis direction. In FIG. 2A, the through electrode 116a and the through electrode 116b are indicated by dotted lines, and the first wiring electrode 114a is electrically connected to the through electrode 116a. On the + X axis side of the first wiring electrode 114a and the second wiring electrode 114b, an inspection electrode 115 for detecting defective application of the conductive adhesive 132 is formed. The detection electrode 115 includes a second inspection electrode 115b formed on the + X axis side of the first wiring electrode 114a and a first inspection electrode 115a formed on the + X axis side of the second wiring electrode 114b. The first inspection electrode 115a is connected to the first wiring electrode 114a via a connection electrode 117a formed on the bottom surface 113a. The second inspection electrode 115b is electrically connected to the second wiring electrode 114b and the through electrode 116b through the connection electrode 117b.

  FIG. 2C is a top view of the package 110 to which the conductive adhesive 132 is applied. When the conductive adhesive 132 is properly applied, the conductive adhesive 132 does not come into contact with the first inspection electrode 115a and the second inspection electrode 115b and on the first wiring electrode 114a and the second wiring electrode 114b. To be applied. In the package 110, the width of the first wiring electrode 114a and the second wiring electrode 114b in the X-axis direction is W1, the width between the first wiring electrode 114a and the second inspection electrode 115b, and the second wiring electrode 114b and the first inspection. When the width between the electrodes 115a is W2, and the diameter of the conductive adhesive 132 when the conductive adhesive 132 is properly applied on the bottom surface 113a of the package 110 is W3, the width W1 and the width W2 are the diameters. It is adjusted by the size of W3 and various other factors. For example, the width W1, the width W2, and the diameter W3 are formed so that the width W1 is the same as the diameter W3 and the width W2 is the same as the diameter W3 in consideration of the application position and the allowable range of the application amount of the conductive adhesive 132. Or it can be formed smaller than this.

  Further, it is known that the CI value increases when the distance between the excitation electrode of the piezoelectric vibrating piece and the conductive adhesive bonded to the piezoelectric vibrating piece is short. Therefore, a state where the distance between the position of the conductive adhesive bonded to the piezoelectric vibrating piece and the excitation electrode becomes too close can be detected as a failure, that is, as the CI value becomes higher than the allowable range. The position of the inspection electrode 115 may be determined so that the case where the distance between the conductive adhesive and the excitation electrode is short can be detected as a defective state. In this case, in determining the formation position of the inspection electrode 115, the size, shape, excitation electrode size, shape, formation position, extraction electrode formation position, size, and the like of the piezoelectric vibrating piece may be considered.

<Examples of poor application of conductive adhesive>
Conventionally, after applying a conductive adhesive to a package, an inspection of whether or not the amount of the conductive adhesive and the application position are appropriate has been performed using a camera. However, as described above, it is not preferable because it is necessary to prepare a pattern that can sharpen the contrast between the conductive adhesive and the background, and to complicate an image processing algorithm.

  When the package 110 is used, it is possible to detect a defect as a piezoelectric device when there is a defective application of the conductive adhesive 132 to the package 110 without performing inspection by a camera. Hereinafter, an example of defective application of the conductive adhesive 132 when the package 110 is used will be described, and how a defect as a piezoelectric device is detected will be described.

  FIG. 3A is a plan view of the package 110 in which poor application example 1 of the conductive adhesive 132 is shown. In FIG. 3A, the conductive adhesive 132 applied on the first wiring electrode 114a is represented as the conductive adhesive 132a, and the conductive adhesive 132 applied on the second wiring electrode 114b is conductive. It is represented as an adhesive 132b. FIG. 3A shows a state where the application position of the conductive adhesive 132a is shifted to the + X-axis side and the conductive adhesive 132a is in contact with the second inspection electrode 115b. Even if the piezoelectric vibrating reed 140 is placed in the cavity 113 and the piezoelectric device 100 is formed in the state of FIG. 3A, the first wiring electrode 114a and the second wiring electrode 114b are made of the conductive adhesive 132a and The piezoelectric device 100 is short-circuited via the second inspection electrode 115b, and the piezoelectric device 100 does not oscillate.

  In the conventional package in which the inspection electrode is not formed, even when the conductive adhesive 132a is applied to the + X axis side as shown in FIG. 3A, the conductive adhesive 132a contacts the first wiring electrode 114a. Therefore, and since there is no second inspection electrode 115b, the piezoelectric device can oscillate. However, the piezoelectric device is not a good product because the distance between the conductive adhesive and the excitation electrode is shortened and the CI value is likely to be large. If a camera inspection is not performed, a defect is detected. There is a possibility that it will be shipped without. On the other hand, when the package 110 is used, the piezoelectric device does not oscillate. Therefore, even if there is no camera inspection process in the state of application of the conductive adhesive, the piezoelectric device can be used in other inspection processes such as an inspection before shipping. The device 100 can be reliably detected as a defective product.

  FIG. 3B is a plan view of the package 110 in which the application example 2 of the conductive adhesive 132 is shown. In FIG. 3B, although the application position of the conductive adhesive 132 is appropriate, the applied amount of the conductive adhesive 132 is large. A state in which one inspection electrode 115a is in contact is shown. In the state shown in FIG. 3B, the conductive adhesive 132a and the conductive adhesive 132b are short-circuited, and the piezoelectric device does not oscillate. Therefore, as in the case of FIG. 3A, the piezoelectric device 100 is reliably detected as a defective product in another inspection process such as a pre-shipment inspection without a camera inspection process in the state of application of the conductive adhesive. be able to.

  FIG. 3C is a plan view of the package 110 in which the defective application example 3 of the conductive adhesive 132 is shown. FIG. 3C shows a state in which the amount of the conductive adhesive 132 applied to the package 110 is small and the conductive adhesive 132 is applied while being shifted to the −X axis side. In the package 110, the width W1 in the X-axis direction of the first wiring electrode 144a and the second wiring electrode 144b is determined to be a predetermined width. Therefore, when the application amount of the conductive adhesive 132 is small and the application position is greatly shifted to the −X-axis side, the conductive adhesive 132 protrudes from the first wiring electrode 114a and the second wiring electrode 114b. It is not electrically connected to the electrode 114a and the second wiring electrode 114b. When the piezoelectric device 100 is formed in this state, the piezoelectric device 100 does not oscillate.

  In the conventional package, the wiring electrode to which the conductive adhesive 132 is applied is formed to be large so that conduction can be ensured even if the conductive adhesive application position is shifted. However, when the piezoelectric device is formed in the application state of the conductive adhesive as shown in FIG. 3C, the formation position of the conductive adhesive is deviated from the proper position and the application of the conductive adhesive. Since the amount is not sufficient, the bonding between the piezoelectric vibrating piece and the conductive adhesive is not sufficient, and there is a high possibility that the impact resistance of the piezoelectric device is weak. That is, it can be said that the piezoelectric device is a defective product. When the piezoelectric device 100 is formed using the package 110, the state shown in FIG. 3C does not oscillate. Therefore, the piezoelectric device is in a defective state even if the application state of the conductive adhesive is not inspected by camera inspection It can be detected.

  As described above, when the package 110 is used, even if the camera inspection process of the application state of the conductive adhesive is omitted, the application position of the conductive adhesive is greatly shifted, and the application amount of the conductive adhesive is large. It is possible to detect a defective state caused by the fluctuation. Therefore, the manufacturing process can be shortened and simplified by omitting the camera inspection process, and the manufacturing cost of the piezoelectric device can be reduced.

(Second Embodiment)
The inspection electrode may be formed in various shapes and positions. Below, the modification of the test | inspection electrode formed in the bottom face of a package is demonstrated.

<Configuration of Package 210>
FIG. 4A is a top view of the package 210. In the package 210, a first wiring electrode 114a and a second wiring electrode 114b are formed on the bottom surface 113a, a second inspection electrode 215b is formed on the + X axis side of the first wiring electrode 114a by a width W2, and a second wiring is formed. A first inspection electrode 215a is formed on the -X axis side of the electrode 114b by being separated by a width W4. The first wiring electrode 114a and the first inspection electrode 215a are electrically connected by the connection electrode 217a, and the second wiring electrode 114b, the second inspection electrode 215b, and the through electrode 116b are electrically connected by the connection electrode 217b. Has been. Other configurations of the package 210 are the same as those of the package 110.

  The package 210 is formed such that the application positions of the conductive adhesive 132a applied on the first wiring electrode 114a and the conductive adhesive 132b applied on the second wiring electrode 114b are aligned in the Z-axis direction. This can be used particularly when only the conductive adhesive is difficult to shift in the X-axis direction. In the package 210, when the pair of conductive adhesives 132 is shifted to the + X axis side, the conductive adhesive 132 is in contact with the second test electrode 215b, and when the pair is shifted to the -X axis side, the first test electrode 215a is contacted. The conductive adhesive 132 contacts. When the amount of the conductive adhesive 132 applied is large, the conductive adhesive 132 comes into contact with at least one of the first inspection electrode 215a or the second inspection electrode 215b, so that the pair of conductive adhesives 132 are in contact with each other. Short circuit. For this reason, as with the package 110, even if the camera inspection process in the state of application of the conductive adhesive is omitted, the application position of the conductive adhesive greatly deviates and the amount of application of the conductive adhesive varies greatly. Can be detected. Therefore, the manufacturing process can be shortened and simplified by omitting the camera inspection process, and the manufacturing cost of the piezoelectric device can be reduced.

<Configuration of Package 310>
FIG. 4B is a top view of the package 310. In the package 310, a first wiring electrode 114a and a second wiring electrode 114b are formed on the bottom surface 113a. Further, the second inspection electrode 315b is formed so as to surround the ± X axis side and the −Z axis side of the first wiring electrode 114a in a “U” shape, and the ± X axis side and the + Z axis of the second wiring electrode 114b are formed. A first inspection electrode 315a is formed so as to surround the side in a “U” shape. The first wiring electrode 114a and the first inspection electrode 315a are electrically connected by the connection electrode 317a, and the second wiring electrode 114b, the second inspection electrode 315b, and the through electrode 116b are electrically connected by the connection electrode 317b. Yes. Other configurations of the package 310 are the same as those of the package 110.

  In the package 310, when the conductive adhesive 132a applied on the first wiring electrode 114a and the conductive adhesive 132b applied on the second wiring electrode 114b are shifted in the application position or the application amount is increased. The defective state occurring in the above can be inspected by detecting a short circuit between the conductive adhesives 132 or detecting a non-oscillation associated with the short circuit.

(Third embodiment)
The inspection electrode formed on the package may be grounded by being connected to a ground terminal. Hereinafter, a package in which the inspection electrode is grounded will be described.

<Configuration of Piezoelectric Device 400>
FIG. 5 is an exploded perspective view of the piezoelectric device 400. The piezoelectric device 400 is mainly formed by a package 410, a piezoelectric vibrating piece 140, and a flat lid 420. The package 410 has a cavity 413 that is a space in which the piezoelectric vibrating piece 140 is placed, and a first wiring electrode 114 a and a second wiring are formed on a bottom surface 413 a that is a surface on the −Y axis side in the cavity 413. An electrode 114b and an inspection electrode 415 are formed. A bonding surface 412 to be bonded to the lid 420 is formed around the cavity 413 on the surface on the + Y axis side of the package 410.

  The package 410 is formed of, for example, ceramic, and is formed by superimposing the first layer 410a and the second layer 410b. The first layer 410a is a part on the + Y axis side of the package 410 and constitutes a side surface of the cavity 413, and the second layer 410b is joined to the −Y axis side of the first layer 410a to be on the −Y axis side of the package 410. Make up part. In addition, a castellation 418 that is recessed inside the package 410 is formed at each corner of the side surface of the package 410. A pair of hot terminals 411 a and a pair of ground terminals 411 b are formed on the mounting surface 411 c that is the surface on the −Y axis side of the package 410.

  FIG. 6A is a cross-sectional view of the piezoelectric device 400. 6A includes a BB cross section of FIG. 5 and FIG. 6B described later. 6A shows a state in which the second wiring electrode 114b and the extraction electrode 142 are joined by the conductive adhesive 132, and the piezoelectric vibrating piece 140 is placed in the cavity 413 of the package 410. FIG. The second wiring electrode 114b is electrically connected to a hot terminal 411a formed on the mounting surface 411c through the connection electrode 417b. The inspection electrode 415 is electrically connected to a ground terminal 411b formed on the mounting surface 411c through the connection electrode 417c.

  FIG. 6B is a top view of the package 410. In FIG. 6B, an electrode formed on the bottom surface 413a of the cavity 413 is shown, and is formed between the first layer 410a and the second layer 410b through the first layer 410a and the second layer 410b. The electrodes formed and the electrodes formed on the mounting surface 411c are indicated by dotted lines. A pair of hot terminals 411 a and a pair of ground terminals 411 b are formed on the mounting surface 411 c of the package 410. The ground terminal 411b is a ground side terminal, and the hot terminal 411a is a non-ground side terminal. The hot terminals 411a are formed at the corners of the mounting surface 411c on the + Z axis side on the + X axis side and on the + Z axis side on the −X axis side. The ground terminal 411b is formed at the corners of the mounting surface 411c on the -Z-axis side on the -X-axis side and on the + Z-axis side on the + X-axis side.

  A first wiring electrode 114 a, a second wiring electrode 114 b, and an inspection electrode 415 are formed on the bottom surface 413 a of the cavity 413 of the package 410. The first wiring electrode 114a is connected to the + X-axis side via the connection electrode 417a formed between the first layer 410a and the second layer 410b and the castellation 418 at the corner on the -Z-axis side on the + X-axis side. -It is electrically connected to a hot terminal 411a formed at the corner on the Z-axis side. The second wiring electrode 114b is connected to the −X-axis side via a connection electrode 417b formed between the first layer 410a and the second layer 410b and on the castellation 418 at the corner on the + Z-axis side on the −X-axis side. Are electrically connected to hot terminals 411a formed at the corners on the + Z-axis side. The inspection electrode 415 is connected to a ground terminal 411b formed at a corner on the + Z-axis side on the + X-axis side via a connection electrode 417c formed on a bottom surface 413a and a castellation 418 on a corner on the + Z-axis side on the + X-axis side. Is electrically connected. The inspection electrode 415 is formed away from the first wiring electrode 114a and the second wiring electrode 114b by a width W2 in the X-axis direction.

  In the package 410, the application position of the conductive adhesive 132a formed on the first wiring electrode 114a or the conductive adhesive 132b formed on the second wiring electrode 114b is shifted, or the amount of the conductive adhesive 132 applied When the contact amount is excessive and the test electrode 415 is contacted, the conductive adhesive 132 is electrically connected to the ground terminal 411b. Depending on how the ground terminal 411b is connected to other circuits, the piezoelectric device It does not oscillate. Alternatively, a defect can be detected by conducting a continuity test between the ground terminal 411b and the first wiring electrode 114a and the second wiring electrode 114b. Therefore, when the package 410 is used, as in the case of using the package 110, it is detected that the piezoelectric device is in a defective state without inspecting the application state of the conductive adhesive by the camera. Can do.

<Configuration of Package 510>
FIG. 7 is a plan view of the package 510. The package 510 is configured by further forming an inspection electrode 515 on the −X axis side of the first wiring electrode 114a and the second wiring electrode 114b in the package 410. The inspection electrode 515 is formed on the mounting surface 411c via the connection electrode 517 formed between the first layer 410a and the second layer 410b and on the castellation 418 at the corner on the −Z axis side on the −X axis side. It is electrically connected to a ground terminal 411b formed at a corner on the -Z-axis side on the X-axis side.

  In the package 410, when the application position of the conductive adhesive 132 is greatly shifted to the −X axis side, the applied amount of the conductive adhesive 132 is large, and the conductive adhesive 132 is in contact with the wiring electrode 114. It does not oscillate as a piezoelectric device. Even in such a case, the package 510 causes the piezoelectric device to oscillate when the conductive adhesive 132 comes into contact with the inspection electrode 515, and does not inspect the application state of the conductive adhesive with the camera. It can be detected that the device is in a defective state.

  As described above, the optimal embodiment of the present invention has been described in detail. However, as will be apparent to those skilled in the art, the present invention can be implemented with various modifications and variations within the technical scope thereof. For example, the first wiring electrode and the second wiring electrode may be provided at one short side end of the cavity. Further, the above embodiments may be implemented in various combinations.

DESCRIPTION OF SYMBOLS 100, 400 ... Piezoelectric device 110, 210, 310, 410 ... Package 111a, 111b ... Mounting terminal 111c, 411c ... Mounting surface 112, 412 ... Bonding surface 112a ... Gold metallization pattern 113, 413 ... Cavity 113a, 413a ... Bottom surface 114a ... First wiring electrode 114b ... Second wiring electrode 115, 215, 415, 515 ... Inspection electrode 115a, 215a, 315a ... First inspection electrode 115b, 215b, 315b ... Second inspection electrode 116a, 116b ... Through electrode 117a, 117b, 217a, 217b, 317a, 317b, 417a, 417b, 417c, 517 ... connection electrode 120, 420 ... lid 130 ... solder 132, 132a, 132b ... conductive adhesive 140 ... piezoelectric vibrating piece 141 ... Excitation electrode 142 ... Extraction electrode 411a ... Hot terminal 411b ... Earth terminal 418 ... Castration

Claims (8)

A package having a cavity on which a piezoelectric vibrating piece is placed,
A first wiring electrode formed on a bottom surface of the cavity and electrically connected to the piezoelectric vibrating piece through a conductive adhesive;
A second wiring electrode that is insulated from the first wiring electrode, is formed side by side with the first wiring electrode on the bottom surface, and is electrically connected to the piezoelectric vibrating piece through a conductive adhesive;
An inspection electrode formed in a region in a direction intersecting the aligned direction of the first wiring electrode and the second wiring electrode on the bottom surface,
The inspection electrode includes a first inspection electrode electrically connected to the second wiring electrode, and a second inspection electrode electrically connected to the first wiring electrode. A package having a cavity on which a piezoelectric vibrating piece is placed, a hot terminal and a ground terminal formed on the bottom surface of the cavity;
A first wiring electrode formed on the bottom surface and electrically connected to the piezoelectric vibrating piece through a conductive adhesive;
A second wiring electrode insulated from the first wiring electrode, formed on the bottom surface side by side with the first wiring electrode, and electrically connected to the piezoelectric vibrating piece through a conductive adhesive;
A test electrode formed at least in a region of the bottom surface in a direction intersecting the aligned direction of the first wiring electrode and the second wiring electrode and insulated from the first wiring electrode and the second wiring electrode And comprising
The first wiring electrode and the second wiring electrode are connected to the different hot terminals, and the inspection electrode is connected to the ground terminal.   The first inspection electrode is formed on the center side of the bottom surface with respect to the first wiring electrode, and the second inspection electrode is formed on the center side of the bottom surface with respect to the second wiring electrode. Package as stated.   The first inspection electrode is formed on both sides of the intersecting direction of the first wiring electrode, and the second inspection electrode is formed on both sides of the intersecting direction of the second wiring electrode. package.   The width of the first wiring electrode and the second wiring electrode in the intersecting direction is the conductive adhesive when the conductive adhesive is properly applied to the first wiring electrode and the second wiring electrode. The package according to claim 1, wherein the package is formed to have the same width as the width in the intersecting direction. The inspection electrode is formed at a predetermined distance in the intersecting direction with respect to the first wiring electrode and the second wiring electrode,
The predetermined distance is formed to be shorter than a width of the conductive adhesive in the intersecting direction when the conductive adhesive is properly applied to the first wiring electrode and the second wiring electrode. The package according to any one of claims 1 to 5.   The said cavity is a rectangular shape in a planar shape, The said 1st wiring electrode and the 2nd wiring electrode are provided in the edge part of one short side of this cavity, The any one of Claims 1-6. Package described in. The package according to any one of claims 1 to 7 and the piezoelectric vibrating piece,
A piezoelectric device in which the conductive adhesive is applied on the first wiring electrode and the second wiring electrode so as not to contact the inspection electrode.