JP2018022004A - Optical deflector and image display system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical deflector which reduces defects by suppressing progress of peeling or cracking when a piezoelectric member is repeatedly deformed.SOLUTION: An optical deflector 13 includes: a mirror part 101 with a reflective surface 14; a supporting part 120 supporting the mirror part 101, the supporting part having a plurality of elastic parts 130a and 130b formed tortuously and continuously; piezoelectric driving parts 131a to 131f and 132a to 132f separately located in the elastic parts; an insulating film 153 partially covering the piezoelectric driving parts; and a connection part 151 connecting at least two of the piezoelectric driving parts via an opening part 154 provided in an insulating film 153, the piezoelectric driving parts 131a to 131f and 132a to 132f having a laminated structure of a lower electrode 201, a piezoelectric part 202, and an upper electrode 203, and the connection part 151 being in contact with the upper electrode 203 and the piezoelectric part 202 of the piezoelectric driving parts 131a to 131f and 132a to 132f.SELECTED DRAWING: Figure 10

Description

  The present invention relates to an optical deflector and an image display system.

As a means for deflecting and scanning a light beam, a small-sized light deflector in which a movable part provided with a reflective surface and an elastic beam part are integrally formed on a substrate by applying a semiconductor manufacturing technique has been developed.
In such an optical deflector, a configuration is known in which a piezoelectric material is sandwiched between electrodes, a voltage is applied, and a movable portion is rotated by expansion and contraction of the piezoelectric material.

  The optical deflector having such a configuration is required to have a large scanning angle and vibrate at high speed. However, when the scanning angle is improved, there is a problem that peeling is likely to proceed between the electrode and the wiring member due to repeated deformation of the piezoelectric member at a high speed, particularly at the end of the piezoelectric material having a large deflection width.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide an optical deflector that reduces the failure by suppressing the progress of peeling and cracking even when deformation to the piezoelectric member occurs repeatedly. To do.

  In order to solve the above-described problems, an optical deflector according to the present invention includes a mirror portion having a reflective surface, a plurality of elastic portions continuously formed in a meandering manner, a support portion that supports the mirror portion, and the elastic portion. A plurality of individually provided piezoelectric parts, an insulating film that at least partially covers the piezoelectric part, and a connecting part that connects at least two piezoelectric parts through an opening provided in the insulating film, The piezoelectric portion includes a lower electrode, a piezoelectric film, and an upper electrode, and the connecting portion contacts the upper electrode and the piezoelectric film of the piezoelectric portion.

  According to the optical deflector of the present invention, even when deformation to the piezoelectric member repeatedly occurs, the occurrence of failure is reduced by suppressing the progress of peeling and cracking.

It is the schematic of an example of an optical scanning system. It is a hardware block diagram of an example of an optical scanning system. It is a functional block diagram of an example of a drive device. It is a flowchart of an example of the process which concerns on an optical scanning system. It is the schematic of an example of the motor vehicle carrying a head up display apparatus. It is a schematic diagram of an example of a head up display device. It is the schematic of an example of the image forming apparatus carrying an optical writing device. It is the schematic of an example of an optical writing device. It is the schematic of an example of the motor vehicle carrying a laser radar apparatus. It is the schematic of an example of a laser radar apparatus. It is the schematic of an example of the packaged optical deflector. It is a top view when an example of an optical deflector is seen from + Z direction. It is P-P 'sectional drawing of the optical deflector shown in FIG. It is Q-Q 'sectional drawing of the optical deflector shown in FIG. It is a figure which shows an example of a structure of the piezoelectric drive part concerning embodiment of this invention. It is sectional drawing which shows an example of a structure of the piezoelectric drive part shown in FIG. It is the schematic diagram which represented typically the deformation | transformation of the 2nd drive part of an optical deflector. (A) is a graph which shows an example of the waveform of the drive voltage A applied to the piezoelectric drive part group A of an optical deflector, (b) is applied to the piezoelectric drive part group B of an optical deflector. It is a graph which shows an example of the waveform of the drive voltage B, (c) is a graph which shows an example which superimposed the waveform of the drive voltage of (a), and the waveform of the drive voltage of (b). FIG. 16 is a diagram illustrating an example of a manufacturing method of the piezoelectric drive unit illustrated in FIG. 15. It is a figure which shows the modification of a structure of a piezoelectric drive part. It is a figure which shows the other modification of a structure of a piezoelectric drive part. It is a figure which shows the modification of an optical deflector. It is a figure which shows the other modification of an optical deflector. It is a figure which shows an example of a structure of the conventional piezoelectric drive part. It is a figure which shows the R-R 'cross section of the prior art example shown in FIG.

Hereinafter, embodiments of the present invention will be described in detail.
[Optical scanning system]
First, an optical scanning system to which a driving apparatus according to an embodiment of the present invention is applied will be described in detail with reference to FIGS.
FIG. 1 shows a schematic diagram of an example of an optical scanning system. As shown in FIG. 1, the optical scanning system 10 optically scans the surface to be scanned 15 by deflecting the light emitted from the light source device 12 according to the control of the driving device 11 by the reflecting surface 14 of the optical deflector 13. It is.
The optical scanning system 10 includes a driving device 11, a light source device 12, and an optical deflector 13 having a reflecting surface 14.

The drive device 11 is an electronic circuit unit including, for example, a CPU (Central Processing Unit) and an FPGA (Field-Programmable Gate Array). The optical deflector 13 is, for example, a MEMS (Micro Electromechanical Systems) device having a reflective surface 14 and capable of moving the reflective surface 14. The light source device 12 is, for example, a laser device that irradiates a laser. The scanned surface 15 is, for example, a screen.
The drive device 11 generates a control command for the light source device 12 and the optical deflector 13 based on the acquired optical scanning information, and outputs a drive signal to the light source device 12 and the optical deflector 13 based on the control command.

The light source device 12 irradiates the light source based on the input drive signal. The optical deflector 13 moves the reflecting surface 14 in at least one of the uniaxial direction and the biaxial direction based on the input drive signal.
Thus, for example, the control of the driving device 11 based on the image information which is an example of the optical scanning information causes the reflecting surface 14 of the optical deflector 13 to reciprocate in a biaxial direction within a predetermined range and enter the reflecting surface 14. An arbitrary image can be projected on the scanned surface 15 by deflecting the light emitted from the light source device 12 and performing optical scanning.
Details of the optical deflector and details of control by the driving device of the present embodiment will be described later.
Next, an exemplary hardware configuration of the optical scanning system 10 will be described with reference to FIG.
FIG. 2 is a hardware configuration diagram of an example of the optical scanning system 10.
As shown in FIG. 2, the optical scanning system 10 includes a driving device 11, a light source device 12, and an optical deflector 13, and each is electrically connected.

[Driver]
Among these, the drive device 11 includes a CPU 20, a RAM 21 (Random Access Memory), a ROM 22 (Read Only Memory), an FPGA 23, an external I / F 24, a light source device driver 25, and an optical deflector driver 26.

The CPU 20 is an arithmetic device that reads out programs and data from a storage device such as the ROM 22 onto the RAM 21 and executes processing to realize the overall control and functions of the drive device 11.
The RAM 21 is a volatile storage device that temporarily stores programs and data.
The ROM 22 is a nonvolatile storage device that can retain programs and data even when the power is turned off, and stores processing programs and data that the CPU 20 executes to control each function of the optical scanning system 10. Yes.
The FPGA 23 is a circuit that outputs control signals suitable for the light source device driver 25 and the optical deflector driver 26 in accordance with the processing of the CPU 20.
The external I / F 24 is an interface with, for example, an external device or a network. The external device includes, for example, a host device such as a PC (Personal Computer), a storage device such as a USB memory, an SD card, a CD, a DVD, an HDD, and an SSD. The network is, for example, a car CAN (Controller Area Network), a LAN (Local Area Network), the Internet, or the like. The external I / F 24 may be configured to enable connection or communication with an external device, and the external I / F 24 may be prepared for each external device.

The light source device triver is an electric circuit that outputs a drive signal such as a drive voltage to the light source device 12 in accordance with an input control signal.
The optical deflector driver 26 is an electric circuit that outputs a drive signal such as a drive voltage to the optical deflector 13 in accordance with the input control signal.
In the driving device 11, the CPU 20 acquires optical scanning information from an external device or a network via the external I / F 24. The CPU 20 may be configured so that the optical scanning information can be acquired. The optical scanning information may be stored in the ROM 22 or the FPGA 23 in the driving device 11, or a new SSD or the like may be included in the driving device 11. A storage device may be provided, and the optical scanning information may be stored in the storage device.
Here, the optical scanning information is information indicating how the scanned surface 15 is optically scanned. For example, when an image is displayed by optical scanning, the optical scanning information is image data. For example, when optical writing is performed by optical scanning, the optical scanning information is writing data indicating the writing order and writing location. In addition, for example, when object recognition is performed by optical scanning, the optical scanning information is irradiation data indicating the timing and irradiation range for irradiating light for object recognition.
The drive device 11 according to the present embodiment can realize the functional configuration described below by the instruction of the CPU 20 and the hardware configuration shown in FIG.

[Functional configuration of drive unit]
Next, a functional configuration of the driving device 11 of the optical scanning system 10 will be described with reference to FIG. FIG. 3 is a functional block diagram of an example of a driving device of the optical scanning system.
As shown in FIG. 3, the drive device 11 includes a control unit 30 and a drive signal output unit 31 as functions.
The control unit 30 is realized by, for example, the CPU 20, the FPGA 23, and the like, acquires optical scanning information from an external device, converts the optical scanning information into a control signal, and outputs the control signal to the drive signal output unit 31. For example, the control unit 30 constitutes a control unit, acquires image data as optical scanning information from an external device or the like, generates a control signal from the image data by a predetermined process, and outputs the control signal to the drive signal output unit 31.
The drive signal output unit 31 constitutes application means, and is realized by the light source device driver 25, the optical deflector driver 26, and the like, and outputs a drive signal to the light source device 12 or the optical deflector 13 based on the input control signal. . The drive signal output unit 31 (applying unit) may be provided for each target that outputs a drive signal, for example.
The drive signal is a signal for controlling driving of the light source device 12 or the optical deflector 13. For example, in the light source device 12, the driving voltage is used to control the irradiation timing and irradiation intensity of the light source. Further, for example, in the optical deflector 13, the driving voltage is used to control the timing and movable range for moving the reflecting surface 14 of the optical deflector 13. The driving device may acquire the irradiation timing and the light receiving timing of the light source from an external device such as the light source device 12 and the light receiving device, and synchronize these with the driving of the optical deflector 13.

[Optical scanning processing]
Next, a process in which the optical scanning system 10 optically scans the scanned surface 15 will be described with reference to FIG. FIG. 4 is a flowchart of an example of processing according to the optical scanning system.
In step S11, the control unit 30 acquires optical scanning information from an external device or the like.
In step S <b> 12, the control unit 30 generates a control signal from the acquired optical scanning information, and outputs the control signal to the drive signal output unit 31.
In step S <b> 13, the drive signal output unit 31 outputs a drive signal to the light source device 12 and the optical deflector 13 based on the input control signal.
In step S <b> 14, the light source device 12 performs light irradiation based on the input drive signal. The optical deflector 13 moves the reflecting surface 14 based on the input drive signal. By driving the light source device 12 and the optical deflector 13, light is deflected in an arbitrary direction and optically scanned.
In the optical scanning system 10, one driving device 11 has a device and a function for controlling the light source device 12 and the optical deflector 13, but the driving device for the light source device and the driving device for the optical deflector Alternatively, it may be provided separately.
In the optical scanning system 10, the function of the control unit 30 and the function of the drive signal output unit 31 of the light source device 12 and the optical deflector 13 are provided in one drive device 11, but these functions are separately provided. For example, a drive signal output device having a drive signal output unit 31 may be provided in addition to the drive device 11 having the control unit 30. In the optical scanning system 10, an optical deflection system that performs optical deflection may be configured by the optical deflector 13 having the reflecting surface 14 and the driving device 11.

[Image projection device]
Next, with reference to FIG. 5 and FIG. 6, an image projection apparatus to which the drive device of this embodiment is applied will be described in detail.
FIG. 5 is a schematic diagram according to an embodiment of an automobile 400 equipped with a head-up display device 500 which is an example of an image projection device. FIG. 6 is a schematic diagram of an example of the head-up display device 500.
The image projection device is a device that projects an image by optical scanning, for example, a head-up display device.
As shown in FIG. 5, the head-up display device 500 is installed, for example, in the vicinity of a windshield (a windshield 401 or the like) of the automobile 400. The projection light L emitted from the head-up display device 500 is reflected by the windshield 401 and travels toward the observer (driver 402) who is the user.
Accordingly, the driver 402 can visually recognize an image or the like projected by the head-up display device 500 as a virtual image. In addition, you may make it the structure which installs a combiner in the inner wall face of a windshield, and makes a user visually recognize a virtual image with the projection light reflected by a combiner.

As shown in FIG. 6, the head-up display device 500 emits laser light from red, green, and blue laser light sources 501R, 501G, and 501B. The emitted laser light passes through an incident optical system composed of collimator lenses 502, 503, and 504 provided for each laser light source, two dichroic mirrors 505 and 506, and a light amount adjusting unit 507. The light is deflected by an optical deflector 13 having a reflecting surface 14.
The deflected laser light is projected onto a screen through a projection optical system including a free-form surface mirror 509, an intermediate screen 510, and a projection mirror 511.
In the head-up display device 500, the laser light sources 501R, 501G, and 501B, the collimator lenses 502, 503, and 504 and the dichroic mirrors 505 and 506 are unitized as an optical housing by an optical housing.
The head-up display device 500 projects the intermediate image displayed on the intermediate screen 510 onto the windshield 401 of the automobile 400 so that the driver 402 can visually recognize the intermediate image as a virtual image.
The respective color laser beams emitted from the laser light sources 501R, 501G, and 501B are substantially collimated by the collimator lenses 502, 503, and 504, and are combined by the two dichroic mirrors 505 and 506. The combined laser light is two-dimensionally scanned by the optical deflector 13 having the reflecting surface 14 after the light amount is adjusted by the light amount adjusting unit 507. The projection light L that has been two-dimensionally scanned by the optical deflector 13 is reflected by the free-form surface mirror 509, corrected for distortion, and then condensed on the intermediate screen 510 to display an intermediate image. The intermediate screen 510 includes a microlens array in which microlenses are two-dimensionally arranged, and enlarges the projection light L incident on the intermediate screen 510 in units of microlenses.
The optical deflector 13 reciprocally moves the reflecting surface 14 in the biaxial direction, and two-dimensionally scans the projection light L incident on the reflecting surface 14. The drive control of the optical deflector 13 is performed in synchronization with the light emission timings of the laser light sources 501R, 501G, and 501B.
The head-up display device 500 as an example of the image projection device has been described above. However, the image projection device is any device that projects an image by performing optical scanning with the optical deflector 13 having the reflective surface 14. Good.
For example, it is mounted on a projector that is placed on a desk or the like and projects an image on a display screen, or a mounting member that is mounted on an observer's head or the like, and is projected on a reflective transmission screen that the mounting member has, or an eyeball as a screen The present invention can be similarly applied to a head-mounted display device that projects an image.
The image projection apparatus is not only a vehicle or a mounting member, but also, for example, a moving body such as an aircraft, a ship, or a mobile robot, or a work robot that operates a driving target such as a manipulator without moving from the spot. It may be mounted on a non-moving body.

[Optical writing device]
Next, with reference to FIG. 7 and FIG. 8, an optical writing device to which the driving device 11 of this embodiment is applied will be described in detail.
FIG. 7 is an example of an image forming apparatus incorporating the optical writing device 600. FIG. 8 is a schematic diagram of an example of an optical writing device.
As shown in FIG. 7, the optical writing device 600 is used as a constituent member of an image forming apparatus represented by a laser printer 650 having a printer function using laser light. In the image forming apparatus, the optical writing device 600 performs optical writing on the photosensitive drum by optically scanning the photosensitive drum which is the surface to be scanned 15 with one or a plurality of laser beams.
As shown in FIG. 8, in the optical writing device 600, the laser light from the light source device 12 such as a laser element passes through an imaging optical system 601 such as a collimator lens, and is then transmitted by the optical deflector 13 having the reflecting surface 14. Deflection is performed in one or two axial directions.
Then, the laser beam deflected by the optical deflector 13 passes through a scanning optical system 602 including a first lens 602a, a second lens 602b, and a reflection mirror unit 602c, and then the surface to be scanned 15 (for example, a photosensitive drum or a photosensitive drum). (Paper) and write optically. The scanning optical system 602 forms a light beam in a spot shape on the scanned surface 15.
The light deflector 13 having the light source device 12 and the reflecting surface 14 is driven based on the control of the driving device 11.
As described above, the optical writing device 600 can be used as a constituent member of an image forming apparatus having a printer function using laser light.
Also, by making the scanning optical system different so that optical scanning is possible not only in one axis direction but also in two axis directions, a laser label device that performs printing by deflecting laser light to a thermal medium, optical scanning, and heating. It can be used as a component of the image forming apparatus.
The optical deflector 13 having the reflecting surface 14 applied to the optical writing device consumes less power for driving than a rotating polygonal mirror using a polygon mirror or the like, so that power saving of the optical writing device is achieved. Is advantageous.
Further, since the wind noise during vibration of the optical deflector 13 is smaller than that of the rotary polygon mirror, it is advantageous for improving the quietness of the optical writing device. The optical writing device requires much less installation space than the rotary polygon mirror, and the optical deflector 13 generates only a small amount of heat. Therefore, the optical writing device can be easily downsized, and thus is advantageous for downsizing the image forming apparatus. Is

[Object recognition device]
Next, with reference to FIG. 9 and FIG. 10, an object recognition device to which the driving device of the present embodiment is applied will be described in detail.
FIG. 9 is a schematic diagram of an automobile equipped with a laser radar device which is an example of an object recognition device. FIG. 10 is a schematic diagram of an example of a laser radar device.
The object recognition device is a device that recognizes an object in a target direction, for example, a laser radar device.
As shown in FIG. 9, a laser radar device 700 is mounted on, for example, an automobile 701, optically scans the target direction, and receives reflected light from the target object 702 existing in the target direction, thereby receiving the target object. 702 is recognized.
As shown in FIG. 10, the laser light emitted from the light source device 12 is reflected through an incident optical system including a collimating lens 703 that is an optical system that makes diverging light substantially parallel light, and a plane mirror 704. Scanning is performed in one or two axial directions by an optical deflector 13 having a surface 14.
Then, the object 702 in front of the apparatus is irradiated through a projection lens 705 or the like that is a projection optical system. Driving of the light source device 12 and the optical deflector 13 is controlled by the driving device 11. The reflected light reflected by the object 702 is detected by the photodetector 709.
That is, the reflected light is received by the image sensor 707 via the condenser lens 706 that is a light receiving optical system, and the image sensor 707 outputs a detection signal to the signal processing circuit 708. The signal processing circuit 708 performs predetermined processing such as binarization and noise processing on the input detection signal, and outputs the result to the distance measurement circuit 710.
The distance measuring circuit 710 determines whether the light source device 12 emits the laser beam and the timing at which the photodetector 709 receives the laser beam, or the phase difference for each pixel of the received image sensor 707. The presence / absence of 702 is recognized, and further distance information with respect to the object 702 is calculated.
Since the optical deflector 13 having the reflecting surface 14 is less likely to be damaged than a polygonal mirror and is small in size, it is possible to provide a small and highly durable radar device.
Such a radar radar apparatus is attached to, for example, a vehicle, an aircraft, a ship, a robot, and the like, and can optically scan a predetermined range to recognize the presence or absence of an obstacle and the distance to the obstacle.
In the object recognition apparatus, the laser radar apparatus 700 as an example has been described. However, the object recognition apparatus performs optical scanning by controlling the optical deflector 13 having the reflecting surface 14 with the driving device 11 to detect light. Any device that recognizes the object 702 by receiving reflected light with a vessel may be used, and is not limited to the above-described embodiment.
For example, object information such as shape is calculated from distance information obtained by optically scanning the hand or face, and biometric authentication that recognizes the target object by referring to the record, or recognizes an intruder by optical scanning of the target range The present invention can be similarly applied to a security sensor, a three-dimensional scanner component that calculates and recognizes object information such as a shape from distance information obtained by optical scanning, and outputs it as three-dimensional data.

[Packaging]
Next, with reference to FIG. 11, the packaging of the optical deflector controlled by the drive device of this embodiment will be described.
FIG. 11 is a schematic diagram of an example of a packaged optical deflector.
As shown in FIG. 11, the optical deflector 13 is attached to an attachment member 802 disposed inside the package member 801, and a part of the package member is covered with a transmission member 803 and sealed to achieve packaging. Is done.
Further, an inert gas such as nitrogen is sealed in the package. As a result, deterioration of the optical deflector 13 due to oxidation is suppressed, and durability against changes in the environment such as temperature is improved.
Next, details of the optical deflector used in the above-described optical deflection system, optical scanning system, image projection apparatus, optical writing apparatus, and object recognition apparatus and details of control by the driving apparatus of the present embodiment will be described. .

[Details of optical deflector]
First, the optical deflector will be described in detail with reference to FIGS.
FIG. 12 is a plan view of another type of optical deflector capable of deflecting light in two axial directions. 13 is a cross-sectional view taken along the line PP ′ of FIG. 14 is a cross-sectional view taken along the line QQ ′ of FIG. As shown in FIG. 12, the optical deflector 13 is connected to the mirror unit 101 that reflects the incident light beam L and the mirror unit 101, and drives the mirror unit 101 around the first axis O ₁ parallel to the Y axis. 1st drive part 110a, 110b.
The optical deflector 13 also has a first support part 120 that supports the mirror part 101 and the first drive parts 110a and 110b.
Optical deflector 13 is also connected to the first support part 120, second driving unit 130a to drive the mirror unit 101 and the first support portion 120 to the second axis _{O 2} around parallel to the X axis, and 130b, first 2 has a second support part 140 that is a frame body part that supports the drive parts 130a and 130b.
The first driving portion 110a in the present embodiment, and 110b, a mirror unit 101, and the first supporting portion 120 constitute a movable portion rotates about a second axis _{O 2.} The second driving units 130 a and 130 b support the movable unit with respect to the second support unit 140.
The optical deflector 13 includes the first drive units 110a and 110b, the second drive units 130a and 130b, and the electrode connection unit 150 electrically connected to the drive device, and from the electrode connection unit 150 to the first drive units 110a and 110b. And an electrode wiring 151 which is an extended current path.

The optical deflector 13 is formed, for example, by forming a single SOI (Silicon On Insulator) substrate by etching or the like, and on the formed substrate, the reflecting surface 14, the first piezoelectric drive units 112a and 112b, and the second piezoelectric drive unit 131a. Each component is integrally formed by forming ~ 131f, 132a to 132f, electrode connecting part 150, and the like.
Note that each of the above-described components may be formed after the SOI substrate is formed or during the formation of the SOI substrate.

  As shown in FIGS. 13 and 14, the SOI substrate includes a silicon support layer 161 as a first silicon layer made of, for example, single crystal silicon (Si), and a silicon oxide layer 162 formed on the silicon support layer 161. And a silicon active layer 163 which is a second silicon layer formed on the silicon oxide layer 162.

  Since the silicon active layer 163 has a smaller thickness in the Z-axis direction with respect to the X-axis direction or the Y-axis direction, a member formed only of the silicon active layer 163 has a function as an elastic part having elasticity.

  Note that the SOI substrate is not necessarily flat and may have a curvature or the like. In addition, the member used for forming the optical deflector 13 is not limited to the SOI substrate as long as it is a substrate that can be integrally formed by etching or the like and can be partially elastic.

The mirror unit 101 includes, for example, a circular mirror unit base 102 and a reflection surface 14 formed on the + Z side surface of the mirror unit base. The mirror part base | substrate 102 is comprised from the silicon | silicone active layer 163, for example.
The reflecting surface 14 is made of a metal thin film containing, for example, aluminum, gold, silver or the like. Further, the mirror portion 101 may have a mirror portion reinforcing rib formed on the surface of the mirror portion base 102 on the −Z side.
The rib is composed of, for example, a silicon support layer 161 and a silicon oxide layer 162, and can suppress distortion of the reflecting surface 14 caused by movement.

  The first drive units 110a and 110b are connected at one end to the mirror unit base 102, extend in the first axial direction, and movably support the mirror unit 101, and one end to the torsion bar. The first piezoelectric drive units 112a and 112b are connected to each other and connected to the inner peripheral portion of the first support unit at the other end.

As shown in FIG. 13, the torsion bars 111 a and 111 b are composed of a silicon active layer 163. In addition, the first piezoelectric driving units 112a and 112b are formed by sequentially stacking a lower electrode 201, a piezoelectric unit 202, and an upper electrode 203 on the surface on the + Z side of the silicon active layer 163 that is an elastic unit.
The upper electrode 203 and the lower electrode 201 are configured using, for example, gold (Au) or platinum (Pt).
The piezoelectric part 202 is configured by a piezoelectric film using PZT (lead zirconate titanate) which is a piezoelectric material, for example.
In the following description, the term “piezoelectric driving unit” will be used with the lower electrode 201, the piezoelectric unit 202, and the upper electrode 203 as a group when particularly necessary.

The first support part 120 is a rectangular support body that is formed of, for example, a silicon support layer 161, a silicon oxide layer 162, and a silicon active layer 163 and is formed so as to surround the mirror part 101.

For example, the second driving units 130a and 130b include a plurality of second piezoelectric driving units 131a to 131f and 132a to 132f connected so as to be folded back, and one end of each of the second driving units 130a and 130b is a first support. The other end is connected to the outer peripheral part of the part 120, and the other end is connected to the inner peripheral part of the second support part 140.
At this time, the connection location between the second drive unit 130a and the first support unit 120, the connection site between the second drive unit 130b and the first support unit 120, the connection site between the second drive unit 130a and the second support unit 140, and the The connection part of the 2 drive part 130b and the 2nd support part 140 is point-symmetric with respect to the center of the reflective surface 14. FIG.

  As shown in FIG. 14, the second driving units 130 a and 130 b are formed by sequentially forming a lower electrode 201, a piezoelectric unit 202, and an upper electrode 203 on the + Z side surface of the silicon active layer 163 that is an elastic unit. . The upper electrode 203 and the lower electrode 201 are configured using, for example, gold (Au) or platinum (Pt). The piezoelectric unit 202 is a piezoelectric body using, for example, PZT (lead zirconate titanate) which is a piezoelectric material.

  The second support unit 140 includes, for example, a silicon support layer 161, a silicon oxide layer 162, and a silicon active layer 163. The mirror unit 101, the first drive units 110a and 110b, the first support unit 120, and the second drive unit 130a. , 130b is a rectangular support formed so as to surround.

The electrode connection unit 150 is formed, for example, on the surface of the second support unit 140 on the + Z side, and the upper electrodes 203 and the lower electrodes 201 of the first piezoelectric driving units 112a and 112b and the second piezoelectric driving units 131a to 131f. , And the drive device 11 are electrically connected via an electrode wiring 151 formed using aluminum (Al) or the like.
Each of the upper electrode 203 and the lower electrode 201 may be directly connected to the electrode connecting portion 150, or may be indirectly connected by connecting the electrodes.

  In the present embodiment, the case where the piezoelectric portion 202 is formed only on one surface (the surface on the + Z side) of the silicon active layer 163 that is an elastic portion has been described as an example. May be provided on both the one surface and the other surface of the elastic portion.

  In addition, as long as the mirror unit 101 can be driven around the first axis or the second axis, the shape of each component is not limited to the shape of the embodiment. For example, the torsion bars 111a and 111b and the first piezoelectric drive units 112a and 112b may have a curved shape.

As shown in FIG. 14, the first piezoelectric drive units 112a and 112b and the second piezoelectric drive units 131a to 131f and 132a to 132f all cover at least a part of the surface of the second piezoelectric drive unit. And an insulating layer 153 which is an insulating film.
The insulating layer 153 is a layer insulating layer serving as a protective film formed so as to maintain insulation between the upper electrode 203 and the lower electrode 201, and is configured using, for example, SiO ₂ or the like.
As shown in FIG. 15 and described later, an opening 154 for connecting the electrode wiring 151 is formed in the insulating layer 153.

In the present embodiment, as shown in FIG. 15, the electrode wiring 151 has a function as a connecting portion that connects two adjacent second piezoelectric driving portions 131a and 131b.
In the following description, the case of connecting the second piezoelectric drive unit 131a and the second piezoelectric drive unit 131b will be described as an example, but the same applies to the second piezoelectric drive units 131a to 131f and the second piezoelectric drive units 132a to 132f. It has a configuration.

The electrode wiring 151 is a connection part for applying a voltage to the upper electrode 203 through the opening 154 formed in the insulating layer 153, and a barrier layer having a function as a passivation film to be described later is formed on the most -Z side layer. I have. In the present embodiment, the electrode wiring 151 has a laminated structure in which a conductive layer such as Al or an Al alloy is laminated on the upper layer of SiO2 serving as a barrier layer. As in the present embodiment, when the upper electrode 203 is in contact with the side surface 203b, the lowermost layer of the electrode wiring 151 may be used as an insulating barrier layer, so that the protection of the entire substrate is improved.
The opening 154 is an opening opened in the insulating layer 153 by using a technique such as etching. In order to provide the opening 154, the width and length of each of the lower electrode 201 and the piezoelectric portion 202 are preferably adjusted such that the lower electrode 201 is larger than the piezoelectric portion 202 and the piezoelectric portion 202 is larger than the upper electrode 203. .
The opening 154 is formed at a position including a portion where the upper electrode 203 and the piezoelectric portion 202 overlap and a portion where they do not overlap when viewed from the + Z direction side. In other words, the opening 154 is formed at the end of the upper electrode 203 in the X direction so as to cover a part of the upper electrode 203 on the + Z direction side and a part of the piezoelectric part 202 on the + Z direction side.

  The end portion of the electrode wiring 151 is in contact with the upper electrode 203 and the piezoelectric portion 202 to connect the upper electrode 203 and the piezoelectric portion 202 of the two adjacent second piezoelectric driving portions 131a and 131b. Further, as shown in FIG. 16, the electrode wiring 151 is disposed so as to contact the upper surface 203 a and the side surface 203 b of the upper electrode 203 and also contact the upper surface 202 a of the piezoelectric portion 202.

[Details of control of drive unit]
Next, details of control of the driving device 11 that drives the first driving units 110a and 110b and the second driving units 130a and 130b of the optical deflector will be described.

  The second piezoelectric drive units 131a to 131f included in the first drive units 110a and 110b and the second drive units 130a and 130b are deformed in proportion to the potential of the applied voltage when a positive or negative voltage is applied in the polarization direction (for example, , Expansion and contraction) occurs, and the so-called reverse piezoelectric effect is exhibited. The first driving units 110a and 110b and the second driving units 130a and 130b move the mirror unit 101 using the above-described inverse piezoelectric effect.

  At this time, the angle at which the light beam incident on the reflecting surface 14 of the mirror unit 101 is deflected is called a deflection angle. When the voltage is not applied to the piezoelectric portion, the deflection angle is set to zero. When the deflection angle is larger than the angle, the deflection angle is positive. When the deflection angle is smaller, the deflection angle is negative.

First, control of the drive device that drives the first drive unit will be described.
In the first driving units 110a and 110b, when a driving voltage is applied in parallel to the piezoelectric units 202 included in the first piezoelectric driving units 112a and 112b via the upper electrode 203 and the lower electrode 201, the respective piezoelectric units 202 are connected. Deform. Due to the action of the deformation of the piezoelectric portion 202, the first piezoelectric driving portions 112a and 112b are bent and deformed.
As a result, a driving force around the first axis O ₁ acts on the mirror portion 101 via the torsion of the two torsion bars 111a and 111b, and the mirror portion 101 moves around the first axis O ₁ . The driving voltage applied to the first driving units 110 a and 110 b is controlled by the driving device 11.

  Therefore, the drive unit 11 applies the drive voltage having a predetermined sine waveform in parallel to the first piezoelectric drive units 112a and 112b included in the first drive units 110a and 110b, so that the mirror unit 101 is moved around the first axis. Can be moved at a period of a drive voltage having a predetermined sine waveform.

  In particular, for example, when the frequency of the sinusoidal waveform voltage is set to about 20 kHz, which is about the same as the resonance frequency of the torsion bars 111a and 111b, utilizing the mechanical resonance caused by the torsion of the torsion bars 111a and 111b, The mirror unit 101 can be resonantly oscillated at about 20 kHz.

  Next, with reference to FIGS. 17-21, control of the drive device which drives a 2nd drive part is demonstrated.

  FIG. 17 is a schematic diagram schematically illustrating driving of the second drive unit 130b of the optical deflector. A region represented by diagonal lines is the mirror unit 101 or the like.

Among the plurality of second piezoelectric drive units 131a to 131f included in the second drive unit 130a, the even-numbered second piezoelectric drive unit counted from the second piezoelectric drive unit (131a) closest to the mirror unit, that is, the second piezoelectric drive unit. The piezoelectric drive units 131b, 131d, and 131f are referred to as a piezoelectric drive unit group A.
Further, among the plurality of second piezoelectric drive units 132a to 132f included in the second drive unit 130b, odd-numbered second piezoelectric drive units counted from the second piezoelectric drive unit (132a) closest to the mirror unit, That is, the second piezoelectric drive units 132a, 132c, and 132e are similarly referred to as a piezoelectric drive unit group A. When the drive voltage is applied in parallel, the piezoelectric drive unit group A is bent so that the piezoelectric drive unit group A bends in the same direction and has a positive deflection angle as shown in FIG. 101 moves around the second axis O ₂ .

Of the plurality of second piezoelectric drive units 131a to 131f of the second drive unit 130a, the odd-numbered second piezoelectric drive units counted from the second piezoelectric drive unit (131a) closest to the mirror unit, that is, The second piezoelectric drive units 131a, 131c, and 131e are referred to as a piezoelectric drive unit group B.
Further, among the plurality of second piezoelectric driving units 132a to 132f included in the second driving unit 130b, the even-numbered second piezoelectric driving unit counted from the second piezoelectric driving unit (132a) closest to the mirror unit, That is, 132b, 132d, and 132f are similarly set as the piezoelectric drive unit group B. When the drive voltage is applied in parallel, the piezoelectric drive unit group B is bent and deformed in the same direction as shown in FIG. 15B so that the mirror unit has a negative deflection angle. 101 moves around the second axis O ₂ .

  As shown in FIGS. 17A and 17B, in the second drive unit 130a or 130b, the plurality of piezoelectric units 202 included in the piezoelectric drive unit group A or the plurality of piezoelectric units 202 included in the piezoelectric drive unit group B are bent. By deforming, the movable amount due to the bending deformation can be accumulated, and the deflection angle around the second axis of the mirror unit 101 can be increased.

For example, as shown in FIG. 12, the second drive units 130a and 130b are connected to the first support unit in a point-symmetric manner with respect to the center point of the first support unit. Therefore, when a driving voltage is applied to the piezoelectric driving unit group A, the second driving unit 130a generates a driving force that moves in the + Z direction at the connecting portion between the first support unit and the second driving unit 130a, and the second driving unit 130b has the second driving unit 130b. 1 support and driving force to move in the -Z direction to the connecting portion of the second driving unit 130b occurs, can be movable amount is accumulated to increase the deflection angle of the second shaft O ₂ around the mirror portion 101.

  Further, when no voltage is applied, or when the movable amount of the mirror unit 101 by the piezoelectric drive unit group A by voltage application is balanced with the movable amount of the mirror unit 101 by the piezoelectric drive group B by voltage application, the deflection angle Becomes zero.

By applying a driving voltage in FIG. 17 (a) ~ FIG 17 (b) so as continuously repeated second piezoelectric driving unit 131 a to 131 f, that drives the mirror unit 101 to the second axis _{O 2} around it can.

[Drive voltage]
The driving voltage applied to the second driving units 130 a and 130 b is controlled by the driving device 11.
With reference to FIG. 16, the drive voltage applied to the piezoelectric drive unit group A (hereinafter referred to as drive voltage A) and the drive voltage applied to the piezoelectric drive unit group B (hereinafter referred to as drive voltage B) will be described. In addition, an application unit that applies the drive voltage A (first drive voltage) is a first application unit, and an application unit that applies the drive voltage B (second drive voltage) is a second application unit.

  FIG. 18A shows an example of the waveform of the drive voltage A applied to the piezoelectric drive unit group A of the optical deflector. FIG. 18B shows an example of the waveform of the drive voltage B applied to the piezoelectric drive unit group B of the optical deflector. FIG. 18C is a diagram in which the waveform of the drive voltage A and the waveform of the drive voltage B are superimposed.

As shown in FIG. 18A, the waveform of the drive voltage A applied to the piezoelectric drive unit group A is, for example, a sawtooth waveform, and the frequency is, for example, 60 Hz.
Further, the waveform of the drive voltage A has a rising time period TrA in which the voltage value increases from the minimum value to the next maximum value, and a falling period in which the voltage value decreases from the maximum value to the next minimum value. For example, a ratio of TrA: TfA = 9: 1 is set in advance. At this time, the ratio of TrA to one cycle is referred to as symmetry of drive voltage A.

As shown in FIG. 18B, the waveform of the drive voltage B applied to the piezoelectric drive unit group B is, for example, a sawtooth waveform, and the frequency is, for example, 60 Hz.
In addition, the waveform of the drive voltage B indicates that the time width of the rising period in which the voltage value increases from the minimum value to the next maximum value is TrB, and the falling period in which the voltage value decreases from the maximum value to the next minimum value. For example, a ratio of TfB: TrB = 9: 1 is set in advance. At this time, the ratio of TfB to one cycle is referred to as symmetry of the drive voltage B.
As shown in FIG. 18C, for example, the period TA of the waveform of the drive voltage A and the period TB of the waveform of the drive voltage B are set to be the same.

The sawtooth waveform of the drive voltage A and the drive voltage B is generated, for example, by superimposing sine waves.
In the present embodiment, the drive voltages A and B use a sawtooth waveform drive voltage. However, the present invention is not limited to this, and a drive voltage having a sawtooth waveform with a rounded apex or a sawtooth waveform. It is also possible to change the waveform according to the device characteristics of the optical deflector, such as a drive voltage having a waveform with the straight line region as a curve. In this case, the symmetry is the ratio of the rise time to one cycle or the ratio of the fall time to one cycle. At this time, it may be arbitrarily set whether the rise time or the fall time is used as a reference.

Next, a method for manufacturing the drive unit will be described.
In the following description, the second piezoelectric drive unit 131a among the piezoelectric drive units will be described in particular. However, the present invention is not limited to this configuration, and the same applies to the portion using the piezoelectric material in the optical deflector 13. It has a configuration.
As shown in FIG. 19A, a lower electrode material 1904, a piezoelectric material 1905, and a piezoelectric material 1905 are formed on an SOI substrate in which a silicon support layer 161, a silicon oxide layer 162, and a silicon active layer 163 are stacked as substrate materials. The upper electrode material 1906 is formed in layers.
Next, as shown in FIG. 19B, patterning of the upper electrode material 1906, patterning of the piezoelectric material 1905, and patterning of the lower electrode material 1904 are performed by dry etching, and the shape of the piezoelectric member of the piezoelectric driving unit 131a is changed. Form.
Further, as shown in FIG. 19C, SiO ₂ is formed as an insulating material 1908 on the entire surface by the CVD method.
When the insulating material 1908 is formed, an opening 154 is formed as a contact hole in the insulating material 1908 by dry etching as shown in FIG. At this time, the opening 154 includes a portion where the upper electrode material 1906 and the piezoelectric material 1905 are overlapped when viewed from the Z direction, and a portion where the piezoelectric material 1905 is formed and the upper electrode material 1906 does not exist. Is formed.

A wiring pattern is formed on the insulating material 1908 using the wiring member 1910 (FIG. 19E). At this time, the wiring member 1910 is filled in the opening 154, whereby the wiring pattern is formed in such a manner that the wiring member 1910 contacts both the upper electrode material 1906 and the piezoelectric material 1905.
After the wiring pattern is formed by the wiring member 1910, a passivation film 1911 is formed on the entire substrate as shown in FIG. As the passivation film, for example, SiN is formed by a CVD method.
The passivation film 1911 has a function as a protective film for protecting the patterned substrate from gas, moisture, and the like from the outside.

In accordance with the structure to be formed in the silicon active layer 163, specifically, the structure as shown in FIG. 12, the passivation film 1911 and the insulating material 1908 are processed by dry etching as shown in FIG. Further, as shown in FIG. 19 (h), the silicon support layer 161 where the second piezoelectric driving portion 131a is formed is removed by etching from the −Z direction side, and the beam-like portion is warped by the piezoelectric member. Process to make it easy to occur.
As described above, when the silicon support layer 161 is processed in the region where the silicon active layer 163 is removed by etching, the silicon support layer 161 is removed to form a so-called punched portion. Similarly, by processing the silicon support layer 161 in the portion where the silicon active layer 163 is left, the silicon active layer 163 remains and the second piezoelectric drive part 131a can be easily deformed when it expands and contracts by voltage application. .

  According to such a manufacturing method, deformation of the opening 154 with respect to repeated voltage application to the second piezoelectric drive units 131a to 131f can be suppressed. -An optical deflector with excellent durability can be provided.

In the conventional optical deflector, as shown in FIGS. 24 and 25, the beam-like member 1700 corresponding to the second piezoelectric drive unit is formed on the silicon active layer 1701 with the lower electrode 1702, the piezoelectric film 1703, and the upper part. An electrode 1704 is stacked.
The beam-shaped member 1700 is in contact with the upper electrode 1704 through the insulating film 1707 formed so as to cover the upper electrode 1703, a contact hole 1705 that is opened in a part of the insulating film 1707, and the contact hole 1705. Wiring 1706.

  In the beam-like member 1700, a contact hole 1705 is provided on the upper electrode 1704 as shown as a cross-sectional view along R-R ′ in FIG. Further, the wiring 1706 is held in such a manner that it only contacts the upper electrode 1704.

Now, when the beam-like member 1700 moves up and down, the piezoelectric film 1703 sandwiched between the upper electrode 1704 and the lower electrode 1702 expands and contracts to cause vertical movement. That is, the beam-like member 1700 also vibrates in the vertical direction with the expansion and contraction of the piezoelectric film 1703 even at the site where the contact hole 1705 is formed.
By repeatedly performing such deformation, repeated stress is generated in the vicinity of the contact hole 1705, and there is a possibility that a failure such as peeling or cracking between the wiring 1706 and the upper electrode 1704 may occur. In particular, as shown in FIG. 24, in the conventional optical deflector, the piezoelectric film expands and contracts all around the contact hole 1705, so that peeling or cracking between the wiring 1706 and the upper electrode 1704 is likely to occur.
In order to make it difficult for such peeling and cracking to occur, it is desirable to reduce the expansion and contraction of the piezoelectric film around the contact hole 1705 or to improve the adhesion between the upper electrode 1704 and the wiring 1706. It is known that such an adhesion force generally varies greatly depending on the contact area and the roughness of the contact surface.

Therefore, in the present embodiment, the mirror part 101 having the reflecting surface 14 and the plurality of elastic parts 130a and 130b are continuously formed in a meandering manner, and the support part 120 that supports the mirror part 101 and the elastic parts 130a and 130b. A plurality of second piezoelectric driving units 131a to 131f provided individually, an insulating film 153 that at least partially covers the second piezoelectric driving units 131a to 131f, and an opening 154 provided in the insulating film 153. And a connecting portion for connecting at least two second piezoelectric driving portions 131a and 131b.
The second piezoelectric drive units 131a and 131b are formed by stacking the lower electrode 201, the piezoelectric unit 202, and the upper electrode 203, and the electrode wiring 151 includes the upper electrode 203 and the piezoelectric unit of the second piezoelectric drive unit 131a. 202 abuts.

This configuration will be described in more detail. As shown in FIGS. 15 and 16, in this embodiment, an opening 154 is formed so that the electrode wiring 151 contacts the piezoelectric portion 202 and the upper electrode 203. Therefore, the electrode wiring 151 is in contact with the upper surface 203a, the side surface 203b, and the upper surface 202a of the piezoelectric portion 202 of the upper electrode 203.
As already described, the deformation of the piezoelectric portion 202 occurs when a voltage is applied between the upper electrode 203 and the lower electrode 201. However, in this embodiment, the openings 154 are provided at both ends of the upper electrode 203. Furthermore, the opening 154 is formed so as to overlap the end of the upper electrode 203 in the ± X direction.
As described above, if the opening 154 is also formed in the portion where the upper electrode 203 is not formed, the portion indicated by the one-dot broken line in the enlarged view of FIG. Does not occur. That is, the expansion and contraction of the piezoelectric film can be reduced around the opening 154 as a contact hole.
With such a configuration, the occurrence of failure is reduced by suppressing the progress of peeling and cracking between the upper electrode 203 and the electrode wiring 151.

In addition to the above effects, this configuration improves the contact area between the electrode wiring 151 and the upper electrode 203 and also makes contact with the side surface of the rough upper electrode 203, so that the adhesion is improved and the second piezoelectric driving unit 131a is improved. Even when deformation repeatedly occurs, the occurrence of failure is further reduced by suppressing the progress of peeling and cracking.
In addition, since the electrode wiring 151 is fixed in a manner surrounded by the side surface 203b of the upper electrode 203 and the upper surface 202a of the piezoelectric portion 202, the force acting in the peeling direction is dispersed and the adhesion is further improved.

Moreover, in this embodiment, the electrode wiring 151 is arrange | positioned so that the adjacent 2nd piezoelectric drive part 131a, 131b may be connected to the folding | turning part of 2nd piezoelectric drive part 131a-131f formed in the meandering shape.
With this configuration, since the electrode wiring 151 is disposed in the folded portion 133 where the deformation of the second piezoelectric drive portions 131a and 131b is unlikely to occur, the progress of peeling and cracks due to the deformation of the second piezoelectric drive portions 131a and 131b is suppressed. The occurrence of failure is reduced.

As a modification of the present embodiment, the positional relationship of the opening 154 will be described.
In the following modifications, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.
In the present modification, the opening 154 is disposed at the end in the Y direction of the second piezoelectric drive units 131a to 131f. Further, as shown in FIG. 20, the electrode wiring 151 is arranged in the folded portion 133 where the second piezoelectric driving portions 131a and 131b are unlikely to be deformed.
Furthermore the width _{W 1} of the folded portion 133 and the width _{W 2} to the -Y direction side of the opening 154 from the + Y direction side of the end portion of the folded portion _133, W 2 _<2W 1/3, satisfy the relationship.
In the folded portion 133, the influence of the displacement of the second piezoelectric drive portion becomes smaller when it is outside either the + Y direction or the -Y direction. Therefore, it is more preferable that the position of the opening 154 is outside either the + Y direction or the −Y direction.

Furthermore, as another modification of the present embodiment, as shown in FIGS. 21A and 21B, the opening 154 includes at least two sides orthogonal to each other among the four sides of the rectangular upper electrode 203. The structure formed so that it may contact | abut may be sufficient. In other words, it may be configured to cover one of the four corners of the upper electrode 203.
According to such a configuration, it is possible to improve the contact area with the side surface 203b of the upper electrode 203 that contributes most to the adhesion between the upper electrode 203 and the electrode wiring 151. Therefore, the second piezoelectric driving units 131a and 131b can be improved. The occurrence of failure is reduced by suppressing the progress of peeling and cracking due to the deformation of.

  Furthermore, the shape of the opening 154 may be a so-called L-shape in which rectangles orthogonal to each other are combined. With such a configuration, the area of contact with the side surface 203b of the upper electrode 203 can be increased while suppressing the area of the opening 154, and the progress of peeling and cracking is further suppressed.

As mentioned above, although embodiment of this invention and its modification were demonstrated, embodiment mentioned above and its modification show one example of application of this invention. The present invention is not limited to the above-described embodiment and its modifications, and can be embodied by adding various modifications and changes without departing from the scope of the invention.
For example, in the above-described embodiment and its modification, the drive device 11 always applies a drive voltage having a waveform having a positive voltage value to the piezoelectric part. However, the drive voltage is applied to the piezoelectric part and the piezoelectric part is deformed. If it is the structure which arises, it will not be restricted to this. As an example, the driving device 11 may apply a driving voltage having a waveform having a negative voltage value to the piezoelectric unit, or may apply a positive voltage value and a negative voltage value alternately.
Further, the shape of the contact hole may be any shape as long as the electrode wiring can contact the upper electrode and the piezoelectric portion.
In the above embodiment and its modification, as shown in FIG. 12, the optical deflector 13 is a cantilever type optical deflector in which the first piezoelectric drive units 112a and 112b extend from the torsion bars 111a and 111b in the + X direction. Although it is used, the present invention is not limited to this as long as the reflecting surface 14 is movable by a piezoelectric part to which a voltage is applied.
For example, as shown in FIG. 22, light of a type having first piezoelectric drive units 212a and 212b extending from the torsion bars 211a and 211b in the + X direction and first piezoelectric drive units 212c and 212d extending in the −X direction. A deflector may be used. Further, when the reflecting surface is movable only in one axis direction, the reflecting surface 14 may be provided on the movable portion 220 as shown in FIG. At this time, the reflection surface 14 may be provided on the entire movable portion 220.

  DESCRIPTION OF SYMBOLS 10 ... Optical scanning system, 11 ... Drive apparatus, 12 ... Light source device, 13 ... Optical deflector, 14 ... Reflecting surface, 15 ... Scanned surface, 30 ... Control part (an example of control means), 31 ... Drive signal output part (Example of applying means), 101... Mirror section, 102... Mirror base, 110 a, 100 b... First driving section a, b, 111 a, b ... Torsion bars a, b, 112 a, 112 b. ... 1st support part, 130a, 130b ... Elastic part (2nd drive part), 131a-131f ... Piezoelectric drive part (2nd piezoelectric drive part a), 132a-132f ... Piezoelectric drive part (2nd piezoelectric drive part b) , 140 ... second support part, 150 ... electrode connection part, 151 ... connection part (electrode wiring), 161 ... silicon support layer, 162 ... silicon oxide layer, 163 ... silicon active layer, 201 ... lower electrode, 202 ... piezoelectric part , 203 Upper electrode, 400 ... motor vehicle, 500 ... head-up display device (image projection apparatus), 600 ... optical writing device, 650 ... laser printer (image forming apparatus), 700 ... laser radar device (object recognition device)

JP2015-055829A Japanese Patent No. 5598578 Japanese Patent No. 5316203 Japanese Patent No. 4926596

Claims (7)

A mirror portion having a reflective surface;
A plurality of elastic portions are continuously formed in a meandering shape, and a support portion for supporting the mirror portion,
A plurality of piezoelectric drive units individually provided in the elastic part;
An insulating film that at least partially covers the piezoelectric drive;
A connecting portion for connecting at least two piezoelectric driving portions through an opening provided in the insulating film,
The piezoelectric driving unit is formed by laminating a lower electrode, a piezoelectric unit, and an upper electrode,
The connecting portion is an optical deflector that contacts the upper electrode and the piezoelectric film of the piezoelectric driving portion. The optical deflector according to claim 1.
The openings are respectively formed at both ends of the piezoelectric driving unit,
The optical deflector, wherein the connecting portion is arranged to connect the adjacent piezoelectric portion to a folded portion of the elastic portion formed in a meandering shape. The optical deflector according to claim 1 or 2,
The connection portion is formed by laminating two or more wiring members. The optical deflector according to claim 3.
Among the wiring members, the wiring member formed in the lowermost layer is a barrier layer. The optical deflector according to any one of claims 1 to 4,
The optical deflector according to claim 1, wherein the mirror unit is pivotally supported about a predetermined first axis and is pivotally supported about a second axis orthogonal to the first axis. The optical deflector according to claim 5, wherein
A support beam having one end connected to the mirror portion and extending in the direction of the first axis;
An elastic part connected to the other end of the support beam and extending in the direction of the second axis;
An optical deflector comprising: An optical deflector according to claim 5 or 6,
A light source that irradiates a plurality of different wavelengths of light toward the mirror unit;
Optical path combining means for combining the optical paths of the light into one;
An image display device, wherein the combined light is irradiated to the optical deflector and reflected by the reflection surface to scan and draw an image on a projection surface.

Images