JP2018019241A - 撮像装置 - Google Patents
撮像装置 Download PDFInfo
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- JP2018019241A JP2018019241A JP2016147782A JP2016147782A JP2018019241A JP 2018019241 A JP2018019241 A JP 2018019241A JP 2016147782 A JP2016147782 A JP 2016147782A JP 2016147782 A JP2016147782 A JP 2016147782A JP 2018019241 A JP2018019241 A JP 2018019241A
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- 238000003384 imaging method Methods 0.000 title claims abstract description 44
- 238000012545 processing Methods 0.000 claims abstract description 69
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- 238000012937 correction Methods 0.000 description 53
- 230000015654 memory Effects 0.000 description 43
- 238000003331 infrared imaging Methods 0.000 description 17
- 238000000034 method Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 15
- 230000007547 defect Effects 0.000 description 13
- 230000002950 deficient Effects 0.000 description 13
- 230000008859 change Effects 0.000 description 9
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- 230000010354 integration Effects 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
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- 238000003199 nucleic acid amplification method Methods 0.000 description 2
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- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
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- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/767—Horizontal readout lines, multiplexers or registers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14649—Infrared imagers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/20—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only
- H04N23/23—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from infrared radiation only from thermal infrared radiation
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
- H04N25/75—Circuitry for providing, modifying or processing image signals from the pixel array
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/30—Transforming light or analogous information into electric information
- H04N5/33—Transforming infrared radiation
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- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Studio Devices (AREA)
Abstract
Description
共通のセンサ素子に対して複数の出力系統が設けられたイメージセンサと、
前記イメージセンサの出力から画像信号を生成する信号処理回路とを備え、
前記複数の出力系統は、夫々、トランジスタと、前記トランジスタを介して前記センサ素子に流れる電流に応じた電荷を蓄積する容量と、前記容量の電圧に応じたセンサ信号を出力する出力部とを有し、
前記トランジスタは、夫々、互いに異なる期間に前記電流を流し、
前記信号処理回路は、前記センサ信号が互いに一致しないとき前記センサ信号を使用せず、前記センサ信号が互いに一致するとき前記センサ信号を前記画像信号の生成に使用する、撮像装置が提供される。
(付記1)
共通のセンサ素子に対して複数の出力系統が設けられたイメージセンサと、
前記イメージセンサの出力から画像信号を生成する信号処理部とを備え、
前記複数の出力系統は、夫々、トランジスタと、前記トランジスタを介して前記センサ素子に流れる電流に応じた電荷を蓄積する容量と、前記容量の電圧に応じたセンサ信号を出力する出力部とを有し、
前記トランジスタは、夫々、互いに異なる期間に前記電流を流し、
前記信号処理部は、前記センサ信号が互いに一致しないとき前記センサ信号を使用せず、前記センサ信号が互いに一致するとき前記センサ信号を前記画像信号の生成に使用する、撮像装置。
(付記2)
前記信号処理部は、前記センサ信号が互いに一致するとき、前記センサ信号を互いに加算して前記映像信号の生成に使用する、付記1に記載の撮像装置。
(付記3)
前記トランジスタは、夫々、前記電流を交互に流す、付記1又は2に記載の撮像装置。
10,110 撮像部
11,111 レンズ
12 センサアレイ
13,113 CMOS読み出し回路
14,114 赤外線イメージセンサ
18,118 信号処理回路
20,120 タイミング生成器
21,121 画素回路
24,124 センサ素子
25,125 スキャン回路
41,141,241 蓄積容量
42,142,242 サンプルホールド容量
Claims (2)
- 共通のセンサ素子に対して複数の出力系統が設けられたイメージセンサと、
前記イメージセンサの出力から画像信号を生成する信号処理部とを備え、
前記複数の出力系統は、夫々、トランジスタと、前記トランジスタを介して前記センサ素子に流れる電流に応じた電荷を蓄積する容量と、前記容量の電圧に応じたセンサ信号を出力する出力部とを有し、
前記トランジスタは、夫々、互いに異なる期間に前記電流を流し、
前記信号処理部は、前記センサ信号が互いに一致しないとき前記センサ信号を使用せず、前記センサ信号が互いに一致するとき前記センサ信号を前記画像信号の生成に使用する、撮像装置。 - 前記信号処理部は、前記センサ信号が互いに一致するとき、前記センサ信号を互いに加算して前記画像信号の生成に使用する、請求項1に記載の撮像装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016147782A JP6702058B2 (ja) | 2016-07-27 | 2016-07-27 | 撮像装置 |
US15/645,143 US10616517B2 (en) | 2016-07-27 | 2017-07-10 | Imaging apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016147782A JP6702058B2 (ja) | 2016-07-27 | 2016-07-27 | 撮像装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018019241A true JP2018019241A (ja) | 2018-02-01 |
JP6702058B2 JP6702058B2 (ja) | 2020-05-27 |
Family
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JP2016147782A Active JP6702058B2 (ja) | 2016-07-27 | 2016-07-27 | 撮像装置 |
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US (1) | US10616517B2 (ja) |
JP (1) | JP6702058B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023021774A1 (ja) * | 2021-08-17 | 2023-02-23 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置及び撮像装置を備える電子機器 |
Families Citing this family (1)
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IT202100013181A1 (it) | 2021-05-20 | 2022-11-20 | St Microelectronics Srl | Procedimento di raccolta di segnali rilevati da transistori di rilevamento, corrispondenti dispositivo sensore e fotocamera per immagini |
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US4831257A (en) * | 1986-09-26 | 1989-05-16 | Honeywell Inc. | Gate coupled input circuit |
JPH01296785A (ja) * | 1988-05-24 | 1989-11-30 | Fujitsu Ltd | 画像重畳装置 |
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JP2550882B2 (ja) * | 1993-09-28 | 1996-11-06 | 日本電気株式会社 | 赤外線撮像装置 |
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US6230108B1 (en) * | 1997-10-23 | 2001-05-08 | Fujitsu Limited | Realtime sensitivity correction method and infrared imaging system |
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GB0301623D0 (en) * | 2003-01-24 | 2003-02-26 | Koninkl Philips Electronics Nv | Electroluminescent display devices |
JP4372097B2 (ja) * | 2005-12-27 | 2009-11-25 | 株式会社東芝 | 赤外線センサ、赤外線カメラ、赤外線センサの駆動方法および赤外線カメラの駆動方法 |
IL173418A (en) * | 2006-01-29 | 2013-10-31 | Rafael Advanced Defense Sys | Correction of unevenness of characters produced by staring detectors |
US8487231B2 (en) * | 2007-03-05 | 2013-07-16 | Arokia Nathan | Sensor pixels, arrays and array systems and methods therefor |
JP4941989B2 (ja) | 2007-12-05 | 2012-05-30 | 国立大学法人静岡大学 | イメージセンサ |
JP4900283B2 (ja) * | 2008-02-29 | 2012-03-21 | 日本電気株式会社 | 赤外線撮像装置および固定パターンノイズ補正方法 |
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US10389953B2 (en) * | 2011-06-10 | 2019-08-20 | Flir Systems, Inc. | Infrared imaging device having a shutter |
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CN106409847B (zh) * | 2015-07-29 | 2020-05-12 | 联华电子股份有限公司 | 影像感测器像素结构 |
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- 2016-07-27 JP JP2016147782A patent/JP6702058B2/ja active Active
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2023021774A1 (ja) * | 2021-08-17 | 2023-02-23 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置及び撮像装置を備える電子機器 |
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Publication number | Publication date |
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US10616517B2 (en) | 2020-04-07 |
US20180035065A1 (en) | 2018-02-01 |
JP6702058B2 (ja) | 2020-05-27 |
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