JP2018018991A - プリント基板構造 - Google Patents
プリント基板構造 Download PDFInfo
- Publication number
- JP2018018991A JP2018018991A JP2016149058A JP2016149058A JP2018018991A JP 2018018991 A JP2018018991 A JP 2018018991A JP 2016149058 A JP2016149058 A JP 2016149058A JP 2016149058 A JP2016149058 A JP 2016149058A JP 2018018991 A JP2018018991 A JP 2018018991A
- Authority
- JP
- Japan
- Prior art keywords
- via hole
- circuit board
- printed circuit
- solder
- distance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
- H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09627—Special connections between adjacent vias, not for grounding vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
図1(a)は第1実施形態に係るプリント基板の部分平面図であり、図1(b)は図1(a)に示すプリント基板の部分断面図である。
図4は、第2実施形態に係るプリント基板の部分平面図である。
図7は、第3実施形態に係るプリント基板の部分平面図である。
実施形態に係るプリント基板構造では、隣接するバイアホールとの間の距離が半田ブリッジが形成される半田ブリッジ形成距離以下であり且つ半田付けされないバイアホールにソルダレジストが塗布される。実施形態に係るプリント基板構造では、隣接するバイアホールとの間の距離が半田ブリッジ形成距離以下であり且つ半田付けされないバイアホールにソルダレジストが塗布されるので、フロー方式またはディップ方式での半田付け時に半田ブリッジが形成されることを防止できる。
11 第1面
12 第2面
13 貫通孔
14 導電材
15 ソルダレジスト
16 ランド
17 導電パターン
20 非塗布バイアホール
21、41、61 塗布バイアホール
30、32 電子部品
31 金属部材
50 境界線
51 第1領域
52 第2領域
Claims (6)
- プリント基板の複数の導電層間を導電接続する複数のバイアホールが形成され、
前記複数のバイアホールは、ランドにソルダレジストが塗布された塗布バイアホールと、ランドにソルダレジストが塗布されていない非塗布バイアホールとを含み、
前記塗布バイアホールは、前記プリント基板上の、半田ブリッジまたは半田ボールが発生する可能性が高い場所に配置され、かつ、少なくとも一つの非塗布バイアホールと電気的に並列接続されている、ことを特徴とするプリント基板構造。 - 前記塗布バイアホールは、隣接するバイアホール間の距離が所定の距離以下である場所に配置され、前記隣接するバイアホールのうち一方が塗布バイアホールであり、他方が非塗布バイアホールである、請求項1に記載のプリント基板構造。
- 前記塗布バイアホールは、前記プリント基板に配置される金属部材からの距離が所定の距離以下である場所に配置される、請求項1に記載のプリント基板構造。
- 電子部品がフロー方式またはディップ方式により半田付けされる第1領域と、第1領域が半田付けされる際に、マスク治具によって半田から保護される第2領域とを含み、
前記塗布バイアホールは、前記第1領域内であって、前記第2領域との境界からの距離が所定の距離以下である場所に配置される、請求項1に記載のプリント基板構造。 - 前記塗布バイアホールは、前記プリント基板の電源電圧が供給される電源電圧パターン部に配置される、請求項1〜4に記載のプリント基板構造。
- 前記塗布バイアホールは、前記プリント基板の接地される接地パターン部に接続される、請求項1〜4に記載のプリント基板構造。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016149058A JP6779063B2 (ja) | 2016-07-28 | 2016-07-28 | プリント基板構造及びプリント基板の設計方法 |
DE102017211986.1A DE102017211986B4 (de) | 2016-07-28 | 2017-07-13 | Leiterplatten-Struktur |
US15/650,292 US20180035539A1 (en) | 2016-07-28 | 2017-07-14 | Printed circuit board structure |
CN201710627094.9A CN107666773A (zh) | 2016-07-28 | 2017-07-27 | 印刷基板结构 |
US16/042,489 US10638605B2 (en) | 2016-07-28 | 2018-07-23 | Printed circuit board structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016149058A JP6779063B2 (ja) | 2016-07-28 | 2016-07-28 | プリント基板構造及びプリント基板の設計方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018018991A true JP2018018991A (ja) | 2018-02-01 |
JP6779063B2 JP6779063B2 (ja) | 2020-11-04 |
Family
ID=60951534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016149058A Active JP6779063B2 (ja) | 2016-07-28 | 2016-07-28 | プリント基板構造及びプリント基板の設計方法 |
Country Status (4)
Country | Link |
---|---|
US (2) | US20180035539A1 (ja) |
JP (1) | JP6779063B2 (ja) |
CN (1) | CN107666773A (ja) |
DE (1) | DE102017211986B4 (ja) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11154778A (ja) | 1997-11-21 | 1999-06-08 | Murata Mach Ltd | 印刷回路基板 |
US6175088B1 (en) * | 1998-10-05 | 2001-01-16 | Avaya Technology Corp. | Multi-layer printed-wiring boards with inner power and ground layers |
US6483714B1 (en) * | 1999-02-24 | 2002-11-19 | Kyocera Corporation | Multilayered wiring board |
US6917525B2 (en) * | 2001-11-27 | 2005-07-12 | Nanonexus, Inc. | Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
DE102007041770A1 (de) | 2007-09-04 | 2009-03-05 | Continental Automotive Gmbh | Leiterplattenstapel aus löttechnisch miteinander verbundenen Leiterplatten |
US9288893B2 (en) * | 2009-02-11 | 2016-03-15 | Broadcom Corporation | Implementations of twisted differential pairs on a circuit board |
CN202503816U (zh) * | 2011-11-04 | 2012-10-24 | 惠州Tcl移动通信有限公司 | 一种射频收发器的pcb板结构 |
CN103313506A (zh) * | 2012-03-15 | 2013-09-18 | 鸿富锦精密工业(深圳)有限公司 | 接地保护的印刷电路板 |
CN204669723U (zh) * | 2014-10-21 | 2015-09-23 | 珠海迈科智能科技股份有限公司 | 一种电路板、印制电路板及钢网 |
-
2016
- 2016-07-28 JP JP2016149058A patent/JP6779063B2/ja active Active
-
2017
- 2017-07-13 DE DE102017211986.1A patent/DE102017211986B4/de active Active
- 2017-07-14 US US15/650,292 patent/US20180035539A1/en not_active Abandoned
- 2017-07-27 CN CN201710627094.9A patent/CN107666773A/zh active Pending
-
2018
- 2018-07-23 US US16/042,489 patent/US10638605B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN107666773A (zh) | 2018-02-06 |
DE102017211986B4 (de) | 2020-07-09 |
US20180332705A1 (en) | 2018-11-15 |
US10638605B2 (en) | 2020-04-28 |
US20180035539A1 (en) | 2018-02-01 |
JP6779063B2 (ja) | 2020-11-04 |
DE102017211986A1 (de) | 2018-02-01 |
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