JP2018014483A - Template for imprint and method of manufacturing template for imprint - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a template for imprint satisfying both request of improvement of contrast of alignment mark at the time of alignment, and prevention of light irradiation of unintended region at the time of imprint, and to provide a manufacturing method thereof.SOLUTION: In a template for imprint having a mesa structure 20 on the principal surface of a light-transmitting base material 10, and having a first uneven structure 21 composing a transfer pattern, and a second uneven structure 22 composing an alignment mark on the upper surface of the mesa structure, a second material film 32 composed of a second material having a refractive index different from that of the first material, and formed on the bottom surface of the recess in the second uneven structure, and on the principal surface 11 of the base material on the outer periphery of the mesa structure.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an imprint template used in nanoimprint lithography for transferring a fine transfer pattern onto a resin formed on a substrate to be transferred, and a method for producing the imprint template.

Nanoimprint lithography is known as a technique for transferring and forming fine patterns in semiconductor device manufacturing and the like.
In the above nanoimprint lithography, an imprint template (also referred to as a mold, stamper, or mold) having a fine uneven transfer pattern formed on its surface is applied to a resin formed on a substrate to be transferred such as a semiconductor wafer. In this technique, the resin is cured after being contacted, and the uneven shape of the transfer pattern of the template (more specifically, the uneven inverted shape) is transferred to the resin.
As a technique of this nanoimprint lithography, there are a thermal imprint method in which a resin is cured by heating and a photoimprint method in which the resin is cured by exposure. For applications that require high alignment accuracy, an optical imprint method that is not affected by expansion or contraction due to heating is mainly used (for example, Patent Documents 1 and 2).

In order to transfer the template transfer pattern onto the resin of the transfer substrate with high positional accuracy by nanoimprint lithography as described above, it is necessary to precisely align the template and the transfer substrate.
In general, alignment is performed by optically detecting an alignment mark of a concavo-convex structure provided on a template and an alignment mark provided on a transfer substrate from the imprint template side.
And in this alignment, in order to improve the contrast of an alignment mark, forming high contrast material in the recessed part of an alignment mark is proposed (for example, patent document 3).

  Further, in the above-described optical imprinting method, in order to reduce or suppress unintentional curing of the resin in the non-transfer area during imprinting, a light shielding member is provided in the non-pattern portion of the template. Has been proposed (for example, Patent Document 4).

JP-T-2004-504718 JP 2002-93748 A Special table 2013-519236 gazette JP 2007-103924 A

  However, no imprint template has been proposed that satisfies both the requirements for improving the contrast of alignment marks during alignment and preventing light irradiation on unintended areas during imprinting. A method for manufacturing a template that satisfies the above has not been proposed.

  The present invention has been made in view of the above circumstances, and an imprint template that satisfies both the requirements of improving the contrast of an alignment mark during alignment and preventing light irradiation to an unintended region during imprinting, and The main purpose is to provide the manufacturing method.

  That is, the present invention is an imprint template having a mesa structure on a main surface of a light-transmitting base material portion, and the first uneven structure constituting a transfer pattern on the upper surface of the mesa structure; A second concavo-convex structure constituting an alignment mark, on the bottom surface of the recess of the second concavo-convex structure, and on the main surface of the base material portion on the outer periphery of the mesa structure An imprint template is provided in which a second material film made of a second material having a refractive index different from that of the first material constituting the base material portion is formed.

  Moreover, in the said invention, the 2nd material film | membrane on the main surface of the said base material part is from the outer edge of the bottom part of the said mesa structure where the said mesa structure and the said main surface contact | connect from the outer edge of the main surface of the said base material part It is preferable that it is formed so as to cover the region.

  Moreover, in the said invention, it is preferable that the transmittance | permeability in wavelength 365nm is 10% or less as for the 2nd material film | membrane on the main surface of the said base material part.

  In the above invention, the second material film formed on the bottom surface of the concave portion of the second concavo-convex structure and the second material film formed on the main surface include: The film thickness is preferably the same.

  Moreover, in the said invention, the film thickness of the said 2nd material film formed on the bottom face of the recessed part of the said 2nd uneven structure body is the said 2nd film formed on the said main surface. It is preferable that the thickness is smaller than the thickness of the material film.

In the aspect described above, the distance from the upper surface of the convex portion of the first uneven structure to the bottom surface of the recess and D _1, on the upper surface of the convex portion of the second concave-convex structures on the bottom surface of the recess the distance to the upper surface of the second material layer in the case of a D _2,
D ₁ ≦ D ₂
It is preferable that the relationship is satisfied.

  Further, the present invention has a mesa structure on the main surface of the light-transmitting base material portion, and forms an alignment mark and a first concavo-convex structure constituting a transfer pattern on the upper surface of the mesa structure. A step of preparing a first imprint template having a second concavo-convex structure, a top surface of the mesa structure, a bottom surface of a recess of the first concavo-convex structure, the second A second material composed of a second material having a refractive index different from that of the first material constituting the base material portion on the bottom surface of the concave portion of the concavo-convex structure and the main surface of the base material portion. Forming a material film on the second material film, forming a resin layer on the second material film, and forming on the second material film on the bottom surface of the concave portion of the second concavo-convex structure. And the resin layer formed on the second material film on the main surface of the base material portion. The resin layer formed on the second material film on the uppermost surface of the mesa structure, and the second material film on the bottom surface of the concave portion of the first concavo-convex structure Removing the resin layer formed thereon, the second material film formed on the top surface of the mesa structure, and the bottom formed on the bottom surface of the recess of the first concavo-convex structure body Removing the second material film; and on the second material film on the bottom surface of the concave portion of the second concavo-convex structure and on the main surface of the base material portion. And a step of removing the resin layer left on the material film in order. A method for manufacturing an imprint template is provided.

  Moreover, in the said invention, the process of forming a resin layer on the said 2nd material film WHEREIN: The said 2nd formed on the upper surface of the convex part of the said 1st uneven structure body, and the bottom face of the recessed part. Forming a first resin layer overlying the material film; and on the second material film formed on the top surface of the convex portion and the bottom surface of the concave portion of the second concavo-convex structure. A step of forming a second resin layer to be covered; and a step of forming a third resin layer on the second material film formed on the main surface of the base member. The thickness of the second resin layer formed on the second material film on the bottom surface of the recess of the concavo-convex structure and the thickness of the third resin layer are determined by the first concavo-convex structure. It is preferable that it is thicker than the thickness of the 1st resin layer formed on the said 2nd material film | membrane on the bottom face of this recessed part.

  Moreover, in the said invention, the process of forming a said 1st resin layer and a said 2nd resin layer was formed on the upper surface of the convex part of the said 1st uneven structure body, and on the bottom face of the recessed part. The first resin constituting the first resin layer is dropped on the second material film, and the first resin layer is formed on the top surface of the convex portion and the bottom surface of the concave portion of the second concavo-convex structure. A step having a step structure corresponding to each thickness of the first resin layer and the second resin layer by dropping a second resin constituting the second resin layer on the second material film. It is preferable to include a step of pressing the template and curing the first resin and the second resin.

  Moreover, in the said invention, the process of forming a said 3rd resin layer is a 3rd which comprises a said 3rd resin layer on the said 2nd material film | membrane on the main surface of the said base material part. It is preferable to include a step of dripping the resin.

  Moreover, in the said invention, in the said 1st imprint template, the distance from the upper surface of the convex part of the said 2nd uneven structure body to the bottom face of a recessed part is the upper surface of the convex part of the said 1st uneven structure body. It is preferable that it is larger than the distance from the bottom surface of the recess.

  Further, the present invention is an imprint template having a mesa structure on a main surface of a light-transmitting base material, the first uneven structure constituting a transfer pattern on the upper surface of the mesa structure, A second concavo-convex structure constituting an alignment mark, a light-shielding film is formed on the main surface of the outer periphery of the mesa structure, and a bottom surface of the concave portion of the second concavo-convex structure A high-contrast film is formed thereon, the high-contrast film is composed of a second material film different from the material constituting the base material, and the light-shielding film is different from the material constituting the base material An imprint template is provided that has a laminated structure in which a first material film and the second material film are sequentially laminated.

  Moreover, in the said invention, the light shielding film on the said main surface is formed so that the area | region from the bottom outer edge of the said mesa structure which the said mesa structure and the said main surface may contact to the outer edge of the said base material may be covered. Is preferred.

  Moreover, in the said invention, the said 1st material film is comprised from the 1st material from which the etching characteristic differs from the material which comprises the said base material, and the said 2nd material film comprises the said base material. The material is preferably composed of a second material having a different refractive index.

  In the above invention, the light-shielding film preferably has a transmittance of 10% or less at a wavelength of 365 nm.

In the aspect described above, the distance from the upper surface of the convex portion of the first uneven structure to the bottom surface of the recess and D _1, on the upper surface of the convex portion of the second concave-convex structures on the bottom surface of the recess When the distance to the upper surface of the high contrast film is D ₂ , it is preferable to satisfy the relationship of D ₁ ≦ D ₂ .

  The present invention also includes a step of preparing a template substrate having a mesa structure on the main surface of the light-transmitting base material, the main surface of the base material, and the upper surface of the mesa structure. A step of forming a first material film different from a material constituting the base material, a first resin layer is formed on the first material film, and the first resin layer is formed on an upper surface of the mesa structure Processing the first resin layer to form a first resin pattern; etching the first resin pattern to form a first material pattern from the first material film; Forming a first concavo-convex structure and a second concavo-convex structure using the first material pattern as an etching mask; and a bottom surface of the concave portion of the first concavo-convex structure on the first material pattern. Above the bottom surface of the recess of the second concavo-convex structure and the main surface of the base material Forming a second material film on the first material film, forming a second resin layer on the second material film, and forming a main surface of the substrate. The second resin layer formed on the second material film and on the second material film on the bottom surface of the concave portion of the second concavo-convex structure is left as it is. , On the second material film formed on the first material pattern on the mesa structure and on the bottom surface of the concave portion of the first concavo-convex structure. Removing the second resin layer formed on the top, on the first material pattern on the mesa structure, and on the bottom surface of the concave portion of the first concavo-convex structure, Removing the formed second material film; removing the first material pattern; and removing the remaining second resin layer. Characterized in that it comprises a step, in turn, provides a method for manufacturing an imprint template.

  In the above invention, the step of forming the second resin layer on the second material film is formed on the top surface of the convex portion and the bottom surface of the concave portion of the first concavo-convex structure. Forming a second resin layer (A) on the second material film; and forming the second resin layer (A) on the top surface of the convex portion and the bottom surface of the concave portion of the second concavo-convex structure. A step of forming a second resin layer (B) on the second material film, and a second resin layer (C) on the second material film formed on the main surface of the substrate. And the thickness of the second resin layer (B) and the thickness of the second resin layer (C) are thicker than the thickness of the second resin layer (A). It is preferable.

  Moreover, in the said invention, the process of forming a said 2nd resin layer (A) and a said 2nd resin layer (B) is on the upper surface of the convex part of the said 1st uneven structure, and the bottom face of a recessed part. A resin constituting the second resin layer (A) is dropped on the second material film formed on the upper surface of the convex portions of the second concavo-convex structure and the concave portions. A resin constituting the second resin layer (B) is dropped on the second material film formed on the bottom surface, and the second resin layer (A) and the second resin layer are dropped. It is preferable to include a step of pressing the step template having a step structure corresponding to each thickness of (B) and curing the resin.

  Moreover, in the said invention, the process of forming a said 2nd resin layer (C) is a said 2nd resin layer (C) on the said 2nd material film | membrane on the main surface of the said base material. It is preferable to include the step of dripping the resin constituting the.

  In the imprint template of the present invention, it is possible to satisfy both the requirements of improving the contrast of the alignment mark during alignment and preventing light irradiation to unintended areas during imprinting.

  In the imprint template manufacturing method of the present invention, the film provided on the second concavo-convex structure constituting the alignment mark for improving the contrast of the alignment mark at the time of alignment, and an unintended region at the time of imprinting Since the film provided on the outer periphery of the mesa structure can be manufactured in a common process to prevent light irradiation on the film, alignment during alignment is performed with fewer processes than in the manufacturing method in which each film is individually formed. An imprint template that can satisfy both the requirements of improving the contrast of the mark and preventing light irradiation to an unintended region during imprinting can be manufactured.

  In the imprint template manufacturing method of the present invention, the high contrast film provided on the second concavo-convex structure for improving the contrast of the alignment mark at the time of alignment, and the light to an unintended region at the time of imprinting Since the upper layer film that constitutes the light shielding film of the laminated structure provided on the outer periphery of the mesa structure can be manufactured in a common process to prevent irradiation, fewer processes are required compared to the manufacturing method in which each film is individually formed. Thus, it is possible to manufacture an imprint template that can satisfy both the requirements of improving the contrast of the alignment mark at the time of alignment and preventing light irradiation to an unintended region during imprinting.

  Further, the first material film constituting the etching mask for forming the first concavo-convex structure constituting the transfer pattern and the second concavo-convex structure constituting the alignment mark is formed under the light-shielding film having a laminated structure. Therefore, the transmittance of the light shielding film can be reduced without increasing the number of steps.

The figure explaining the example of the template for imprint which concerns on 1st Embodiment. The figure explaining the usage example of the template for imprint which concerns on 1st Embodiment. The figure explaining an example of the principal part of the template for imprint which concerns on 1st Embodiment. The flowchart which shows an example of the manufacturing method of the template for imprint which concerns on 1st Embodiment. Schematic process drawing showing an example of a method for manufacturing an imprint template according to the first embodiment FIG. 5 is a schematic process diagram illustrating an example of a method for manufacturing an imprint template according to the first embodiment, following FIG. The figure explaining an example of the method of forming the resin layer of the aspect shown in FIG.5 (c) The figure explaining the example of the template for imprint which concerns on 2nd Embodiment. The figure explaining the usage example of the template for imprint which concerns on 2nd Embodiment. The figure explaining an example of the principal part of the template for imprint which concerns on 2nd Embodiment. 8 is a flowchart showing an example of a method for manufacturing an imprint template according to the second embodiment. Schematic process drawing showing an example of a method for producing an imprint template according to the second embodiment Schematic process drawing showing an example of a method for manufacturing an imprint template according to the second embodiment, following FIG. The figure explaining an example of the method of forming the resin layer of the aspect shown in FIG.13 (g).

  Hereinafter, a first embodiment and a second embodiment according to the present invention will be described.

A. First Embodiment Hereinafter, an imprint template and a method for manufacturing an imprint template according to a first embodiment will be described in detail with reference to the drawings.

<Imprint template>
First, the imprint template according to the first embodiment will be described.
FIG. 1 is a diagram illustrating an example of an imprint template according to the first embodiment. FIGS. 1A and 1B are diagrams of imprint templates according to the first embodiment in different modes, respectively. It is a schematic sectional drawing for demonstrating a structure.

For example, as shown in FIGS. 1A and 1B, the imprint templates 1 and 2 are imprint templates having a mesa structure 20 on the main surface 11 of the light-transmitting base material portion 10. The mesa structure 20 has a first concavo-convex structure 21 constituting a transfer pattern and a second concavo-convex structure 22 constituting an alignment mark on the upper surface of the mesa structure 20. On the bottom surface of the recess and on the main surface 11 of the base material portion 10 on the outer periphery of the mesa structure 20, the second material having a refractive index different from that of the first material constituting the base material portion 10 is configured. Second material films 31 and 32 are formed.
The film thickness of the second material film 31 and the film thickness of the second material film 32 are preferably the same. This is because the second material film 31 and the second material film 32 can be formed in the same process. Here, the film thickness of the second material film 31 and the film thickness of the second material film 32 are the same as the film thickness of the second material film 31 and the film thickness of the second material film 32. This means that the error is within ± 5%.

  On such a configuration, that is, on the bottom surface of the concave portion of the second concavo-convex structure 22 constituting the alignment mark and on the main surface 11 on the outer periphery of the mesa structure 20, the second material films 31 and 32 are provided. Because it has a formed configuration, the imprint templates 1 and 2 satisfy both the requirements of improving the contrast of alignment marks during alignment and preventing light irradiation to unintended areas during imprinting. Is possible.

The differences between the imprint templates 1 and 2 shown in FIGS. 1A and 1B are different in the region where the second material film 32 is formed on the main surface 11 of the base material portion 10. Is a point.
More specifically, in the imprint template 2 shown in FIG. 1B, the second material film 32 starts from a location where the mesa structure 20 and the main surface 11 are in contact (that is, the bottom outer edge of the mesa structure 20). The base portion 10 is formed so as to cover the region up to the outer edge of the main surface 11.
On the other hand, in the imprint template 1 shown in FIG. 1A, the second material film 32 is formed from the portion where the mesa structure 20 and the main surface 11 are in contact with each other (that is, the bottom outer edge of the mesa structure 20). It is formed in a predetermined region between the regions up to the outer edge of the ten main surfaces 11. This “predetermined area” will be described below with reference to FIG.

FIG. 2 is a diagram illustrating an example of using the imprint template according to the first embodiment.
As shown in FIG. 2, when pattern transfer is performed to the transfer region 61 of the photocurable resin 60 formed on the transfer target substrate 50 by the photoimprint method using the imprint template 1, the photocurable resin is used. It is necessary to prevent exposure light (for example, ultraviolet light having a wavelength of 365 nm) from being irradiated to the 60 non-transfer areas 62. This is to prevent the photocurable resin 60 in the non-transfer area 62 from being unintentionally cured.

Here, in general, an imprint apparatus equipped with the imprint template 1 has a frame shape in a plan view in which an exposure area is an opening for the purpose of suppressing exposure of exposure light to an unintended area. A light shielding plate is provided.
For example, in the example shown in FIG. 2, since the light shielding plate 70 is provided, the region irradiated with the exposure light is defined as an irradiation region 90 corresponding to the opening of the light shielding plate 70. In other words, the exposure light 83 outside the irradiation region 90 is blocked by the light shielding plate 70 and is not irradiated to the photocurable resin 60.

However, with this light shielding plate 70 alone, the distance from the photocurable resin 60 on the substrate 50 to be transferred (for example, the imprint template 1 intervenes in the middle), so that the position accuracy is high. It is difficult to prevent exposure light from being irradiated to the non-transfer area 62 of the photocurable resin 60.
Therefore, the irradiation region 90 defined by the light shielding plate 70 including the shape accuracy and mounting accuracy of the light shielding plate 70 is normally designed to be larger than the transfer region 61 of the photocurable resin 60. That is, as shown in FIG. 2, the irradiation region 90 includes an irradiation region 92 that is originally unnecessary in addition to the irradiation region 91 having a size corresponding to the transfer region 61 of the photocurable resin 60.

  Therefore, in the imprint template 1, as shown in FIG. 2, the exposure light 82 in the irradiation region 92 is formed on the main surface 11 of the base material portion 10 on the outer periphery of the mesa structure 20. The material film 32 is shielded. Thereby, only the exposure light 81 in the irradiation area 91 having a size corresponding to the transfer area 61 is irradiated onto the photocurable resin 60 on the transfer substrate 50.

As described above, in the imprint template 1 mounted on the imprint apparatus including the light shielding plate 70 that regulates the exposure light irradiation region 90, the second material formed on the main surface 11 of the base material portion 10. The film 32 needs to be formed so as to cover the entire region from the location where the mesa structure 20 and the main surface 11 are in contact (that is, the outer edge of the bottom of the mesa structure 20) to the outer edge of the main surface 11 of the base member 10. It may be formed in a predetermined region.
More specifically, in the imprint template 1, the second material film 32 formed on the main surface 11 of the base material portion 10 is at least a place where the mesa structure 20 and the main surface 11 are in contact (that is, the mesa structure). 20 to the outer edge of the region of the main surface 11 of the base member 10 in the region corresponding to the irradiation region 90 shown in FIG.

In the first embodiment, as in the imprint template 2 shown in FIG. 1B, the second material film 32 is located at a location where the mesa structure 20 and the main surface 11 are in contact (that is, the mesa structure 20). It may be formed so as to cover a region from the bottom outer edge) to the outer edge of the main surface 11 of the base material part 10.
With such a configuration, the non-transfer area 62 of the photocurable resin 60 is not dependent on the configuration of the imprint apparatus (for example, the size of the irradiation area 90 shown in FIG. 2) on which the imprint template 2 is mounted. Can prevent exposure light from being irradiated.

  Next, the film thickness of the second material film 31 on the bottom surface of the concave portion of the second concavo-convex structure 22 and the second material film on the main surface 11 of the base material portion 10 on the outer periphery of the mesa structure 20 The relationship between the film thickness of 32 and the relationship between the depth of the first concavo-convex structure 21 constituting the transfer pattern and the depth of the second concavo-convex structure 22 constituting the alignment mark will be described with reference to FIG. To do.

FIG. 3 is a diagram illustrating an example of a main part of the imprint template according to the first embodiment.
FIG. 3 is for explaining the relationship between the film thicknesses of the second material film 31 and the second material film 32 and the relationship between the depths of the first uneven structure 21 and the second uneven structure 22. The other elements constituting the imprint template 1 are not shown.
In FIG. 3, the imprint template 1 is described as an example, but the imprint template 2 can be similarly described.

  First, the film thickness of the second material film 31 on the bottom surface of the concave portion of the second concavo-convex structure 22 and the second material film 32 on the main surface 11 of the base material portion 10 on the outer periphery of the mesa structure 20. The film thickness relationship will be described.

An example of a preferable aspect of the imprint template according to the first embodiment is that the second material film 31 formed on the bottom surface of the concave portion of the second concavo-convex structure 22 and the outer peripheral base of the mesa structure 20 are used. In this embodiment, the second material film 32 on the main surface 11 of the material part 10 has the same film thickness. For example, in the example shown in FIG. 3, the thickness of the second material thickness of the film 31 (T ₁₎ and the second material layer 32 (T ₂₎ is the same thickness (T ₁ = T ₂₎ It is an aspect.
With such an aspect, when the imprint template according to the first embodiment is manufactured, the second material film 31 and the second material film 32 can be easily formed by the same film forming process. This is because both films can be formed with fewer steps compared to the manufacturing method in which each film is formed individually. In detail, in the manufacturing method of the imprint template which concerns on 1st Embodiment mentioned later, it demonstrates using FIGS.

In the imprint template according to the first embodiment, the film thickness (T ₁ ) of the second material film 31 formed on the bottom surface of the concave portion of the second concavo-convex structure 22 has a mesa structure. the second thickness of the material film 32 formed on the major surface 11 of the base portion 10 of the outer circumference of 20 (T ₂₎ than thinner (T ₁ <T ₂₎ may be those with a further aspect .
The second material film 32 on the main surface 11 of the base material portion 10 on the outer periphery of the mesa structure 20 is required to prevent exposure light from being irradiated to an unintended region during imprinting. The second material film 31 formed on the bottom surface of the concave portion of the concavo-convex structure 22 only needs to improve the contrast of the alignment mark at the time of alignment, and is thinner than the second material film 32. This is because it may be thick.

Such a difference in film thickness can be caused, for example, by providing a fine pattern that does not affect the alignment in the concave portion of the second concavo-convex structure 22.
For example, the recesses of the second uneven structure 22 are provided with a fine pattern that does not affect alignment, so that the recesses of the second uneven structure 22 are spatially narrowed. However, the bottom surface of the concave portion of the second concavo-convex structure 22 is larger than the second material film 32 formed on the main surface 11 of the planar base member 10 which is spatially wide, that is, released. The film thickness (T ₁ ) of the second material film 31 is made smaller than the film thickness (T ₂ ) of the second material film 32 by making it difficult to form the second material film 31 formed thereon. be able to.

Next, the relationship between the depth of the first concavo-convex structure 21 constituting the transfer pattern and the second concavo-convex structure 22 constituting the alignment mark will be described.
In imprint template according to the first embodiment, as shown in FIG. 3, the distance to the bottom surface of the recess and D ₁ from the upper surface of the convex portion of the first concave-convex structure 21 constituting the transfer pattern, alignment the distance from the upper surface of the convex portion of the second concave-convex structures 22 constituting the mark to the top surface of the second material layer 31 on the bottom surface of the recess in the case of a D _2, the relationship D ₁ ≦ D ₂ It is preferable to satisfy.
With such a configuration, when the imprint template according to the first embodiment is manufactured, the resin layer (second resin shown in FIG. 6) as an etching mask remaining on the second material film 31 is produced. This is because the thickness of the layer 102) can be increased, and the problem that the second material film 31 disappears during etching can be prevented more reliably. In detail, in the manufacturing method of the imprint template which concerns on 1st Embodiment mentioned later, it demonstrates using FIGS.

Next, materials constituting the imprint template according to the first embodiment will be described.
The light-transmitting base material portion 10 constituting the imprint template according to the first embodiment can be used for a light imprint method, and includes exposure light during imprinting and alignment. The alignment light can be transmitted.

In general, ultraviolet light having a wavelength in the range of 200 nm to 400 nm (particularly in the range of 300 nm to 380 nm) is used as the exposure light.
On the other hand, as the alignment light, light having a wavelength different from that of the exposure light is used so as not to cure the photocurable resin on the transfer substrate. Generally, visible light having a wavelength in the range of 400 nm to 800 nm (particularly in the vicinity of 633 nm) is used.

Examples of the material (first material) constituting the light-transmitting base material portion 10 include quartz glass, heat-resistant glass, calcium fluoride (CaF ₂ ), magnesium fluoride (MgF ₂ ), and acrylic glass. The transparent material and the laminated structure of these transparent materials can be mentioned. In particular, synthetic quartz has high rigidity, a low thermal expansion coefficient, and good transmittance in the range of 300 nm to 380 nm, which is a commonly used wavelength, and thus is suitable as a material used for the base material portion 10.
Note that the main material constituting the base material portion and the main material constituting the mesa structure having the transfer pattern are usually the same material in the imprint template, and also in the imprint template according to the first embodiment. The mesa structure 20 having the first concavo-convex structure 21 constituting the transfer pattern and the second concavo-convex structure 22 constituting the alignment mark is made of the same material as the base material portion 10.

  The second material films 31 and 32 constituting the imprint template according to the first embodiment have a refractive index different from the material (first material) constituting the base material portion 10 (second material). Consists of By using materials having different refractive indexes, the contrast of the alignment mark at the time of alignment using alignment light can be improved. Moreover, the effect of preventing light irradiation to an unintended region at the time of imprinting can be achieved.

  As a material (second material) constituting the second material films 31 and 32, for example, a material containing at least one metal material and its oxide, nitride, oxynitride, or the like can be given. Specific examples of the metal material include chromium (Cr), molybdenum (Mo), tantalum (Ta), tungsten (W), zirconium (Zr), titanium (Ti), and the like.

Here, the second material film 32 formed on the main surface 11 of the base material portion 10 has a transmittance at a wavelength of 365 nm in order to prevent exposure of exposure light to an unintended region during imprinting. It is preferable that it is 10% or less.
For example, when chromium (Cr) is used as the material (second material) constituting the second material film 32, the film thickness (T ₂ ) of the second material film 32 may be 15 nm or more.

Note that the imprint template according to the first embodiment may have a recessed portion on the back surface side that has a positional relationship including the mesa structure in plan view.
For example, as shown in FIGS. 1A and 1B, the imprint templates 1 and 2 have a recess 40 on the back surface 12 side that is in a positional relationship including the mesa structure 20 in plan view. Yes.

With such a configuration, it is possible to reduce the thickness of the imprint templates 1 and 2 in the portion where the recess 40 is formed, and the mesa structure 20 can be easily bent.
Therefore, for example, when the transfer pattern (first concavo-convex structure 21) of the imprint templates 1 and 2 is brought into contact with the photocurable resin 60 on the transfer substrate 50, the mesa structure 20 is placed at its center. The transfer pattern (first concavo-convex structure 21) is gradually removed from the central part toward the outer peripheral part by curving the part closer to the photocurable resin 60 than the surroundings, while gradually excluding gas from mixing. It can be brought into contact with the photocurable resin 60.
In addition, even at the time of mold release, the mesa structure 20 is curved so that the transfer pattern (first uneven structure 21) is gradually detached from the photocurable resin 60 from the outer peripheral portion toward the central portion. Can do.

  The transfer pattern of the imprint template according to the first embodiment may be a line and space pattern or may be a pillar shape. As an example, in the case of a line and space pattern, the line width is about 30 nm and the height is about 60 nm. In the case of a pillar shape, the diameter is about 50 nm and the height is about 60 nm.

<Method for producing imprint template>
Next, a method for manufacturing an imprint template according to the first embodiment will be described.
FIG. 4 is a flowchart illustrating an example of a method for manufacturing an imprint template according to the first embodiment. 5 and 6 are schematic process diagrams showing an example of a method for manufacturing an imprint template according to the first embodiment. FIGS. 4 to 6 mainly explain a method of forming the second material film 31 and the second material film 32 of the imprint template according to the first embodiment. The forming method is omitted.

  For example, in order to manufacture the imprint template 1 by this manufacturing method, first, the mesa structure 20 is provided on the main surface 11 of the light-transmitting substrate portion, and the transfer pattern is formed on the upper surface of the mesa structure 20. A first imprint template 100 having a first concavo-convex structure 21 that constitutes an alignment mark and a second concavo-convex structure 22 that constitutes an alignment mark is prepared (S1 in FIG. 4, FIG. 5A). ).

The first imprint template 100 does not have the second material film 31 or the second material film 32, and is the same as, for example, the imprint template used in the conventional optical imprint method. Things can be used.
For example, the first imprint template 100 is made of synthetic quartz, and, as in the imprint template 1 shown in FIG. , On the back side.

Here, in the first imprint template 100, the distance (D ₃ ) from the upper surface of the convex portion of the second concavo-convex structure 22 to the bottom surface of the concave portion is the upper surface of the convex portion of the first concavo-convex structure 21. It is preferable that the distance is larger than the distance (D ₁ ) from the bottom surface of the recess.
With such a configuration, it becomes possible to increase the thickness of the second resin layer 102 remaining on the second material film 31 in an etching step (FIG. 6E) described later, This is because the problem that the second material film 31 disappears during etching can be prevented more reliably.

The above aspect can be obtained by the method described in Japanese Patent Application No. 2014-193694, for example.
That is, after forming a hard mask pattern to be an etching mask when forming the first concavo-convex structure 21 and the second concavo-convex structure 22, a hard mask pattern region for forming the first concavo-convex structure 21 is formed. The second concavo-convex structure 22 is half-etched with the resin layer covered, and then the resin layer is removed to form the first concavo-convex structure 21 and the second concavo-convex structure 22 by etching. Can be obtained.

  Next, on the top surface 20 a of the mesa structure 20, on the bottom surface of the concave portion of the first concavo-convex structure body 21, on the bottom surface of the concave portion of the second concavo-convex structure body 22, and on the main surface 11 of the base material portion. The second material films 30a, 30b, 31, and 32 made of the second material having a refractive index different from that of the first material constituting the base material portion are formed on the substrate (S2, FIG. 4). 5 (b)).

As a method of forming the second material films 30a, 30b, 31, and 32, a vacuum film forming technique such as a sputtering method or a CVD method can be used.
For example, chromium (Cr) is used as a material (second material) constituting the second material film 30a, 30b, 31, 32, and vacuum film formation is performed by a sputtering method, so that the film of the second material film 32 A film having a thickness of 15 nm or more can be formed.

  In the first embodiment, it is only necessary that the second material films 31 and 32 be formed on the bottom surface of the concave portion of the second concavo-convex structure 22 and on the main surface 11 of the base material portion. The second material films 30 a and 30 b need not necessarily be formed on the top surface 20 a of the mesa structure 20 and the bottom surface of the concave portion of the first concavo-convex structure 21, which are other places. There is no.

Next, on the second material films 30a, 30b, 31, 32 formed in the step shown in FIG. 5B, the first resin layer 101, the second resin layer 102, A third resin layer 103 is formed (S3 in FIG. 4, FIG. 5C).
More specifically, the first resin layer 101 is formed so as to cover the second material film formed on the top surface of the convex portion and the bottom surface of the concave portion of the first concavo-convex structure 21, The second resin layer 102 is formed so as to cover the second material film formed on the top surface of the convex portion and the bottom surface of the concave portion of the two concavo-convex structure 22, and the main surface of the base material portion A third resin layer 103 is formed on the second material film formed on the substrate 11.

At this time, as shown in FIG. 5C, the thickness (R _{2) of} the second resin layer 102 formed on the second material film 31 on the bottom surface of the concave portion of the second concave-convex structure 22. ) And the thickness (R ₃ ) of the third resin layer 103 is formed on the second material film 30b on the bottom surface of the concave portion of the first concave-convex structure 21. Each resin layer is formed to be thicker than the thickness (R ₁ ).
In the next step, that is, the resin layer partial removing step shown in FIG. 6D, the second resin layer 102 formed on the second material film 31 and the second material film 32 are formed. This is because the third resin layer 103 formed on the top can remain.

As described above, the thickness (R ₂ ) of the second resin layer 102 formed on the second material film 31 is set to be equal to that of the first resin layer 101 formed on the second material film 30b. In order to make it thicker than the thickness (R ₁ ), for example, a method using a step template 110 as shown in FIG. 7 can be mentioned.
More specifically, the first resin constituting the first resin layer 101 on the second material film formed on the top surface of the convex portion and the bottom surface of the concave portion of the first concavo-convex structure 21. The second resin constituting the second resin layer 102 on the second material film formed on the top surface of the convex portion and the bottom surface of the concave portion of the second concavo-convex structure 22 As shown in FIG. 7, a step template 110 having a step structure corresponding to each thickness of the first resin layer 101 and the second resin layer 102 is pressed against the first resin and the second resin. Is cured.

For the first resin constituting the first resin layer 101 and the second resin constituting the second resin layer 102, a photo-curable resin that can be used for the photoimprint method is preferably used. be able to. The first resin and the second resin may be the same or different.
In the case of using a photocurable resin for the first resin and the second resin, for example, using a step template 110 made of synthetic quartz, irradiation with ultraviolet light 111 as shown in FIG. The first resin layer 101 and the second resin layer 102 having a desired thickness can be formed by curing the resin and the second resin.

By using the method as described above, in the example shown in FIG. 5C, the thickness (R ₁ ) of the first resin layer 101 formed on the second material film 30b is in the range of 50 nm to 100 nm. The first resin layer 101 and the second resin layer 102 in which the thickness (R ₂ ) of the second resin layer 102 formed on the second material film 31 is in the range of 160 nm to 300 nm. Can be formed.

On the other hand, the third resin layer 103 can be formed by dropping a third resin constituting the third resin layer 103 on the second material film 32.
As the third resin, a photocurable resin that can be used in the photoimprinting method can be suitably used. The third resin may be the same as or different from the first resin or the second resin.
For example, a photo-curing resin is used as the third resin, and the third resin is dropped so as to cover the necessary region of the second material film 32, and then the photo-curing is performed. 3 resin layers 103 can be formed.

Note that the third resin layer 103 formed by the method as described above has a film thickness as compared with the first resin layer 101 and the second resin layer 102 that press the step template 110 to define the film thickness. Is non-uniform, that is, an embodiment including a thick portion and a thin portion is likely to occur.
However, in the first embodiment, in the region where the third resin layer 103 is required, the thickness of the thinnest portion is the second material film on the bottom surface of the recess of the first uneven structure 21. as is thicker than the first thickness of the resin layer 101 formed on the 30b (R _1), it may be formed a third resin layer 103.
For example, in the example shown in FIG. 5C, the film thickness (R ₃ ) of the third resin layer 103 can be 1 μm or more.

Next, while leaving the second resin layer 102 formed on the second material film 31 and the third resin layer 103 formed on the second material film 32, the second material film The first resin layer 101, the second resin layer 102, and the second resin layer 102 formed on the second material film 30b are removed (S4 in FIG. 4, FIG. 6). (D)).
Since there is a difference in film thickness (R ₂ > R ₁ , R ₃ > R ₁ ) shown in FIG. 5C, it is formed on the second material film 31 as shown in FIG. 6D. The second resin layer 102 and the third resin layer 103 formed on the second material film 32 can be left.

  This partial removal, more specifically, the second resin layer 101 formed on the first resin layer 101, the second resin layer 102, and the second material film 30b formed on the second material film 30a. For removing the resin layer 102, an etch-back technique using oxygen gas can be used.

Next, by the process shown in FIG. 6D, the second material films 30a and 30b that have been exposed by removing the resin layer are removed (S5 in FIG. 4, FIG. 6E). .
More specifically, as shown in FIG. 6E, the second material film 30a formed on the top surface 20a of the mesa structure and the bottom surface of the concave portion of the first concavo-convex structure 21 are formed. The second material film 30b thus formed is removed.

  For example, when chromium (Cr) is used as the second material constituting the second material films 30a and 30b, the second material film 30a can be obtained by etching using a mixed gas containing oxygen and chlorine. , 30b can be removed.

Next, the first resin layer 101 and the second resin layer 102 left in the step shown in FIG. 6D are removed (S6 in FIG. 4 and FIG. 6F), and the imprinting is performed. Template 1 is obtained.
For the removal of the first resin layer 101 and the second resin layer 102, for example, an ashing method using oxygen gas can be used.

  As described above, in the imprint template manufacturing method according to the first embodiment, the film (second film) provided on the second concavo-convex structure constituting the alignment mark in order to improve the contrast of the alignment mark during alignment. Since the material film 31) and the film (second material film 32) provided on the outer periphery of the mesa structure for preventing light irradiation to an unintended region at the time of imprinting can be manufactured in a common process, It is possible to satisfy both the requirements of improving the contrast of alignment marks during alignment and preventing light irradiation to unintended areas during imprinting, with fewer steps compared to individual manufacturing methods. An imprint template can be manufactured.

  The imprint template and the imprint template manufacturing method according to the first embodiment have been described above. However, the first embodiment is not limited to the above embodiment. The above embodiment is an exemplification, and has the same configuration as that of the technical idea described in the claims of the first embodiment, and exhibits the same operational effects in any case. Is also included in the technical scope of the first embodiment.

B. Second Embodiment Hereinafter, an imprint template and a method for manufacturing an imprint template according to a second embodiment will be described in detail with reference to the drawings.

<Imprint template>
First, an imprint template according to the second embodiment will be described.
FIG. 8 is a diagram for explaining an example of an imprint template according to the second embodiment. FIGS. 8A and 8B are diagrams of imprint templates according to the second embodiment having different aspects, respectively. It is a schematic sectional drawing for demonstrating a structure.

  For example, as shown in FIGS. 8A and 8B, the imprint templates 201 and 202 are imprint templates having a mesa structure 220 on a main surface 211 of a light-transmitting substrate 210. The mesa structure 220 has a first concavo-convex structure 221 constituting a transfer pattern and a second concavo-convex structure 222 constituting an alignment mark on the upper surface of the mesa structure 220, and the main surface 211 on the outer periphery of the mesa structure 220. A light shielding film 233 having a stacked structure in which a first material film 231 and a second material film 232 are sequentially stacked is formed on the bottom surface of the concave portion of the second concavo-convex structure 222. A high contrast film composed of the second material film 232 is formed.

  A high-contrast film composed of the second material film 232 is formed on the bottom surface of the concave portion of the second concavo-convex structure 222 constituting the alignment mark, and the mesa structure 220 Since the light-shielding film 233 having a stacked structure in which the first material film 231 and the second material film 232 are sequentially stacked is formed on the outer peripheral main surface 211, the imprint template 201, In 202, it is possible to satisfy both the requirements of improving the contrast of the alignment mark at the time of alignment and preventing light irradiation to an unintended region at the time of imprinting.

The difference between the imprint templates 201 and 202 shown in FIGS. 8A and 8B is that the region where the light shielding film 233 is formed on the main surface 211 of the substrate 210 is different.
More specifically, in the imprint template 202 shown in FIG. 8B, the light shielding film 233 is formed from the portion where the mesa structure 220 and the main surface 211 are in contact (that is, the bottom outer edge of the mesa structure 220). 210 is formed so as to cover the region up to the outer edge of main surface 211 of 210.
On the other hand, in the imprint template 201 shown in FIG. 8A, the light-shielding film 233 is formed from the portion where the mesa structure 220 and the main surface 211 are in contact (that is, the bottom outer edge of the mesa structure 220). It is formed in a predetermined area between the areas up to the outer edge of 211. This “predetermined area” will be described below with reference to FIG.

FIG. 9 is a diagram for explaining an example of using the imprint template according to the second embodiment.
As shown in FIG. 9, when a pattern is transferred to a transfer region 261 of a photocurable resin 260 formed on a substrate to be transferred 250 by a photoimprint method using an imprint template 201, the photocurable resin is used. It is necessary to prevent the non-transfer area 262 of 260 from being irradiated with exposure light (for example, ultraviolet light having a wavelength of 365 nm). This is to prevent the photocurable resin 260 in the non-transfer area 262 from being unintentionally cured.

Here, in general, an imprint apparatus equipped with the imprint template 201 has a frame shape in a plan view in which an exposure area is an opening for the purpose of suppressing exposure light to an unintended area. A light shielding plate is provided.
For example, in the example shown in FIG. 9, since the light shielding plate 270 is provided, the region irradiated with the exposure light is defined as an irradiation region 290 corresponding to the opening of the light shielding plate 270. In other words, the exposure light 283 outside the irradiation region 290 is blocked by the light shielding plate 270 and is not irradiated to the photocurable resin 260.

However, with this light shielding plate 270 alone, the distance from the photocurable resin 260 on the substrate to be transferred 250 may be increased (for example, the imprint template 201 is interposed in the middle), so that the position accuracy is high. It is difficult to prevent exposure light from being irradiated to the non-transfer area 262 of the photocurable resin 260.
Therefore, the irradiation region 290 defined by the light shielding plate 270 including the shape accuracy and mounting accuracy of the light shielding plate 270 is usually designed to be larger than the transfer region 261 of the photocurable resin 260. That is, as shown in FIG. 9, the irradiation region 290 includes an irradiation region 292 that is originally unnecessary in addition to the irradiation region 291 having a size corresponding to the transfer region 261 of the photocurable resin 260.

  Therefore, in the imprint template 201, as shown in FIG. 9, the exposure light 282 in the irradiation region 292 is formed by the light shielding film 233 formed on the main surface 211 of the base 210 on the outer periphery of the mesa structure 220. Try to block. As a result, only the exposure light 281 of the irradiation region 291 having a size corresponding to the transfer region 261 is irradiated onto the photocurable resin 260 on the transfer substrate 250.

As described above, in the imprint template 201 mounted on the imprint apparatus including the light shielding plate 270 that regulates the exposure light irradiation region 290, the light shielding film 233 formed on the main surface 211 of the base 210 is: The mesa structure 220 and the main surface 211 are not necessarily formed so as to cover the entire region from the place where the main surface 211 is in contact (that is, the outer edge of the bottom of the mesa structure 220) to the outer edge of the main surface 211 of the base 210, but a predetermined region. What is necessary is just to be formed.
More specifically, in the imprint template 201, the light-shielding film 233 formed on the main surface 211 of the base 210 is at least a portion where the mesa structure 220 and the main surface 211 are in contact (that is, the outer edge of the bottom of the mesa structure 220). ) To the outer edge of the region of the main surface 211 of the base 210 in the region corresponding to the irradiation region 290 shown in FIG. 9.

In the second embodiment, as in the imprint template 202 shown in FIG. 8B, the light shielding film 233 is a portion where the mesa structure 220 and the main surface 211 are in contact (that is, the bottom outer edge of the mesa structure 220). To the outer edge of the main surface 211 of the substrate 210 may be formed.
With such a configuration, the non-transfer area 262 of the photo-curable resin 260 is used regardless of the configuration of the imprint apparatus (for example, the size of the irradiation area 290 shown in FIG. 9) on which the imprint template 202 is mounted. This is because exposure light can be prevented from being irradiated.

  Next, the film thickness of the high-contrast film (second material film 232) on the bottom surface of the concave portion of the second concavo-convex structure 222 and the light shielding on the main surface 211 of the base 210 on the outer periphery of the mesa structure 220 The film thickness relationship of the film 233 (a stacked structure in which the first material film 231 and the second material film 232 are sequentially stacked), the depth of the first concavo-convex structure 221 constituting the transfer pattern, and the alignment mark The depth relationship of the second concavo-convex structure 222 that constitutes the structure will be described with reference to FIG.

FIG. 10 is a diagram illustrating an example of a main part of an imprint template according to the second embodiment.
FIG. 10 illustrates the relationship between the film thickness of the high-contrast film (second material film 232) and the light-shielding film 233, and the relationship between the depths of the first concavo-convex structure 221 and the second concavo-convex structure 222. The other elements constituting the imprint template 201 are not shown.
In FIG. 10, the imprint template 201 is described as an example, but the imprint template 202 can be similarly described.

  First, the film thickness of the high-contrast film (second material film 232) on the bottom surface of the concave portion of the second concavo-convex structure 222 and the light-shielding film on the main surface 211 of the base 210 on the outer periphery of the mesa structure 220 The relationship of the film thickness of 233 will be described.

In the imprint template according to the second embodiment, the high-contrast film (second material film 232) formed on the bottom surface of the concave portion of the second concavo-convex structure 222 is an alignment mark at the time of alignment. As long as the contrast can be improved, the light shielding film 233 on the main surface 211 of the substrate 210 on the outer periphery of the mesa structure 220 can prevent exposure light from being irradiated to an unintended region during imprinting. Desired.
Therefore, for example, when the material constituting the light shielding film 233 and the material constituting the high contrast film (second material film 232) are materials having the same optical characteristics, the film thickness of the light shielding film 233 (T ₂ ) Is preferably thicker (T ₁ <T ₂ ) than the film thickness (T ₁ ) of the high-contrast film (second material film 232). This is because the light shielding property is further improved.
Here, in the imprint template according to the second embodiment, the light shielding film 233 includes the first material film 231 in addition to the second material film 232 constituting the high contrast film. .
Therefore, the thickness (T ₂ ) of the light shielding film 233 is thicker (T ₁ <T ₂ ) than the thickness (T ₁ ) of the high contrast film (second material film 232).

Next, the relationship between the depths of the first concavo-convex structure 221 constituting the transfer pattern and the second concavo-convex structure 222 constituting the alignment mark will be described.
In imprint template according to the second embodiment, as shown in FIG. 10, the distance to the bottom surface of the recess and D ₁ from the upper surface of the convex portion of the first concave-convex structure 221 constituting the transfer pattern, alignment When the distance from the upper surface of the convex portion of the second concavo-convex structure 222 constituting the mark to the upper surface of the high contrast film (second material film 232) on the bottom surface of the concave portion is D ₂ , D ₁ ≦ it is preferably satisfy the relation of D _2.
With such a configuration, when the imprint template according to the second embodiment is manufactured, the resin layer (the first layer shown in FIG. 13H) as an etching mask remaining on the second material film 232 is produced. This is because the thickness of the second resin layer 302a) can be increased, and the problem that the second material film 232 disappears during etching can be more reliably prevented.

The above aspect can be obtained by the method described in Japanese Patent Application No. 2014-193694, for example.
That is, in the method for manufacturing an imprint template according to the second embodiment to be described later, a hard mask pattern (FIG. 12 (FIG. 12)) that serves as an etching mask when the first concavo-convex structure 221 and the second concavo-convex structure 222 are formed. After the first material pattern 231P) shown in d) is formed, the second concavo-convex structure 222 is half-etched in a state where the hard mask pattern region for forming the first concavo-convex structure 221 is covered with a resin layer. Thereafter, the resin layer is removed and the first concavo-convex structure 221 and the second concavo-convex structure 222 can be formed by etching.

Next, materials constituting the imprint template according to the second embodiment will be described.
The light-transmitting substrate 210 constituting the imprint template according to the second embodiment can be used for a light imprint method, and includes exposure light during imprinting and alignment. It can transmit alignment light.

In general, ultraviolet light having a wavelength in the range of 200 nm to 400 nm (particularly in the range of 300 nm to 380 nm) is used as the exposure light.
On the other hand, as the alignment light, light having a wavelength different from that of the exposure light is used so as not to cure the photocurable resin on the transfer substrate. Generally, visible light having a wavelength in the range of 400 nm to 800 nm (particularly in the vicinity of 633 nm) is used.

Examples of the material constituting the light-transmitting substrate 210 include transparent materials such as quartz glass, heat resistant glass, calcium fluoride (CaF ₂ ), magnesium fluoride (MgF ₂ ), and acrylic glass, and these transparent materials. Can be mentioned. In particular, synthetic quartz is suitable as a material used for the substrate 210 because it has high rigidity, a low coefficient of thermal expansion, and good transmittance in a range of 300 nm to 380 nm, which is a commonly used wavelength.
Normally, in the imprint template, the main material constituting the base material and the main material constituting the mesa structure having the transfer pattern are the same material, and also in the imprint template according to the second embodiment. The mesa structure 220 having the first concavo-convex structure 221 constituting the transfer pattern and the second concavo-convex structure 222 constituting the alignment mark is made of the same material as the substrate 210.

The first material film 231 constituting the imprint template according to the second embodiment is made of a material having etching characteristics different from those of the material constituting the substrate 210.
More specifically, the first material film 231 forms the first concavo-convex structure 221 and the second concavo-convex structure 222 as shown in FIG. 12E in the imprint template manufacturing method described later. At the time of the step, the material is made of a material having etching resistance that functions as an etching mask.
As described above, since the first material film 231 constituting the etching mask for forming the first concavo-convex structure 221 and the second concavo-convex structure 222 is used as a film below the light-shielding film 233, the first In the second embodiment, the transmittance of the light shielding film 233 can be reduced without increasing the number of steps.

As a material constituting the first material film 231, any material can be used as long as it functions as an etching mask when the material used for the substrate 210 is etched.
Here, since the material used for the base material 210 is mainly synthetic quartz as described above, the material constituting the first material film 231 has resistance to dry etching using a fluorine-based gas. It is preferable that
As a material constituting the first material film 231, for example, a material containing one or more metal materials and oxides, nitrides, oxynitrides thereof, and the like can be given. Specific examples of the metal material include chromium (Cr), molybdenum (Mo), tantalum (Ta), tungsten (W), zirconium (Zr), titanium (Ti), and the like.
When chromium (Cr) is used as a material constituting the first material film 231, the film thickness depends on the size of the first concavo-convex structure 221 to be formed, for example, a thickness of about 3 nm to 5 nm. If there is.

The second material film 232 constituting the imprint template according to the second embodiment is made of a material having a refractive index different from that of the material constituting the substrate 210.
By using materials having different refractive indexes, the contrast of the alignment mark at the time of alignment using alignment light can be improved.

As a material constituting the second material film 232, any material having a refractive index different from that of the material constituting the substrate 210 with respect to the alignment light can be used.
Since the material used for the substrate 210 is mainly synthetic quartz as described above, examples of the material constituting the second material film 232 include a metal material and its oxide, nitride, oxynitride, and the like. The thing containing 1 or more types can be mentioned. Specific examples of the metal material include chromium (Cr), molybdenum (Mo), tantalum (Ta), tungsten (W), zirconium (Zr), titanium (Ti), and the like.

Here, in order to prevent exposure light from being irradiated to an unintended region during imprinting, the light shielding film 33 formed on the main surface 211 of the substrate 210 has a transmittance of 10% or less at a wavelength of 365 nm. Preferably there is.
For example, when chromium (Cr) is used as a material constituting the first material film 231 and a material constituting the second material film 232, the thickness (T ₂ ) of the light shielding film 33 is 15 nm or more. Good.

Note that the imprint template according to the second embodiment may have a recessed portion on the back surface side that has a positional relationship including the mesa structure in plan view.
For example, as shown in FIGS. 8A and 8B, the imprint templates 201 and 202 have a recess 240 on the back surface 212 side that is in a positional relationship including the mesa structure 220 in plan view. Yes.

With such a configuration, the thickness of the imprint templates 201 and 202 in the portion where the recess 240 is formed can be reduced, and the mesa structure 220 can be easily bent.
Therefore, for example, when the transfer pattern (first concavo-convex structure 221) of the imprint templates 201 and 202 is brought into contact with the photocurable resin 260 on the transfer substrate 250, the mesa structure 220 is moved to the center. The transfer pattern (the first concavo-convex structure 221) is gradually eliminated from the central portion toward the outer peripheral portion by curving the portion closer to the photo-curable resin 260 than the surroundings, while gradually excluding gas contamination. It can be brought into contact with the photocurable resin 260.
Further, even at the time of mold release, by curving the mesa structure 220, the transfer pattern (first concavo-convex structure 221) is gradually detached from the photocurable resin 260 from the outer peripheral portion toward the central portion. Can do.

  The transfer pattern of the imprint template according to the second embodiment may be a line and space pattern or a pillar shape. As an example, in the case of a line and space pattern, the line width is about 30 nm and the height is about 60 nm. In the case of a pillar shape, the diameter is about 50 nm and the height is about 60 nm.

<Method for producing imprint template>
Next, a method for manufacturing an imprint template according to the second embodiment will be described.
FIG. 11 is a flowchart illustrating an example of a method for manufacturing an imprint template according to the second embodiment. 12 and 13 are schematic process diagrams showing an example of a method for manufacturing an imprint template according to the second embodiment. 11 to 13 mainly show the first concavo-convex structure 221, the second concavo-convex structure 222, the high contrast film (second material film 232), and the imprint template according to the second embodiment. In addition, a method for forming the light shielding film 233 (a stacked structure in which the first material film 231 and the second material film 232 are sequentially stacked) is described, and a method for forming other components is omitted. Yes.

For example, in order to manufacture the imprint template 201 by this manufacturing method, first, the template substrate 300 having the mesa structure 220 on the main surface 211 of the light-transmitting substrate 210 is prepared (see FIG. 11). S1, FIG. 12A), a first material film 231 is formed on the main surface 211 of the substrate 210 and on the upper surface 220a of the mesa structure 220 (S2, FIG. 12B). ).
As a method for forming the first material film 231, for example, a sputtering film forming method can be used.

  Next, first resin layers 301a and 301b are formed on the first material film 231, and the first resin layer 301a formed on the upper surface of the mesa structure 220 is processed to obtain a first resin pattern. 221a and 222a are formed (S3 in FIG. 11, FIG. 12C).

As the resin constituting the first resin layers 301a and 301b, a photocurable resin that can be used in the photoimprint method can be suitably used. Note that the resin constituting the first resin layer 301a and the resin constituting the first resin layer 301b may be the same or different.
When a photocurable resin is used as the resin constituting the first resin layer 301a, for example, the first imprint method using a master template having an uneven pattern corresponding to the first resin patterns 221a and 222a Resin patterns 221a and 222a can be formed.

On the other hand, the first resin layer 301b can be formed by dropping a resin constituting the first resin layer 301b on the first material film 231.
For example, using a photocurable resin, this resin is dropped so as to cover the necessary region of the first material film 231, and then photocured to form the first resin layer 301 b. Can be formed.

In addition, in the 1st resin layer 301b formed by the above methods, it is easy to produce the aspect containing a nonuniform film thickness, ie, a thick part and a thin part.
However, in the second embodiment, in the region where the first resin layer 301b is required, the thickness of the thinnest part is the thickness of the recesses of the first resin patterns 221a and 222a (first resin pattern The first resin layer 301b may be formed so as to be thicker than the thickness of the resin from the bottom surface of the recesses 221a and 222a to the top surface of the first material film 231.

  Next, the first resin patterns 221a and 222a are etched to form a first material pattern 231P from the first material film 231 (S4 in FIG. 11, FIG. 12D), and the first material Using the pattern 231P as an etching mask, the first concavo-convex structure 221 and the second concavo-convex structure 222 are formed (S5 in FIG. 11, FIG. 12E).

  In the process of forming the first material pattern 231P from the first material film 231 by etching the first resin patterns 221a and 222a (S4 in FIG. 11 and FIG. 12D), the conventional process is performed. A method similar to the imprint method can be used.

For example, first, the resin under the recesses of the first resin patterns 221a and 222a is removed by dry etching using oxygen gas to expose the first material film 231, and then the exposed first material film The first material pattern 231P can be formed by etching away the portion 231 (S4 in FIG. 11, FIG. 12D).
For example, when chromium (Cr) is used as a material constituting the first material film 231, the first material pattern 231P can be formed by dry etching using a mixed gas of chlorine and oxygen.

  In addition, when synthetic quartz is used as the material of the substrate 210, the first concavo-convex structure 221 and the second concavo-convex structure 222 can be formed by dry etching using a fluorine-based gas (FIG. 11). S5, FIG. 12 (e)).

  Note that the first resin layers 301a and 301b remaining after the step of forming the first concavo-convex structure 221 and the second concavo-convex structure 222 (S5 in FIG. 11, FIG. 12E) are, for example, oxygen It is removed by ashing using gas.

  Next, on the first material pattern 231P, on the bottom surface of the concave portion of the first concave-convex structure body 221, on the bottom surface of the concave portion of the second concave-convex structure body 222, and on the main surface of the substrate 210 A second material film 232 is formed on the first material film 231 (S6 in FIG. 11, FIG. 13F).

As a method of forming the second material film 232, a vacuum film forming technique such as a sputtering method or a CVD method can be used.
For example, in the case where chromium (Cr) is used as a material constituting the second material film 232, the second material film 232 can be formed by performing vacuum film formation by a sputtering method.

Next, second resin layers 302a and 302b are formed on the second material film 232 (S7 in FIG. 11, FIG. 13G).
More specifically, the second resin layer 302a (second resin layer (on the second material layer 232) is formed on the second material film 232 formed on the top surface of the convex portion and the bottom surface of the concave portion of the first concavo-convex structure 221. A)), and the second resin layer 302a (the second resin layer 302a is formed on the second material film 232 formed on the top surface of the convex portion and the bottom surface of the concave portion of the second concavo-convex structure 222. The resin layer (B)) is formed, and the second resin layer 302b (second resin layer (C)) is formed on the second material film 232 formed on the main surface of the substrate 210. .

At this time, as shown in FIG. 13G, the second resin layer 302a (second resin) formed on the second material film 232 on the bottom surface of the concave portion of the second concave-convex structure 222. The thickness of the layer (B)) and the thickness of the second resin layer 302b (second resin layer (C)) are such that the second material film 232 on the bottom surface of the concave portion of the first concavo-convex structure 221. Each resin layer is formed so as to be thicker than the second resin layer 302a (second resin layer (A)) formed thereon.
In the next step, that is, in the partial removal step of the second resin layer shown in FIG. 13H, the second resin layer 302a (second resin layer (B)) and the second resin layer 302b ( This is to remove the second resin layer 302a (second resin layer (A)) while leaving the second resin layer (C)).

As described above, the thickness (R ₂ ) of the second resin layer 302a (second resin layer (B)) is set to the thickness (R ₁ ) of the second resin layer 302a (second resin layer (A)). For example, a method using a step template 310 as shown in FIG. 14 can be mentioned.
More specifically, the second resin layer 302a (second resin layer) is formed on the second material film 232 formed on the top surface of the convex portion and the bottom surface of the concave portion of the first concavo-convex structure 221. (A)) is dropped, and the second resin is formed on the second material film 232 formed on the top surface of the convex portion and the bottom surface of the concave portion of the second concavo-convex structure 222. A resin constituting the layer 302a (second resin layer (B)) is dropped, and the second resin layer 302a (second resin layer (A)) and the second resin layer 302a (second resin layer ( The step template 310 having a step structure corresponding to each thickness of B)) is pressed to cure the resin.

As the resin constituting the second resin layer 302a, a photocurable resin that can be used for the photoimprinting method can be suitably used.
When a photocurable resin is used as the resin constituting the second resin layer 302a, for example, a step template 310 made of synthetic quartz is used to irradiate ultraviolet light 311 as shown in FIG. The second resin layer 302a (second resin layer (A)) and second resin layer 302a (second resin layer (B)) having a desired thickness are cured by curing the resin constituting the resin layer 302a. ) Can be formed.

By using the method as described above, in the example shown in FIGS. 13 (g) and 14, the second resin layer 302a (second resin layer (A) having a thickness (R ₁ ) in the range of 50 nm to 100 nm is used. )) And the second resin layer 302a (second resin layer (B)) having a thickness (R ₂ ) in the range of 160 nm to 300 nm can be formed.

On the other hand, the second resin layer 302b (second resin layer (C)) constitutes the second resin layer 302b on the second material film 232 formed on the main surface of the substrate 210. It can form by dripping resin to do.
As the resin constituting the second resin layer 302b, a photocurable resin that can be used in the photoimprint method can be suitably used. The resin constituting the second resin layer 302b may be the same as or different from the resin constituting the second resin layer 302a.
For example, a mode in which a photocurable resin is used as the resin constituting the second resin layer 302b and covers a necessary region of the second material film 232 formed on the main surface of the substrate 210, and The second resin layer 302b (second resin layer (C)) can be formed by dropping the resin so that the resin layer is light-cured.

In the second resin layer 302b (second resin layer (C)) formed by the method as described above, the second resin layer 302a (second resin layer) is formed by pressing the step template 310 to define the film thickness. In comparison with the second resin layer (A)) and the second resin layer 302a (second resin layer (B)), the film thickness is non-uniform, that is, an aspect including a thick portion and a thin portion is likely to occur.
However, in the second embodiment, in the region where the second resin layer 302b (second resin layer (C)) is required, the thickness of the thinnest portion is the concave portion of the first concavo-convex structure 221. The second resin so as to be thicker than the thickness (R ₁ ) of the second resin layer 302a (second resin layer (A)) formed on the second material film 232 on the bottom surface of The layer 302b (second resin layer (C)) may be formed.
For example, in the example shown in FIG. 13G, the thickness of the second resin layer 302b (second resin layer (C)) can be 1 μm or more.

Next, the second resin layer 302b (second resin layer (C)) formed on the second material film 232 on the main surface of the substrate 210, and the second concavo-convex structure 222 The second resin layer 302a (second resin layer (B)) formed on the second material film 232 on the bottom surface of the concave portion of the concave portion of the first recess on the mesa structure 220 is left. The second material film 232 formed on the material pattern 231P and the second material film 232 formed on the bottom surface of the concave portion of the first concavo-convex structure 221 are formed on the second material film 232 formed on the material pattern 231P. The resin layer 302a is removed (S8 in FIG. 11, FIG. 13 (h)).
Since there is a difference in film thickness shown in FIG. 13 (g), as shown in FIG. 13 (h), the second resin layer 302a (second resin layer (B)) and the second resin The layer 302b (second resin layer (C)) can be left.

  This partial removal, more specifically, the second resin layer 302a formed on the second material film 232 formed on the first material pattern 231P, and the first concavo-convex structure 221 An etching back method using oxygen gas can be used to remove the second resin layer 302a formed on the second material film 232 on the bottom surface of the recess.

Next, by the process shown in FIG. 13H, the second material film 232 that has been exposed by partially removing the second resin layer 302a is removed, and then the first material is removed. The pattern 231 </ b> P is removed, and then the remaining second resin layers 302 a and 302 b are removed (S <b> 9 to 10 in FIG. 11, FIG. 13 (i)) to obtain the imprint template 201.
More specifically, first, the second material film 232 formed on the first material pattern 231P on the mesa structure 220 and on the bottom surface of the concave portion of the first concavo-convex structure 221 is removed. Then, the exposed first material pattern 31P is removed, and then the second resin layer 302a remaining on the second material film 232 formed in the recess of the second uneven structure 222, and the base The second resin layer 302b remaining on the second material film 232 on the main surface of the material 210 is removed to obtain an imprint template 201 shown in FIG.

For example, when chromium (Cr) is used as the material constituting the second material film 232 and the first material pattern 231P, the second material film 232 and the first material pattern 231P are subjected to dry etching using a mixed gas containing chlorine and oxygen. The material film 232 and the first material pattern 231P can be removed.
Further, for example, an ashing method using oxygen gas can be used to remove the second resin layers 302a and 302b.
When the material constituting the second material film 232 and the material constituting the first material pattern 231P are the same material, the step of removing the second material film 232 and the first material The step of removing the pattern 231P can be performed in one step.

  As described above, in the method for manufacturing an imprint template of the second embodiment, the high contrast film provided on the second concavo-convex structure for improving the contrast of the alignment mark at the time of alignment, and the intention at the time of imprinting Since the upper layer film constituting the light-shielding film of the laminated structure provided on the outer periphery of the mesa structure can be manufactured in a common process in order to prevent light irradiation to the areas not to be irradiated, compared with the manufacturing method in which each film is individually formed Therefore, it is possible to manufacture an imprint template that can satisfy both the requirements of improving the contrast of the alignment mark at the time of alignment and preventing light irradiation to an unintended area at the time of imprinting with fewer steps. Can do.

  Further, the first material film constituting the etching mask for forming the first concavo-convex structure constituting the transfer pattern and the second concavo-convex structure constituting the alignment mark is formed under the light-shielding film having a laminated structure. Therefore, the transmittance of the light shielding film can be reduced without increasing the number of steps.

  In the case where a light shielding member is formed on a non-pattern part of a substrate (template substrate) for manufacturing an imprint template and then a concavo-convex structure is formed on the pattern part, Although there is a problem that the light-shielding film is easily damaged, in the imprint template manufacturing method according to the second embodiment, after the formation of the first concavo-convex structure 221 and the second concavo-convex structure 222, the laminated structure Since the upper film (second material film 232) constituting the light shielding film is formed, the above-described problem can be prevented.

  The imprint template and the imprint template manufacturing method according to the second embodiment have been described above. However, the second embodiment is not limited to the above embodiment. The above-described embodiment is an exemplification, and in any case, it has substantially the same configuration as the technical idea described in the claims of the second embodiment and exhibits the same effect. Is also included in the technical scope of the second embodiment.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

DESCRIPTION OF SYMBOLS 1, 2 Imprint template 10 Base material part 11 Main surface 12 Back surface 20 Mesa structure 20a Top surface 21 of mesa structure 1st uneven structure body 22 2nd uneven structure body 30a, 30b, 31, 32 2nd material Film 40 Depression 50 Transferred substrate 60 Photocurable resin 61 Transfer area 62 Non-transfer area 70 Light shielding plates 81, 82, 83 Exposure light 90, 91, 92 Irradiation area 100 First imprint template 101 First resin Layer 102 Second resin layer 103 Third resin layer 110 Step template 111 Ultraviolet light 201, 202 Imprint template 210 Base material 211 Main surface 212 Back surface 220 Mesa structure 220a Mesa structure upper surface 221 First uneven structure 221a First resin pattern 222 Second uneven structure 222a First resin pattern 231 First material film 231 P First material pattern 232 Second material film 233 Light-shielding film 240 Recessed portion 250 Transferred substrate 260 Photo-curing resin 261 Transfer region 262 Non-transfer region 270 Light-shielding plates 281, 282, 283 Exposure light 290, 291, 292 Irradiation Region 300 Template substrate 301a, 301b First resin layer 302a, 302b Second resin layer 310 Step template 311 Ultraviolet light

Claims (20)

An imprint template having a mesa structure on a main surface of a light-transmitting base material portion,
On the top surface of the mesa structure,
A first concavo-convex structure constituting a transfer pattern;
A second concavo-convex structure constituting an alignment mark;
Have
On the bottom surface of the concave portion of the second concavo-convex structure and on the main surface of the base material portion on the outer periphery of the mesa structure,
A template for imprinting, wherein a second material film made of a second material having a refractive index different from that of the first material constituting the substrate portion is formed. The second material film on the main surface of the base material portion is
2. The imprint according to claim 1, wherein the imprint is formed so as to cover a region from a bottom outer edge of the mesa structure that contacts the mesa structure and the main surface to an outer edge of the main surface of the base material portion. Template.   The imprint template according to claim 1 or 2, wherein the second material film on the main surface of the base material portion has a transmittance of 10% or less at a wavelength of 365 nm.   The second material film formed on the bottom surface of the concave portion of the second concavo-convex structure and the second material film formed on the main surface have the same film thickness. The imprint template according to claim 1, wherein the imprint template is a template.   The film thickness of the second material film formed on the bottom surface of the concave portion of the second concavo-convex structure is smaller than the film thickness of the second material film formed on the main surface. The imprint template according to claim 1, wherein the imprint template is a template. D ₁ is a distance from the top surface of the convex portion of the first concavo-convex structure to the bottom surface of the concave portion,
The distance from the upper surface of the convex portion of the second concave-convex structures to the upper surface of said second material film on the bottom surface of the recess in the case of a D _2,
D ₁ ≦ D ₂
The imprint template according to claim 1, wherein the imprint template satisfies the following relationship. A first concavo-convex structure that has a mesa structure on the main surface of the light-transmitting base material portion and that forms a transfer pattern on the upper surface of the mesa structure, and a second concavo-convex structure that forms an alignment mark And preparing a first imprint template having:
On the top surface of the mesa structure, on the bottom surface of the concave portion of the first concavo-convex structure, on the bottom surface of the concave portion of the second concavo-convex structure, and on the main surface of the base material portion, Forming a second material film composed of a second material having a refractive index different from that of the first material constituting the base portion;
Forming a resin layer on the second material film;
On the resin layer formed on the second material film on the bottom surface of the concave portion of the second concavo-convex structure, and on the second material film on the main surface of the base material portion The resin layer formed on the second material film on the uppermost surface of the mesa structure and the bottom surface of the concave portion of the first concavo-convex structure body while the formed resin layer remains. Removing the resin layer formed on the second material film;
Removing the second material film formed on the uppermost surface of the mesa structure and the second material film formed on the bottom surface of the recess of the first concavo-convex structure;
The resin layer left on the second material film on the bottom surface of the concave portion of the second concavo-convex structure and on the second material film on the main surface of the base material portion Removing the
In order. The manufacturing method of the template for imprints characterized by the above-mentioned. Forming a resin layer on the second material film,
Forming a first resin layer covering the second material film formed on the top surface of the convex portion and the bottom surface of the concave portion of the first concavo-convex structure;
Forming a second resin layer covering the second material film formed on the top surface of the convex portion and the bottom surface of the concave portion of the second concavo-convex structure;
Forming a third resin layer on the second material film formed on the main surface of the base material part,
The thickness of the second resin layer formed on the second material film on the bottom surface of the concave portion of the second concavo-convex structure, and the thickness of the third resin layer are:
The imprint according to claim 7, wherein the imprint is thicker than a thickness of the first resin layer formed on the second material film on the bottom surface of the concave portion of the first concavo-convex structure. Template manufacturing method. Forming the first resin layer and the second resin layer,
A first resin constituting the first resin layer is dropped on the second material film formed on the top surface of the convex portion and the bottom surface of the concave portion of the first concavo-convex structure;
A second resin constituting the second resin layer is dropped on the second material film formed on the top surface of the convex portion and the bottom surface of the concave portion of the second concavo-convex structure,
A step of pressing a step template having a step structure corresponding to each thickness of the first resin layer and the second resin layer, and curing the first resin and the second resin. The method for manufacturing an imprint template according to claim 8.   The step of forming the third resin layer includes a step of dropping a third resin constituting the third resin layer onto the second material film on the main surface of the base material portion. The method for producing an imprint template according to claim 8, wherein the imprint template is produced.   In the first imprint template, the distance from the top surface of the convex portion of the second concavo-convex structure to the bottom surface of the concave portion is the distance from the top surface of the convex portion of the first concavo-convex structure to the bottom surface of the concave portion. The imprint template manufacturing method according to any one of claims 7 to 10, wherein the imprint template is larger than the imprint template. An imprint template having a mesa structure on a main surface of a light-transmitting substrate,
On the top surface of the mesa structure,
A first concavo-convex structure constituting a transfer pattern;
A second concavo-convex structure constituting an alignment mark;
Have
A light shielding film is formed on the main surface of the outer periphery of the mesa structure,
A high contrast film is formed on the bottom surface of the concave portion of the second concavo-convex structure,
The high contrast film is
It is composed of a second material film different from the material constituting the base material,
The light shielding film is
An imprint template comprising a laminated structure in which a first material film different from a material constituting the substrate and the second material film are sequentially laminated. A light-shielding film on the main surface,
The imprint template according to claim 12, wherein the template is formed so as to cover a region from a bottom outer edge of the mesa structure where the mesa structure and the main surface are in contact to an outer edge of the base material. The first material film is
The material constituting the base material is composed of a first material having different etching characteristics,
The second material film is
The imprint template according to claim 12 or 13, wherein the imprint template is composed of a second material having a refractive index different from that of the material constituting the base material.   The imprint template according to any one of claims 12 to 14, wherein the light-shielding film has a transmittance of 10% or less at a wavelength of 365 nm. D ₁ is a distance from the top surface of the convex portion of the first concavo-convex structure to the bottom surface of the concave portion,
The distance to the upper surface of the high-contrast film on the top surface of the recess of the bottom surface of the convex portion of the second concave-convex structure in the case of a D _2,
D ₁ ≦ D ₂
The imprint template according to any one of claims 12 to 15, wherein the relationship is satisfied. Preparing a template substrate having a mesa structure on a main surface of a light-transmitting substrate;
Forming a first material film different from the material constituting the base material on the main surface of the base material and on the top surface of the mesa structure;
Forming a first resin layer on the first material film, processing the first resin layer formed on the upper surface of the mesa structure, and forming a first resin pattern;
The first resin pattern is etched to form a first material pattern from the first material film, and the first concavo-convex structure and the second material are formed using the first material pattern as an etching mask. Forming the concavo-convex structure,
On the first material pattern, on the bottom surface of the recess of the first concavo-convex structure, on the bottom surface of the recess of the second concavo-convex structure, and on the main surface of the substrate. Forming a second material film on the first material film;
Forming a second resin layer on the second material film;
The second material film formed on the second material film on the main surface of the base material and on the second material film on the bottom surface of the concave portion of the second concavo-convex structure. While leaving the resin layer of
On the second material film formed on the first material pattern on the mesa structure and on the second material film on the bottom surface of the recess of the first uneven structure Removing the second resin layer formed on,
Removing the second material film formed on the first material pattern on the mesa structure and on the bottom surface of the concave portion of the first concavo-convex structure;
Removing the first material pattern;
Removing the remaining second resin layer;
In order. The manufacturing method of the template for imprints characterized by the above-mentioned. Forming a second resin layer on the second material film,
Forming a second resin layer (A) on the second material film formed on the top surface of the convex portion and the bottom surface of the concave portion of the first concavo-convex structure;
Forming a second resin layer (B) on the second material film formed on the top surface of the convex portion and the bottom surface of the concave portion of the second concavo-convex structure;
Forming a second resin layer (C) on the second material film formed on the main surface of the substrate;
Including
The thickness of the second resin layer (B) and the thickness of the second resin layer (C) are:
The method for producing an imprint template according to claim 17, wherein the imprint template is thicker than a thickness of the second resin layer (A). Forming the second resin layer (A) and the second resin layer (B),
A resin constituting the second resin layer (A) is dropped on the second material film formed on the top surface of the convex portion and the bottom surface of the concave portion of the first concavo-convex structure. ,
A resin constituting the second resin layer (B) is dropped on the second material film formed on the top surface of the convex portion and the bottom surface of the concave portion of the second concavo-convex structure. ,
The method includes pressing a step template having a step structure corresponding to each thickness of the second resin layer (A) and the second resin layer (B) and curing the resin. Item 19. A method for producing an imprint template according to Item 18.   In the step of forming the second resin layer (C), the resin constituting the second resin layer (C) is dropped on the second material film on the main surface of the base material. The method for producing an imprint template according to claim 18, further comprising a step.