JP2018014430A - Laminated feedthrough capacitor and electronic component device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated feedthrough capacitor hard to cause the variation in ESR value and aging while ensuring high ESR.SOLUTION: A laminated feedthrough capacitor comprises: a first external electrode having a first electrode portion disposed on one end face; a second external electrode having a second electrode portion disposed on the other end face; a third external electrode having a third electrode portion disposed on one first side face; a fourth external electrode having a fourth electrode portion disposed on the other first side face; an internal electrode 11 connected to the first, second and fourth electrode portions; an internal electrode 13 connected to the fourth electrode portion, and not connected to the first and second electrode portions; and an internal electrode 15 disposed so as to be opposed to at least the internal electrode 13 in a direction in which a pair of second side faces are opposed to each other, and connected to the third electrode portion.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a multilayer feedthrough capacitor and an electronic component device including the multilayer feedthrough capacitor.

  A rectangular parallelepiped element having a pair of end faces facing each other, a pair of first side faces facing each other, and a pair of second side faces facing each other, and one end face A first external electrode disposed; a second external electrode disposed on the other end surface; a third external electrode disposed on one first side surface; and a second external electrode disposed on the other first side surface A laminated through comprising a fourth external electrode, an internal electrode connected to the first external electrode and the second external electrode, and an internal electrode connected to the third external electrode and the fourth external electrode A capacitor is known (see, for example, Patent Document 1).

  In the multilayer feedthrough capacitor described in Patent Document 1, the ESR (equivalent series resistance) is increased by the resistor film provided in the external electrode. The internal electrode is electrically connected to the resistor film.

JP 2007-096215 A

  In the multilayer feedthrough capacitor described in Patent Document 1, in order to control the ESR to a desired value, the thickness of the resistor film and the material composition of the resistor film must be adjusted, and it is extremely difficult to control the ESR. It becomes. That is, in the multilayer feedthrough capacitor described in Patent Document 1, the ESR value tends to vary. When the resistor film contains a resin, the ESR value may change over time due to moisture absorption.

  An object of one embodiment of the present invention is to provide a multilayer feedthrough capacitor and an electronic component device in which variation and aging hardly occur in the ESR value while ensuring high ESR.

  A multilayer feedthrough capacitor according to an aspect of the present invention includes a pair of end surfaces facing each other, a pair of first side surfaces facing each other, and a pair of second side surfaces facing each other. A rectangular parallelepiped element whose first side surface is a mounting surface, and a plurality of internal electrodes arranged in the element body so as to face each other in a direction in which the pair of second side surfaces oppose each other, A first external electrode having a first electrode portion disposed on one end face, a second external electrode having a second electrode portion disposed on the other end face, and a third electrode disposed on one first side face A third external electrode having a portion, and a fourth external electrode having a fourth electrode portion disposed on the other first side surface. The plurality of internal electrodes are connected to the first electrode portion, the second electrode portion, and the fourth electrode portion, to the fourth electrode portion, and to the first electrode portion and the second electrode. A second internal electrode that is not connected to the portion, and a second internal electrode that is disposed so as to face at least the second internal electrode in a direction in which the pair of second side surfaces face each other, and is connected to the third electrode portion And three internal electrodes.

  In the multilayer feedthrough capacitor according to one aspect of the present invention, a capacitance component is formed between the second internal electrode and the third internal electrode. The second internal electrode forming the capacitive component is not directly connected to the first external electrode and the second external electrode, and the first external electrode and the second external electrode through the fourth external electrode and the first internal electrode. It is indirectly connected to the electrode. That is, in the multilayer feedthrough capacitor according to this aspect, the number of internal electrodes directly connected to the first external electrode and the second external electrode is smaller than that of the multilayer feedthrough capacitor to be compared below. The value of ESR inserted with respect to the external electrode and the second external electrode is large. In the multilayer feedthrough capacitor to be compared, the plurality of internal electrodes do not have the second internal electrode, that is, the internal electrode connected to the first external electrode and the second external electrode, and the third external electrode, An internal electrode connected to the fourth external electrode, and the total number of internal electrodes is the same as that of the multilayer feedthrough capacitor according to this aspect.

  As described above, in the multilayer feedthrough capacitor according to this aspect, high ESR is achieved without providing a resistor film. Therefore, in the multilayer feedthrough capacitor according to this aspect, variations in the ESR value and aging are unlikely to occur.

  A multilayer feedthrough capacitor according to another aspect of the present invention has a pair of end faces facing each other, a pair of first side faces facing each other, and a pair of second side faces facing each other. And a plurality of internal electrodes arranged in the element body so as to face each other in a direction in which the pair of second side faces are opposed to each other. A first external electrode having a first electrode portion disposed on one end surface, a second external electrode having a second electrode portion disposed on the other end surface, and a third disposed on one first side surface A third external electrode having an electrode portion; and a fourth external electrode having a fourth electrode portion disposed on the other first side surface. The plurality of internal electrodes are a first internal electrode connected to the third electrode portion and the fourth electrode portion, and a second internal electrode connected to the fourth electrode portion and not connected to the third electrode portion And a third internal electrode that is disposed so as to face at least the second internal electrode in a direction in which the pair of second side surfaces face each other, and is connected to the first electrode part and the second electrode part, have.

  In the multilayer feedthrough capacitor according to another aspect of the present invention, a capacitance component is formed between the second internal electrode and the third internal electrode. The second internal electrode forming the capacitive component is not directly connected to the third external electrode, but is indirectly connected to the third external electrode through the fourth external electrode and the first internal electrode. That is, in the multilayer feedthrough capacitor according to this aspect, the number of internal electrodes directly connected to the third external electrode is smaller than that of the multilayer capacitor to be compared below, so ESR value is large. In the multilayer capacitor to be compared, the plurality of internal electrodes do not have the second internal electrode, that is, the internal electrode connected to the first external electrode and the second external electrode, the third external electrode, And the number of internal electrodes is the same as that of the multilayer capacitor according to this embodiment.

  As described above, in the multilayer feedthrough capacitor according to this aspect, high ESR is achieved without providing a resistor film. Therefore, in the multilayer feedthrough capacitor according to this aspect, variations in the ESR value and aging are unlikely to occur.

  In the multilayer feedthrough capacitor according to each of the above aspects, the third internal electrode may be disposed so as to face the first internal electrode in a direction in which the pair of second side surfaces face each other. In this case, a capacitive component is also formed between the first internal electrode and the third internal electrode. Therefore, in the multilayer feedthrough capacitor of this embodiment, since the current path formed between the first external electrode or the second external electrode and the third external electrode is relatively short, the equivalent series inductance (ESL) is reduced. .

  In the multilayer feedthrough capacitor according to each of the above embodiments, the plurality of internal electrodes are arranged so as to face at least the first internal electrode in a direction in which the pair of second side surfaces face each other, and are connected to the third electrode portion. A fourth internal electrode may be further included. In this case, a capacitive component is also formed between the first internal electrode and the fourth internal electrode. Therefore, in the multilayer feedthrough capacitor of this embodiment, the ESL is reduced because the current path formed between the first external electrode or the second external electrode and the third external electrode is relatively short.

  An electronic component device according to an aspect of the present invention includes the multilayer feedthrough capacitor, a main surface, and an electronic device having at least three pad electrodes arranged on the main surface. The multilayer feedthrough capacitor is mounted on the electronic device such that one first side surface and the main surface face each other. The first external electrode, the second external electrode, and the third external electrode are connected to corresponding pad electrodes among at least three pad electrodes.

  In the electronic component device according to one aspect of the present invention, one of the first side faces the main surface of the electronic device, and therefore the other first side does not face the main surface of the electronic device. Therefore, even when the multilayer feedthrough capacitor is mounted on the electronic device, the fourth external electrode is not connected to the pad electrode of the electronic device. For this reason, in the multilayer feedthrough capacitor mounted on the electronic device, the increase in ESR is not hindered.

  According to one aspect of the present invention, it is possible to provide a multilayer feedthrough capacitor and an electronic component device in which variations in the ESR value and aging are unlikely to occur while ensuring a high ESR.

1 is a perspective view showing a multilayer feedthrough capacitor according to an embodiment. It is a figure for demonstrating the cross-sectional structure of the multilayer feedthrough capacitor which concerns on this embodiment. It is a figure for demonstrating the cross-sectional structure of the multilayer penetration capacitor concerning this embodiment. It is a disassembled perspective view which shows the structure of an element body. It is a top view which shows each internal electrode. It is a disassembled perspective view which shows the structure of the element body with which the multilayer penetration capacitor of a comparison object is provided. It is a disassembled perspective view which shows the structure of an element body. It is a figure which shows the equivalent circuit of each multilayer feedthrough capacitor. It is a perspective view which shows the electronic component apparatus which concerns on one Embodiment. It is a circuit diagram which shows an example of the electronic component apparatus which concerns on this embodiment. It is a circuit diagram which shows an example of the electronic component apparatus which concerns on this embodiment. It is a figure for demonstrating the cross-sectional structure of the multilayer feedthrough capacitor which concerns on other embodiment. It is a figure for demonstrating the cross-sectional structure of the multilayer feedthrough capacitor which concerns on other embodiment. It is a disassembled perspective view which shows the structure of an element body. It is a top view which shows each internal electrode.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

  With reference to FIGS. 1-4, the structure of the multilayer feedthrough capacitor C1 which concerns on this embodiment is demonstrated. FIG. 1 is a perspective view showing a multilayer feedthrough capacitor according to this embodiment. 2 and 3 are views for explaining a cross-sectional configuration of the multilayer feedthrough capacitor according to the present embodiment. FIG. 4 is an exploded perspective view showing the configuration of the element body.

  As shown in FIGS. 1 to 3, the multilayer feedthrough capacitor C <b> 1 includes an element body 2, a first external electrode 5, a second external electrode 6, a third external electrode 7, a fourth external electrode 8, It has. The first external electrode 5, the second external electrode 6, the third external electrode 7, and the fourth external electrode 8 are disposed on the outer surface of the element body 2 and are separated from each other. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which corners and ridge lines are chamfered and a rectangular parallelepiped shape in which corners and ridge lines are rounded.

  The element body 2 has, as its outer surface, a pair of end surfaces 2a, 2b facing each other, a pair of first side surfaces 2c, 2d facing each other, and a pair of second side surfaces 2e, facing each other. 2f. The direction in which the pair of end surfaces 2a, 2b are opposed is the first direction D1, the direction in which the pair of first side surfaces 2c, 2d is opposed is the second direction D2, and the pair of second side surfaces 2e, 2f. The direction in which is opposed is the third direction D3. In the present embodiment, the first direction D1 is the longitudinal direction of the element body 2. The second direction D2 is the height direction of the element body 2, and is orthogonal to the first direction D1. The third direction D3 is the width direction of the element body 2, and is orthogonal to the first direction D1 and the second direction D2.

  The pair of first side surfaces 2c, 2d extends in the first direction D1 so as to connect the pair of end surfaces 2a, 2b. The pair of first side surfaces 2c, 2d also extends in the second direction D2. The pair of second side surfaces 2e, 2f extends in the first direction D1 so as to connect the pair of end surfaces 2a, 2b. The pair of second side surfaces 2e and 2f also extend in the third direction D3. In the present embodiment, each of the pair of end surfaces 2a, 2b, the pair of first side surfaces 2c, 2d, and the pair of second side surfaces 2e, 2f has a substantially rectangular shape. Each end surface 2a, 2b may have a substantially square shape.

The element body 2 is configured by laminating a plurality of dielectric layers in a direction (third direction D3) in which the pair of second side surfaces 2e and 2f are opposed to each other. In the element body 2, the direction in which the plurality of dielectric layers are stacked coincides with the third direction D3. Each dielectric layer is made of a sintered body of a ceramic green sheet containing, for example, a dielectric material (dielectric ceramic such as BaTiO ₃ series, Ba (Ti, Zr) O ₃ series, or (Ba, Ca) TiO ₃ series). Composed. In the actual element body 2, the dielectric layers are integrated to such an extent that the boundary between the dielectric layers is not visible.

  As shown in FIGS. 2 to 4, the multilayer feedthrough capacitor C <b> 1 includes a plurality of internal electrodes 11, 13, and 15 disposed in the element body 2. In this embodiment, the number of internal electrodes 11, 13, and 15 is plural. In the example shown in FIG. 4, the number of internal electrodes 11 is larger than the number of internal electrodes 13. Each internal electrode 11, 13, 15 is made of a conductive material (for example, Ni or Cu) that is normally used as an internal electrode of a laminated electric element. Each internal electrode 11, 13, 15 is configured as a sintered body of a conductive paste containing the conductive material.

  The internal electrodes 11 and 13 and the internal electrode 15 are arranged at different positions (layers) in the width direction of the element body 2. That is, the internal electrodes 11 and 13 and the internal electrode 15 are alternately arranged in the element body 2 so as to face each other with a gap in the third direction D3. The internal electrode 15 is located between the internal electrode 11 and the internal electrode 13 in the third direction D3. The internal electrode 15 is opposed to the internal electrode 11 in the third direction D3, and is opposed to the internal electrode 13 in the third direction D3.

  As shown in FIG. 5A, the internal electrode 11 includes a main electrode portion 11a and connecting portions 11b, 11c, and 11d. The main electrode portion 11a has a rectangular shape in which the first direction D1 is the long side direction and the second direction D2 is the short side direction. The connection portion 11b extends from one side (one short side) of the main electrode portion 11a and is exposed to the end surface 2a. The connecting portion 11c extends from one side (the other short side) of the main electrode portion 11a and is exposed to the end face 2b. The connecting portion 11d extends from one side (one long side) of the main electrode portion 11a and is exposed to the first side surface 2d. The internal electrode 11 is exposed to the pair of end surfaces 2a and 2b and the first side surface 2d, and is not exposed to the first side surface 2c and the pair of second side surfaces 2e and 2f. The main electrode part 11a and each connection part 11b, 11c, 11d are integrally formed.

  The connection part 11b extends from the end part on the end face 2a side of the main electrode part 11a to the end face 2a. The end of the connecting portion 11b is exposed at the end face 2a, and the end exposed at the end face 2a is connected to the first external electrode 5. The connection portion 11c extends from the end portion on the end surface 2b side of the main electrode portion 11a to the end surface 2b. The end of the connecting portion 11c is exposed at the end surface 2b, and the end exposed at the end surface 2b is connected to the second external electrode 6. The connecting portion 11d extends from the position of the central portion in the first direction D1 to the first side surface 2d at the end portion on the first side surface 2d side of the main electrode portion 11a. The end of the connecting portion 11d is exposed on the first side surface 2d, and the end exposed on the first side surface 2d is connected to the fourth external electrode 8.

  As shown in FIG. 5B, the internal electrode 13 includes a main electrode portion 13a and a connection portion 13b. The main electrode portion 13a has a rectangular shape in which the first direction D1 is the long side direction and the second direction D2 is the short side direction. The connection portion 13b extends from one side (one long side) of the main electrode portion 13a and is exposed to the first side surface 2d. The internal electrode 13 is exposed on the first side surface 2d, and is not exposed on the pair of end surfaces 2a and 2b, the first side surface 2c, and the pair of second side surfaces 2e and 2f. The main electrode portion 13a and the connection portion 13b are integrally formed.

  The connection portion 13b extends from the position of the central portion in the first direction D1 at the end portion on the first side surface 2d side of the main electrode portion 13a to the first side surface 2d. The end of the connection portion 13b is exposed at the first side surface 2d, and the end exposed at the first side surface 2d is connected to the fourth external electrode 8.

  As shown in FIG. 5C, the internal electrode 15 includes a main electrode portion 15a and a connection portion 15b. The main electrode portion 15a faces the main electrode portion 11a and the main electrode portion 13a via a part (dielectric layer) of the element body 2 in the third direction D3. The main electrode portion 15a has a rectangular shape in which the first direction D1 is the long side direction and the second direction D2 is the short side direction. The connection portion 15b extends from one side (the other long side) of the main electrode portion 15a and is exposed to the first side surface 2c. The internal electrode 15 is exposed on the first side surface 2c, and is not exposed on the pair of end surfaces 2a, 2b, the first side surface 2d, and the pair of second side surfaces 2e, 2f. The main electrode portion 15a and the connection portion 15b are integrally formed.

  The connecting portion 15b extends from the position of the central portion in the first direction D1 to the first side surface 2c at the end of the main electrode portion 15a on the first side surface 2c side. The end of the connecting portion 15b is exposed at the first side surface 2c, and the end exposed at the first side surface 2c is connected to the third external electrode 7.

  The first external electrode 5 is disposed at one end of the element body 2 in the first direction D1. The first external electrode 5 includes an electrode portion 5a disposed on the end surface 2a, and electrode portions 5b disposed on the pair of first side surfaces 2c and 2d and the pair of second side surfaces 2e and 2f, respectively. ing. Adjacent electrode portions 5a and 5b are connected at the ridge line portion of the element body 2 and are electrically connected to each other. The first external electrode 5 is formed on the five surfaces of the end surface 2a, the pair of first side surfaces 2c, 2d, and the pair of second side surfaces 2e, 2f.

  The electrode part 5a is arranged so as to cover all the part exposed to the end surface 2a of the connection part 11b, and the connection part 11b is directly connected to the first external electrode 5. That is, the connection part 11b connects the main electrode part 11a and the electrode part 5a. Thereby, each internal electrode 11 is electrically connected to the first external electrode 5.

  The second external electrode 6 is disposed at the other end of the element body 2 in the first direction D1. The second external electrode 6 includes an electrode portion 6a disposed on the end surface 2b, and electrode portions 6b disposed on the pair of first side surfaces 2c and 2d and the pair of second side surfaces 2e and 2f, respectively. ing. Adjacent electrode portions 6a and 6b are connected at the ridge line portion of the element body 2 and are electrically connected to each other. The second external electrode 6 is formed on the five surfaces of the end surface 2b, the pair of first side surfaces 2c, 2d, and the pair of second side surfaces 2e, 2f.

  The electrode part 6a is arranged so as to cover all the part exposed at the end face 2b of the connection part 11c, and the connection part 11c is directly connected to the second external electrode 6. That is, the connection part 11c connects the main electrode part 11a and the electrode part 6a. Thereby, each internal electrode 11 is electrically connected to the second external electrode 6.

  The third external electrode 7 is disposed at the central portion of the element body 2 in the first direction D1. The third external electrode 7 has an electrode portion 7a disposed on the first side surface 2c and electrode portions 7b disposed on the pair of second side surfaces 2e and 2f, respectively. Adjacent electrode portions 7a and 7b are connected at the ridge line portion of the element body 2 and are electrically connected to each other. The third external electrode 7 is formed on the three surfaces of the first side surface 2c and the pair of second side surfaces 2e and 2f.

  The electrode portion 7a is disposed so as to cover all the portion exposed to the first side surface 2c of the connection portion 15b, and the connection portion 15b is directly connected to the third external electrode 7. That is, the connection portion 15b connects the main electrode portion 15a and the electrode portion 7a. Thereby, each internal electrode 15 is electrically connected to the third external electrode 7.

  The fourth external electrode 8 is disposed at the central portion of the element body 2 in the first direction D1. The fourth external electrode 8 has an electrode portion 8a disposed on the first side surface 2d and an electrode portion 8b disposed on each of the pair of second side surfaces 2e and 2f. Adjacent electrode portions 8a and 8b are connected at the ridge line portion of the element body 2 and are electrically connected to each other. The fourth external electrode 8 is formed on the three surfaces of the first side surface 2d and the pair of second side surfaces 2e and 2f.

  The electrode portion 8a is disposed so as to cover all the portions exposed to the first side surface 2d of the connection portions 11d and 13b, and the connection portions 11d and 13b are directly connected to the fourth external electrode 8. That is, the connecting part 11d connects the main electrode part 11a and the electrode part 8a, and the connecting part 13b connects the main electrode part 13a and the electrode part 8a. Thereby, each internal electrode 11 and 13 is electrically connected to the fourth external electrode 8.

  The internal electrode 11 is connected to the first external electrode 5, the second external electrode 6, and the fourth external electrode 8. The internal electrode 11 is not connected to the third external electrode 7. The internal electrode 13 is connected only to the fourth external electrode 8. The internal electrode 13 is not connected to the first external electrode 5, the second external electrode 6, and the third external electrode 7. The internal electrode 15 is connected only to the third external electrode 7. The internal electrode 13 is not connected to the first external electrode 5, the second external electrode 6, and the fourth external electrode 8.

  For example, when the first external electrode 5 and the second external electrode 6 function as signal terminal electrodes and the third external electrode 7 functions as a ground terminal electrode, the internal electrodes 11 and 13 function as signal internal electrodes. The internal electrode 15 functions as a grounding internal electrode. The potential connected to the internal electrodes 11 and 13 may be “positive” or “negative”.

  The first external electrode 5, the second external electrode 6, the third external electrode 7, and the fourth external electrode 8 have a sintered metal layer. The sintered metal layer is formed, for example, by applying a conductive paste to the outer surface of the element body 2 and baking it. In the conductive paste, a metal powder (for example, a powder made of Cu or Ni), a glass component, an organic binder, and an organic solvent are mixed. The sintered metal layer is a layer obtained by sintering the metal powder contained in the conductive paste. The first external electrode 5, the second external electrode 6, the third external electrode 7, and the fourth external electrode 8 may have a plating layer formed on the sintered metal layer.

  The multilayer feedthrough capacitor C1 is mounted on another electronic device (for example, a circuit board or an electronic component). For example, the multilayer feedthrough capacitor C1 is solder-mounted on another electronic device. In the multilayer feedthrough capacitor C1, the first side surface 2c is a mounting surface that faces another electronic device.

  As described above, in this embodiment, a capacitive component is formed between the internal electrode 13 and the internal electrode 15. The internal electrode 13 that forms the capacitive component is not directly connected to the first external electrode 5 and the second external electrode 6, and is connected to the first external electrode 5 and the second external electrode through the fourth external electrode 8 and the internal electrode 11. The two external electrodes 6 are indirectly connected. That is, in the multilayer feedthrough capacitor C1, the number of internal electrodes directly connected to the first external electrode 5 and the second external electrode 6 is smaller than that of a multilayer feedthrough capacitor to be compared which will be described later. As shown, the value of ESR inserted into the first external electrode 5 and the second external electrode 6 is large.

  In the multilayer feedthrough capacitor to be compared, as shown in FIG. 6, the plurality of internal electrodes arranged in the element body 102 do not have the internal electrode 13. That is, in the multilayer feedthrough capacitor to be compared, the plurality of internal electrodes are the internal electrode 101 connected to the first external electrode 5 and the second external electrode 6, the third external electrode 7, and the fourth external electrode 8. And an internal electrode 103 connected to the. The multilayer feedthrough capacitor to be compared and the multilayer feedthrough capacitor C1 have the same total number of internal electrodes.

  The equivalent circuit shown in FIG. 8A is an equivalent circuit of the multilayer feedthrough capacitor C1. The equivalent circuit shown in (c) of FIG. 8 is an equivalent circuit of the multilayer feedthrough capacitor to be compared. In the multilayer feedthrough capacitor C1, the number of internal electrodes directly connected to the first external electrode 5 and the second external electrode 6 is smaller than that of the multilayer feedthrough capacitor to be compared. There are few, and the value of ESR is large.

  In the multilayer feedthrough capacitor C1, high ESR is achieved without providing a resistor film. Therefore, in the multilayer feedthrough capacitor C1, variations in the ESR value and aging are unlikely to occur.

  In the multilayer feedthrough capacitor C1, the internal electrode 15 is also disposed so as to face the internal electrode 11 in the third direction D3, so that a capacitance component is also formed between the internal electrode 11 and the internal electrode 15. Therefore, in the multilayer feedthrough capacitor C1, since the current path formed between the first external electrode 5 or the second external electrode 6 and the third external electrode 7 is relatively short, ESL is reduced.

  The multilayer feedthrough capacitor C <b> 1 includes a plurality of internal electrodes 15. The plurality of internal electrodes 15 include not only the internal electrode 15 disposed to face the internal electrode 13 in the third direction D3 but also the internal electrode 15 facing at least the internal electrode 11 in the third direction D3. It is out. For this reason, a capacitance component is also formed between the internal electrode 11 and the internal electrode 15. Therefore, in the multilayer feedthrough capacitor C1, as described above, ESL is reduced.

  In the multilayer feedthrough capacitor C1, the number of internal electrodes 11 and the number of internal electrodes 13 are not limited to the numbers shown in FIG. For example, as shown in FIG. 7, the number of internal electrodes 11 may be smaller than the number of internal electrodes 13. In this case, the multilayer feedthrough capacitor C1 shown in FIG. 7 has an internal electrode directly connected to the first external electrode 5 and the second external electrode 6 as compared with the multilayer feedthrough capacitor C1 shown in FIG. Therefore, as shown in FIG. 8B, there are few resistance components connected in parallel. Therefore, the value of ESR of the multilayer feedthrough capacitor C1 shown in FIG. 7 is larger than the value of ESR of the multilayer feedthrough capacitor C1 shown in FIG.

  As described above, in the multilayer feedthrough capacitor C1, the value of ESR can be controlled by changing the number of internal electrodes 11 directly connected to the first external electrode 5 and the second external electrode 6. It is.

  Next, the configuration of the electronic component device ECD according to the present embodiment will be described with reference to FIG. FIG. 9 is a perspective view showing the electronic component device according to the present embodiment.

  As shown in FIG. 9, the electronic component device ECD includes a multilayer feedthrough capacitor C1 and an electronic device ED. The electronic device ED is, for example, a circuit board or another electronic component.

  The multilayer feedthrough capacitor C1 is mounted on the electronic device ED. In the present embodiment, the multilayer feedthrough capacitor C1 is solder-mounted on the electronic device ED. The electronic device ED includes a main surface Eda and at least three pad electrodes PE1, PE2, and PE3. Each pad electrode PE1, PE2, PE3 is arranged on the main surface EDa. The three pad electrodes PE1, PE2, PE3 are separated from each other. The multilayer feedthrough capacitor C1 is arranged in the electronic device ED so that the first side surface 2c which is a mounting surface and the main surface EDa face each other.

  The first external electrode 5 is connected to the pad electrode PE1. The second external electrode 6 is connected to the pad electrode PE2. The third external electrode 7 is connected to the pad electrode PE3. The fourth external electrode 8 is not connected to any pad electrode PE1, PE2, PE3.

  In the electronic component device ECD, the first side surface 2d does not face the main surface EDa because the first side surface 2c faces the main surface EDa of the electronic device ED. Therefore, even when the multilayer feedthrough capacitor C1 is mounted on the electronic device ED, the fourth external electrode 8 is not connected to the pad electrodes PE1, PE2, and PE3 included in the electronic device ED. For this reason, in the multilayer feedthrough capacitor C1 mounted on the electronic device ED, the increase in ESR is not hindered.

  The multilayer feedthrough capacitor C1 is connected to a line (for example, a power supply line or a signal line) included in the electronic device ED as shown in FIG. 10 or FIG. 10 and 11 are circuit diagrams illustrating an example of the electronic component device according to the present embodiment.

  In the example shown in FIG. 10, the electronic device ED includes lines L1, L2, and L3. The multilayer feedthrough capacitor C1 is through-connected to the lines L1 and L2. The first external electrode 5 and the line L1 are connected, and the second external electrode 6 and the line L2 are connected. The third external electrode 7 and the line L3 are connected, and the third external electrode 7 is grounded through the line L3. The fourth external electrode 8 is not connected to any of the lines L1, L2, and L3.

  In the example shown in FIG. 11, the multilayer feedthrough capacitor C1 is non-through connected (shunt connected) to the line. The electronic device ED includes lines L4 and L5. The multilayer feedthrough capacitor C1 is non-through connected to the line L4. The first external electrode 5 and the second external electrode 6 are connected to the line L4. The third external electrode 7 and the line L5 are connected, and the third external electrode 7 is grounded through the line L5. The fourth external electrode 8 is not connected to any of the lines L4 and L5.

  Next, with reference to FIGS. 12-14, the structure of the multilayer feedthrough capacitor C2 which concerns on other embodiment is demonstrated. 12 and 13 are views for explaining a cross-sectional configuration of a multilayer feedthrough capacitor according to another embodiment. FIG. 14 is an exploded perspective view showing the configuration of the element body.

  The multilayer feedthrough capacitor C2 is similar to the multilayer feedthrough capacitor C1, and as shown in FIGS. 12 to 14, the element body 2, the first external electrode 5, the second external electrode 6, the third external electrode 7, And a fourth external electrode 8. The element body 2 has a pair of end surfaces 2a and 2b, a pair of first side surfaces 2c and 2d, and a pair of second side surfaces 2e and 2f.

  The multilayer feedthrough capacitor C <b> 2 includes a plurality of internal electrodes 21, 25, 27 arranged in the element body 2. In the present embodiment, the number of internal electrodes 21, 25, 27 is plural. In the example shown in FIG. 14, the number of internal electrodes 25 and the number of internal electrodes 27 are the same. Each internal electrode 21, 25, 27 is made of a conductive material (for example, Ni or Cu) that is normally used as an internal electrode of a laminated electric element, like the internal electrodes 11, 13, 15. Each internal electrode 21, 25, 27 is configured as a sintered body of a conductive paste containing the conductive material.

  The internal electrode 21 and the internal electrodes 25 and 27 are disposed at different positions (layers) in the width direction of the element body 2. That is, the internal electrodes 21 and the internal electrodes 25 and 27 are alternately arranged in the element body 2 so as to face each other with an interval in the third direction D3. The internal electrode 21 is located between the internal electrode 25 and the internal electrode 27 in the third direction D3. The internal electrode 21 is opposed to the internal electrode 25 in the third direction D3, and is opposed to the internal electrode 27 in the third direction D3.

  As shown in FIG. 15A, the internal electrode 21 includes a main electrode portion 21a and connecting portions 21b and 21c. The main electrode portion 21a has a rectangular shape in which the first direction D1 is the long side direction and the second direction D2 is the short side direction. The connection portion 21b extends from one side (one short side) of the main electrode portion 11a and is exposed to the end surface 2a. The connecting portion 21c extends from one side (the other short side) of the main electrode portion 21a and is exposed to the end face 2b. The internal electrode 21 is exposed at the pair of end surfaces 2a and 2b, and is not exposed at the pair of first side surfaces 2c and 2d and the pair of second side surfaces 2e and 2f. The main electrode portion 21a and the connection portions 21b and 21c are integrally formed.

  The connection portion 21b extends from the end portion on the end surface 2a side of the main electrode portion 21a to the end surface 2a. The end of the connecting portion 21b is exposed at the end face 2a, and the end exposed at the end face 2a is connected to the first external electrode 5. The connection portion 21c extends from the end portion on the end surface 2b side of the main electrode portion 21a to the end surface 2b. The end of the connection portion 21 c is exposed on the end surface 2 b, and the end exposed on the end surface 2 b is connected to the second external electrode 6.

  As shown in FIG. 5B, the internal electrode 25 includes a main electrode portion 25a and connection portions 25b and 25c. The main electrode portion 25a has a rectangular shape in which the first direction D1 is the long side direction and the second direction D2 is the short side direction. The connection portion 25b extends from one side (one long side) of the main electrode portion 13a and is exposed to the first side surface 2c. The connection portion 25c extends from one side (the other long side) of the main electrode portion 13a and is exposed to the first side surface 2d. The internal electrode 25 is exposed on the pair of first side surfaces 2c and 2d, and is not exposed on the pair of end surfaces 2a and 2b and the pair of second side surfaces 2e and 2f. The main electrode portion 25a and the connection portions 25b and 25c are integrally formed.

  The connection portion 25b extends from the position of the central portion in the first direction D1 at the end portion on the first side surface 2c side of the main electrode portion 25a to the first side surface 2c. The end of the connecting portion 25b is exposed at the first side surface 2c, and the end exposed at the first side surface 2c is connected to the third external electrode 7. The connecting portion 25c extends from the position of the central portion in the first direction D1 to the first side surface 2d at the end of the main electrode portion 25a on the first side surface 2d side. The end of the connection portion 25c is exposed at the first side surface 2d, and the end exposed at the first side surface 2d is connected to the fourth external electrode 8.

  As shown in FIG. 5C, the internal electrode 27 includes a main electrode portion 27a and a connection portion 27b. The main electrode portion 27a has a rectangular shape in which the first direction D1 is the long side direction and the second direction D2 is the short side direction. The connection portion 27b extends from one side (one long side) of the main electrode portion 27a and is exposed to the first side surface 2d. The internal electrode 27 is exposed on the first side surface 2d, and is not exposed on the pair of end surfaces 2a, 2b, the first side surface 2c, and the pair of second side surfaces 2e, 2f. The main electrode portion 27a and the connection portion 27b are integrally formed.

  The connecting portion 27b extends from the position of the central portion in the first direction D1 at the end portion on the first side surface 2d side of the main electrode portion 27a to the first side surface 2d. The end of the connecting portion 27b is exposed at the first side surface 2d, and the end exposed at the first side surface 2d is connected to the fourth external electrode 8.

  The electrode part 5a of the first external electrode 5 is arranged so as to cover all the part exposed at the end surface 2a of the connection part 21b, and the connection part 21b is directly connected to the first external electrode 5. That is, the connection part 21b connects the main electrode part 21a and the electrode part 5a. Thereby, each internal electrode 21 is electrically connected to the first external electrode 5.

  The electrode part 6a of the second external electrode 6 is arranged so as to cover all the part exposed at the end face 2b of the connection part 21c, and the connection part 21c is directly connected to the second external electrode 6. That is, the connection part 21c connects the main electrode part 21a and the electrode part 6a. Thereby, each internal electrode 21 is electrically connected to the second external electrode 6.

  The electrode portion 7a of the third external electrode 7 is arranged so as to cover all the portion exposed to the first side surface 2c of the connection portion 25b, and the connection portion 25b is directly connected to the third external electrode 7. Yes. That is, the connection part 25b connects the main electrode part 25a and the electrode part 7a. Thereby, each internal electrode 25 is electrically connected to the third external electrode 7.

  The electrode portion 8a of the fourth external electrode 8 is disposed so as to cover all the portions exposed to the first side surface 2d of the connection portions 25c and 27b, and the connection portions 25c and 27b are directly connected to the fourth external electrode 8. It is connected to the. That is, the connection part 25c connects the main electrode part 25a and the electrode part 8a, and the connection part 27b connects the main electrode part 27a and the electrode part 8a. As a result, the internal electrodes 25 and 27 are electrically connected to the fourth external electrode 8.

  The internal electrode 21 is connected to the first external electrode 5 and the second external electrode 6. The internal electrode 11 is not connected to the third external electrode 7 and the fourth external electrode 8. The internal electrode 25 is connected to the third external electrode 7 and the fourth external electrode 8. The internal electrode 25 is not connected to the first external electrode 5 and the second external electrode 6. The internal electrode 27 is connected only to the fourth external electrode 8. The internal electrode 27 is not connected to the first external electrode 5, the second external electrode 6, and the third external electrode 7.

  For example, when the first external electrode 5 and the second external electrode 6 function as signal terminal electrodes and the third external electrode 7 functions as a ground terminal electrode, the internal electrode 21 functions as a signal internal electrode, The internal electrodes 25 and 27 function as grounding internal electrodes. The potential connected to the internal electrode 21 may be “positive” or “negative”.

  Similarly to the multilayer feedthrough capacitor C1, the multilayer feedthrough capacitor C2 is also mounted on another electronic device. For example, the multilayer feedthrough capacitor C2 is solder-mounted on another electronic device. Also in the multilayer feedthrough capacitor C2, the first side surface 2c is a mounting surface facing another electronic device.

  As described above, in this embodiment, a capacitance component is formed between the internal electrode 21 and the internal electrode 27. The internal electrode 27 that forms the capacitive component is not directly connected to the third external electrode 7 but is indirectly connected to the third external electrode 7 through the fourth external electrode 8 and the internal electrode 25. That is, in the multilayer feedthrough capacitor C2, since the number of internal electrodes directly connected to the third external electrode 7 is smaller than that of the above-described comparative multilayer capacitor, the multilayer feedthrough capacitor C2 is inserted into the third external electrode 7. ESR value is large.

  In the multilayer feedthrough capacitor C2, a high ESR is achieved without providing a resistor film. Therefore, in the multilayer feedthrough capacitor C2, variations in the ESR value and aging are unlikely to occur.

  In the multilayer feedthrough capacitor C2, the internal electrode 21 is also disposed so as to face the internal electrode 25 in the third direction D3, so that a capacitance component is also formed between the internal electrode 21 and the internal electrode 25. Therefore, in the multilayer feedthrough capacitor C2, since the current path formed between the first external electrode 5 or the second external electrode 6 and the third external electrode 7 is relatively short, ESL is reduced.

  The multilayer feedthrough capacitor C <b> 2 includes a plurality of internal electrodes 21. The plurality of internal electrodes 21 include not only the internal electrode 21 disposed to face the internal electrode 25 in the third direction D3 but also the internal electrode 21 facing at least the internal electrode 27 in the third direction D3. It is out. For this reason, a capacitive component is also formed between the internal electrode 21 and the internal electrode 25. Therefore, in the multilayer feedthrough capacitor C2, as described above, ESL is reduced.

  In the multilayer feedthrough capacitor C2, the number of internal electrodes 25 and the number of internal electrodes 27 are not limited to the numbers shown in FIG. The number of internal electrodes 25 may be smaller than the number of internal electrodes 27. The number of internal electrodes 25 may be larger than the number of internal electrodes 27. When the number of internal electrodes 25 is smaller than the number of internal electrodes 27, there are fewer resistance components connected in parallel than when the number of internal electrodes 25 is larger than the number of internal electrodes 27. Therefore, the ESR value of the multilayer feedthrough capacitor C2 in which the number of internal electrodes 25 is smaller than the number of internal electrodes 27 is larger than the ESR value of the multilayer feedthrough capacitor C2 in which the number of internal electrodes 25 is larger than the number of internal electrodes 27.

  As described above, in the multilayer feedthrough capacitor C2, it is possible to control the value of ESR by changing the number of internal electrodes 25 directly connected to the third external electrode 7.

  As mentioned above, although embodiment of this invention has been described, this invention is not necessarily limited to embodiment mentioned above, A various change is possible in the range which does not deviate from the summary.

  The electronic component device ECD may include a multilayer feedthrough capacitor C2 instead of the multilayer feedthrough capacitor C1.

  2 ... Element, 2a, 2b ... End face, 2c, 2d ... First side, 2e, 2f ... Second side, 5 ... First external electrode, 5a ... Electrode part, 6 ... Second external electrode, 6a ... Electrode part 7 ... third external electrode, 7a ... electrode portion, 8 ... fourth external electrode, 8a ... electrode portion, 11, 13, 15, 21, 25, 27 ... internal electrode, C1, C2 ... multilayer feedthrough capacitor, D1 ... 1st direction, D2 ... 2nd direction, D3 ... 3rd direction, ECD ... Electronic component apparatus, ED ... Electronic equipment, EDa ... Main surface, PE1, PE2, PE3 ... Pad electrode.

Claims (5)

A pair of end surfaces facing each other, a pair of first side surfaces facing each other, and a pair of second side surfaces facing each other, wherein one of the first side surfaces is a mounting surface A rectangular parallelepiped element,
A plurality of internal electrodes arranged in the element body so as to oppose each other in a direction in which the pair of second side surfaces oppose each other;
A first external electrode having a first electrode portion disposed on one of the end faces;
A second external electrode having a second electrode portion disposed on the other end face;
A third external electrode having a third electrode portion disposed on the one first side surface;
A fourth external electrode having a fourth electrode portion disposed on the other first side surface,
The plurality of internal electrodes are:
A first internal electrode connected to the first electrode portion, the second electrode portion and the fourth electrode portion;
A second internal electrode connected to the fourth electrode portion and not connected to the first electrode portion and the second electrode portion;
A third internal electrode that is disposed to face at least the second internal electrode in the direction in which the pair of second side surfaces oppose each other, and is connected to the third electrode portion; Multilayer feedthrough capacitor. A pair of end surfaces facing each other, a pair of first side surfaces facing each other, and a pair of second side surfaces facing each other, wherein one of the first side surfaces is a mounting surface A rectangular parallelepiped element,
A plurality of internal electrodes arranged in the element body so as to oppose each other in a direction in which the pair of second side surfaces oppose each other;
A first external electrode having a first electrode portion disposed on one of the end faces;
A second external electrode having a second electrode portion disposed on the other end face;
A third external electrode having a third electrode portion disposed on the one first side surface;
A fourth external electrode having a fourth electrode portion disposed on the other first side surface,
The plurality of internal electrodes are:
A first internal electrode connected to the third electrode portion and the fourth electrode portion;
A second internal electrode connected to the fourth electrode portion and not connected to the third electrode portion;
A third internal portion disposed so as to face at least the second internal electrode in the direction in which the pair of second side surfaces oppose each other and connected to the first electrode portion and the second electrode portion; And a multilayer feedthrough capacitor.   3. The multilayer feedthrough capacitor according to claim 1, wherein the third internal electrode is also arranged to face the first internal electrode in the direction in which the pair of second side surfaces face each other. The plurality of internal electrodes are:
The pair of second side surfaces are arranged so as to face at least the first internal electrode in the direction in which the pair of second side surfaces face each other, and further include a fourth internal electrode connected to the third electrode portion. The multilayer feedthrough capacitor according to claim 1 or 2. The multilayer feedthrough capacitor according to any one of claims 1 to 4,
An electronic device having a main surface and at least three pad electrodes arranged on the main surface;
The multilayer feedthrough capacitor is mounted on the electronic device such that the first side surface of the one and the main surface face each other,
The electronic component device, wherein the first external electrode, the second external electrode, and the third external electrode are connected to corresponding pad electrodes among the at least three pad electrodes.

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