JP2017528178A5 - - Google Patents

Download PDF

Info

Publication number
JP2017528178A5
JP2017528178A5 JP2017501646A JP2017501646A JP2017528178A5 JP 2017528178 A5 JP2017528178 A5 JP 2017528178A5 JP 2017501646 A JP2017501646 A JP 2017501646A JP 2017501646 A JP2017501646 A JP 2017501646A JP 2017528178 A5 JP2017528178 A5 JP 2017528178A5
Authority
JP
Japan
Prior art keywords
ultrasonic transducer
transducer assembly
substrate island
ultrasonic
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2017501646A
Other languages
English (en)
Japanese (ja)
Other versions
JP6670292B2 (ja
JP2017528178A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/EP2015/064365 external-priority patent/WO2016008690A1/en
Publication of JP2017528178A publication Critical patent/JP2017528178A/ja
Publication of JP2017528178A5 publication Critical patent/JP2017528178A5/ja
Application granted granted Critical
Publication of JP6670292B2 publication Critical patent/JP6670292B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2017501646A 2014-07-17 2015-06-25 超音波トランスデューサアセンブリ、超音波プローブ及び超音波イメージングシステム Expired - Fee Related JP6670292B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14177454.7 2014-07-17
EP14177454 2014-07-17
PCT/EP2015/064365 WO2016008690A1 (en) 2014-07-17 2015-06-25 Ultrasound transducer arrangement and assembly, coaxial wire assembly, ultrasound probe and ultrasonic imaging system

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019190035A Division JP6878546B2 (ja) 2014-07-17 2019-10-17 同軸ワイヤアセンブリ

Publications (3)

Publication Number Publication Date
JP2017528178A JP2017528178A (ja) 2017-09-28
JP2017528178A5 true JP2017528178A5 (OSRAM) 2018-08-02
JP6670292B2 JP6670292B2 (ja) 2020-03-18

Family

ID=51211086

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2017501646A Expired - Fee Related JP6670292B2 (ja) 2014-07-17 2015-06-25 超音波トランスデューサアセンブリ、超音波プローブ及び超音波イメージングシステム
JP2019190035A Active JP6878546B2 (ja) 2014-07-17 2019-10-17 同軸ワイヤアセンブリ
JP2021075645A Pending JP2021129996A (ja) 2014-07-17 2021-04-28 超音波トランスデューサ装置及びアセンブリ、同軸ワイヤアセンブリ、超音波プローブ並びに超音波イメージングシステム

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2019190035A Active JP6878546B2 (ja) 2014-07-17 2019-10-17 同軸ワイヤアセンブリ
JP2021075645A Pending JP2021129996A (ja) 2014-07-17 2021-04-28 超音波トランスデューサ装置及びアセンブリ、同軸ワイヤアセンブリ、超音波プローブ並びに超音波イメージングシステム

Country Status (5)

Country Link
US (2) US10828673B2 (OSRAM)
EP (2) EP3169448A1 (OSRAM)
JP (3) JP6670292B2 (OSRAM)
CN (1) CN106536068B (OSRAM)
WO (1) WO2016008690A1 (OSRAM)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11325828B2 (en) * 2013-02-22 2022-05-10 Vibrant Composites Inc. High-volume millimeter scale manufacturing
US10814352B2 (en) * 2014-05-06 2020-10-27 Koninklijke Philips N.V. Ultrasonic transducer chip assembly, ultrasound probe, ultrasonic imaging system and ultrasound assembly and probe manufacturing methods
EP3169448A1 (en) * 2014-07-17 2017-05-24 Koninklijke Philips N.V. Ultrasound transducer arrangement and assembly, coaxial wire assembly, ultrasound probe and ultrasonic imaging system
US20170055948A1 (en) * 2015-08-27 2017-03-02 Tyco Electronics Corporation Probe assembly and system including a modular device and a cable assembly
WO2017182344A1 (en) * 2016-04-19 2017-10-26 Koninklijke Philips N.V. Ultrasound transducer positioning
US20210338198A1 (en) * 2016-09-29 2021-11-04 Koninklijke Philips N.V. Guide member for electrical cable alignment and attachment and associated intraluminal devices, systems, and methods
WO2018065849A1 (en) * 2016-10-03 2018-04-12 Koninklijke Philips N.V. Radiopaque arrangement of electronic components in intra-cardiac echocardiography (ice) catheter
US10088642B2 (en) 2016-11-09 2018-10-02 International Business Machines Corporation Coaxial wire and optical fiber trace via hybrid structures and methods to manufacture
GB2555835B (en) 2016-11-11 2018-11-28 Novosound Ltd Ultrasound transducer
EP3568879B1 (en) * 2017-01-10 2024-05-29 The Regents of the University of California Stretchable ultrasonic transducer devices
EP3369383A1 (en) * 2017-03-02 2018-09-05 Koninklijke Philips N.V. Ultrasound device
WO2018204487A1 (en) 2017-05-02 2018-11-08 De Rochemont L Pierre High speed semiconductor chip stack
US11413008B2 (en) 2017-06-30 2022-08-16 Koninklijke Philips N.V. Intraluminal ultrasound imaging device comprising a substrate separated into a plurality of spaced-apart segments, intraluminal ultrasound imaging device comprising a trench, and method of manufacturing
WO2019110334A1 (en) * 2017-12-08 2019-06-13 Koninklijke Philips N.V. Rolled flexible substrate with integrated window for intraluminal ultrasound imaging device
WO2019154699A1 (en) * 2018-02-09 2019-08-15 Koninklijke Philips N.V. Flexible support member for intraluminal imaging device and associated devices, systems, and methods
CN112384148B (zh) * 2018-07-10 2025-04-04 皇家飞利浦有限公司 超声成像设备、系统和方法中的电线连接
CN109031259A (zh) * 2018-07-24 2018-12-18 常州波速传感器有限公司 超声波探头
US20220043028A1 (en) * 2018-11-05 2022-02-10 Carnegie Mellon University High-density implantable neural probes
CN111447533B (zh) * 2019-01-16 2021-05-18 昆山康龙电子科技有限公司 利用金属料带成型的内部模块
EP3719841B1 (en) * 2019-04-01 2022-02-16 Detection Technology Oy Radiation sensor element and method
US11679975B2 (en) 2019-07-24 2023-06-20 Vermon Sa Panel transducer scale package and method of manufacturing the same
EP4041463B1 (en) * 2019-10-10 2025-08-27 Sunnybrook Research Institute Systems and methods for cooling ultrasound transducers and ultrasound transducer arrays
US11207140B2 (en) * 2019-12-18 2021-12-28 GE Precision Healthcare LLC Ultrasound-enabled invasive medical device and method of manufacturing an ultrasound-enabled invasive medical device
US12465329B2 (en) * 2020-07-24 2025-11-11 Koninklijke Philips N.V. Curved circuit substrate for intraluminal ultrasound imaging assembly
WO2024085880A1 (en) * 2022-10-21 2024-04-25 Veran Medical Technologies, Inc. Low profile ultrasound catheter and system
CN118369051A (zh) * 2021-10-22 2024-07-19 韦兰医疗技术公司 低轮廓超声导管和系统
WO2025015451A1 (zh) * 2023-07-14 2025-01-23 声索生物科技(上海)有限公司 一种超声探头
CN117257351B (zh) * 2023-11-22 2024-04-23 深圳欢影医疗科技有限公司 一种高性能微型线阵换能器及制备方法
DE102023213147A1 (de) * 2023-12-21 2025-06-26 Robert Bosch Gesellschaft mit beschränkter Haftung Ultraschallsensor und Verfahren zur Herstellung eines Ultraschallsensors

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04179074A (ja) 1990-11-13 1992-06-25 Toshiba Corp 多芯ケーブルの接続方法
DE69516444T2 (de) * 1994-03-11 2001-01-04 Intravascular Research Ltd., London Ultraschall Wandleranordnung und Verfahren zu dessen Herstellung
US6283919B1 (en) 1996-11-26 2001-09-04 Atl Ultrasound Ultrasonic diagnostic imaging with blended tissue harmonic signals
US6458083B1 (en) 1996-11-26 2002-10-01 Koninklijke Philips Electronics N.V. Ultrasonic harmonic imaging with adaptive image formation
US5857974A (en) 1997-01-08 1999-01-12 Endosonics Corporation High resolution intravascular ultrasound transducer assembly having a flexible substrate
US5947905A (en) * 1997-10-15 1999-09-07 Advanced Coronary Intervention, Inc. Ultrasound transducer array probe for intraluminal imaging catheter
US6013032A (en) 1998-03-13 2000-01-11 Hewlett-Packard Company Beamforming methods and apparatus for three-dimensional ultrasound imaging using two-dimensional transducer array
US5997479A (en) 1998-05-28 1999-12-07 Hewlett-Packard Company Phased array acoustic systems with intra-group processors
JP2001178724A (ja) * 1999-12-22 2001-07-03 Olympus Optical Co Ltd 超音波プローブ
US6530885B1 (en) 2000-03-17 2003-03-11 Atl Ultrasound, Inc. Spatially compounded three dimensional ultrasonic images
US6443896B1 (en) 2000-08-17 2002-09-03 Koninklijke Philips Electronics N.V. Method for creating multiplanar ultrasonic images of a three dimensional object
US6468216B1 (en) 2000-08-24 2002-10-22 Kininklijke Philips Electronics N.V. Ultrasonic diagnostic imaging of the coronary arteries
JP2002352877A (ja) * 2001-05-29 2002-12-06 Hitachi Cable Ltd 極細同軸ケーブルの端末接続部及び接続方法
US20030236443A1 (en) 2002-04-19 2003-12-25 Cespedes Eduardo Ignacio Methods and apparatus for the identification and stabilization of vulnerable plaque
GB0405325D0 (en) 2004-03-10 2004-04-21 Koninkl Philips Electronics Nv Trench-gate transistors and their manufacture
JP4571435B2 (ja) * 2004-05-27 2010-10-27 ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー 超音波プローブ
EP1762182B1 (en) * 2004-06-10 2011-08-03 Olympus Corporation Electrostatic capacity type ultrasonic probe device
CN101305448B (zh) * 2005-11-08 2012-05-23 Nxp股份有限公司 电容器装置、宽带系统、电子部件及电容器的制造方法
WO2008007257A2 (en) * 2006-06-20 2008-01-17 Nxp B.V. Integrated circuit and assembly therewith
US8403858B2 (en) * 2006-10-12 2013-03-26 Perceptive Navigation Llc Image guided catheters and methods of use
JP5261929B2 (ja) * 2006-12-15 2013-08-14 株式会社デンソー 半導体装置
JP5497657B2 (ja) * 2007-12-03 2014-05-21 コロ テクノロジーズ インコーポレイテッド 超音波システム用ｃｍｕｔパッケージング
CN101270345A (zh) 2008-02-13 2008-09-24 南开大学 一株门多萨假单胞菌及其应用
CH702048B1 (de) 2008-03-14 2011-04-29 Huber+Suhner Ag Mehrfach-Koaxialkabel-Steckverbindung sowie Verfahren zum Montieren einer solchen Mehrfach-Koaxialkabel-Steckverbindung.
CN201270345Y (zh) * 2008-09-12 2009-07-08 镇江天安电信电器有限公司(中外合资） 同轴电缆连接器绝缘体
CN103221148B (zh) * 2010-11-18 2016-04-13 皇家飞利浦电子股份有限公司 具有嵌在挠性箔片内的超声波换能器的医疗设备
US8864674B2 (en) * 2012-05-11 2014-10-21 Volcano Corporation Circuit architectures and electrical interfaces for rotational intravascular ultrasound (IVUS) devices
EP3169448A1 (en) * 2014-07-17 2017-05-24 Koninklijke Philips N.V. Ultrasound transducer arrangement and assembly, coaxial wire assembly, ultrasound probe and ultrasonic imaging system
US10192281B2 (en) 2016-07-07 2019-01-29 Intel Corporation Graphics command parsing mechanism

Similar Documents

Publication Publication Date Title
JP2017528178A5 (OSRAM)
US9319800B2 (en) Electro acoustic transducer
JP2013243668A5 (OSRAM)
US9475092B2 (en) Electro-acoustic transducer and method of manufacturing the same
EP2762441A3 (en) Internal electrical contact for enclosed MEMS devices
JP2014502201A (ja) 超音波デバイスの形成方法、および関連する装置
US10898925B2 (en) Ultrasound transducer assembly and method for manufacturing an ultrasound transducer assembly
JP2014526149A5 (OSRAM)
US20160234604A1 (en) Molded Interconnect Mircoelectromechanical System (MEMS) Device Package
JP2014504451A5 (OSRAM)
US11231491B2 (en) Robust ultrasound transducer probes having protected integrated circuit interconnects
JP5393681B2 (ja) Ｍｉｄ回路支持体およびこれに接続される結合インタフェースを備えた電気回路装置
JP2013206617A5 (OSRAM)
JPWO2015011969A1 (ja) 超音波振動子及び超音波振動子の製造方法
JP2013141211A5 (OSRAM)
JP2014057136A (ja) 超音波探触子
US20160051226A1 (en) Ultrasonic transducers and methods of manufacturing the same
CN107107109A (zh) 具有直接同轴电缆附接的紧凑超声换能器
KR102321313B1 (ko) 침습 가능한 유연성 전극장치 및 이의 제조방법
JP2015537393A5 (OSRAM)
JP2015524318A5 (OSRAM)
JP2012198194A5 (OSRAM)
JP2018522667A5 (OSRAM)
US9955948B2 (en) Capacitive micromachined ultrasonic transducer probe using wire-bonding
JP2013115205A5 (OSRAM)