CN106536068B - 超声换能器布置和组件、同轴电线组件、超声探头及超声成像系统 - Google Patents

超声换能器布置和组件、同轴电线组件、超声探头及超声成像系统 Download PDF

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Publication number
CN106536068B
CN106536068B CN201580039047.1A CN201580039047A CN106536068B CN 106536068 B CN106536068 B CN 106536068B CN 201580039047 A CN201580039047 A CN 201580039047A CN 106536068 B CN106536068 B CN 106536068B
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China
Prior art keywords
ultrasound
substrate
ultrasound transducer
substrate island
assembly
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Application number
CN201580039047.1A
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English (en)
Chinese (zh)
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CN106536068A (zh
Inventor
V·A·亨内肯
M·C·卢韦斯
J·W·威克普
R·德克尔
M·G·M·诺滕
A·C·J·范伦斯
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Koninklijke Philips NV
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Koninklijke Philips NV
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/12—Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
    • A61B8/445—Details of catheter construction
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/515—Terminal blocks providing connections to wires or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H01R4/023—Soldered or welded connections between cables or wires and terminals

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Surgery (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biomedical Technology (AREA)
  • Physics & Mathematics (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Biophysics (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Gynecology & Obstetrics (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Cable Accessories (AREA)
CN201580039047.1A 2014-07-17 2015-06-25 超声换能器布置和组件、同轴电线组件、超声探头及超声成像系统 Active CN106536068B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP14177454.7 2014-07-17
EP14177454 2014-07-17
PCT/EP2015/064365 WO2016008690A1 (en) 2014-07-17 2015-06-25 Ultrasound transducer arrangement and assembly, coaxial wire assembly, ultrasound probe and ultrasonic imaging system

Publications (2)

Publication Number Publication Date
CN106536068A CN106536068A (zh) 2017-03-22
CN106536068B true CN106536068B (zh) 2020-06-05

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580039047.1A Active CN106536068B (zh) 2014-07-17 2015-06-25 超声换能器布置和组件、同轴电线组件、超声探头及超声成像系统

Country Status (5)

Country Link
US (2) US10828673B2 (OSRAM)
EP (2) EP3169448A1 (OSRAM)
JP (3) JP6670292B2 (OSRAM)
CN (1) CN106536068B (OSRAM)
WO (1) WO2016008690A1 (OSRAM)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11325828B2 (en) * 2013-02-22 2022-05-10 Vibrant Composites Inc. High-volume millimeter scale manufacturing
US10814352B2 (en) * 2014-05-06 2020-10-27 Koninklijke Philips N.V. Ultrasonic transducer chip assembly, ultrasound probe, ultrasonic imaging system and ultrasound assembly and probe manufacturing methods
EP3169448A1 (en) * 2014-07-17 2017-05-24 Koninklijke Philips N.V. Ultrasound transducer arrangement and assembly, coaxial wire assembly, ultrasound probe and ultrasonic imaging system
US20170055948A1 (en) * 2015-08-27 2017-03-02 Tyco Electronics Corporation Probe assembly and system including a modular device and a cable assembly
WO2017182344A1 (en) * 2016-04-19 2017-10-26 Koninklijke Philips N.V. Ultrasound transducer positioning
US20210338198A1 (en) * 2016-09-29 2021-11-04 Koninklijke Philips N.V. Guide member for electrical cable alignment and attachment and associated intraluminal devices, systems, and methods
WO2018065849A1 (en) * 2016-10-03 2018-04-12 Koninklijke Philips N.V. Radiopaque arrangement of electronic components in intra-cardiac echocardiography (ice) catheter
US10088642B2 (en) 2016-11-09 2018-10-02 International Business Machines Corporation Coaxial wire and optical fiber trace via hybrid structures and methods to manufacture
GB2555835B (en) 2016-11-11 2018-11-28 Novosound Ltd Ultrasound transducer
EP3568879B1 (en) * 2017-01-10 2024-05-29 The Regents of the University of California Stretchable ultrasonic transducer devices
EP3369383A1 (en) * 2017-03-02 2018-09-05 Koninklijke Philips N.V. Ultrasound device
WO2018204487A1 (en) 2017-05-02 2018-11-08 De Rochemont L Pierre High speed semiconductor chip stack
US11413008B2 (en) 2017-06-30 2022-08-16 Koninklijke Philips N.V. Intraluminal ultrasound imaging device comprising a substrate separated into a plurality of spaced-apart segments, intraluminal ultrasound imaging device comprising a trench, and method of manufacturing
WO2019110334A1 (en) * 2017-12-08 2019-06-13 Koninklijke Philips N.V. Rolled flexible substrate with integrated window for intraluminal ultrasound imaging device
WO2019154699A1 (en) * 2018-02-09 2019-08-15 Koninklijke Philips N.V. Flexible support member for intraluminal imaging device and associated devices, systems, and methods
CN112384148B (zh) * 2018-07-10 2025-04-04 皇家飞利浦有限公司 超声成像设备、系统和方法中的电线连接
CN109031259A (zh) * 2018-07-24 2018-12-18 常州波速传感器有限公司 超声波探头
US20220043028A1 (en) * 2018-11-05 2022-02-10 Carnegie Mellon University High-density implantable neural probes
CN111447533B (zh) * 2019-01-16 2021-05-18 昆山康龙电子科技有限公司 利用金属料带成型的内部模块
EP3719841B1 (en) * 2019-04-01 2022-02-16 Detection Technology Oy Radiation sensor element and method
US11679975B2 (en) 2019-07-24 2023-06-20 Vermon Sa Panel transducer scale package and method of manufacturing the same
EP4041463B1 (en) * 2019-10-10 2025-08-27 Sunnybrook Research Institute Systems and methods for cooling ultrasound transducers and ultrasound transducer arrays
US11207140B2 (en) * 2019-12-18 2021-12-28 GE Precision Healthcare LLC Ultrasound-enabled invasive medical device and method of manufacturing an ultrasound-enabled invasive medical device
US12465329B2 (en) * 2020-07-24 2025-11-11 Koninklijke Philips N.V. Curved circuit substrate for intraluminal ultrasound imaging assembly
WO2024085880A1 (en) * 2022-10-21 2024-04-25 Veran Medical Technologies, Inc. Low profile ultrasound catheter and system
CN118369051A (zh) * 2021-10-22 2024-07-19 韦兰医疗技术公司 低轮廓超声导管和系统
WO2025015451A1 (zh) * 2023-07-14 2025-01-23 声索生物科技(上海)有限公司 一种超声探头
CN117257351B (zh) * 2023-11-22 2024-04-23 深圳欢影医疗科技有限公司 一种高性能微型线阵换能器及制备方法
DE102023213147A1 (de) * 2023-12-21 2025-06-26 Robert Bosch Gesellschaft mit beschränkter Haftung Ultraschallsensor und Verfahren zur Herstellung eines Ultraschallsensors

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0853919A2 (en) * 1997-01-08 1998-07-22 Endosonics Corporation A high resolution intravascular ultrasound transducer assembly having a flexible substrate and method for manufacture thereof
CN1930689A (zh) * 2004-03-10 2007-03-14 皇家飞利浦电子股份有限公司 沟槽栅晶体管及其制造
CN201270345Y (zh) * 2008-09-12 2009-07-08 镇江天安电信电器有限公司(中外合资） 同轴电缆连接器绝缘体
CN101868185A (zh) * 2007-12-03 2010-10-20 科隆科技公司 用于超声系统的cmut封装
CN101960673A (zh) * 2008-03-14 2011-01-26 胡贝尔和茹纳股份公司 多芯同轴电缆插头连接装置及其安装方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04179074A (ja) 1990-11-13 1992-06-25 Toshiba Corp 多芯ケーブルの接続方法
DE69516444T2 (de) * 1994-03-11 2001-01-04 Intravascular Research Ltd., London Ultraschall Wandleranordnung und Verfahren zu dessen Herstellung
US6283919B1 (en) 1996-11-26 2001-09-04 Atl Ultrasound Ultrasonic diagnostic imaging with blended tissue harmonic signals
US6458083B1 (en) 1996-11-26 2002-10-01 Koninklijke Philips Electronics N.V. Ultrasonic harmonic imaging with adaptive image formation
US5947905A (en) * 1997-10-15 1999-09-07 Advanced Coronary Intervention, Inc. Ultrasound transducer array probe for intraluminal imaging catheter
US6013032A (en) 1998-03-13 2000-01-11 Hewlett-Packard Company Beamforming methods and apparatus for three-dimensional ultrasound imaging using two-dimensional transducer array
US5997479A (en) 1998-05-28 1999-12-07 Hewlett-Packard Company Phased array acoustic systems with intra-group processors
JP2001178724A (ja) * 1999-12-22 2001-07-03 Olympus Optical Co Ltd 超音波プローブ
US6530885B1 (en) 2000-03-17 2003-03-11 Atl Ultrasound, Inc. Spatially compounded three dimensional ultrasonic images
US6443896B1 (en) 2000-08-17 2002-09-03 Koninklijke Philips Electronics N.V. Method for creating multiplanar ultrasonic images of a three dimensional object
US6468216B1 (en) 2000-08-24 2002-10-22 Kininklijke Philips Electronics N.V. Ultrasonic diagnostic imaging of the coronary arteries
JP2002352877A (ja) * 2001-05-29 2002-12-06 Hitachi Cable Ltd 極細同軸ケーブルの端末接続部及び接続方法
US20030236443A1 (en) 2002-04-19 2003-12-25 Cespedes Eduardo Ignacio Methods and apparatus for the identification and stabilization of vulnerable plaque
JP4571435B2 (ja) * 2004-05-27 2010-10-27 ジーイー・メディカル・システムズ・グローバル・テクノロジー・カンパニー・エルエルシー 超音波プローブ
EP1762182B1 (en) * 2004-06-10 2011-08-03 Olympus Corporation Electrostatic capacity type ultrasonic probe device
CN101305448B (zh) * 2005-11-08 2012-05-23 Nxp股份有限公司 电容器装置、宽带系统、电子部件及电容器的制造方法
WO2008007257A2 (en) * 2006-06-20 2008-01-17 Nxp B.V. Integrated circuit and assembly therewith
US8403858B2 (en) * 2006-10-12 2013-03-26 Perceptive Navigation Llc Image guided catheters and methods of use
JP5261929B2 (ja) * 2006-12-15 2013-08-14 株式会社デンソー 半導体装置
CN101270345A (zh) 2008-02-13 2008-09-24 南开大学 一株门多萨假单胞菌及其应用
CN103221148B (zh) * 2010-11-18 2016-04-13 皇家飞利浦电子股份有限公司 具有嵌在挠性箔片内的超声波换能器的医疗设备
US8864674B2 (en) * 2012-05-11 2014-10-21 Volcano Corporation Circuit architectures and electrical interfaces for rotational intravascular ultrasound (IVUS) devices
EP3169448A1 (en) * 2014-07-17 2017-05-24 Koninklijke Philips N.V. Ultrasound transducer arrangement and assembly, coaxial wire assembly, ultrasound probe and ultrasonic imaging system
US10192281B2 (en) 2016-07-07 2019-01-29 Intel Corporation Graphics command parsing mechanism

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0853919A2 (en) * 1997-01-08 1998-07-22 Endosonics Corporation A high resolution intravascular ultrasound transducer assembly having a flexible substrate and method for manufacture thereof
CN1930689A (zh) * 2004-03-10 2007-03-14 皇家飞利浦电子股份有限公司 沟槽栅晶体管及其制造
CN101868185A (zh) * 2007-12-03 2010-10-20 科隆科技公司 用于超声系统的cmut封装
CN101960673A (zh) * 2008-03-14 2011-01-26 胡贝尔和茹纳股份公司 多芯同轴电缆插头连接装置及其安装方法
CN201270345Y (zh) * 2008-09-12 2009-07-08 镇江天安电信电器有限公司(中外合资） 同轴电缆连接器绝缘体

Also Published As

Publication number Publication date
US20170209898A1 (en) 2017-07-27
EP3169448A1 (en) 2017-05-24
JP6670292B2 (ja) 2020-03-18
US10828673B2 (en) 2020-11-10
US20210031234A1 (en) 2021-02-04
CN106536068A (zh) 2017-03-22
WO2016008690A1 (en) 2016-01-21
JP2017528178A (ja) 2017-09-28
JP2021129996A (ja) 2021-09-09
JP2020032199A (ja) 2020-03-05
JP6878546B2 (ja) 2021-05-26
EP3795262A1 (en) 2021-03-24

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