JP2017528006A5 - - Google Patents

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Publication number
JP2017528006A5
JP2017528006A5 JP2017527190A JP2017527190A JP2017528006A5 JP 2017528006 A5 JP2017528006 A5 JP 2017528006A5 JP 2017527190 A JP2017527190 A JP 2017527190A JP 2017527190 A JP2017527190 A JP 2017527190A JP 2017528006 A5 JP2017528006 A5 JP 2017528006A5
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JP
Japan
Prior art keywords
discrete component
handle
ultra
substrate
release layer
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JP2017527190A
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English (en)
Japanese (ja)
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JP2017528006A (ja
JP6480583B2 (ja
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Priority claimed from PCT/US2015/043550 external-priority patent/WO2016022528A1/en
Publication of JP2017528006A publication Critical patent/JP2017528006A/ja
Publication of JP2017528006A5 publication Critical patent/JP2017528006A5/ja
Application granted granted Critical
Publication of JP6480583B2 publication Critical patent/JP6480583B2/ja
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JP2017527190A 2014-08-05 2015-08-04 組み立てが容易な超小型または超薄型離散コンポーネントの構成 Active JP6480583B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462033595P 2014-08-05 2014-08-05
US62/033,595 2014-08-05
US201462060928P 2014-10-07 2014-10-07
US62/060,928 2014-10-07
PCT/US2015/043550 WO2016022528A1 (en) 2014-08-05 2015-08-04 Setting up ultra-small or ultra-thin discrete components for easy assembly

Publications (3)

Publication Number Publication Date
JP2017528006A JP2017528006A (ja) 2017-09-21
JP2017528006A5 true JP2017528006A5 (cg-RX-API-DMAC7.html) 2018-09-13
JP6480583B2 JP6480583B2 (ja) 2019-03-13

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ID=55264414

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JP2017527190A Active JP6480583B2 (ja) 2014-08-05 2015-08-04 組み立てが容易な超小型または超薄型離散コンポーネントの構成

Country Status (6)

Country Link
US (4) US10529614B2 (cg-RX-API-DMAC7.html)
EP (1) EP3177463A4 (cg-RX-API-DMAC7.html)
JP (1) JP6480583B2 (cg-RX-API-DMAC7.html)
KR (3) KR102240810B1 (cg-RX-API-DMAC7.html)
CN (2) CN113715458A (cg-RX-API-DMAC7.html)
WO (1) WO2016022528A1 (cg-RX-API-DMAC7.html)

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JP6480583B2 (ja) 2014-08-05 2019-03-13 ユニカルタ・インコーポレイテッド 組み立てが容易な超小型または超薄型離散コンポーネントの構成
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US12094811B2 (en) 2016-04-29 2024-09-17 Kulicke And Soffa Industries, Inc. Connecting electronic components to substrates
CN118538834A (zh) 2017-06-12 2024-08-23 库力索法荷兰有限公司 分立组件向基板上的并行组装
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WO2020168174A1 (en) 2019-02-15 2020-08-20 Uniqarta, Inc Dynamic release tapes for assembly of discrete components
KR102858957B1 (ko) 2019-06-11 2025-09-12 쿨리케 & 소파 네덜란드 비.브이. 광학 시스템 특성의 조정에 의해 개별 콤포넌트의 어셈블레에서의 위치 오차 보상
WO2021126580A1 (en) * 2019-12-17 2021-06-24 Uniqarta, Inc. Adhesive tapes for receiving discrete components
EP3933902B1 (en) 2020-06-29 2023-05-03 IMEC vzw A method for positioning components on a substrate
TWI859583B (zh) * 2021-11-30 2024-10-21 群創光電股份有限公司 電子裝置的製造方法
GB2633617A (en) * 2023-09-15 2025-03-19 Pragmatic Semiconductor Ltd Methods and apparatus for facilitating manufacture of an integrated circuit

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