JP2017526533A5 - - Google Patents

Download PDF

Info

Publication number
JP2017526533A5
JP2017526533A5 JP2016575502A JP2016575502A JP2017526533A5 JP 2017526533 A5 JP2017526533 A5 JP 2017526533A5 JP 2016575502 A JP2016575502 A JP 2016575502A JP 2016575502 A JP2016575502 A JP 2016575502A JP 2017526533 A5 JP2017526533 A5 JP 2017526533A5
Authority
JP
Japan
Prior art keywords
imaging plane
pattern
spatial light
light modulator
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2016575502A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017526533A (ja
Filing date
Publication date
Priority claimed from GB1415083.3A external-priority patent/GB2529808B/en
Application filed filed Critical
Publication of JP2017526533A publication Critical patent/JP2017526533A/ja
Publication of JP2017526533A5 publication Critical patent/JP2017526533A5/ja
Ceased legal-status Critical Current

Links

JP2016575502A 2014-08-26 2015-08-19 基板上でレーザーアブレーションを実行する装置及び方法 Ceased JP2017526533A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1415083.3 2014-08-26
GB1415083.3A GB2529808B (en) 2014-08-26 2014-08-26 Apparatus and methods for performing laser ablation on a substrate
PCT/GB2015/052413 WO2016030665A1 (en) 2014-08-26 2015-08-19 Apparatus and methods for performing laser ablation on a substrate

Publications (2)

Publication Number Publication Date
JP2017526533A JP2017526533A (ja) 2017-09-14
JP2017526533A5 true JP2017526533A5 (enExample) 2019-12-19

Family

ID=51727048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016575502A Ceased JP2017526533A (ja) 2014-08-26 2015-08-19 基板上でレーザーアブレーションを実行する装置及び方法

Country Status (8)

Country Link
US (1) US20170197279A1 (enExample)
EP (1) EP3186028A1 (enExample)
JP (1) JP2017526533A (enExample)
KR (1) KR20170045151A (enExample)
CN (1) CN106664798B (enExample)
GB (1) GB2529808B (enExample)
TW (1) TWI696052B (enExample)
WO (1) WO2016030665A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017007689B3 (de) * 2017-08-16 2018-12-20 Empac GmbH Flexibler elektrostatisch ableitfähiger Schüttgutbehälter und Verfahren zur Herstellung einer Mehrschichtfolie für einen derartigen Schüttgutbehälter
US10744539B2 (en) * 2017-10-27 2020-08-18 The Boeing Company Optimized-coverage selective laser ablation systems and methods
CN108493766A (zh) * 2018-02-06 2018-09-04 中国计量科学研究院 一种新型弧形vcsel发光阵列、制作方法、控制系统和控制方法
CN108471047A (zh) * 2018-02-06 2018-08-31 中国计量科学研究院 一种新型vcsel发光阵列、其制作方法、控制系统及控制方法
DE102018106579A1 (de) * 2018-03-20 2019-09-26 Pulsar Photonics Gmbh Verfahren zur Bearbeitung eines Werkstücks mittels Bestrahlung mit Laserstrahlung sowie Vorrichtung hierzu
DE102018127633B4 (de) * 2018-11-06 2024-10-02 Bundesdruckerei Gmbh Verfahren zum Erzeugen einer Durchkontaktierung in einer beidseitig bedruckten Trägerfolie unter Verwendung einer diffraktiven Optik
KR102306973B1 (ko) * 2019-07-30 2021-09-30 (주)칼리온 패턴 마스크를 이용한 3차원 스캐닝의 프로젝션 시스템 및 그 방법
DE102020201207A1 (de) * 2020-01-31 2021-08-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Anordnung zur Materialbearbeitung mit einem Laserstrahl, insbesondere zum Laserstrahl-Bohren
JP7632880B2 (ja) * 2021-06-24 2025-02-19 株式会社Ti-connectoMe レーザ加工方法及びレーザ加工装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW207588B (enExample) * 1990-09-19 1993-06-11 Hitachi Seisakusyo Kk
CN1124917C (zh) * 1997-12-26 2003-10-22 三菱电机株式会社 激光加工装置
JP2003115449A (ja) * 2001-02-15 2003-04-18 Nsk Ltd 露光装置
US7399661B2 (en) * 2002-05-01 2008-07-15 Amkor Technology, Inc. Method for making an integrated circuit substrate having embedded back-side access conductors and vias
US7230677B2 (en) * 2004-12-22 2007-06-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method utilizing hexagonal image grids
US7528342B2 (en) * 2005-02-03 2009-05-05 Laserfacturing, Inc. Method and apparatus for via drilling and selective material removal using an ultrafast pulse laser
US7436579B1 (en) * 2006-09-08 2008-10-14 Arasor Corporation Mobile charge induced periodic poling and device
US20080218817A1 (en) * 2007-03-07 2008-09-11 Grygier Robert K System and method for making seamless holograms, optically variable devices and embossing substrates
US8324529B2 (en) * 2007-11-14 2012-12-04 Hamamatsu Photonics K.K. Laser machining device with a converged laser beam and laser machining method
JP5180021B2 (ja) * 2008-10-01 2013-04-10 浜松ホトニクス株式会社 レーザ加工装置およびレーザ加工方法
GB0900036D0 (en) * 2009-01-03 2009-02-11 M Solv Ltd Method and apparatus for forming grooves with complex shape in the surface of apolymer
US8743165B2 (en) * 2010-03-05 2014-06-03 Micronic Laser Systems Ab Methods and device for laser processing
NL2008426A (en) * 2011-04-08 2012-10-09 Asml Netherlands Bv Lithographic apparatus, programmable patterning device and lithographic method.
KR20120136206A (ko) * 2011-06-08 2012-12-18 삼성전기주식회사 마스크리스 가공 장치
GB2513498A (en) * 2012-01-20 2014-10-29 Light Blue Optics Ltd Touch sensitive image display devices
GB2507542B (en) * 2012-11-02 2016-01-13 M Solv Ltd Apparatus and Method for forming fine scale structures in the surface of a substrate to different depths
JP5951451B2 (ja) * 2012-11-12 2016-07-13 浜松ホトニクス株式会社 光照射装置、顕微鏡装置及びレーザ加工装置
US8980726B2 (en) * 2013-01-25 2015-03-17 Applied Materials, Inc. Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafers
KR102278351B1 (ko) * 2013-01-28 2021-07-19 에이에스엠엘 네델란즈 비.브이. 리소그래피 장치를 위한 방사선 소스, 거울 및 투영 시스템

Similar Documents

Publication Publication Date Title
JP2017526533A5 (enExample)
JP7114728B2 (ja) 物体を多次元捕捉するためのマルチパルスｌｉｄａｒシステム
JP7371443B2 (ja) 三次元計測装置
KR102427381B1 (ko) 부품의 실장 상태를 검사하기 위한 방법, 인쇄 회로 기판 검사 장치 및 컴퓨터 판독 가능한 기록매체
JP2013049269A5 (enExample)
CN109581360B (zh) 用于光检测和测距的装置和方法
JP2012148302A5 (enExample)
US20130321823A1 (en) Form measuring apparatus, structure manufacturing system, scanning apparatus, method for measuring form, method for manufacturing structure, and non-transitory computer readable medium storing program for measuring form
JPWO2018056199A1 (ja) 距離測定システム、距離測定方法およびプログラム
JP2013048235A5 (enExample)
JP2016008875A (ja) 距離測定装置
JP2007528023A5 (enExample)
JP2016200808A5 (enExample)
JP2013047797A5 (enExample)
KR101298706B1 (ko) 레이저 마킹 시스템의 마킹 보정 방법
WO2018158983A1 (ja) 三次元計測装置
TWI688830B (zh) 曝光裝置及曝光方法
JP2020009749A (ja) 光源、投影装置、計測装置、ロボット、電子機器、移動体、および造形装置
JP5723419B2 (ja) 画像読取装置及びその画像読取方法
JP2013201787A5 (enExample)
JP2003057021A (ja) 三次元形状入力装置及び投影装置
JP6321386B2 (ja) 露光装置および露光方法
JP2021018081A (ja) 撮像装置、計測装置、及び、計測方法
JP2010182933A (ja) 描画装置および描画方法
TW201629637A (zh) 用於從探照燈提供均勻亮度至影像區域的方法