JP2017517837A5

JP2017517837A5 -

Info

Publication number: JP2017517837A5
Application number: JP2016560690A
Authority: JP
Filing date: 2015-03-30
Publication date: 2019-10-03
Anticipated expiration: 2035-03-30

Description

しかしながら、インターフェース２−３及び３−４については、ガスケット層で挟む組合せにおいて固定する新しい方法が、本発明によって導入される。ガスケット層の一つ又は二つ以上は、シーリング領域中に一つ又は多数の穴、くぼみ又は隆起部を設けて製造される。これは、ガスケット層を切断して成形される時に行うことができる。圧縮下でガスケット層が一緒にサンドイッチされる際、穴又はくぼみを有するガスケット層に隣接するガスケット層は、その際にその穴又はくぼみ内へ突出し、それにより、ガスケット層を互いに固定するのに必要な固定がもたらされる。同様に、隆起部を有するガスケット層に隣接するガスケット層は、圧縮下でガスケット層が一緒にサンドイッチされる時にその隆起部に対向する位置でくぼみによる接合を達成し、これもまた、ガスケット層を互いに固定するのに必要な固定をもたらす。この解法は、例えば、サンドイッチ型のガスケットのための、取り囲む二つのガスケット層よりも合成な、中央のガスケット層に適用できる。このように、一つのガスケット層だけに穴、くぼみ又は隆起部を設ける必要があり、それよりもさらに可撓性である該二つの取り囲むガスケット層は、その際、その穴又はくぼみ内へ突出するか、又は該中央のガスケット層の隆起部が位置する箇所でくぼみにより接合される。それにより、全てのインターフェースが固定され、そして、ＳＯＣスタックの運転の間及び熱サイクルの間に平面上で移動できなくなる。 However, for the interfaces 2-3 and 3-4, a new way of fixing in the combination sandwiched between gasket layers is introduced by the present invention. One or more of the gasket layers are manufactured with one or more holes, indentations or ridges in the sealing area. This can be done when the gasket layer is cut and molded. When the gasket layers are sandwiched together under compression, the gasket layer adjacent to the gasket layer having a hole or indentation will then protrude into the hole or indentation , thereby securing the gasket layers together Fixing is brought about. Similarly, a gasket layer adjacent to a gasket layer having a ridge achieves a dip joint at a location opposite the ridge when the gasket layers are sandwiched together under compression, which also Provides the necessary fixation to secure each other. This solution can be applied, for example, to a central gasket layer that is more synthetic than the surrounding two gasket layers for a sandwich type gasket. Thus, only one gasket layer needs to be provided with holes, depressions or ridges, and the two surrounding gasket layers, which are more flexible than that, will then protrude into the holes or depressions . Or joined by a recess where the raised portion of the central gasket layer is located. Thereby, all interfaces are fixed and cannot move on the plane during operation of the SOC stack and during thermal cycling.

本発明の実施形態において、少なくとも第一及び第三の層の可撓性は、ガスケット層のそれぞれの間を固定し、そしてさらには、ガスケットと隣接する実装用インターフェースとの間を固定するのに利用される。くぼみ、穴又は隆起部は、それら三つのガスケット層のうちの少なくとも一つ中（すなわち第二の層中）に形成されて、該層を互いに固定させる。 In an embodiment of the invention, the flexibility of at least the first and third layers is to secure between each of the gasket layers, and further to secure between the gasket and the adjacent mounting interface. Used. A depression , hole or ridge is formed in at least one of the three gasket layers (ie, in the second layer) to secure the layers together.

本発明のさらなる実施形態において、ガスケットを、該ガスケットと接触して隣接する実装用インターフェースに対して固定して、その実装用インターフェースの平面において移動するのを防止するのに同じ原理が利用される。したがって、穴、隆起部又はくぼみは、ガスケットと接触する実装用インターフェース中に形成される。圧縮下において、これは、ガスケットを実装用インターフェースに対して固定する。 In a further embodiment of the invention, the same principle is utilized to secure the gasket against the adjacent mounting interface in contact with the gasket to prevent movement in the plane of the mounting interface. . Thus, a hole, ridge or indentation is formed in the mounting interface that contacts the gasket. Under compression, this secures the gasket to the mounting interface.

この組み立て工程のさらなる実施形態では、三つのガスケット層を組み立てる前に、それら層のうちの少なくとも一つにくぼみ又は穴が形成される。これにより、ガスケットが圧縮されると、スタックシステムの運転及び熱サイクルの間、相対するガスケット層が互いに固定される。該穴又はくぼみは、ガスケットの第二かつそれほど可撓性でない層に設けることができ、これは、最も簡単な製造である。 In a further embodiment of this assembly process, prior to assembling the three gasket layers, a recess or hole is formed in at least one of the layers. Thus, when the gasket is compressed, the opposing gasket layers are secured together during stack system operation and thermal cycling. The holes or indentations can be provided in the second and less flexible layer of the gasket, which is the simplest manufacture.

該組み立て工程の実施形態において、ガスケットを圧縮する実装用インターフェースのうちの少なくとも一つに、穴、くぼみ又は隆起部が設けられて、ガスケットが接触する実装用インターフェースに対してそれが固定される。該ガスケット層はマイカから製造でき、そのガスケットの第二の層は、第一及び第三の層ほど可撓性ではいが、電気絶縁性である。 In the assembly process embodiment, at least one of the mounting interfaces that compress the gasket is provided with a hole, indentation, or ridge that is secured to the mounting interface with which the gasket contacts. The gasket layer can be manufactured from mica, and the second layer of the gasket is as flexible as the first and third layers, but is electrically insulating.

７．前記三つの層のうちの少なくとも一つに、該層のそれぞれの互いに対する固定を提供するために、くぼみ、穴又は隆起が形成されている、上記の１〜６のいずれか一つに記載の固体酸化物形セルスタックシステム。 7). 7. Any one of 1-6 above, wherein at least one of the three layers is formed with indentations , holes or ridges to provide a fixation of each of the layers to each other. Solid oxide cell stack system.

９．前記ガスケットに接触する前記実装インターフェースのうちの少なくとも一つに、該接触する実装インターフェースに対するガスケットの固定を提供するために、くぼみ、穴又は隆起部が形成されている、上記の１〜８のいずれか一つに記載の固体酸化物形セルスタックシステム。 9. Any of the above 1-8, wherein at least one of the mounting interfaces contacting the gasket is provided with a recess , hole or ridge to provide a fixation of the gasket to the contacting mounting interface. The solid oxide cell stack system according to claim 1.

１４．前記三つの層のうちの少なくとも一つに、該層のそれぞれの互いに対する固定を提供するためにくぼみ又は穴が形成される、上記の１２又は１３に記載の方法。 14 14. A method according to 12 or 13 above, wherein at least one of the three layers is formed with a recess or hole to provide a fixation of each of the layers to each other.

１６．前記ガスケットに接触する前記実装インターフェースのうちの少なくとも一つに、該接触する実装インターフェースに対するガスケットの固定を提供するために、くぼみ、穴又は隆起部が形成される、上記の１２〜１５のいずれか一つに記載の方法。 16. Any of 12-15 above, wherein at least one of the mounting interfaces contacting the gasket is provided with a recess , hole or ridge to provide a fixation of the gasket to the contacting mounting interface. The method according to one.

Claims

A solid oxide cell stack system including a plurality of stacked cell units and a mounting interface, the mounting interface including at least one gasket, the gasket including vibration, surface defects on the mounting interface, and heat First and third flexible layers that are flexible enough to offset movement due to the second electrical insulating layer located between the first and third layers; A solid oxide cell stack system comprising a sandwich structure of at least three layers.

The solid oxide cell stack system of claim 1, wherein the layer is made from mica and the first and third layers are more flexible than the second layer.

The solid oxide cell stack system according to claim 1 or 2, wherein the tensile strength of the second layer is 60 to 180 N / mm 2, preferably 90 to 150 N / mm 2.

4. The solid oxide cell stack system according to claim 1, wherein the compressive strength of the second layer at 200 ° C. is 180 to 300 N / mm 2, preferably 220 to 260 N / mm 2.

5. The solid oxide cell stack system according to claim 1, wherein the bending strength of the second layer is 150 to 250 N / mm 2, preferably 140 to 200 N / mm 2.

The solid oxide cell according to any one of claims 1 to 5, wherein the thickness of each of the first, second and third layers is 0.2 mm to 15 mm, preferably 0.4 mm to 5 mm. Stack system.

7. At least one of the three layers is formed with indentations , holes or ridges to provide a fixation of each of the layers to each other. Solid oxide cell stack system.

The solid oxide cell stack system of claim 7, wherein holes are formed in the second layer to provide a fixation of each of the layers to each other.

9. A recess , hole or ridge is formed in at least one of the mounting interfaces contacting the gasket to provide gasket fixation to the contacting mounting interface. The solid oxide cell stack system according to claim 1.

The solid oxide cell stack system according to claim 1, wherein an adhesive is applied between the three layers.

The solid oxide cell stack system according to claim 1, wherein the gasket is mounted between the cell stack and a process gas manifold.

A solid oxide cell stack system comprising a plurality of stacked cell units and a plurality of mounting interfaces, and comprising at least one sandwich gasket with at least three layers to be disposed between the two mounting interfaces A method of assembling the following steps:
The first and third gasket layers of the gasket are made of a flexible gasket material that is vibrated to physically match the two mounting interfaces; A process that is sufficiently flexible to offset movement due to surface defects and heat of the mounting interface;
· In order to physically aligned relative to the two mounting interface and the first and second gasket layer, step of producing a second gasket layer of electrically insulating material;
Assembling the three layers with the second gasket layer sandwiched between the first and third gasket layers;
Placing the assembled gasket on one of the two mounting interfaces;
Implementing the other of the two mounting interfaces; and applying compression to the gasket between the two mounting interfaces;
Including the above method.

13. The method of claim 12, wherein an adhesive is applied to at least two surfaces of the gasket layers prior to assembling the three gasket layers.

14. A method according to claim 12 or 13, wherein at least one of the three layers is formed with a recess or hole to provide a fixation of each of the layers to each other.

15. A method according to any one of claims 12 to 14, wherein holes are formed in the second layer to provide fixation of each of the layers to each other.

16. A recess , a hole or a ridge is formed in at least one of the mounting interfaces contacting the gasket to provide a gasket fixation to the contacting mounting interface. The method according to one.

17. A method according to any one of claims 12 to 16, wherein the gasket layer is manufactured from mica and the first and third gasket layers are more flexible than the second layer.