JP2017513588A - 放射線信号を検出するためのセンサ装置及び画像化システム - Google Patents
放射線信号を検出するためのセンサ装置及び画像化システム Download PDFInfo
- Publication number
- JP2017513588A JP2017513588A JP2016562208A JP2016562208A JP2017513588A JP 2017513588 A JP2017513588 A JP 2017513588A JP 2016562208 A JP2016562208 A JP 2016562208A JP 2016562208 A JP2016562208 A JP 2016562208A JP 2017513588 A JP2017513588 A JP 2017513588A
- Authority
- JP
- Japan
- Prior art keywords
- sensor device
- interposer
- detector
- integrated circuit
- sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 60
- 238000003384 imaging method Methods 0.000 title claims description 26
- 238000001125 extrusion Methods 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 29
- 239000004952 Polyamide Substances 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 238000002591 computed tomography Methods 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 230000003595 spectral effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000013170 computed tomography imaging Methods 0.000 description 4
- 230000001419 dependent effect Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000002600 positron emission tomography Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000002603 single-photon emission computed tomography Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- CEKJAYFBQARQNG-UHFFFAOYSA-N cadmium zinc Chemical compound [Zn].[Cd] CEKJAYFBQARQNG-UHFFFAOYSA-N 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000002059 diagnostic imaging Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002594 fluoroscopy Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000009607 mammography Methods 0.000 description 1
- 238000003701 mechanical milling Methods 0.000 description 1
- QKEOZZYXWAIQFO-UHFFFAOYSA-M mercury(1+);iodide Chemical compound [Hg]I QKEOZZYXWAIQFO-UHFFFAOYSA-M 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
Images
Classifications
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/42—Arrangements for detecting radiation specially adapted for radiation diagnosis
- A61B6/4208—Arrangements for detecting radiation specially adapted for radiation diagnosis characterised by using a particular type of detector
- A61B6/4241—Arrangements for detecting radiation specially adapted for radiation diagnosis characterised by using a particular type of detector using energy resolving detectors, e.g. photon counting
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/02—Arrangements for diagnosis sequentially in different planes; Stereoscopic radiation diagnosis
- A61B6/03—Computed tomography [CT]
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/42—Arrangements for detecting radiation specially adapted for radiation diagnosis
- A61B6/4208—Arrangements for detecting radiation specially adapted for radiation diagnosis characterised by using a particular type of detector
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/42—Arrangements for detecting radiation specially adapted for radiation diagnosis
- A61B6/4208—Arrangements for detecting radiation specially adapted for radiation diagnosis characterised by using a particular type of detector
- A61B6/4233—Arrangements for detecting radiation specially adapted for radiation diagnosis characterised by using a particular type of detector using matrix detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14658—X-ray, gamma-ray or corpuscular radiation imagers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/24—Measuring radiation intensity with semiconductor detectors
- G01T1/243—Modular detectors, e.g. arrays formed from self contained units
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Medical Informatics (AREA)
- Molecular Biology (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Optics & Photonics (AREA)
- Veterinary Medicine (AREA)
- Biophysics (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Public Health (AREA)
- Pathology (AREA)
- Radiology & Medical Imaging (AREA)
- Biomedical Technology (AREA)
- Heart & Thoracic Surgery (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Toxicology (AREA)
- Mathematical Physics (AREA)
- Measurement Of Radiation (AREA)
- Apparatus For Radiation Diagnosis (AREA)
Abstract
Description
図1は、被験体の放射線信号を検出するための、複数の検出器11を含むセンサ装置10の概略図を示す。各検出器11は、レシーバ面12、センサ素子14、インターポーザ要素16、及び集積回路素子18を含む。好ましくは、各検出器11は、基板要素20をさらに含む。複数の検出器11は、センサアレイ22を形成するように配置されており、個々の検出器11は、個々のレシーバ面12がセンサアレイ22の同じ側に配置されるように整列される。センサアレイ22は、図1に示される実施形態では直線状に配置された8つの検出器11を含む。別の実施形態では、検出器11は、湾曲に沿って少なくとも部分的に配置される。一般に、検出器10の数は、8つよりも大きくても、又は小さくてもよい。
Claims (15)
- 複数の検出器を有するセンサアレイを含む、X線放射線信号を検出するためのセンサ装置であって、各検出器は、
被験体を透過する又は該被験体から放射される複数の放射線信号を受けるためのレシーバ面と、
前記受けた放射線信号を複数の対応する電気信号に変換するためのセンサ素子と、
第1面と第2面との間で横方向に延びるインターポーザ要素であって、該インターポーザ要素は、前記センサ素子に面する前面と、該前面に対して平行な背面とを含み、前記背面に設けられた背面コンタクト構成に前記電気信号を導くために、前面コンタクト構成が、前記前面に設けられる、インターポーザ要素と、
前記背面に面しており且つ前記背面コンタクト構成に電気的に接続される集積回路素子であって、該集積回路素子は、前記第2面で背面の外側で横方向に延びる回路部分を含む、集積回路素子と、を備えており、
前記前面は、押出面を含む押出し部により前記第1面で背面の外側で横方向に延びており、前記センサアレイの第1の検出器の前記回路部分は、第1の検出器に隣接する第2の検出器の前記押出面と縦方向に重なり、且つ前記押出面から縦方向に離間される、
センサ装置。 - 前記押出面は、前記前面と前記背面との間に配置される、請求項1に記載のセンサ装置。
- 前記押出面は、前記前面に対して平行な表面部分を含む、請求項1に記載のセンサ装置。
- 前記インターポーザ要素の前記第1面は、前記前面と前記押出面とを接続する上側面、及び/又は前記背面と前記押出面とを接続する下側面を含み、前記上側面及び前記下側面の少なくとも一方は、前記前面に対して垂直である、請求項1に記載のセンサ装置。
- 前記インターポーザ要素の前記第2面は、前記前面に対して垂直である、請求項1に記載のセンサ装置。
- 前記検出器は、前記集積回路素子、特に前記回路部分に電気的に接続された基板要素をさらに含む、請求項1に記載のセンサ装置。
- 前記基板要素は、前記回路部分の外側で横方向に延びるように構成される、請求項6に記載のセンサ装置。
- 前記基板要素は、前記回路部分に設けられたコンタクトパッドにワイヤボンドにより電気的に接続される、請求項6に記載のセンサ装置。
- 前記検出器は、フレキシブル基板をさらに含む、請求項1に記載のセンサ装置。
- 第1の検出器の前記集積回路素子は、第2の検出器の前記集積回路素子から横方向に離間される、請求項1に記載のセンサ装置。
- 前記前面コンタクト構成は、複数の前面コンタクトパッドを含み、前記背面コンタクト構成は、複数の背面コンタクトパッドを含み、各前面コンタクトパッドは、前記電気信号の1つを前記背面コンタクトパッドの対応する1つに導くように構成される、請求項1に記載のセンサ装置。
- 各前面コンタクトパッドには、第1の横方向寸法が設けられ、各背面コンタクトパッドには、第2の横方向寸法が設けられ、第1の横方向寸法は、第2の横方向寸法よりも大きい、請求項11に記載のセンサ装置。
- 前記前面コンタクトパッドの数は、前記背面コンタクトパッドの数と同じである、請求項11に記載のセンサ装置。
- 前記インターポーザ要素は、プレス層、特にプレスされたポリアミド層を用いて形成される、請求項1に記載のセンサ装置。
- 放射線信号を検出するための画像化システムであって、当該画像化システムは、
複数の放射線信号を生成するための放射線源と、
前記生成された放射線信号を被験体に導くための放射線方向付け手段と、
有向した前記放射線信号を検出するための、請求項1に記載のセンサ装置と、を有する、
画像化システム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14191210 | 2014-10-31 | ||
EP14191210.5 | 2014-10-31 | ||
PCT/EP2015/075363 WO2016066850A1 (en) | 2014-10-31 | 2015-11-02 | Sensor device and imaging system for detecting radiation signals |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6126758B1 JP6126758B1 (ja) | 2017-05-10 |
JP2017513588A true JP2017513588A (ja) | 2017-06-01 |
Family
ID=51846507
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016562208A Active JP6126758B1 (ja) | 2014-10-31 | 2015-11-02 | 放射線信号を検出するためのセンサ装置及び画像化システム |
Country Status (6)
Country | Link |
---|---|
US (1) | US9955930B2 (ja) |
EP (1) | EP3143430B1 (ja) |
JP (1) | JP6126758B1 (ja) |
CN (1) | CN106662661B (ja) |
RU (1) | RU2647206C1 (ja) |
WO (1) | WO2016066850A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109478556B (zh) | 2016-07-14 | 2023-07-14 | 皇家飞利浦有限公司 | 检测器模块、检测器、成像设备和制造检测器模块的方法 |
WO2018053774A1 (en) * | 2016-09-23 | 2018-03-29 | Shenzhen Xpectvision Technology Co.,Ltd. | Packaging of semiconductor x-ray detectors |
US10674992B2 (en) * | 2017-09-29 | 2020-06-09 | General Electric Company | Selectable ROI and flexible detector for X-ray imaging |
WO2019144342A1 (en) | 2018-01-25 | 2019-08-01 | Shenzhen Xpectvision Technology Co., Ltd. | Packaging of radiation detectors |
CN109106391A (zh) * | 2018-09-18 | 2019-01-01 | 上海联影医疗科技有限公司 | 一种x射线探测器和医学成像设备 |
EP3663806A1 (de) * | 2018-12-03 | 2020-06-10 | Siemens Healthcare GmbH | Photonendetektor, verfahren zur herstellung eines photonendetektors und röntgengerät |
CN110664422A (zh) * | 2019-09-09 | 2020-01-10 | 东软医疗系统股份有限公司 | 探测器模块、探测器及医疗成像设备 |
EP3839575A1 (en) * | 2019-12-17 | 2021-06-23 | Koninklijke Philips N.V. | Photon counting detector |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000514557A (ja) * | 1996-07-11 | 2000-10-31 | シマゲ オユ | 大きい感知面積を有する撮像装置 |
WO2010150717A1 (ja) * | 2009-06-23 | 2010-12-29 | 株式会社 日立メディコ | X線ct装置 |
JP2011007789A (ja) * | 2009-06-29 | 2011-01-13 | General Electric Co <Ge> | 一体型直接変換式検出器モジュール |
JP2011257431A (ja) * | 1997-12-18 | 2011-12-22 | Siemens Ag | モジュール構造のイメージング装置 |
JP2012088301A (ja) * | 2010-10-15 | 2012-05-10 | Ge Medical Systems Global Technology Co Llc | 正面照射検出器、a/d変換器の載置方法及びct装置 |
JP2012118073A (ja) * | 2010-11-30 | 2012-06-21 | General Electric Co <Ge> | スルービアインターポーザを有する検出器アレイ |
JP2013026285A (ja) * | 2011-07-15 | 2013-02-04 | Fujitsu Ltd | 赤外線検知器及び赤外線検知器の製造方法 |
Family Cites Families (47)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7136452B2 (en) * | 1995-05-31 | 2006-11-14 | Goldpower Limited | Radiation imaging system, device and method for scan imaging |
US5635718A (en) * | 1996-01-16 | 1997-06-03 | Minnesota Mining And Manufacturing Company | Multi-module radiation detecting device and fabrication method |
US6396898B1 (en) * | 1999-12-24 | 2002-05-28 | Kabushiki Kaisha Toshiba | Radiation detector and x-ray CT apparatus |
US6426991B1 (en) * | 2000-11-16 | 2002-07-30 | Koninklijke Philips Electronics N.V. | Back-illuminated photodiodes for computed tomography detectors |
US6510195B1 (en) * | 2001-07-18 | 2003-01-21 | Koninklijke Philips Electronics, N.V. | Solid state x-radiation detector modules and mosaics thereof, and an imaging method and apparatus employing the same |
JP4269653B2 (ja) * | 2002-11-20 | 2009-05-27 | 株式会社島津製作所 | 放射線検出器の製造方法 |
US7223981B1 (en) * | 2002-12-04 | 2007-05-29 | Aguila Technologies Inc. | Gamma ray detector modules |
US7379528B2 (en) * | 2003-01-06 | 2008-05-27 | Koninklijke Philips Electronics N.V. | Radiation detector with shielded electronics for computed tomography |
US6990176B2 (en) * | 2003-10-30 | 2006-01-24 | General Electric Company | Methods and apparatus for tileable sensor array |
US7634061B1 (en) * | 2004-03-26 | 2009-12-15 | Nova R & D, Inc. | High resolution imaging system |
WO2006006147A2 (en) * | 2004-07-14 | 2006-01-19 | Orbotech Medical Solutions Ltd. | Radiation detector head |
US7606347B2 (en) * | 2004-09-13 | 2009-10-20 | General Electric Company | Photon counting x-ray detector with overrange logic control |
US7260174B2 (en) * | 2004-09-13 | 2007-08-21 | General Electric Company | Direct conversion energy discriminating CT detector with over-ranging correction |
US7289336B2 (en) * | 2004-10-28 | 2007-10-30 | General Electric Company | Electronic packaging and method of making the same |
US7212604B2 (en) * | 2005-06-29 | 2007-05-01 | General Electric Company | Multi-layer direct conversion computed tomography detector module |
US7450683B2 (en) | 2006-09-07 | 2008-11-11 | General Electric Company | Tileable multi-layer detector |
US7606346B2 (en) * | 2007-01-04 | 2009-10-20 | General Electric Company | CT detector module construction |
US7532703B2 (en) * | 2007-03-28 | 2009-05-12 | General Electric Company | Energy discriminating detector with direct conversion layer and indirect conversion layer |
EP2203763A2 (en) * | 2007-09-07 | 2010-07-07 | Koninklijke Philips Electronics N.V. | Radiation detector with several conversion layers |
US7916836B2 (en) | 2007-09-26 | 2011-03-29 | General Electric Company | Method and apparatus for flexibly binning energy discriminating data |
US7613274B2 (en) * | 2007-11-16 | 2009-11-03 | General Electric Company | Method and system of energy integrating and photon counting using layered photon counting detector |
US8304739B2 (en) * | 2007-12-20 | 2012-11-06 | Koninklijke Philips Electronics N.V. | Direct conversion detector |
JP2012508375A (ja) * | 2008-11-10 | 2012-04-05 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 放射線検出器用のコンバータ・エレメント |
CN105044758B (zh) * | 2008-11-18 | 2022-06-14 | 皇家飞利浦电子股份有限公司 | 光谱成像检测器 |
DE102009004119A1 (de) * | 2009-01-08 | 2010-07-15 | Siemens Aktiengesellschaft | Sensoreinheit für einen Röntgendetektor und zugehöriges Fertigungsverfahren |
EP2538244B1 (en) * | 2009-03-26 | 2016-12-14 | Koninklijke Philips N.V. | Data acquisition |
US9063240B2 (en) * | 2009-12-21 | 2015-06-23 | Koninklijke Philips N.V. | Radiation detector assembly with test circuitry |
US8659148B2 (en) * | 2010-11-30 | 2014-02-25 | General Electric Company | Tileable sensor array |
KR20140024844A (ko) * | 2010-12-21 | 2014-03-03 | 텔레시스템즈 가부시키가이샤 | 방사선 검출기 및 이 검출기를 구비한 방사선 촬상 장치 |
US8548119B2 (en) * | 2011-01-13 | 2013-10-01 | General Electric Company | Multi-slice CT detector with tileable packaging structure |
CN103329007B (zh) * | 2011-01-17 | 2015-11-25 | 皇家飞利浦电子股份有限公司 | 具有包括两个或更多个可供选择地可选的和分离的子阳极的阳极的光子计数检测器像素 |
US20130049151A1 (en) | 2011-08-31 | 2013-02-28 | General Electric Company | Anode-illuminated radiation detector |
US8824635B2 (en) * | 2011-10-27 | 2014-09-02 | General Electric Company | Detector modules for imaging systems and methods of manufacturing |
US9069088B2 (en) * | 2011-11-09 | 2015-06-30 | Koninklijke Philips N.V. | Radiation-sensitive detector device with charge-rejecting segment gaps |
US9012857B2 (en) * | 2012-05-07 | 2015-04-21 | Koninklijke Philips N.V. | Multi-layer horizontal computed tomography (CT) detector array with at least one thin photosensor array layer disposed between at least two scintillator array layers |
DE102012212124B4 (de) * | 2012-07-11 | 2018-06-14 | Siemens Healthcare Gmbh | Zählender digitaler Röntgendetektor und Verfahren zur Aufnahme einer Serie von Röntgenbildern |
JP2014048171A (ja) * | 2012-08-31 | 2014-03-17 | Tele Systems:Kk | 放射線検出器に駆動用のバイアス電圧を供給する装置及びその方法 |
DE102012224209B4 (de) * | 2012-12-21 | 2017-09-14 | Siemens Healthcare Gmbh | Zählender digitaler Röntgendetektor und Verfahren zur Aufnahme eines Röntgenbildes |
DE102013200021B4 (de) * | 2013-01-02 | 2016-01-28 | Siemens Aktiengesellschaft | Verfahren zur Kalibrierung eines zählenden digitalen Röntgendetektors, Röntgensysteme zur Durchführung eines solchen Verfahrens und Verfahren zur Aufnahme eines Röntgenbildes |
EP2997397B1 (en) * | 2013-05-16 | 2017-10-04 | Koninklijke Philips N.V. | Imaging detector |
US9613992B2 (en) * | 2013-06-24 | 2017-04-04 | Ge Medical Systems Israel, Ltd | Detector module for an imaging system |
US9519069B2 (en) * | 2013-09-06 | 2016-12-13 | General Electric Company | Precision self-aligning CT detector sensors |
DE102013219740A1 (de) * | 2013-09-30 | 2015-04-02 | Siemens Aktiengesellschaft | Zählender digitaler Röntgenbilddetektor mit zwei schaltbaren Modi |
JP6247918B2 (ja) * | 2013-12-09 | 2017-12-13 | 浜松ホトニクス株式会社 | 放射線イメージセンサ |
WO2016046014A1 (en) * | 2014-09-26 | 2016-03-31 | Koninklijke Philips N.V. | Radiation detector with heating device |
KR20160043453A (ko) * | 2014-10-13 | 2016-04-21 | 삼성전자주식회사 | 전류저항층을 포함하는 포토컨덕터를 가진 엑스선 검출기 |
US9337233B1 (en) * | 2014-12-15 | 2016-05-10 | General Electric Company | Photodiode array for imaging applications |
-
2015
- 2015-11-02 WO PCT/EP2015/075363 patent/WO2016066850A1/en active Application Filing
- 2015-11-02 US US15/118,911 patent/US9955930B2/en active Active
- 2015-11-02 JP JP2016562208A patent/JP6126758B1/ja active Active
- 2015-11-02 CN CN201580032422.XA patent/CN106662661B/zh active Active
- 2015-11-02 RU RU2016150369A patent/RU2647206C1/ru not_active IP Right Cessation
- 2015-11-02 EP EP15788029.5A patent/EP3143430B1/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000514557A (ja) * | 1996-07-11 | 2000-10-31 | シマゲ オユ | 大きい感知面積を有する撮像装置 |
JP2011257431A (ja) * | 1997-12-18 | 2011-12-22 | Siemens Ag | モジュール構造のイメージング装置 |
WO2010150717A1 (ja) * | 2009-06-23 | 2010-12-29 | 株式会社 日立メディコ | X線ct装置 |
JP2011007789A (ja) * | 2009-06-29 | 2011-01-13 | General Electric Co <Ge> | 一体型直接変換式検出器モジュール |
JP2012088301A (ja) * | 2010-10-15 | 2012-05-10 | Ge Medical Systems Global Technology Co Llc | 正面照射検出器、a/d変換器の載置方法及びct装置 |
JP2012118073A (ja) * | 2010-11-30 | 2012-06-21 | General Electric Co <Ge> | スルービアインターポーザを有する検出器アレイ |
JP2013026285A (ja) * | 2011-07-15 | 2013-02-04 | Fujitsu Ltd | 赤外線検知器及び赤外線検知器の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP3143430B1 (en) | 2018-01-10 |
JP6126758B1 (ja) | 2017-05-10 |
US9955930B2 (en) | 2018-05-01 |
EP3143430A1 (en) | 2017-03-22 |
RU2647206C1 (ru) | 2018-03-14 |
CN106662661B (zh) | 2019-06-25 |
CN106662661A (zh) | 2017-05-10 |
WO2016066850A1 (en) | 2016-05-06 |
US20170227658A1 (en) | 2017-08-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6126758B1 (ja) | 放射線信号を検出するためのセンサ装置及び画像化システム | |
US8710448B2 (en) | Radiation detector array | |
CN105044758B (zh) | 光谱成像检测器 | |
US9599725B2 (en) | Spectral imaging detector | |
US7606346B2 (en) | CT detector module construction | |
US20080253507A1 (en) | Computed Tomography Detector Using Thin Circuits | |
JP2004536313A (ja) | 固体x線放射検出器モジュールとそのモザイク構造、および撮像方法とそれを用いる撮像装置 | |
JP2015521283A (ja) | 少なくとも2つのシンチレータアレイ層間に配置される少なくとも1つの薄型フォトセンサを有する多層型水平コンピュータ断層撮影(ct)検出器アレイ | |
US10283557B2 (en) | Radiation detector assembly | |
JP2005229110A (ja) | 電離放射線を検出する装置 | |
JP2001318155A (ja) | 放射線検出器、およびx線ct装置 | |
JP5973834B2 (ja) | 放射線検出器 | |
US20170194374A1 (en) | Radiation detector assembly | |
JP2013054030A (ja) | 陽極照射型放射線検出器 | |
KR102609264B1 (ko) | 센서 유닛, 방사선 검출기 및 센서 유닛 제조 방법 | |
JP6194126B2 (ja) | モジュライメージング検出器asic | |
JP2023548706A (ja) | X線放射の検出のためのモジュールアセンブリ | |
CN117907360A (zh) | 用于制造辐射探测器模块的方法和辐射探测器模块 | |
JP2016186502A (ja) | 放射線検出器 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161012 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20161012 |
|
A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20161012 |
|
A975 | Report on accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A971005 Effective date: 20170308 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170314 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170407 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6126758 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |