JP2017513210A5 - - Google Patents

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Publication number
JP2017513210A5
JP2017513210A5 JP2016553552A JP2016553552A JP2017513210A5 JP 2017513210 A5 JP2017513210 A5 JP 2017513210A5 JP 2016553552 A JP2016553552 A JP 2016553552A JP 2016553552 A JP2016553552 A JP 2016553552A JP 2017513210 A5 JP2017513210 A5 JP 2017513210A5
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JP
Japan
Prior art keywords
brush
hump
diameter
ratio
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016553552A
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English (en)
Japanese (ja)
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JP6843621B2 (ja
JP2017513210A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2015/016949 external-priority patent/WO2015127301A1/en
Publication of JP2017513210A publication Critical patent/JP2017513210A/ja
Publication of JP2017513210A5 publication Critical patent/JP2017513210A5/ja
Application granted granted Critical
Publication of JP6843621B2 publication Critical patent/JP6843621B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016553552A 2014-02-20 2015-02-20 目標とする高い洗浄性能を得るためのこぶの比率 Active JP6843621B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201461942231P 2014-02-20 2014-02-20
US61/942,231 2014-02-20
PCT/US2015/016949 WO2015127301A1 (en) 2014-02-20 2015-02-20 Nodule ratios for targeted enhanced cleaning performance

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2020165904A Division JP7097415B2 (ja) 2014-02-20 2020-09-30 目標とする高い洗浄性能を得るためのこぶの比率

Publications (3)

Publication Number Publication Date
JP2017513210A JP2017513210A (ja) 2017-05-25
JP2017513210A5 true JP2017513210A5 (pt) 2018-04-05
JP6843621B2 JP6843621B2 (ja) 2021-03-17

Family

ID=53879067

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2016553552A Active JP6843621B2 (ja) 2014-02-20 2015-02-20 目標とする高い洗浄性能を得るためのこぶの比率
JP2020165904A Active JP7097415B2 (ja) 2014-02-20 2020-09-30 目標とする高い洗浄性能を得るためのこぶの比率

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2020165904A Active JP7097415B2 (ja) 2014-02-20 2020-09-30 目標とする高い洗浄性能を得るためのこぶの比率

Country Status (4)

Country Link
US (1) US10790167B2 (pt)
JP (2) JP6843621B2 (pt)
TW (1) TWI670763B (pt)
WO (1) WO2015127301A1 (pt)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2552512A (en) * 2016-07-26 2018-01-31 Matchstick Monkey Ltd An improved teething device
US11766703B2 (en) * 2018-08-15 2023-09-26 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for wafer cleaning
US20200203192A1 (en) * 2018-12-14 2020-06-25 Xia Tai Xin Semiconductor (Qing Dao) Ltd. Backside brush for cleaning wafer and cleaning apparatus having the same
US11109667B2 (en) * 2019-10-16 2021-09-07 Tung An Development Ltd. Device of bi-spiral cleaning brush
US20230064958A1 (en) * 2021-08-30 2023-03-02 Taiwan Semiconductor Manufacturing Company Ltd. Method for wafer backside polishing
CN114227526B (zh) * 2022-02-28 2022-06-07 西安奕斯伟材料科技有限公司 一种研磨载台、研磨装置、研磨方法及硅片

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US937509A (en) * 1908-03-09 1909-10-19 Donald A Carpenter Lavatory-fixture.
US4098728A (en) 1976-01-02 1978-07-04 Solomon Rosenblatt Medical surgical sponge and method of making same
JPS596974A (ja) 1982-07-05 1984-01-14 カネボウ株式会社 洗浄方法
JPH03155551A (ja) 1989-11-14 1991-07-03 Seiko Epson Corp 洗浄用治具
US6080092A (en) * 1994-10-06 2000-06-27 Xomed Surgical Products, Inc. Industrial cleaning sponge
JP3680185B2 (ja) 1996-07-19 2005-08-10 アイオン株式会社 洗浄用ローラ
JP3403108B2 (ja) 1999-02-26 2003-05-06 アイオン株式会社 洗浄用スポンジローラ
EP0937509A4 (en) * 1996-11-08 2005-01-19 Aion Co Ltd SPONGE ROLL FOR CLEANING
US6502273B1 (en) * 1996-11-08 2003-01-07 Kanebo, Ltd. Cleaning sponge roller
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
JP2000270929A (ja) 1999-03-26 2000-10-03 Shibaura Mechatronics Corp 洗浄用ブラシ
JP2001358110A (ja) 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
JP2004298767A (ja) 2003-03-31 2004-10-28 Aion Kk 洗浄用多孔質ロール体
CN1863645B (zh) * 2003-08-08 2011-11-30 安格斯公司 用于制作浇注在可旋转基体上的整体式多孔垫的方法和材料
US20050109371A1 (en) * 2003-10-27 2005-05-26 Applied Materials, Inc. Post CMP scrubbing of substrates
KR101324870B1 (ko) 2005-12-06 2013-11-01 엔테그리스, 아이엔씨. 다공성 패드를 위한 성형된 회전가능 기부
JP2009066527A (ja) 2007-09-13 2009-04-02 Nec Electronics Corp 洗浄用ローラおよび洗浄装置
JP2009117765A (ja) 2007-11-09 2009-05-28 Aion Kk 洗浄用スポンジローラ
JP5470746B2 (ja) 2008-05-22 2014-04-16 富士通セミコンダクター株式会社 半導体装置の製造方法
US8555458B2 (en) * 2008-06-30 2013-10-15 Aion Co., Ltd Cleaning sponge roller
US9524886B2 (en) 2009-05-15 2016-12-20 Illinois Tool Works Inc. Brush core and brush driving method
JP5977175B2 (ja) * 2010-02-22 2016-08-24 インテグリス・インコーポレーテッド Ｃｍｐ後の洗浄ブラシ
JP5535687B2 (ja) 2010-03-01 2014-07-02 株式会社荏原製作所 基板洗浄方法及び基板洗浄装置
KR20140069043A (ko) 2011-09-26 2014-06-09 인티그리스, 인코포레이티드 포스트-cmp 세정 장치 및 방법
US20130255721A1 (en) * 2012-04-03 2013-10-03 Illinois Tool Works Inc. Concave nodule sponge brush

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