JP2017506096A - Alternative placement of temperature sensors on bipolar electrodes - Google Patents
Alternative placement of temperature sensors on bipolar electrodes Download PDFInfo
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B18/04—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating
- A61B18/12—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating by passing a current through the tissue to be heated, e.g. high-frequency current
- A61B18/14—Probes or electrodes therefor
- A61B18/1492—Probes or electrodes therefor having a flexible, catheter-like structure, e.g. for heart ablation
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B2018/00053—Mechanical features of the instrument of device
- A61B2018/0016—Energy applicators arranged in a two- or three dimensional array
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B2018/00053—Mechanical features of the instrument of device
- A61B2018/00214—Expandable means emitting energy, e.g. by elements carried thereon
- A61B2018/0022—Balloons
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B2018/00315—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body for treatment of particular body parts
- A61B2018/00345—Vascular system
- A61B2018/00404—Blood vessels other than those in or around the heart
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B2018/00315—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body for treatment of particular body parts
- A61B2018/00434—Neural system
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B2018/00315—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body for treatment of particular body parts
- A61B2018/00505—Urinary tract
- A61B2018/00511—Kidney
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B2018/00571—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body for achieving a particular surgical effect
- A61B2018/00577—Ablation
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B2018/00636—Sensing and controlling the application of energy
- A61B2018/00773—Sensed parameters
- A61B2018/00791—Temperature
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B18/04—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating
- A61B18/12—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating by passing a current through the tissue to be heated, e.g. high-frequency current
- A61B18/14—Probes or electrodes therefor
- A61B2018/1465—Deformable electrodes
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B18/00—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
- A61B18/04—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating
- A61B18/12—Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating by passing a current through the tissue to be heated, e.g. high-frequency current
- A61B18/14—Probes or electrodes therefor
- A61B2018/1467—Probes or electrodes therefor using more than two electrodes on a single probe
Abstract
組織アブレーション用の医療器具は、カテーテル・シャフトと、カテーテル・シャフト上に配置されるかカテーテル・シャフトに連結される拡張可能な部材と、フレキシブル回路として各々構成される複数の長尺状電極アセンブリとを備える。拡張可能な部材は非拡張形態と拡張形態との間を変化するように構成される。複数の電極アセンブリは拡張可能な部材の外側表面上に配置される。複数の電極アセンブリの各々は、2つ以上の電極と一列に並べられる温度センサを含む。A medical device for tissue ablation includes a catheter shaft, an expandable member disposed on or coupled to the catheter shaft, and a plurality of elongated electrode assemblies each configured as a flexible circuit. Is provided. The expandable member is configured to change between an unexpanded configuration and an expanded configuration. The plurality of electrode assemblies are disposed on the outer surface of the expandable member. Each of the plurality of electrode assemblies includes a temperature sensor aligned with two or more electrodes.
Description
本開示は医療器具、および医療器具を製造する方法に関する。特に、本開示は組織アブレーション用医療器具に関する。 The present disclosure relates to medical devices and methods of manufacturing medical devices. In particular, the present disclosure relates to a tissue ablation medical device.
様々な体内の医療器具が例えば血管内の使用などの医療用途において開発されている。これらの器具のうちのいくつかはガイドワイヤ、カテーテルなどを含む。これらの器具は様々な異なる製造方法のうちの任意の1つによって製造され、様々な方法のうちの任意の1つによって使用される。 A variety of internal medical devices have been developed for medical applications such as, for example, intravascular use. Some of these devices include guidewires, catheters, and the like. These instruments are manufactured by any one of a variety of different manufacturing methods and used by any one of a variety of methods.
周知の医療器具および方法の各々は所定の効果および短所を有する。医療器具を製造し使用するための代替方法の他、代替医療器具を提供することに対する継続的なニーズがある。 Each of the known medical devices and methods has certain advantages and disadvantages. In addition to alternative methods for manufacturing and using medical devices, there is a continuing need to provide alternative medical devices.
組織アブレーション用の医療器具は、カテーテル・シャフトと、カテーテル・シャフト上に配置される拡張可能なバルーンとを備える。バルーンは非拡張形態と拡張形態との間を変化可能である。医療器具は、各々フレキシブル回路として構成される複数の長尺状電極アセンブリを備える。複数の電極アセンブリは各々、少なくとも第1および第2の離間した配列の複数の電極を含み、複数の電極アセンブリはバルーンの外側表面に配置される。複数の電極アセンブリの各々は、配列内の2つ以上の電極と一列に並べられる1つ以上の温度センサを含む。 A medical device for tissue ablation includes a catheter shaft and an expandable balloon disposed on the catheter shaft. The balloon can change between an unexpanded configuration and an expanded configuration. The medical device includes a plurality of elongated electrode assemblies each configured as a flexible circuit. Each of the plurality of electrode assemblies includes at least a first and second spaced apart plurality of electrodes, the plurality of electrode assemblies being disposed on an outer surface of the balloon. Each of the plurality of electrode assemblies includes one or more temperature sensors aligned with two or more electrodes in the array.
組織アブレーション用の医療器具は、カテーテル・シャフトと、カテーテル・シャフトに連結される拡張可能な部材と、フレキシブル回路として各々構成される複数の長尺状電極アセンブリとを備える。拡張可能な部材は非拡張形態と拡張形態との間を変化可能である。複数の電極アセンブリは拡張可能な部材の外側表面上に配置され、複数の電極アセンブリの各々は、少なくとも1つの電極の下に位置される少なくとも1つの温度センサを含む。 A medical device for tissue ablation includes a catheter shaft, an expandable member coupled to the catheter shaft, and a plurality of elongated electrode assemblies each configured as a flexible circuit. The expandable member can change between an unexpanded configuration and an expanded configuration. The plurality of electrode assemblies are disposed on the outer surface of the expandable member, and each of the plurality of electrode assemblies includes at least one temperature sensor positioned under the at least one electrode.
身体通路内の組織アブレーション用の医療器具は、長手方向軸線を有するカテーテル・シャフトと、カテーテル・シャフトに連結される拡張可能な部材と、フレキシブル回路として各々構成される複数の長尺状電極アセンブリとを備える。拡張可能な部材は非拡張形態と拡張形態との間を変化可能であり、複数の電極アセンブリは拡張可能な部材の外側表面に接合される。複数の電極アセンブリの各々は、複数の活性電極、複数の外側電極、および1つ以上の温度センサを含む。温度センサは、複数の外側電極に線形に並べられる。 A medical device for tissue ablation in a body passage includes a catheter shaft having a longitudinal axis, an expandable member coupled to the catheter shaft, and a plurality of elongated electrode assemblies each configured as a flexible circuit. Is provided. The expandable member can vary between an unexpanded configuration and an expanded configuration, and the plurality of electrode assemblies are joined to the outer surface of the expandable member. Each of the plurality of electrode assemblies includes a plurality of active electrodes, a plurality of outer electrodes, and one or more temperature sensors. The temperature sensor is linearly arranged on the plurality of outer electrodes.
いくつかの実施形態の上記の課題を解決するための手段は、本開示に示す実施形態の各々あるいはすべての実施を開示するように意図されるものではない。図面および後述する詳細な説明は、これらの実施形態をより特定して例示する。 The means for solving the above-mentioned problems of some embodiments are not intended to disclose each or every implementation of the embodiments presented in this disclosure. The drawings and detailed description to be described below more particularly exemplify these embodiments.
本開示は、添付の図面に関する後述する詳細な説明を考慮してより完全に理解される。
本開示は様々な変形および別例の形態に柔軟であるが、その具体例は図面に例示され、詳細に後述する。しかしながら、本発明を所定の実施形態に限定することを意図したものではないものといえる。逆に、本開示の趣旨および範囲内にあるすべての変更、均等物、および別例をカバーするものと意図される。
The present disclosure will be more fully understood in view of the following detailed description with reference to the accompanying drawings.
While the present disclosure is flexible in various modifications and alternative forms, specific examples thereof are illustrated in the drawings and will be described in detail later. However, it can be said that the present invention is not intended to be limited to a given embodiment. On the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the disclosure.
本明細書は図面を参照して読まれるべきであり、複数の図にわたって類似の参照符号は類似の要素を示す。図面は必ずしも正確な縮尺ではない。詳細な説明および図面は、例示するようにのみ意図され、特許請求の範囲に記載の発明を制限するようには意図されない。当業者は、開示され、かつ/または図示される様々な要素が、本開示の範囲から逸脱することなく様々な組み合わせおよび構成で設けられることを認識するであろう。発明の詳細な説明および図面は、特許請求の範囲に記載の発明の実施形態を例示する。 The specification should be read with reference to the drawings, wherein like reference numerals indicate like elements throughout the several views. The drawings are not necessarily to scale. The detailed description and drawings are intended to be illustrative only and are not intended to limit the claimed invention. Those skilled in the art will recognize that the various elements disclosed and / or illustrated may be provided in various combinations and configurations without departing from the scope of the present disclosure. The detailed description and drawings illustrate embodiments of the claimed invention.
以下に定義された用語に関して、異なる定義が特許請求の範囲や本明細書の別の部分で示されない限り、これらの定義が適用されるものとする。
すべての数値は、明示的に示されているかを問わず、用語「約」によって修飾されるものと仮定する。用語「約」は、数値の文脈において、通常記載の値に相当すると当業者が考える(すなわち、同じ機能あるいは結果を有する)数値範囲を示す。多くの実例において、用語「約」は、最も近い有効数字に端数を切り捨てられる数を含む。用語「約」の他の用途(すなわち、数値以外の文脈における)は、別段の定めがない限り、明細書の文脈から理解され、明細書の文脈に一致するように、その通常の慣習的な定義を有すると仮定される。
With respect to the terms defined below, these definitions shall apply unless a different definition is given in the claims or elsewhere in this specification.
All numbers are assumed to be modified by the term “about”, whether explicitly indicated or not. The term “about” indicates in the numerical context a numerical range that one of ordinary skill in the art would appreciate (ie, having the same function or result) as would normally be described. In many instances, the term “about” includes numbers that are rounded to the nearest significant figure. Other uses of the term “about” (ie, in a non-numeric context) are understood from the context of the specification, unless otherwise specified, and are in its usual customary manner to be consistent with the context of the specification. It is assumed to have a definition.
終点による数値範囲の記載は、終点を含むその範囲内のすべての数値を含む(例えば、1乃至5は1、1.5、2、2.75、3、3.80、4、および5を含む)。
本明細書および添付の特許請求の範囲において使用されるように、単数「a」、「an」および「the」は、内容が他の方法で明白に示されない限り、複数の指示物を含む。本明細書および添付の特許請求の範囲において使用されるように、用語「あるいは」は、特に明確な記載がない限り、通常その意味において「および/または」を含んで使用される。
The recitation of numerical ranges by endpoints includes all numbers within that range including endpoints (eg, 1 to 5 is 1, 1.5, 2, 2.75, 3, 3.80, 4, and 5). Including).
As used herein and in the appended claims, the singular “a”, “an”, and “the” include plural referents unless the content clearly dictates otherwise. As used herein and in the appended claims, the term “or” is generally used in its sense including “and / or” unless the content clearly dictates otherwise.
本明細書における「実施形態」、「いくつかの実施形態」、および「別例」等への言及は、開示される1つ以上の実施形態が、特定の特徴、構造体、あるいは特性を含むことを示すが、すべての実施形態が必ずしも特定の特徴、構造体、あるいは特性を含んでいるとは限らない。更に、そのような句は必ずしも同じ実施形態を示すものではない。更に、所定の特徴、構造体、あるいは特性が一実施形態に関して記載される場合、そのような特徴、構造体、あるいは特性は、明白に開示されているか否かにかかわらず、明確に反対が述べられない限り、別例に関しても得られることが当業者の知識の範囲内にある。すなわち、以下に開示される様々な個別の要素は、明示的に特定の組み合わせに示されなくても、当業者に理解されるように、他の付加的な実施形態をなすべく、あるいは開示される1つ以上の実施形態を補足し、かつ/または発展させるべく、互いに組み合わせ可能または互いに対して配置可能であると考えられる。 References herein to “embodiments”, “some embodiments”, “another example”, etc., include one or more disclosed embodiments including certain features, structures, or characteristics. However, not all embodiments necessarily include specific features, structures, or characteristics. Moreover, such phrases are not necessarily referring to the same embodiment. Further, when a given feature, structure, or characteristic is described with respect to one embodiment, such feature, structure, or characteristic is clearly stated to the contrary, whether or not explicitly disclosed. Unless otherwise stated, it is within the knowledge of those skilled in the art to obtain other examples. That is, the various individual elements disclosed below may be made or disclosed in other additional embodiments, as will be appreciated by those skilled in the art, even if not explicitly shown in a particular combination. It is contemplated that they can be combined with each other or arranged with respect to each other to supplement and / or develop one or more embodiments.
所定の処理は組織アブレーションを目的とする。いくつかの例において、組織アブレーションは、選択した神経機能の一時的または恒久的中断あるいは修正を含む。いくつかの実施形態では、神経は交感神経である。一例による治療は、腎神経アブレーションであり、これは、高血圧症、鬱血心不全、糖尿病、あるいは高血圧や塩類貯留によって影響を受ける他の症状などを、あるいはこれらに関係がある症状を治療するために通常使用される。腎臓は感応反応を生じ、これは、水および/またはナトリウムの望ましくない保持を増加させる。感応反応の結果は例えば血圧の上昇である。腎臓まで延びる神経のうちのいくつか(例えば、腎動脈に隣接するか、腎動脈に沿って配置される)をアブレーションすることにより、この感応反応が低減または除去され、これにより、関連付けられる望ましくない症状が対応して低減される(例えば血圧の低減)。 The predetermined treatment is aimed at tissue ablation. In some examples, tissue ablation includes temporary or permanent interruption or correction of selected neural function. In some embodiments, the nerve is a sympathetic nerve. One example of treatment is renal nerve ablation, which is usually used to treat hypertension, congestive heart failure, diabetes, or other symptoms affected by high blood pressure or salt retention, or related symptoms. used. The kidney produces a sensitive response, which increases the undesirable retention of water and / or sodium. The result of the sensitive response is, for example, an increase in blood pressure. Ablation of some of the nerves that extend to the kidney (eg, adjacent to or located along the renal artery) reduces or eliminates this sensitive response, and is therefore associated with an undesirable Symptoms are correspondingly reduced (eg, reduction in blood pressure).
本開示のいくつかの実施形態は、治療効果を得るべく通常目的の組織の治療のためのパワー生成および制御装置に関する。いくつかの実施形態では、目的の組織は、神経を含むか、神経近傍の組織である。別例では、目的の組織は交感神経であり、例えば、血管に隣接して配置される交感神経を含む。更なる別例では、目的の組織は管腔の組織であり、これは、主要な疾病に見られるような患部組織を更に含む。 Some embodiments of the present disclosure relate to a power generation and control device for the treatment of normal purpose tissue to obtain a therapeutic effect. In some embodiments, the tissue of interest is a tissue that includes or is near a nerve. In another example, the tissue of interest is a sympathetic nerve, including, for example, a sympathetic nerve placed adjacent to a blood vessel. In yet another example, the tissue of interest is luminal tissue, which further includes diseased tissue such as found in major diseases.
本開示のいくつかの実施形態では、目的の投薬中にエネルギーを伝える能力は、有益な生物学的反応を得るべく神経組織に使用される。例えば、慢性疼痛、泌尿器科の機能障害、高血圧症、および様々な他の持続する症状は、神経組織の手術によって影響されることが周知である。例えば、薬剤に反応しない慢性高血圧症は、腎動脈近傍の神経の過度の活動を不能にすることにより、改善または取り除かれることが周知である。神経組織は通常再生特性を有さないことが更に周知である。従って、神経組織の伝達通路を分裂させることにより、効果的に過度の神経活動に影響を及ぼすことが可能である。神経伝達通路を分裂させる際に、近隣の神経や器官組織に対する損傷を回避することが特に効果的である。エネルギー適用量を指示し制御する能力は、神経組織の治療に好適である。加熱のエネルギー適用量であれアブレーションのエネルギー適用量であれ、ここに記述され開示されるようなエネルギー輸送の正確な制御は、神経組織に向けられる。更に、エネルギーの指示される適用は、通常のアブレーション・プローブを使用する際に要求されるような、正確な接触を要することなく神経を目的とするために十分である。例えば、偏心した加熱が、アブレーションを生じさせることなく、かつ管腔の組織の貫通を要することなく、神経組織の変性させるのに十分高い温度で適用される。しかしながら、組織を貫通し、かつ電源制御および生成装置によって制御される正確なエネルギー適用量を備えるアブレーション・プローブと同様のアブレーション・エネルギーを輸送する本開示のエネルギー輸送面を構成することが更に望ましい。 In some embodiments of the present disclosure, the ability to transmit energy during the intended dose is used in neural tissue to obtain a beneficial biological response. For example, it is well known that chronic pain, urological dysfunction, hypertension, and various other persistent symptoms are affected by nerve tissue surgery. For example, it is well known that chronic hypertension that is not responsive to drugs can be ameliorated or eliminated by disabling excessive nerve activity near the renal arteries. It is further well known that neural tissue usually does not have regenerative properties. Therefore, it is possible to effectively influence excessive nerve activity by splitting the transmission path of nerve tissue. It is particularly effective to avoid damage to nearby nerves and organ tissues when disrupting the nerve transmission pathway. The ability to direct and control energy dosage is suitable for the treatment of neural tissue. Regardless of the heating energy dose or the ablation energy dose, precise control of energy transport as described and disclosed herein is directed to the neural tissue. Furthermore, the directed application of energy is sufficient to target the nerve without requiring precise contact, as required when using conventional ablation probes. For example, eccentric heating is applied at a temperature high enough to degenerate neural tissue without causing ablation and requiring penetration of luminal tissue. However, it is further desirable to construct the energy transport surface of the present disclosure that transports ablation energy similar to an ablation probe that penetrates tissue and has the precise energy dosage controlled by the power supply control and generation device.
いくつかの実施形態では、除神経治療の効能は、処置の前、処置中、および/または処置後に測定によって評価され、特定の患者に対する治療の1つ以上のパラメータを調整するか、付加的な治療の必要性を識別する。例えば、除神経システムは、治療が目的の組織あるいは近傍の組織の神経作用を低減させたか低減しているかを評価する機能を含み、これにより、治療のパラメータを調整するためのフィードバックが得られるか、付加的な治療の必要性が示される。 In some embodiments, the efficacy of denervation therapy is assessed by measurement before, during, and / or after treatment to adjust one or more parameters of the therapy for a particular patient or additional Identify the need for treatment. For example, does the denervation system include the ability to assess whether treatment has reduced or reduced the nerve activity of the target tissue or nearby tissue, and can this provide feedback to adjust treatment parameters? The need for additional treatment is indicated.
ここに開示される器具および方法の多くは、腎神経アブレーションおよび/または調整に関して議論される。しかしながら、器具および方法は他の治療位置および/または応用において使用されてもよいものと考えられる。加熱、活性化、閉塞、分裂、あるいはアブレーションを含む神経調整および/または他の組織の調整が、トロカールおよびカニューレによるアクセスを介した血管、尿の血管、あるいは他の組織において望ましいが、これらに限定されるものではない。例えば、ここに開示される器具および方法は、増殖性組織アブレーション、心臓アブレーション、疼痛処理、肺静脈分離、肺静脈アブレーション、腫瘍アブレーション、前立腺肥大症治療、神経刺激、ブロック、あるいはアブレーション、筋肉活動の調整、高熱、あるいは組織の他の昇温等に適用可能である。開示される方法および装置は、ヒトおよび非ヒトの患者の両者を含む、任意の関連する医学的処置に適用可能である。用語「調整」は、影響を受ける神経および他の組織の機能を変更するアブレーションおよび他の技術を示す。 Many of the devices and methods disclosed herein are discussed with respect to renal nerve ablation and / or adjustment. However, it is contemplated that the devices and methods may be used in other treatment locations and / or applications. Neural adjustments and / or other tissue adjustments including heating, activation, occlusion, division, or ablation are desirable in, but not limited to, blood vessels, urine vessels, or other tissues via trocar and cannula access Is not to be done. For example, the devices and methods disclosed herein include proliferative tissue ablation, cardiac ablation, pain treatment, pulmonary vein isolation, pulmonary vein ablation, tumor ablation, treatment for benign prostatic hyperplasia, nerve stimulation, block or ablation, muscle activity It is applicable to adjustment, high heat, or other temperature increase of the tissue. The disclosed methods and devices are applicable to any relevant medical procedure, including both human and non-human patients. The term “modulation” refers to ablation and other techniques that alter the function of affected nerves and other tissues.
図1は、例による交感神経アブレーション・システム100を示す概略図である。システム100は交感神経アブレーション器具120を含む。交感神経アブレーション器具120は、腎臓Kに隣接して配置される神経(例えば腎神経)を除去するために使用される(例えば腎動脈RAの周囲に配置される腎神経)。使用の際、交感神経アブレーション器具120は、腎動脈RA内の位置まで大動脈Aのような血管を通して進められる。これはガイド・シースやカテーテル14を介して交感神経アブレーション器具120を進めることを含む。所望に応じて位置されると、交感神経アブレーション器具120は1つ以上の電極(図示しない)を活性化するために活性化される。活性化は、電極に所望の活性化エネルギーを供給するように、RFジェネレータを含む制御装置110に交感神経アブレーション器具120を作動的に連結することを含む。例えば、交感神経アブレーション器具120は、ワイヤまたは導電性部材18を含み、第1のコネクタ20は、制御装置110上で第2のコネクタ22に接続可能であり、かつ/またはワイヤ24は、制御装置110に接続される。少なくともいくつかの実施形態において、制御装置110は、交感神経アブレーション器具120の遠位端に、あるいはその遠位端近傍に配置される1つ以上のセンサを活性化するために、適切な電気的エネルギーおよび/または信号を供給すること、あるいは受け取ることにも利用されてもよい。適切に活性化されると、1つ以上の電極は後述するように組織(例えば交感神経)をアブレーション可能であり、1つ以上のセンサは、所望の物理的および/または生物学的パラメータを検知することに使用される。 FIG. 1 is a schematic diagram illustrating an exemplary sympathetic ablation system 100. System 100 includes a sympathetic ablation instrument 120. The sympathetic ablation instrument 120 is used to remove nerves (eg, renal nerves) placed adjacent to the kidney K (eg, renal nerves placed around the renal artery RA). In use, sympathetic ablation instrument 120 is advanced through a blood vessel such as aorta A to a location within renal artery RA. This includes advancing the sympathetic ablation instrument 120 through the guide sheath or catheter 14. When positioned as desired, the sympathetic ablation instrument 120 is activated to activate one or more electrodes (not shown). Activation includes operatively coupling the sympathetic ablation instrument 120 to a controller 110 that includes an RF generator so as to provide the desired activation energy to the electrodes. For example, the sympathetic ablation instrument 120 includes a wire or conductive member 18, the first connector 20 can be connected to the second connector 22 on the control device 110, and / or the wire 24 is connected to the control device. 110. In at least some embodiments, the controller 110 may be configured with an appropriate electrical device to activate one or more sensors located at or near the distal end of the sympathetic ablation instrument 120. It may also be used to supply or receive energy and / or signals. When properly activated, one or more electrodes can ablate tissue (eg, sympathetic nerves), as described below, and one or more sensors sense desired physical and / or biological parameters. Used to do.
交感神経アブレーション器具120は長尺状管状部材またはカテーテル・シャフト122を備える。いくつかの実施形態では、長尺状管状部材またはカテーテル・シャフト122はガイドワイヤまたは他の長尺状医療器具を伝って目的の部位に摺動自在に進められるように構成される。いくつかの実施形態では、長尺状管状部材またはカテーテル・シャフト122はガイド・シースまたはカテーテル14内を摺動自在に目的の部位に進められるように構成される。いくつかの実施形態では、長尺状管状部材またはカテーテル・シャフト122は、ガイドワイヤを伝ってガイド・シースまたはカテーテル14内、あるいはこれらの組み合わせ内を目的の部位に進められるように構成されてもよい。拡張可能な部材130は、長尺状管状部材またはカテーテル・シャフト122の遠位側領域に、遠位側領域上に、遠位側領域の周囲に、あるいは遠位側領域の近傍に配置される。いくつかの実施形態では、拡張可能な部材130は、従順な、あるいは非従順なバルーンである。いくつかの実施形態では、拡張可能な部材130は非拡張形態と拡張形態との間を変化可能である。 Sympathetic ablation instrument 120 includes an elongate tubular member or catheter shaft 122. In some embodiments, the elongate tubular member or catheter shaft 122 is configured to be slidably advanced over a guidewire or other elongate medical device to a target site. In some embodiments, the elongate tubular member or catheter shaft 122 is configured to be slidably advanced within the guide sheath or catheter 14 to a target site. In some embodiments, the elongate tubular member or catheter shaft 122 may be configured to be advanced over the guidewire into the guide sheath or catheter 14, or a combination thereof, to the target site. Good. The expandable member 130 is disposed in the distal region of the elongate tubular member or catheter shaft 122, on the distal region, around the distal region, or near the distal region. . In some embodiments, the expandable member 130 is a compliant or non-compliant balloon. In some embodiments, the expandable member 130 can change between an unexpanded configuration and an expanded configuration.
連結される1つ以上の電極アセンブリを備えるバルーンを含む医療器具の使用は、例えばここに開示されるように、望ましい。しかしながら、いくつかの実例では、電極アセンブリは比較的堅固であり、かつ/またはかさばった材料あるいは要素を含む。そのため、治療手順に従ってバルーンが空気を抜かれると、電極アセンブリは平坦になり、かつ/または広げられる傾向にある。そのように構成されると、1つ以上の電極アセンブリ、および/またはその要素または縁は、医療器具をガイド・カテーテル内に(例えば、取り付けられる電極アセンブリを含め)近位側に格納すると、ガイド・カテーテルの縁にひっかかるかもしれない。電極アセンブリのサイズ、電極アセンブリや医療器具の他の構造体が、例えばガイド・カテーテル内への格納時に、ガイド・カテーテルの端部に「ひっかかる」可能性を低減する構造的要素を含む医療器具が開示され、これにより、後退する力が低減される。 The use of a medical device that includes a balloon with one or more electrode assemblies to be coupled is desirable, eg, as disclosed herein. However, in some instances, the electrode assembly is relatively rigid and / or includes bulky materials or elements. Thus, when the balloon is deflated according to the treatment procedure, the electrode assembly tends to become flat and / or unfolded. When so configured, the one or more electrode assemblies, and / or elements or edges thereof, guide the medical device when stored proximally (eg, including the attached electrode assembly) within the guide catheter. • It may get caught on the edge of the catheter. A medical device that includes structural elements that reduce the size of the electrode assembly, the electrode assembly and other structures of the medical device, for example, the likelihood of "snipping" the end of the guide catheter upon storage within the guide catheter. Disclosed, thereby reducing the retracting force.
電極アセンブリは拡張可能な部材上に設けられ、アセンブリは各々、外側電極10、正の電極12、および温度センサまたはサーミスタ26の各々のうちの1つ以上を含む。いくつかの先行技術による電極対設計は、図2Aに示すように、複数の正の電極12とは数ミリメートル離間して配置される複数の外側電極10を有する電極パッド70から構成され、サーミスタ26が電極間に配置される。これにより、個別の電極が活性化されると、正確な温度の検知ができ、これにより、一貫した患部が形成される。個別の電極対はそれぞれ個別に活性化され、血管の周囲でジグザグに治療する。図2Bに示すように、電極アセンブリがバルーン・カテーテル上に配置されると、電極アセンブリは各サーミスタの周囲で個別に活性化されるように配線される。 The electrode assemblies are provided on an expandable member, each assembly including one or more of each of an outer electrode 10, a positive electrode 12, and a temperature sensor or thermistor 26. Some prior art electrode pair designs consist of an electrode pad 70 having a plurality of outer electrodes 10 spaced a few millimeters away from a plurality of positive electrodes 12, as shown in FIG. Is disposed between the electrodes. Thus, when individual electrodes are activated, accurate temperature detection can be performed, thereby forming a consistent affected area. Each individual electrode pair is activated individually to treat zigzag around the blood vessel. As shown in FIG. 2B, when the electrode assembly is placed on the balloon catheter, the electrode assembly is wired to be individually activated around each thermistor.
他の応用では、より完全かつ周辺の治療が望ましい。そのような応用では、電極対は矢印50によって示される対内で始動するように、かつ矢印60によって示される対間で始動するように構成される。図3を参照。このシナリオにおいて、電極間の対は、活性化中に温度を監視するためのサーミスタを有さない。 For other applications, a more complete and peripheral treatment is desirable. In such applications, the electrode pairs are configured to start within the pair indicated by arrow 50 and between the pair indicated by arrow 60. See FIG. In this scenario, the pair between the electrodes does not have a thermistor for monitoring temperature during activation.
図4に示すように、電極間の対の温度を監視するために、追加のサーミスタ26が電極パッド70間に配置される。しかしながら、この配置により、サーミスタの数を2倍にすることが要求され、これにより、バルーン上に追加の表面積が要求され、バルーンの剛性および外形が増加され、追加のサーミスタのための回路を完成させるために追加の電気的な接続が要求される。サーミスタは電極アセンブリの最大の要素である。例えば、サーミスタは、0.02インチ(0.0508センチメートル)×0.04インチ(0.1016センチメートル)で、厚み0.006インチ(0.01524センチメートル)である。電極間に配置されると、サーミスタは回路外形および回路面積/質量を増加させる。この構造により、更に拡張可能な部材は折り畳みが困難なものとなり、より大きなカテーテルやシースが要求される。 As shown in FIG. 4, an additional thermistor 26 is placed between the electrode pads 70 to monitor the temperature of the pair between the electrodes. However, this arrangement requires that the number of thermistors be doubled, which requires additional surface area on the balloon, increases the rigidity and profile of the balloon, and completes the circuit for the additional thermistor. Additional electrical connections are required to achieve this. The thermistor is the largest element of the electrode assembly. For example, the thermistor is 0.02 inches (0.0508 centimeters) by 0.04 inches (0.1016 centimeters) and 0.006 inches (0.01524 centimeters) thick. When placed between the electrodes, the thermistor increases circuit profile and circuit area / mass. This structure makes the expandable member more difficult to fold and requires larger catheters and sheaths.
いくつかの実施形態では、バイポーラ電極構造体上で温度センサが中心から外れて配置されることにより、フレキシブル回路外形が低減され、バルーンの折り畳み性が改善され、これにより、バルーンは、より小さなシースやカテーテルを通過可能である。中心から外れるように、あるいは電極に沿って温度センサを移動させることにより、温度センサを破損することなく、電極の2つの列の中心に沿って拡張可能な部材を折り畳むことができる。バルーンの格納時に、温度センサは電極が配置されるフレキシブル回路の背骨部とともに引き戻される。電極の2つの列の間の中間部は、容易に折り畳まれる。この構造体により、器具は、より小さなシースやカテーテルに挿入可能であるとともに格納可能である。 In some embodiments, the temperature sensor is placed off-center on the bipolar electrode structure to reduce the flexible circuit profile and improve the foldability of the balloon so that the balloon has a smaller sheath. And can pass through the catheter. By moving the temperature sensor off center or along the electrode, the expandable member can be folded along the center of the two rows of electrodes without damaging the temperature sensor. When the balloon is retracted, the temperature sensor is withdrawn along with the backbone of the flexible circuit where the electrodes are placed. The middle part between the two rows of electrodes is easily folded. This structure allows the instrument to be inserted and retracted into a smaller sheath or catheter.
図5に例による温度センサ配置を示す。これにより、温度センサの数を増やすことなく活性化される電極の対内および電極間の対内の両者を十分に温度監視する。図5に示すように、サーミスタのような温度センサ226は外側電極210の下に配置される。ポリイミドのような絶縁材の層が外側電極210と温度センサ226との間に配置される。この配置では図6Aに示すように、温度センサ226はそれぞれ活性化される電極の対50内、および活性化される電極間の対60内の温度を監視する。始動する周波数およびシーケンスは、ジェネレータのハードウェアおよびソフトウェアによって制御され、これにより温度精度が最適化され、電極活性化および温度検知の間におけるクロス・トークの量が低減される。いくつかの実施形態では、より長手のバルーンが望ましい。電極アセンブリ140は延長され、外側電極210およびアクティブな正の電極212の両者を含む追加の電極222、並びに温度センサ226が、電極の長さに沿って延びる配列に加えられ、全長に沿った温度を監視する。図6Bを参照。電極の配列は、互いに平行に、あるいは互いに角度をなして配置され、間隔をおいて配置される。いくつかの実施形態では、電極210および212の配列間の電極アセンブリの領域145は、回路類が欠けている。回路類が欠けているこの領域145は、電極アセンブリの折り畳みを支援する。 FIG. 5 shows an exemplary temperature sensor arrangement. Thus, the temperature of both the pair of electrodes and the pair of electrodes to be activated can be sufficiently monitored without increasing the number of temperature sensors. As shown in FIG. 5, a temperature sensor 226 such as a thermistor is disposed under the outer electrode 210. A layer of insulating material such as polyimide is disposed between the outer electrode 210 and the temperature sensor 226. In this arrangement, as shown in FIG. 6A, the temperature sensors 226 monitor the temperature in the activated electrode pair 50 and in the activated electrode pair 60, respectively. The starting frequency and sequence is controlled by the generator hardware and software, which optimizes temperature accuracy and reduces the amount of cross talk between electrode activation and temperature sensing. In some embodiments, a longer length balloon is desirable. The electrode assembly 140 is extended and an additional electrode 222, including both the outer electrode 210 and the active positive electrode 212, and a temperature sensor 226 are added to the array extending along the length of the electrode, and the temperature along the entire length. To monitor. See FIG. 6B. The electrodes are arranged in parallel to each other or at an angle to each other and spaced apart from each other. In some embodiments, the region 145 of the electrode assembly between the array of electrodes 210 and 212 lacks circuitry. This area 145 lacking circuitry assists in folding the electrode assembly.
電極アセンブリ140はそれぞれ、基層202の上に積層される複数の個別の導電トレースを含む。複数の個別の導電トレースは外側電極トレース210、アクティブまたは正の電極トレース212、および温度センサ・トレース214を含む。外側電極トレース210は長尺状の外側電極支持体216を含み、活性電極トレース212は長尺状の活性電極支持体217を含む。所望の量の可撓性を得るために、電極支持体216および217はそれらの近位端で幅が先端ほど細くなるが、これは必要ではない。通常、ネッキングが示されるトレースの湾曲は、バルーン回復力が低減され、かつより鋭利な外形が示すひっかかりの可能性が低減されるように最適化される。トレースの形状および位置も、電極アセンブリ140に全体としての寸法安定性を提供し、これにより、配備および使用中における歪みを防ぐように最適化される。 Each electrode assembly 140 includes a plurality of individual conductive traces stacked on the base layer 202. The plurality of individual conductive traces include an outer electrode trace 210, an active or positive electrode trace 212, and a temperature sensor trace 214. Outer electrode trace 210 includes an elongated outer electrode support 216 and active electrode trace 212 includes an elongated active electrode support 217. In order to obtain the desired amount of flexibility, the electrode supports 216 and 217 are narrower in width at their proximal ends, but this is not necessary. Typically, the curvature of the trace where necking is indicated is optimized so that the balloon recovery force is reduced and the possibility of a stagnation exhibited by a sharper profile is reduced. The shape and position of the traces are also optimized to provide overall dimensional stability to the electrode assembly 140, thereby preventing distortion during deployment and use.
図6Bに示すように、外側電極トレース210および活性電極トレース212は各々、複数の電極222を含む。しかしながら、いくつかの実施形態では、少なくとも1つの電極が各電極トレースに設けられ、より多くまたはより少なく使用される。例えば、いくつかの実施形態では、3つの電極が各電極トレースに設けられる。図11乃至13を参照。別例では、図7および図8に示すように、35までの、あるいは35以上の電極が各電極トレースに設けられてもよい。複数の電極222は上に突出し、かつ/または絶縁層206を通して延びる。 As shown in FIG. 6B, the outer electrode trace 210 and the active electrode trace 212 each include a plurality of electrodes 222. However, in some embodiments, at least one electrode is provided on each electrode trace and used more or less. For example, in some embodiments, three electrodes are provided on each electrode trace. See FIGS. 11-13. Alternatively, as shown in FIGS. 7 and 8, up to 35 or more electrodes may be provided on each electrode trace. The plurality of electrodes 222 project upward and / or extend through the insulating layer 206.
いくつかの実施形態では、複数の電極222は、長尺状活性電極支持体217に取り付けられ、かつ/または電気的に接続される少なくとも1つの活性電極および長尺状外側電極支持体216に取り付けられ、かつ/または電気的に接続される少なくとも1つの外側電極を含む。いくつかの実施形態では、複数の電極222は、長尺状外側電極支持体216に取り付けられ、かつ/または電気的に接続され、これにより複数の外側電極を形成し、かつ/または長尺状活性電極支持体217に取り付けられ、かつ/または電気的に接続され、複数の活性電極を形成する。いくつかの実施形態では、複数の電極222は厚み約0.030mm乃至厚み約0.070mmである。いくつかの実施形態では、複数の電極222は厚み約0.051mmである。いくつかの実施形態では、複数の電極222は絶縁層206の上を約0.020mm乃至約0.050mm延びる。いくつかの実施形態では、複数の電極222は絶縁層206の上を約0.038mm延びる。加えて、電極はそれぞれ、他の器具および/または組織にひっかかる傾向を低減するために丸みを帯びた角部を有する。複数の電極、およびそれらに関連付けられるトレースの上記記載は、バイポーラ電極アセンブリの文脈で開示されたが、当業者は、同じ電極アセンブリが単極のモードでも同様に機能することを認識するであろう。例えば、1つの制限しない例として、活性電極トレース212に関連付けられる複数の電極は、単極の電極として使用され、外側電極トレース210は、それらの電極の活性化中に分離される。 In some embodiments, the plurality of electrodes 222 are attached to the elongated active electrode support 217 and / or attached to at least one active electrode and the elongated outer electrode support 216 that are electrically connected. And / or includes at least one outer electrode that is electrically connected. In some embodiments, the plurality of electrodes 222 are attached to and / or electrically connected to the elongate outer electrode support 216, thereby forming a plurality of outer electrodes and / or elongate. The active electrode support 217 is attached and / or electrically connected to form a plurality of active electrodes. In some embodiments, the plurality of electrodes 222 has a thickness of about 0.030 mm to about 0.070 mm. In some embodiments, the plurality of electrodes 222 is about 0.051 mm thick. In some embodiments, the plurality of electrodes 222 extends from about 0.020 mm to about 0.050 mm above the insulating layer 206. In some embodiments, the plurality of electrodes 222 extend about 0.038 mm over the insulating layer 206. In addition, each electrode has rounded corners to reduce the tendency to catch on other instruments and / or tissue. Although the above description of multiple electrodes, and their associated traces, has been disclosed in the context of a bipolar electrode assembly, those skilled in the art will recognize that the same electrode assembly functions in a monopolar mode as well. . For example, as one non-limiting example, the plurality of electrodes associated with the active electrode trace 212 is used as a monopolar electrode, and the outer electrode trace 210 is separated during activation of those electrodes.
いくつかの実施形態では、温度センサ226の長さは約0.100mm乃至約2.000mmであり、幅は約0.100mm乃至約0.800mmである。いくつかの実施形態では、温度センサ226は長さ約1.000mmおよび幅約0.500mmを有する。別例では、温度センサは長さ約0.2mmおよび幅0.01mmを有してもよい。他のサイズおよび/または寸法が考えられる。 In some embodiments, the temperature sensor 226 has a length of about 0.100 mm to about 2.000 mm and a width of about 0.100 mm to about 0.800 mm. In some embodiments, the temperature sensor 226 has a length of about 1.000 mm and a width of about 0.500 mm. In another example, the temperature sensor may have a length of about 0.2 mm and a width of 0.01 mm. Other sizes and / or dimensions are possible.
いくつかの実施形態では、バルーンの周囲に螺旋形の構造体を形成するために、電極は僅かな角度をなしてバルーンの周囲を傾斜し、これにより、治療後のバルーンの収縮が支援される。例えば、図7に示すように、複数の電極アセンブリ140は拡張した状態で示される拡張可能な部材130上に角度をなして配置される。電極アセンブリ140は、電極アセンブリによって作用されるエネルギーが、オーバーラップするか、オーバーラップしない治療をなすように構成される。電極アセンブリ140によって適用される治療は、長手方向軸線L−Lに沿って周方向に連続的または非連続的である。図7に示す電極アセンブリ140のような電極アセンブリによって適用されるエネルギーは、少なくともある程度まで、長手方向に、周方向に、かつ/または他の方法でオーバーラップする。図7および図8に示す電極アセンブリ140は、矩形形状の基層202を含む。これは、制限するようには意図されない。他の形状が考えられる。加えて、電極アセンブリ140は、付加的な可撓性を備えるようにこれを通して延びる複数の開口部を含み、アセンブリの部分は丸みを帯びるか湾曲した角部、移行部、および他の部分を含む。いくつかの実例において、開口部および丸みを帯びた/湾曲した要素により、拡張可能な部材130からの剥離に対するアセンブリの抵抗が高められる。剥離は、いくつかの実例において、例えば複数の部位の処置中に治療する際に要求されるように、拡張可能な部材130が繰り返し拡張され、折り畳まれる場合に生じる(これは、更に保護シースからの配備および保護シース内への格納を必然的に伴う)。 In some embodiments, the electrodes tilt around the balloon at a slight angle to form a helical structure around the balloon, which assists in deflating the balloon after treatment. . For example, as shown in FIG. 7, the plurality of electrode assemblies 140 are arranged at an angle on an expandable member 130 shown in an expanded state. The electrode assembly 140 is configured such that the energy applied by the electrode assembly provides a treatment that overlaps or does not overlap. The treatment applied by the electrode assembly 140 may be continuous or discontinuous circumferentially along the longitudinal axis LL. The energy applied by an electrode assembly such as electrode assembly 140 shown in FIG. 7 overlaps at least to some extent in the longitudinal direction, circumferentially and / or otherwise. The electrode assembly 140 shown in FIGS. 7 and 8 includes a rectangular base layer 202. This is not intended to be limiting. Other shapes are possible. In addition, the electrode assembly 140 includes a plurality of openings extending therethrough to provide additional flexibility, with portions of the assembly including rounded or curved corners, transitions, and other portions. . In some instances, the openings and rounded / curved elements increase the assembly's resistance to delamination from the expandable member 130. Delamination occurs in some instances when the expandable member 130 is repeatedly expanded and folded as required, for example, during treatment of multiple sites (this is further from the protective sheath). Inevitably involves deployment and storage within a protective sheath).
図8に一例の電極アセンブリ140を示す。図8に示すように、電極アセンブリ140はそれぞれセンサ・トレース214の上の1つ以上の温度センサ226と、複数の電極222とを含み、いくつかは外側配列トレース210上に配置され、いくつかはアクティブまたは正の配列またはトレース212上に配置される。センサ・トレース214は、電極アセンブリ140上に中央に配置される。他の例において、センサ・トレース214は、配列あるいはトレース210および212のうちの一方に隣接して配置される。電極アセンブリ140はそれぞれ、拡張可能な部材130の近位端から、カテーテル・シャフト122に沿ってカテーテル・シャフト122の近位端まで延びる狭小な領域を含む近位側尾部180を含む。 An example electrode assembly 140 is shown in FIG. As shown in FIG. 8, each electrode assembly 140 includes one or more temperature sensors 226 on the sensor trace 214 and a plurality of electrodes 222, some disposed on the outer array trace 210, Are placed on an active or positive array or trace 212. Sensor trace 214 is centrally disposed on electrode assembly 140. In other examples, sensor trace 214 is positioned adjacent to one of the arrays or traces 210 and 212. Each electrode assembly 140 includes a proximal tail 180 that includes a narrow region extending from the proximal end of the expandable member 130 along the catheter shaft 122 to the proximal end of the catheter shaft 122.
いくつかの実施形態では、温度センサ226はサーミスタである。図9に示すように、温度センサ226は、電極アセンブリ140の非組織接触側(つまり底部側)に配置される。従って、アブレーション器具120に組み込まれると、温度センサ226は電極アセンブリ140と拡張可能な部材130との間に捕捉される。これは、サーミスタのような表面実装電気要素が通常鋭い縁および角部を有し、これにより、組織にひっかかり、バルーン展開および/または格納中に問題を生じ得るため、効果的である。ハンダは通常生体適合性を備えないため、この配置により、ハンダ付けされた接続部は、血液と接触しないように保持される。 In some embodiments, the temperature sensor 226 is a thermistor. As shown in FIG. 9, the temperature sensor 226 is disposed on the non-tissue contact side (that is, the bottom side) of the electrode assembly 140. Thus, when incorporated into the ablation instrument 120, the temperature sensor 226 is captured between the electrode assembly 140 and the expandable member 130. This is advantageous because surface mount electrical elements such as thermistors usually have sharp edges and corners, which can trap tissue and cause problems during balloon deployment and / or storage. Since solder is usually not biocompatible, this arrangement keeps the soldered connections out of contact with blood.
温度センサ226における電極アセンブリ140の寸法および/または厚みにより、拡張可能な部材130の外側表面から外側に延びる突出部が形成される。治療手順に従って、更にここに議論されるように、拡張可能な部材130は折り畳み輸送形態に折り畳まれ、アブレーション器具120はガイド・シースまたはカテーテル14内に格納される。1つ以上の相当な突出部により、ガイド・シースまたはカテーテル14内への格納はより困難であり、かつ/または大きな直径のガイド・シースまたはカテーテル14が要求されるが、そうでない場合が望ましい。加えて、1つ以上の突出部は、輸送および格納の両者において、拡張可能な部材130の折り畳み特性に消極的に影響する。 Depending on the size and / or thickness of the electrode assembly 140 at the temperature sensor 226, a protrusion is formed that extends outwardly from the outer surface of the expandable member 130. In accordance with the treatment procedure, as further discussed herein, the expandable member 130 is folded into a collapsed transport configuration and the ablation instrument 120 is stored within the guide sheath or catheter 14. One or more substantial protrusions may be more difficult to retract into the guide sheath or catheter 14 and / or require a larger diameter guide sheath or catheter 14, although it is desirable otherwise. In addition, the one or more protrusions negatively affect the folding characteristics of the expandable member 130 during both transportation and storage.
図9は、例による電極アセンブリ140およびその断面の部分平面図を示す。図9の断面図において、図の底部は、拡張可能な部材130の外側表面に直接面し、接触し、かつ/または取り付けられ、かつ/または接合される電極アセンブリ140の部分である。いくつかの実施形態において、絶縁の基層202により、電極アセンブリ140の基部が設けられる。基層202はポリイミドのようなポリマから構成されるが他の材料も考えられる。いくつかの実施形態では、基層202は厚み約0.010mm乃至約0.020mmである。いくつかの実施形態では、基層202は厚み約0.015mmである。他の適切な厚みも考えられる。参考のために、基層202は、拡張可能な部材130の外側表面に直接面し、接触し、かつ/または取り付けられ、かつ/または接合される電極アセンブリ140の底部側の大部分を形成してもよい。 FIG. 9 shows an example electrode assembly 140 and a partial plan view of a cross section thereof. In the cross-sectional view of FIG. 9, the bottom of the figure is the portion of electrode assembly 140 that faces, contacts, and / or attaches and / or joins the outer surface of expandable member 130 directly. In some embodiments, the insulating base layer 202 provides the base of the electrode assembly 140. The base layer 202 is composed of a polymer such as polyimide, but other materials are also contemplated. In some embodiments, the base layer 202 has a thickness of about 0.010 mm to about 0.020 mm. In some embodiments, the base layer 202 is about 0.015 mm thick. Other suitable thicknesses are also contemplated. For reference, the base layer 202 directly faces the outer surface of the expandable member 130 and forms the majority of the bottom side of the electrode assembly 140 that is in contact with and / or attached and / or joined. Also good.
第1の導電層204は、基層202上に積層される複数の個別の導電トレースを含む。いくつかの実施形態では、複数の個別の導電トレースは、非導電材料によって横断方向に分離される。導電層204の複数の個別の導電トレースは、例えば、電着された銅、あるいは圧延焼鈍銅の層を含む。他の適切な導電材料も考えられる。いくつかの実施形態では、導電層204および/または複数の個別の導電トレースは、厚み約0.010mm乃至約0.030mmである。いくつかの実施形態では、導電層204および/または複数の個別の導電トレースは、厚み約0.018mmである。他の適切な厚みも考えられる。第1の導電層204は温度センサ226のための正の接地接続を形成するためにエッチングされる。温度センサ226は第1の導電層を覆うように配置される。 The first conductive layer 204 includes a plurality of individual conductive traces stacked on the base layer 202. In some embodiments, the plurality of individual conductive traces are separated transversely by a non-conductive material. The plurality of individual conductive traces of conductive layer 204 include, for example, a layer of electrodeposited copper or rolled annealed copper. Other suitable conductive materials are also conceivable. In some embodiments, the conductive layer 204 and / or the plurality of individual conductive traces have a thickness of about 0.010 mm to about 0.030 mm. In some embodiments, the conductive layer 204 and / or the plurality of individual conductive traces are about 0.018 mm thick. Other suitable thicknesses are also contemplated. The first conductive layer 204 is etched to form a positive ground connection for the temperature sensor 226. The temperature sensor 226 is disposed so as to cover the first conductive layer.
第2の導電層304は基層202を覆うように配置され、絶縁層206は不連続的にあるいは連続的に第2の導電層304の頂部上に積層される。これにより、第2の導電層304は基層202と絶縁層206との間で液密にシールされる。すなわち、絶縁層206は、拡張可能な部材130の外側表面に面していない電極アセンブリ140の頂部側または表面を形成する。基層202、第1の導電層204、第2の導電層304、および絶縁層206の関係は例示的であり、他の構造体が考えられる。基層202と同様に、絶縁層206は他の材料が考えられるが、ポリイミドのようなポリマから構成される。いくつかの実施形態では、絶縁層206は厚み約0.010mm乃至厚み約0.020mmである。いくつかの実施形態では、絶縁層206は厚み約0.013mmである。他の適切な厚みも考えられる。いくつかの実施形態では、絶縁層206は、PTFEまたはシリコーンのような完全または部分的なポリマ・コーティングである。他の材料も考えられる。 The second conductive layer 304 is disposed so as to cover the base layer 202, and the insulating layer 206 is laminated on the top of the second conductive layer 304 discontinuously or continuously. As a result, the second conductive layer 304 is liquid-tightly sealed between the base layer 202 and the insulating layer 206. That is, the insulating layer 206 forms the top side or surface of the electrode assembly 140 that does not face the outer surface of the expandable member 130. The relationship between the base layer 202, the first conductive layer 204, the second conductive layer 304, and the insulating layer 206 is exemplary, and other structures are possible. As with the base layer 202, the insulating layer 206 is made of a polymer such as polyimide, although other materials are conceivable. In some embodiments, the insulating layer 206 is about 0.010 mm thick to about 0.020 mm thick. In some embodiments, the insulating layer 206 is about 0.013 mm thick. Other suitable thicknesses are also contemplated. In some embodiments, the insulating layer 206 is a complete or partial polymer coating such as PTFE or silicone. Other materials are also conceivable.
電極アセンブリ140は複数の層を有するフレキシブル回路として構成される。そのような層は連続的または非隣接(すなわち、個別の部分から構成される)である。電極アセンブリ140は、上側表面上(拡張可能な部材から離間する)に電極222を、下側表面上(拡張可能な部材に対する)に温度センサ226のような温度センサを備える複数層構造体である。電極アセンブリ140は、1つ以上のポリマ層および1つ以上の導電材料の層を含む。図9の断面に示すように、電極アセンブリ140は2つのポリマ層202および206、2つの導電層204および304、温度センサ226、並びに電極222を含む。ポリマ層および導電層は、導電層204および304に接着剤で接合されるポリマ層202および206の積層シートである。いくつかの実施形態では、2枚のそのようなシートが接着層205で一体的に接合される。図9に示すように、2枚のポリマ/導電性のシートは、導電性の側に対してポリマ側と一体的に接合され、これにより、断面が上側表面から始め(拡張可能な部材から離間して)、交互のポリマ206、導電部304、接着剤205、ポリマ202、導電部204の構造体が得られる。 The electrode assembly 140 is configured as a flexible circuit having a plurality of layers. Such layers are continuous or non-adjacent (ie, composed of discrete parts). Electrode assembly 140 is a multi-layer structure comprising an electrode 222 on the upper surface (spaced from the expandable member) and a temperature sensor such as temperature sensor 226 on the lower surface (relative to the expandable member). . The electrode assembly 140 includes one or more polymer layers and one or more layers of conductive material. As shown in the cross section of FIG. 9, the electrode assembly 140 includes two polymer layers 202 and 206, two conductive layers 204 and 304, a temperature sensor 226, and an electrode 222. The polymer layer and conductive layer are laminated sheets of polymer layers 202 and 206 that are bonded to the conductive layers 204 and 304 with an adhesive. In some embodiments, two such sheets are joined together with an adhesive layer 205. As shown in FIG. 9, the two polymer / conductive sheets are integrally joined to the polymer side with respect to the conductive side, so that the cross section begins at the upper surface (separate from the expandable member). Thus, a structure of alternating polymer 206, conductive portion 304, adhesive 205, polymer 202, and conductive portion 204 is obtained.
第2の導電層304は、接地および正の電極222の対のためのトレースを形成するようにエッチングされる。ビアは、第1の導電層204の温度センサ226接地トレースに対して第2の導電層304の電極接地トレースを接続するために形成される。温度センサ226は第1の導電層204上にハンダ付けされる。絶縁層206は凹部208を形成するように削られ、これにより金メッキが施され、金の電極222が形成される。 The second conductive layer 304 is etched to form a trace for the ground and positive electrode 222 pair. A via is formed to connect the electrode ground trace of the second conductive layer 304 to the temperature sensor 226 ground trace of the first conductive layer 204. The temperature sensor 226 is soldered on the first conductive layer 204. The insulating layer 206 is shaved so as to form a recess 208, and is gold-plated to form a gold electrode 222.
図10Aに示す別例では、外側電極の凹部のうちの1つは取り除かれ、温度センサ226は、凹部がかつてあった領域に位置される。凹部208は任意の方向に配向される。第1の導電層204は、温度センサ226と接地トレース210を共有するように構成され、新しいトレースが温度センサの正の接続のために形成される。より多くの温度センサを要求するより長手の電極において、温度センサは、図10Bに示すように、接地トレース210に沿って配置されるとともに互いに平行にワイヤ接続される。これに代えて、複数の温度センサが使用される場合、温度センサは個別にワイヤ接続されてもよい(図示しない)。 In another example shown in FIG. 10A, one of the outer electrode recesses is removed and the temperature sensor 226 is located in the region where the recess was once. The recess 208 is oriented in any direction. The first conductive layer 204 is configured to share the ground trace 210 with the temperature sensor 226, and a new trace is formed for the positive connection of the temperature sensor. In the longer electrodes that require more temperature sensors, the temperature sensors are placed along the ground trace 210 and wired in parallel to each other, as shown in FIG. 10B. Alternatively, if multiple temperature sensors are used, the temperature sensors may be individually wired (not shown).
いくつかの実施形態では、1つ以上の電極アセンブリ140は、予め定められた折り目線に沿って配置されるか、あるいは折り目線を形成し、この折り目線に沿って拡張可能な部材130が収縮後に折り畳まれる。いくつかの実施形態では、予め定められた折り目線は、拡張可能な部材130の再度の折り畳みを支援する。いくつかの実施形態では、1つ以上の電極アセンブリ140は略線形にあり、拡張可能な部材130の全長に沿った長手方向軸線L−Lに沿って、あるいは軸線L−Lに角度をなして延びる。いくつかの実施形態では、電極アセンブリは、近位側領域の長手方向軸線に平行に延び、続いて遠位側領域(図示しない)において角度をなす配向に屈曲される。1つ以上の電極アセンブリ140により、バルーンは1つ以上の電極アセンブリ140の線に沿って折り畳まれ、これにより、ガイド・シースまたはカテーテル14内にアブレーション器具120を格納するために要する格納力が低減され、より小径のガイド・シースの使用が可能となる。例えば、6Frあるいは7Frのガイド・カテーテル14が使用され、これにより8Frのガイド・カテーテルが以前に使用されていた所定の処置(例えば腎臓部の処置)において効果が得られる。1つ以上の電極アセンブリ140により、更に剪断力が低減され、あるいはバルーンの再折り畳み性能が改善され、これにより拡張可能な部材130からの1つ以上の電極アセンブリ140の剥離が低減される。 In some embodiments, the one or more electrode assemblies 140 are disposed along or form a crease line and the expandable member 130 contracts along the crease line. It will be folded later. In some embodiments, the predetermined crease line assists in refolding the expandable member 130. In some embodiments, the one or more electrode assemblies 140 are substantially linear and are along the longitudinal axis LL along the entire length of the expandable member 130 or at an angle to the axis LL. Extend. In some embodiments, the electrode assembly extends parallel to the longitudinal axis of the proximal region and is subsequently bent into an angular orientation in the distal region (not shown). The one or more electrode assemblies 140 cause the balloon to fold along the line of the one or more electrode assemblies 140, thereby reducing the storage force required to store the ablation instrument 120 within the guide sheath or catheter 14. Accordingly, a guide sheath having a smaller diameter can be used. For example, a 6Fr or 7Fr guide catheter 14 is used, which can be beneficial in certain procedures where an 8Fr guide catheter has been previously used (eg, kidney treatment). The one or more electrode assemblies 140 may further reduce shear forces or improve balloon refolding performance, thereby reducing separation of the one or more electrode assemblies 140 from the expandable member 130.
図8に示すように、いくつかの実施形態では、電極アセンブリ140は、単列または配列の正の電極212、および単列あるいは配列の外側電極210を含む。図11Aおよび図11Bに示すように、別例では、電極アセンブリ340および440は、長手方向に間隔をおいて配置される電極パッド308および336並びに408および436を含む。遠位側電極パッド308および408から近位側に移動して、連結した基層202、導電層304、および絶縁層206は、中間の尾部328および428に至る側面の幅が低減される。中間の尾部328および428から近位側に移動し続けると、連結した基層202、導電層304、および絶縁層206は側面の幅が増し、近位側電極パッド336および436が形成される。近位側電極パッド336および436は遠位側電極パッド308および408と同様に構成される。しかしながら、図示のように、近位側電極パッド336および436は、電極アセンブリ340および440に沿って延びる中央の長手方向軸線に対して遠位側電極パッド308および408から横断方向にずれる。 As shown in FIG. 8, in some embodiments, the electrode assembly 140 includes a single row or array of positive electrodes 212 and a single row or array of outer electrodes 210. As shown in FIGS. 11A and 11B, in another example, electrode assemblies 340 and 440 include electrode pads 308 and 336 and 408 and 436 spaced longitudinally. Moving proximally from the distal electrode pads 308 and 408, the connected base layer 202, conductive layer 304, and insulating layer 206 have reduced side widths leading to the intermediate tails 328 and 428. Continuing to move proximally from the middle tails 328 and 428, the connected base layer 202, conductive layer 304, and insulating layer 206 increase in lateral width to form proximal electrode pads 336 and 436. Proximal electrode pads 336 and 436 are configured similarly to distal electrode pads 308 and 408. However, as shown, the proximal electrode pads 336 and 436 are offset laterally from the distal electrode pads 308 and 408 with respect to a central longitudinal axis extending along the electrode assemblies 340 and 440.
近位側電極パッド336および436から、連結した基層202、導電層304、および絶縁層206は、側面の幅が低減され、近位側尾部338および438を形成する。近位側尾部338および438はコネクタ(図示しない)を含み、1つ以上のサブ配線ハーネスおよび/またはコネクタに、また、最終的に制御装置110に連結可能となる。これらの線の各々は、電極アセンブリ340および440の中心軸線に対して平行な対応する軸線に沿って拡張される。電極アセンブリ340および440は、電極アセンブリ340および440の中心軸線を基準とした遠位側電極パッド308および408、並びに近位側電極パッド336および436の対称、あるいは非対称の配置を有する。更に、電極パッドの両者の外側電極210は、アース線に加えて中心軸線に沿って略並べられる。この配置により所定の効果が得られることが分かっている。例えば、同じ接地トレースを実質的に共有することにより、近位側尾部の幅は、各電極パッドが個別のアース線を有する場合に約2倍になるのと比べて、中間の尾部の幅の約1.5倍のみである。従って、近位側尾部338および438は、並んで位置される2つの中間の尾部328および428よりも狭小である。 From the proximal electrode pads 336 and 436, the coupled base layer 202, conductive layer 304, and insulating layer 206 are reduced in lateral width to form proximal tails 338 and 438. Proximal tails 338 and 438 include connectors (not shown) that can be coupled to one or more sub-wiring harnesses and / or connectors and ultimately to controller 110. Each of these lines extends along a corresponding axis parallel to the central axis of electrode assemblies 340 and 440. Electrode assemblies 340 and 440 have a symmetrical or asymmetrical arrangement of distal electrode pads 308 and 408 and proximal electrode pads 336 and 436 with respect to the central axis of electrode assemblies 340 and 440. Further, the outer electrodes 210 of both electrode pads are generally arranged along the central axis in addition to the ground wire. It has been found that this arrangement provides a predetermined effect. For example, by sharing substantially the same ground trace, the width of the proximal tail is about twice that of the middle tail, compared to about twice when each electrode pad has a separate ground wire. Only about 1.5 times. Accordingly, the proximal tails 338 and 438 are narrower than the two middle tails 328 and 428 located side by side.
図11Aは、正の電極212および外側電極210の線形の列を備える電極アセンブリ340を示し、基層202を含む基板材料がこれらの列の間を延びる。図11Bは、電極212および210の線形の列の間を切り取られた基板材料を備える同様の電極アセンブリ440を示す。電極の列の間の基板材料を取り除くことにより、折り畳まれる必要のある回路の質量が低減される。バルーン上に配置されると、電極アセンブリ440は電極アセンブリ340と比較して、高められた折り畳み性を示す。その理由として、電極の線形の列の間に基板がないことにより、電極の列の間がより容易に折り畳まれ、温度センサ226が外側電極210と一体的に折り畳まれることが挙げられる。本構造体により、器具はより小型のシースまたはカテーテルを通して挿入されるか後退されることができる。しかしながら、図11Aに示すように、電極の列間に配置される基層202が設けられる場合でも、温度センサ226を中心から離間するように、かつ電極の列上に移動させることにより、図2Aおよび図2Bに示す先行技術による電極アセンブリに対して折り畳み性が高められる。図11Aおよび図11Bに示す電極アセンブリ340および440は、もっとも近位側の外側電極210に沿って、かつこの外側電極210よりも近位側に配置される温度センサ226を更に示す。この構造体により、2つの線形の列の電極および温度センサが設けられ、これにより、電極の列の間の線に沿って電極アセンブリが折り畳まれることが支援される。 FIG. 11A shows an electrode assembly 340 comprising linear rows of positive electrodes 212 and outer electrodes 210, with the substrate material comprising the base layer 202 extending between these rows. FIG. 11B shows a similar electrode assembly 440 comprising substrate material cut between linear rows of electrodes 212 and 210. By removing the substrate material between the rows of electrodes, the mass of the circuit that needs to be folded is reduced. When placed on a balloon, electrode assembly 440 exhibits enhanced foldability as compared to electrode assembly 340. The reason is that the absence of a substrate between the linear rows of electrodes makes it easier to fold between the rows of electrodes and the temperature sensor 226 to be folded together with the outer electrode 210. With this structure, the instrument can be inserted or retracted through a smaller sheath or catheter. However, as shown in FIG. 11A, even when a base layer 202 is provided between the electrode rows, by moving the temperature sensor 226 away from the center and onto the electrode rows, FIG. Foldability is enhanced over the prior art electrode assembly shown in FIG. 2B. The electrode assemblies 340 and 440 shown in FIGS. 11A and 11B further illustrate a temperature sensor 226 disposed along the most proximal outer electrode 210 and proximal to the outer electrode 210. This structure provides two linear rows of electrodes and a temperature sensor, which assists in folding the electrode assembly along a line between the rows of electrodes.
いくつかの実施形態では、温度センサ226は、スパッタリングされた熱電対(例えば、タイプTの構造体: 銅/コンスタンタン)である。図12Aおよび図12Bに示す実施形態では、温度センサは、接地トレース210上の中間の電極近傍の、連結部を備えた熱電対426である。中間の電極は、バルーンの付加により、変化がより少なく、先行技術による中心位置に対してよりよい相関性あるいは誤差を有する。いくつかの実施形態では、熱電対は、銅およびコンスタンタンの個別の層を含む。熱電対は、2つの層間の貫通孔によって形成され、ハンダで満たされる。これにより貫通孔は、熱電対連結部となる。図11Aおよび図11Bと同様に、図12Aは、基板または基層402が接地トレース210と正のトレース212との間に配置された電極アセンブリ440を示し、図12Bは、基板が正負の電極の列の間で取り払われた電極アセンブリ540を示す。 In some embodiments, the temperature sensor 226 is a sputtered thermocouple (eg, type T structure: copper / constantan). In the embodiment shown in FIGS. 12A and 12B, the temperature sensor is a thermocouple 426 with a connection near the middle electrode on the ground trace 210. The intermediate electrode has less change due to the addition of the balloon and has better correlation or error with respect to the center position according to the prior art. In some embodiments, the thermocouple includes separate layers of copper and constantan. The thermocouple is formed by a through hole between the two layers and filled with solder. Thereby, a through-hole becomes a thermocouple connection part. Similar to FIGS. 11A and 11B, FIG. 12A shows an electrode assembly 440 having a substrate or base layer 402 disposed between a ground trace 210 and a positive trace 212, and FIG. 12B shows an array of positive and negative electrodes on the substrate. The electrode assembly 540 is shown removed between.
図13Aおよび図13Bに示すように、熱電対連結部は、近位側の外側電極上に、あるいはその近傍に配置される。熱による連結部は、金およびコンスタンタンに代えて、銅およびコンスタンタン(Tタイプ)から形成される。しかしながら、連結部が加熱要素の正確な温度を測定することができるように、連結部は銅層近傍にある。熱電対は、本技術において周知のように、2つの相違する金属の連結部における温度に基づき、連結部に差動電圧を生じさせる。いくつかの実施形態では、等温の連結部が電極アセンブリ140の近位端に形成され、1つ以上の電極パッドおよび/または複数の電極とは間隔をおいて配置されるとともに熱的に隔離される。いくつかの実施形態では、温度センサ226は、導電層204内の電着された銅の個別のトレースとして形成される。いくつかの実施形態において、センサ・トレース214の遠位端部、また、いくつかの場合において、センサ・トレース214全体は、例えばコンスタンタン(すなわち、銅−ニッケル合金)、ニッケル・クロミウム、あるいは他の適切な導電材料から形成される。 As shown in FIGS. 13A and 13B, the thermocouple coupling is located on or near the proximal outer electrode. The connecting portion by heat is formed of copper and constantan (T type) instead of gold and constantan. However, the connection is in the vicinity of the copper layer so that the connection can measure the exact temperature of the heating element. Thermocouples generate a differential voltage at the junction based on the temperature at the junction of two different metals, as is well known in the art. In some embodiments, an isothermal connection is formed at the proximal end of the electrode assembly 140 and is spaced and thermally isolated from the one or more electrode pads and / or electrodes. The In some embodiments, temperature sensor 226 is formed as a separate trace of electrodeposited copper in conductive layer 204. In some embodiments, the distal end of sensor trace 214, and in some cases, the entire sensor trace 214 may be, for example, constantan (ie, copper-nickel alloy), nickel-chromium, or other It is formed from a suitable conductive material.
図13Aは、基板または基層502上に平行な列の外側電極210および正の電極212を有する別例による電極アセンブリ640を示す。温度センサ526は、もっとも近位側の外側電極210の近位端に連結部を備える熱電対である。図13Bは、基層502の一部が外側電極210および正の電極212の列の間で取り払われた同様の電極アセンブリ740を示す。 FIG. 13A shows another example electrode assembly 640 having parallel columns of outer electrodes 210 and positive electrodes 212 on a substrate or base layer 502. The temperature sensor 526 is a thermocouple including a coupling portion at the proximal end of the outermost electrode 210 on the most proximal side. FIG. 13B shows a similar electrode assembly 740 with a portion of the base layer 502 removed between the outer electrode 210 and positive electrode 212 rows.
例示的な器具は、それらのバルーン構造体およびバイポーラのエネルギー伝達により、RF伝達中にバルーン上、および組織の内部に非常に一様な温度プロフィールを有する。図14は、電極822、導電層804、および基層または基板802を備えた単純化されたモデル電極アセンブリ840を示す断面図である。図15A乃至15Cは、30秒加熱された様々な表面の熱プロフィールを示す。図15Aは、図14の断面A−Aにおける、ポリイミド基層802の面を示す。図15Bは、図14の断面B−Bにおける、銅の導電層804とポリイミド基層802との間の接合面を示す。図15Cは、図14の断面C−Cにおけるバルーンの外径を示す。図15A乃至15Cを比較すると分かるように、温度プロフィールは、電極アセンブリ840の断面を横断して略一定である。バルーン1501の中心の温度は電極1502の温度に近似する。この一貫性のために、バルーン1501の中心の温度は、更に電極アセンブリ1502の縁の温度に近似し、この温度とよく関連している。 Exemplary instruments have a very uniform temperature profile on the balloon and within the tissue during RF transmission due to their balloon structure and bipolar energy transfer. FIG. 14 is a cross-sectional view illustrating a simplified model electrode assembly 840 comprising an electrode 822, a conductive layer 804, and a base layer or substrate 802. FIGS. 15A-15C show the thermal profiles of various surfaces heated for 30 seconds. FIG. 15A shows the surface of the polyimide base layer 802 in section AA of FIG. FIG. 15B shows the bonding surface between the copper conductive layer 804 and the polyimide base layer 802 in section BB of FIG. FIG. 15C shows the outer diameter of the balloon in section CC in FIG. As can be seen by comparing FIGS. 15A-15C, the temperature profile is substantially constant across the cross section of the electrode assembly 840. The temperature at the center of the balloon 1501 approximates the temperature of the electrode 1502. Because of this consistency, the temperature at the center of the balloon 1501 further approximates the temperature of the edge of the electrode assembly 1502 and is well related to this temperature.
図16は、電極対1601の中心の温度、および中心からの様々な距離における温度を示す。図示のように、温度は、電極対の中心から電極の列の縁まで略一定である。電極近傍の温度の測定は、中心の温度の測定に代わり温度調整に適切であり、患部の一貫性が維持されることが分かっている。 FIG. 16 shows the temperature at the center of electrode pair 1601 and the temperature at various distances from the center. As shown, the temperature is substantially constant from the center of the electrode pair to the edge of the electrode row. Measuring the temperature in the vicinity of the electrodes has been found to be appropriate for temperature adjustment instead of the central temperature measurement, and to maintain consistency of the affected area.
使用の際、アブレーション器具120は、いくつかの場合に輸送シースまたはカテーテル14の支援により、血管または身体の通路を通して目的の組織に隣接している位置(例えば、腎動脈内)に進められる。いくつかの実施形態では、目的の組織は血管の周囲に配置される1つ以上の交感神経である。いくつかの実施形態では、制御装置110は、アブレーション器具120に作動的に連結される。アブレーション器具120は、拡張可能な部材130(複数の電極アセンブリ300を有する)が治療が必要な目的の組織に隣接するように配置されるように、血管または身体の通路に挿入される。治療が必要な目的の組織に隣接するようなアブレーション器具120の配置は、従来の方法(例えば透視法のガイダンスの下でガイドワイヤを伝って)によって行われる。適切に位置決めされると、拡張可能な部材130は、例えば、バルーンの場合約2乃至10気圧から流体を加圧することにより、折り畳まれた輸送形態から拡張形態に拡張される。これにより、血管の壁部に対して複数の電極が配置または押圧付勢される。複数の活性電極が活性化される。アブレーション・エネルギーは、複数の活性電極から目的の組織を通り(交感神経がアブレーションされ、調整され、あるいは衝撃を付与される)、バイポーラ構造体における複数の外側電極を通して戻るように、あるいはモノポーラ構造体における共通の外側電極を通して戻るように伝達される。処理に続いて、拡張可能な部材130は、ガイド・シースまたはカテーテル14内への格納、および血管または身体通路からの後の後退のために折り畳まれた輸送形態に折り畳まれる。 In use, the ablation instrument 120 is advanced through a blood vessel or body passageway to a location adjacent to the tissue of interest (eg, within the renal artery), in some cases with the aid of a transport sheath or catheter 14. In some embodiments, the tissue of interest is one or more sympathetic nerves that are placed around a blood vessel. In some embodiments, the controller 110 is operatively coupled to the ablation instrument 120. The ablation instrument 120 is inserted into a blood vessel or body passageway such that the expandable member 130 (having a plurality of electrode assemblies 300) is positioned adjacent to the tissue of interest that requires treatment. Placement of the ablation instrument 120 adjacent to the tissue of interest that requires treatment is performed by conventional methods (eg, over a guide wire under fluoroscopic guidance). When properly positioned, the expandable member 130 is expanded from a folded transport configuration to an expanded configuration, for example, by pressurizing fluid from about 2 to 10 atmospheres in the case of a balloon. Thereby, a some electrode is arrange | positioned or pressed with respect to the wall part of the blood vessel. A plurality of active electrodes are activated. Ablation energy passes from multiple active electrodes through target tissue (sympathetic nerves are ablated, regulated, or impacted) and returned through multiple outer electrodes in a bipolar structure, or a monopolar structure Is transmitted back through the common outer electrode. Following processing, the expandable member 130 is folded into a collapsed transport configuration for storage within the guide sheath or catheter 14 and subsequent retraction from the blood vessel or body passage.
アブレーション器具120(および/またはここに開示される他の器具)の様々な要素に使用することができる材料は、医療器具に一般に関連付けられるものを含む。単純に示す目的のために、以下にアブレーション器具120を後述する。しかしながら、これは、ここに開示される器具および方法に限定されることを意図したものではない。下記は、ここに開示される他の同様の管状部材および/または拡張可能部材、並びに/または管状部材および/または拡張可能部材の要素に適用される。 Materials that can be used for various elements of the ablation device 120 (and / or other devices disclosed herein) include those commonly associated with medical devices. For purposes of simplicity only, ablation instrument 120 is described below. However, this is not intended to be limited to the instruments and methods disclosed herein. The following applies to other similar tubular members and / or expandable members disclosed herein, and / or elements of tubular members and / or expandable members.
アブレーション器具120およびその様々な要素は、金属、合金、ポリマ(それらのいくつかの例を以下に示す)、金属−高分子複合材料、セラミックス、これらの組み合わせ等、あるいは他の適切な材料から形成される。適切なポリマのいくつかの例は、ポリテトラフルオロエチレン(PTFE)、エチレン・テトラフロオルエチレン(ETFE)、フッ化エチレンプロピレン(FEP)、ポリオキシメチレン(POM、例えばデュポン社から販売されているDELRTN(登録商標))、ポリエーテル・ブロック・エステル、ポリウレタン(例えばポリウレタン85A)、ポリプロピレン(PP)、ポリ塩化ビニル(PVC)、ポリエーテル・エステル(例えばDSMエンジニアリング・プラスチックス社から販売されているARNITEL(登録商標))、エーテルあるいはエステルベースの共重合体(例えば、ブチレン/ポリ(アルキレン・エーテル)フタル酸塩および/またはデュポンから販売されているHYTREL(登録商標)のような他のポリエステルエラストマ)、ポリアミド(例えばバイエル社から販売されているDURETHAN(登録商標)やElf Atochem社から販売されているCRISTAMID(登録商標))、エラストマ系のポリアミド、ブロック・ポリアミド/エーテル、ポリエーテル・ブロック・アミド(PEBA、例えば商標PEBAX(登録商標)で販売されている)、エチレン酢酸ビニル共重合体(EVA)、シリコーン、ポリエチレン(PE)、Marlex(登録商標)高密度ポリエチレン、Marlex(登録商標)低密度ポリエチレン、リニア低密度ポリエチレン(例えばREXELL(登録商標))、ポリエステル、ポリブチレン・テレフタレート(PBT)、ポリエチレン・テレフタレート(PET)、ポリトリメチレン・テレフタレート、ポリエチレンナフタレート(PEN)、ポリエーテルエーテルケトン(PEEK)、ポリイミド(PI)、ポリエーテルイミド(PEI)、ポリフェニレン・サルファイド(PPS)、ポリフェニレン・オキシド(PPO)、ポリパラフェニレン・テレフタルアミド(例えばKEVLAR(登録商標))、ポリスルフホン、ナイロン、ナイロン12(EMS American Grilon社から販売されているGRILAMID(登録商標)など)、パーフルオロ(プロピルビニルエーテル)(PFA)、エチレン・ビニルアルコール、ポリオレフィン、ポリスチレン、エポキシ樹脂、ポリ塩化ビニリデン(PVdC)、ポリ(スチレン‐b‐イソブチレン‐b‐スチレン)(例えばSIBSおよび/またはSIBS 50A)、ポリカーボネート、イオノマ、生体適合性を備えたポリマ、他の適切な材料、あるいは混合物、組み合わせ、これらの共重合体、ポリマ/金属合成物などを含む。いくつかの実施形態において、シースは液晶ポリマ(LCP)と混合可能である。例えば、その混合物は約6パーセント以内のLCPを含み得る。 Ablation instrument 120 and its various elements are formed from metals, alloys, polymers (some examples of which are given below), metal-polymer composites, ceramics, combinations thereof, or other suitable materials. Is done. Some examples of suitable polymers are sold by polytetrafluoroethylene (PTFE), ethylene tetrafluoroethylene (ETFE), fluorinated ethylene propylene (FEP), polyoxymethylene (POM, eg DuPont). DELRTN®), polyether block ester, polyurethane (eg polyurethane 85A), polypropylene (PP), polyvinyl chloride (PVC), polyether ester (eg DSM Engineering Plastics) ARNITEL®), ether or ester based copolymers (eg, butylene / poly (alkylene ether) phthalates and / or other polyesters such as HYTREL® sold by DuPont). Terelastomer), polyamide (for example, DURETHAN (registered trademark) sold by Bayer and CRISTAMID (registered trademark) sold by Elf Atochem), elastomeric polyamide, block polyamide / ether, polyether block Amides (sold under PEBA, for example the trademark PEBAX®), ethylene vinyl acetate copolymer (EVA), silicone, polyethylene (PE), Marlex® high density polyethylene, Marlex® Low density polyethylene, linear low density polyethylene (for example, REXELL (registered trademark)), polyester, polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polytrimethylene terephthalate Polyethylene naphthalate (PEN), polyetheretherketone (PEEK), polyimide (PI), polyetherimide (PEI), polyphenylene sulfide (PPS), polyphenylene oxide (PPO), polyparaphenylene terephthalamide ( For example, KEVLAR (registered trademark), polysulfone, nylon, nylon 12 (such as GRILAMID (registered trademark) sold by EMS American Grilon), perfluoro (propyl vinyl ether) (PFA), ethylene vinyl alcohol, polyolefin, polystyrene , Epoxy resin, polyvinylidene chloride (PVdC), poly (styrene-b-isobutylene-b-styrene) (eg SIBS and / or SIBS 50A), poly Including Boneto, ionomers, polymers having biocompatibility, other suitable materials, or mixtures, combinations, copolymers thereof, polymer / metal composites, and the like. In some embodiments, the sheath can be mixed with a liquid crystal polymer (LCP). For example, the mixture can contain up to about 6 percent LCP.
適切な金属および合金のいくつかの例は、304V、304L、および316LVステンレス鋼などのステンレス鋼;軟鋼;線形弾性および/または超弾性ニチノールなどのニッケル・チタン合金;ニッケル・クロミウム・モリブデン合金(例えばINCONEL(登録商標)625のようなUNS:N06625、HASTELLOY(登録商標)、C−22(登録商標)などのUNS:N06022、HASTELLOY(登録商標)、C276(登録商標)などのUNS:N10276、他のHASTELLOY(登録商標)合金など)のような他のニッケル合金、ニッケル銅合金(例えばMONEL(登録商標)400、NICKELVAC(登録商標)400、NICORROS(登録商標)400などのUNS:N04400)、ニッケル・コバルト・クロミウム・モリブデン合金(例えば、MP35N(登録商標)などのUNS:R30035)、ニッケル・モリブデン合金(例えば、HASTELLOY(登録商標)ALLOY B2(登録商標)などのUNS: N10665)、他のニッケル・クロム合金、他のニッケル・モリブデン合金、他のニッケル・コバルト合金、他のニッケル鉄合金、他のニッケル銅合金、他のニッケル・タングステンあるいはタングステン合金など;コバルト・クロム合金;コバルト・クロミウム・モリブデン合金(例えばELGILOY(登録商標)、PHYNOX(登録商標)などのUNS:R30003);白金を豊富に含むステンレス鋼;チタン;これらの組み合わせなど;あるいは他の適切な材料を含む。 Some examples of suitable metals and alloys include: stainless steels such as 304V, 304L, and 316LV stainless steel; mild steel; nickel-titanium alloys such as linear elastic and / or superelastic Nitinol; nickel-chromium-molybdenum alloys (eg, UNS: N06625 such as INCONEL (registered trademark) 625, UNS: N06022, such as HASTELLOY (registered trademark), C-22 (registered trademark), UNS: N10276 such as C276 (registered trademark), etc. Other nickel alloys such as HASTELLOY® alloys, etc., nickel copper alloys (eg UNS: N04400 such as MONEL® 400, NICKELVAC® 400, NICORROS® 400) Nickel-cobalt-chromium-molybdenum alloys (eg UNS: R30035 such as MP35N®), nickel-molybdenum alloys (eg UNS: N10665 such as HASTELLOY® ALLOY B2®), etc. Nickel-chromium alloys, other nickel-molybdenum alloys, other nickel-cobalt alloys, other nickel-iron alloys, other nickel-copper alloys, other nickel-tungsten or tungsten alloys, etc .; cobalt-chromium alloys; cobalt-chromium- Molybdenum alloys (eg UNS: R30003 such as ELGILOY®, PHYNOX®); platinum-rich stainless steel; titanium; combinations thereof; or other suitable materials.
ここに示唆されるように、市場にて入手可能なニッケル・チタンやニチノール合金の系は、「線形弾性」あるいは「非超弾性」と示されるカテゴリであり、これは化学において従来の形状記憶および超弾性の変形と同様であるが、明瞭かつ有用な機械的特性を示すものである。線形弾性かつ/または非超弾性ニチノールは、超弾性ニチノールが示すようなその応力/負荷曲線における実質的な「超弾性平坦部(plateau)」や「フラグ領域」を線形弾性かつ/または非超弾性ニチノールが示さないという点において、超弾性ニチノールと識別される。これに代えて、線形弾性および/または非超弾性ニチノールにおいて、復元可能な負荷が増加すると、塑性変形が開始されるまで、超弾性ニチノールで見られる超弾性の平坦部および/またはフラグ領域が略線形の関係において、あるいは必ずしも完全である必要はないが完全な線形の関係において、あるいは少なくともより線形な関係において、応力が継続して増加する。したがって、本開示のために、線形弾性および/または非超弾性ニチノールは、「実質的に」線形弾性および/または非超弾性ニチノールとも示される。 As suggested here, nickel-titanium and nitinol alloy systems available on the market are the categories indicated as “linear elastic” or “non-superelastic”, which is the traditional shape memory and chemistry in chemistry. Similar to superelastic deformation, but exhibits clear and useful mechanical properties. Linear elastic and / or non-superelastic nitinol is a linear elastic and / or non-superelastic material that has a substantial “superelastic plateau” or “flag region” in its stress / load curve as superelastic nitinol exhibits. It is distinguished from superelastic nitinol in that nitinol does not show. Alternatively, in linear elastic and / or non-superelastic nitinol, when the recoverable load increases, the superelastic flats and / or flag regions seen in superelastic nitinol are substantially reduced until plastic deformation is initiated. Stress continues to increase in a linear relationship, or not necessarily in a complete linear relationship, or at least in a more linear relationship. Thus, for purposes of this disclosure, linear elastic and / or non-superelastic nitinol is also referred to as “substantially” linear elastic and / or non-superelastic nitinol.
所定の場合において、線形弾性および/または非超弾性ニチノールは、線形弾性および/または非超弾性ニチノールが約2乃至5%までの負荷を受けるが、実質的に弾性を保持し(例えば、塑性変形前の)、超弾性ニチノールが塑性変形前に約8%までの負荷を受ける点で超弾性ニチノールから更に識別可能である。これらの材料の両者は、ステンレス鋼(その塑性に基づいて更に識別可能である)のような他の線形弾性材と識別することができ、これらは塑性変形前に約0.2乃至0.44パーセントの負荷のみを受ける。 In certain cases, linear elastic and / or non-superelastic nitinol is loaded with up to about 2-5% linear elastic and / or non-superelastic nitinol, but remains substantially elastic (eg, plastic deformation Previously, superelastic nitinol is further distinguishable from superelastic nitinol in that it is loaded up to about 8% before plastic deformation. Both of these materials can be distinguished from other linear elastic materials such as stainless steel (which can be further distinguished on the basis of its plasticity), which are approximately 0.2 to 0.44 prior to plastic deformation. Receive only a percentage load.
いくつかの実施形態において、線形弾性および/または非超弾性ニッケル・チタン合金は、大きな温度領域にわたって示差走査熱量測定(DSC)および動的な金属熱分析(DMTA)分析によって検知可能ないかなるマルテンサイト/オーステナイト位相変化も示さない合金である。例えば、いくつかの実施形態において、線形弾性および/または非超弾性を備えるニッケル・チタン合金において、摂氏約−60度(℃)乃至約120 ℃の範囲にDSCおよびDMTA分析によって検知可能なマルテンサイト/オーステナイト相変化は存在しない。したがって、そのような材料の機械的な曲げ特性は、温度のこの広範囲にわたって温度の影響に対して通常不活発である。いくつかの実施形態において、周囲温度または室温の線形弾性および/または非超弾性のニッケル・チタン合金の機械的な曲げ特性は、例えばそれらが超弾性平坦部および/またはフラグ領域を示さないという点において、体温における機械的特性と略同じである。すなわち、広い温度領域を横断して、線形弾性および/または非超弾性ニッケル・チタン合金は、その線形弾性および/または非超弾性の特徴および/または特性を保持する。 In some embodiments, the linear elastic and / or non-superelastic nickel-titanium alloy is any martensite detectable by differential scanning calorimetry (DSC) and dynamic metal thermal analysis (DMTA) analysis over a large temperature range. / Alloy that does not show austenite phase change. For example, in some embodiments, martensite detectable by DSC and DMTA analysis in a range of about −60 degrees Celsius (° C.) to about 120 ° C. in a nickel-titanium alloy with linear elasticity and / or non-superelasticity. / There is no austenite phase change. Thus, the mechanical bending properties of such materials are usually inactive with respect to temperature effects over this wide range of temperatures. In some embodiments, the mechanical bending properties of linear elastic and / or non-superelastic nickel-titanium alloys at ambient or room temperature are, for example, that they do not exhibit superelastic flats and / or flag regions. Is substantially the same as the mechanical characteristics at body temperature. That is, across a wide temperature range, a linear elastic and / or non-superelastic nickel-titanium alloy retains its linear elastic and / or non-superelastic characteristics and / or properties.
いくつかの実施形態において、線形弾性および/または非超弾性ニッケル・チタン合金は、約50乃至約60重量パーセントの範囲のニッケルであり、残部が実質的にチタンである。いくつかの実施形態において、組成は、約54乃至約57重量パーセントの範囲のニッケである。適切なニッケル・チタン合金の一例は、神奈川(日本)の古河テクノマテリアル社から販売されているFHP−NT合金である。ニッケル・チタン合金のいくつかの例は米国特許第5238004号明細書および第6508803号明細書に開示され、これらの明細書はその全体がここに開示されたものとする。他の適切な材料は、ULTANIUM(登録商標)(Neo−Metrics社から販売されている)およびGUM METAL(登録商標)(トヨタ社から販売されている)を含む。他のいくつかの実施形態において、超弾性合金、例えば超弾性ニチノールが所望の特性を得るために使用される。 In some embodiments, the linear elastic and / or non-superelastic nickel-titanium alloy is nickel in the range of about 50 to about 60 weight percent with the balance being substantially titanium. In some embodiments, the composition is a Nicke in the range of about 54 to about 57 weight percent. An example of a suitable nickel-titanium alloy is the FHP-NT alloy sold by Furukawa Techno Materials of Kanagawa (Japan). Some examples of nickel-titanium alloys are disclosed in US Pat. Nos. 5,234,004 and 6,508,803, which are hereby incorporated in their entirety. Other suitable materials include ULTINIUM® (sold by Neo-Metrics) and GUM METAL® (sold by Toyota). In some other embodiments, a superelastic alloy, such as a superelastic nitinol, is used to obtain the desired properties.
少なくともいくつかの実施形態では、アブレーション器具120の部分は更に放射線不透過性の材料でドープされるか、形成されるか、これを含む。放射線不透過性の材料は、医学的処置の間に蛍光透視スクリーンや、別の映像技術上に比較的明るい像を生成することができる材料であるものといえる。この比較的明るい像は、アブレーション器具120のユーザがその位置を判断することを支援する。放射線不透過性の材料のいくつかの例は、金、白金、パラジウム、タンタル、タングステン合金、放射線不透過性充填剤を装填した高分子材料などを含むが、これらに限定されるものではない。加えて、他の放射線不透過性マーカ・バンド、および/またはコイルも同じ結果を得るべくアブレーション器具120の構成に更に組み込まれる。 In at least some embodiments, the portion of the ablation instrument 120 is further doped, formed or includes a radiopaque material. A radiopaque material can be one that can produce a relatively bright image on a fluoroscopic screen or another imaging technique during a medical procedure. This relatively bright image assists the user of the ablation instrument 120 to determine its location. Some examples of radiopaque materials include, but are not limited to, gold, platinum, palladium, tantalum, tungsten alloys, polymeric materials loaded with radiopaque fillers, and the like. In addition, other radiopaque marker bands and / or coils are further incorporated into the configuration of the ablation instrument 120 to achieve the same result.
いくつかの実施形態において、所定の程度の磁気共鳴画像診断法(MRI)適合性が、アブレーション器具120に付与される。例えば、器具の部分は、実質的に像を歪めたり実質的にアーティファクト(つまり像中のギャップ)を形成しない材料から形成される。所定の強磁性体は、例えば、MRI像にアーティファクトを形成するため、適切ではない。これらのうちのいくつか、および別例では、アブレーション器具120の部分は、MRI機械が撮像可能な材料から更に形成される。これらの特性を示すいくつかの材料は、例えば、タングステン、コバルト・クロミウム・モリブデン合金(例えば、ELGILOY(登録商標)、PHYNOX(登録商標)などのUNS:R30003)、ニッケル・コバルト・クロミウム・モリブデン合金(例えば、MP35N(登録商標)などのUNS:R30035)、ニチノールなど、および他のものを含む。 In some embodiments, a predetermined degree of magnetic resonance imaging (MRI) compatibility is imparted to the ablation instrument 120. For example, the portion of the instrument is formed of a material that does not substantially distort the image or form artifacts (ie, gaps in the image). Certain ferromagnets are not suitable, for example, because they form artifacts in the MRI image. In some of these, and in another example, the portion of the ablation instrument 120 is further formed from a material that the MRI machine can image. Some materials that exhibit these properties include, for example, tungsten, cobalt-chromium-molybdenum alloys (eg, UNS: R30003 such as ELGILOY®, PHYNOX®), nickel-cobalt-chromium-molybdenum alloys. (Eg, UNS: R30035 such as MP35N®), nitinol, and others.
2013年1月25日に米国特許出願第13/750879号として出願された米国特許出願公開第2013−0165926A1号明細書は、その全体がここに開示されたものとする。 US Patent Application Publication No. 2013-0165926A1, filed January 25, 2013 as US Patent Application No. 13/750879, is hereby incorporated in its entirety.
本開示は単に多くの点において例示に過ぎないものといえる。変更が、特に本開示の範囲を逸脱することなく形状、寸法、および工程の構成に関して詳細になされてもよい。これは、適切である程度まで、他の実施形態において使用される一例の実施形態の任意の要素の使用を含む。本発明の範囲は、添付の特許請求の範囲に示される言語に定義される。 The disclosure is merely illustrative in many respects. Changes may be made in detail with respect to shapes, dimensions, and process configurations, particularly without departing from the scope of the present disclosure. This includes the use of any element of an example embodiment used in other embodiments, to an extent appropriate. The scope of the present invention is defined in the language set forth in the appended claims.
Claims (15)
カテーテル・シャフトと、
同カテーテル・シャフト上に配置されるとともに、非拡張形態と拡張形態との間を変化可能である拡張可能なバルーンと、
各々フレキシブル回路として構成される複数の長尺状電極アセンブリとを備え、同複数の電極アセンブリは各々、少なくとも第1および第2の離間した配列に配置される複数の電極を含み、該複数の電極アセンブリは前記バルーンの外側表面上に配置され、
前記複数の電極アセンブリの各々は、前記配列内の2つ以上の前記電極と一列に並べられる1つ以上の温度センサを含むことを特徴とする組織アブレーション用の医療器具。 A medical device for tissue ablation,
A catheter shaft;
An expandable balloon disposed on the catheter shaft and capable of changing between an unexpanded configuration and an expanded configuration;
A plurality of elongated electrode assemblies each configured as a flexible circuit, the plurality of electrode assemblies each including a plurality of electrodes disposed in at least first and second spaced apart arrangements, the plurality of electrodes The assembly is disposed on an outer surface of the balloon;
Each of the plurality of electrode assemblies includes one or more temperature sensors aligned with two or more of the electrodes in the array.
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US11116571B2 (en) | 2021-09-14 |
US9907609B2 (en) | 2018-03-06 |
US20180140356A1 (en) | 2018-05-24 |
CN106572881A (en) | 2017-04-19 |
US20210353357A1 (en) | 2021-11-18 |
EP3424453A1 (en) | 2019-01-09 |
US20150216591A1 (en) | 2015-08-06 |
JP6325121B2 (en) | 2018-05-16 |
EP3102136B1 (en) | 2018-06-27 |
EP3102136A1 (en) | 2016-12-14 |
CN106572881B (en) | 2019-07-26 |
WO2015119890A1 (en) | 2015-08-13 |
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