|
WO2014079478A1
(en)
|
2012-11-20 |
2014-05-30 |
Light In Light Srl |
High speed laser processing of transparent materials
|
|
EP2754524B1
(de)
|
2013-01-15 |
2015-11-25 |
Corning Laser Technologies GmbH |
Verfahren und Vorrichtung zum laserbasierten Bearbeiten von flächigen Substraten, d.h. Wafer oder Glaselement, unter Verwendung einer Laserstrahlbrennlinie
|
|
US9701564B2
(en)
|
2013-01-15 |
2017-07-11 |
Corning Incorporated |
Systems and methods of glass cutting by inducing pulsed laser perforations into glass articles
|
|
EP2781296B1
(de)
|
2013-03-21 |
2020-10-21 |
Corning Laser Technologies GmbH |
Vorrichtung und verfahren zum ausschneiden von konturen aus flächigen substraten mittels laser
|
|
US10005152B2
(en)
*
|
2013-11-19 |
2018-06-26 |
Rofin-Sinar Technologies Llc |
Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
|
|
US9517963B2
(en)
|
2013-12-17 |
2016-12-13 |
Corning Incorporated |
Method for rapid laser drilling of holes in glass and products made therefrom
|
|
US20150166393A1
(en)
*
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Laser cutting of ion-exchangeable glass substrates
|
|
US9676167B2
(en)
|
2013-12-17 |
2017-06-13 |
Corning Incorporated |
Laser processing of sapphire substrate and related applications
|
|
US9815730B2
(en)
|
2013-12-17 |
2017-11-14 |
Corning Incorporated |
Processing 3D shaped transparent brittle substrate
|
|
US10442719B2
(en)
|
2013-12-17 |
2019-10-15 |
Corning Incorporated |
Edge chamfering methods
|
|
US9850160B2
(en)
|
2013-12-17 |
2017-12-26 |
Corning Incorporated |
Laser cutting of display glass compositions
|
|
US20150165560A1
(en)
|
2013-12-17 |
2015-06-18 |
Corning Incorporated |
Laser processing of slots and holes
|
|
US9701563B2
(en)
|
2013-12-17 |
2017-07-11 |
Corning Incorporated |
Laser cut composite glass article and method of cutting
|
|
US11556039B2
(en)
|
2013-12-17 |
2023-01-17 |
Corning Incorporated |
Electrochromic coated glass articles and methods for laser processing the same
|
|
JP6262039B2
(ja)
|
2014-03-17 |
2018-01-17 |
株式会社ディスコ |
板状物の加工方法
|
|
JP6301203B2
(ja)
*
|
2014-06-02 |
2018-03-28 |
株式会社ディスコ |
チップの製造方法
|
|
KR102445217B1
(ko)
|
2014-07-08 |
2022-09-20 |
코닝 인코포레이티드 |
재료를 레이저 가공하는 방법 및 장치
|
|
WO2016010943A2
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Method and system for arresting crack propagation
|
|
LT3169477T
(lt)
*
|
2014-07-14 |
2020-05-25 |
Corning Incorporated |
Skaidrių medžiagų apdorojimo sistema ir būdas, naudojant lazerio pluošto židinio linijas, kurių ilgis ir skersmuo yra reguliuojami
|
|
US10526234B2
(en)
|
2014-07-14 |
2020-01-07 |
Corning Incorporated |
Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
|
|
WO2016010949A1
(en)
|
2014-07-14 |
2016-01-21 |
Corning Incorporated |
Method and system for forming perforations
|
|
US9617180B2
(en)
|
2014-07-14 |
2017-04-11 |
Corning Incorporated |
Methods and apparatuses for fabricating glass articles
|
|
US10047001B2
(en)
|
2014-12-04 |
2018-08-14 |
Corning Incorporated |
Glass cutting systems and methods using non-diffracting laser beams
|
|
JP2018507154A
(ja)
|
2015-01-12 |
2018-03-15 |
コーニング インコーポレイテッド |
マルチフォトン吸収方法を用いた熱強化基板のレーザー切断
|
|
US10429553B2
(en)
|
2015-02-27 |
2019-10-01 |
Corning Incorporated |
Optical assembly having microlouvers
|
|
EP3269688B1
(en)
*
|
2015-03-11 |
2021-04-28 |
Panasonic Intellectual Property Management Co., Ltd. |
Manufacturing method for glass panel unit and manufacturing method for glass window
|
|
JP7292006B2
(ja)
|
2015-03-24 |
2023-06-16 |
コーニング インコーポレイテッド |
ディスプレイガラス組成物のレーザ切断及び加工
|
|
CN107666983B
(zh)
|
2015-03-27 |
2020-10-02 |
康宁股份有限公司 |
可透气窗及其制造方法
|
|
KR20180006935A
(ko)
|
2015-05-13 |
2018-01-19 |
코닝 인코포레이티드 |
감소된 핫스팟을 가진 광 가이드와 그 제조 방법
|
|
US11186060B2
(en)
|
2015-07-10 |
2021-11-30 |
Corning Incorporated |
Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
|
|
DE102015111490A1
(de)
*
|
2015-07-15 |
2017-01-19 |
Schott Ag |
Verfahren und Vorrichtung zum lasergestützten Abtrennen eines Teilstücks von einem flächigen Glaselement
|
|
US20180166353A1
(en)
*
|
2015-08-21 |
2018-06-14 |
Corning Incorporated |
Glass substrate assemblies having low dielectric properties
|
|
CN105855244B
(zh)
*
|
2016-04-25 |
2018-11-09 |
江苏大学 |
一种曲轴油孔的激光空化清洁强化装置及清洁强化方法
|
|
SG11201809797PA
(en)
|
2016-05-06 |
2018-12-28 |
Corning Inc |
Laser cutting and removal of contoured shapes from transparent substrates
|
|
US10410883B2
(en)
|
2016-06-01 |
2019-09-10 |
Corning Incorporated |
Articles and methods of forming vias in substrates
|
|
US10794679B2
(en)
|
2016-06-29 |
2020-10-06 |
Corning Incorporated |
Method and system for measuring geometric parameters of through holes
|
|
WO2018020144A1
(fr)
*
|
2016-07-25 |
2018-02-01 |
Amplitude Systemes |
Appareil et procédé de découpe de matériau par faisceau laser allongé non diffractif
|
|
KR20190035805A
(ko)
|
2016-07-29 |
2019-04-03 |
코닝 인코포레이티드 |
레이저 처리를 위한 장치 및 방법
|
|
US10522963B2
(en)
|
2016-08-30 |
2019-12-31 |
Corning Incorporated |
Laser cutting of materials with intensity mapping optical system
|
|
EP3296054B1
(de)
*
|
2016-09-19 |
2020-12-16 |
Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. |
Verfahren zur herstellung eines mikrobearbeiteten werkstücks mittels laserabtrag
|
|
CN107876971A
(zh)
*
|
2016-09-30 |
2018-04-06 |
上海微电子装备（集团）股份有限公司 |
一种激光切割装置及方法
|
|
CN109803786B
(zh)
|
2016-09-30 |
2021-05-07 |
康宁股份有限公司 |
使用非轴对称束斑对透明工件进行激光加工的设备和方法
|
|
US11542190B2
(en)
*
|
2016-10-24 |
2023-01-03 |
Corning Incorporated |
Substrate processing station for laser-based machining of sheet-like glass substrates
|
|
US10752534B2
(en)
*
|
2016-11-01 |
2020-08-25 |
Corning Incorporated |
Apparatuses and methods for laser processing laminate workpiece stacks
|
|
US10668561B2
(en)
*
|
2016-11-15 |
2020-06-02 |
Coherent, Inc. |
Laser apparatus for cutting brittle material
|
|
US10688599B2
(en)
|
2017-02-09 |
2020-06-23 |
Corning Incorporated |
Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
|
|
JP6955684B2
(ja)
*
|
2017-03-09 |
2021-10-27 |
株式会社リコー |
光加工装置、及び光加工物の生産方法
|
|
JP2020513118A
(ja)
*
|
2017-04-12 |
2020-04-30 |
サン−ゴバン グラス フランス |
エレクトロクロミック構造およびエレクトロクロミック構造の分離方法
|
|
US10580725B2
(en)
|
2017-05-25 |
2020-03-03 |
Corning Incorporated |
Articles having vias with geometry attributes and methods for fabricating the same
|
|
US11078112B2
(en)
|
2017-05-25 |
2021-08-03 |
Corning Incorporated |
Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
|
|
US10626040B2
(en)
|
2017-06-15 |
2020-04-21 |
Corning Incorporated |
Articles capable of individual singulation
|
|
JP6893691B2
(ja)
*
|
2017-09-29 |
2021-06-23 |
三星ダイヤモンド工業株式会社 |
複層脆性材料基板の作製方法および作製システム
|
|
KR102629386B1
(ko)
*
|
2017-11-27 |
2024-01-29 |
닛토덴코 가부시키가이샤 |
플라스틱 필름의 레이저 가공 방법 및 플라스틱 필름
|
|
JP2019109396A
(ja)
*
|
2017-12-19 |
2019-07-04 |
シャープ株式会社 |
表示パネルの製造方法
|
|
US12180108B2
(en)
|
2017-12-19 |
2024-12-31 |
Corning Incorporated |
Methods for etching vias in glass-based articles employing positive charge organic molecules
|
|
JP2019139182A
(ja)
*
|
2018-02-15 |
2019-08-22 |
株式会社ディスコ |
液晶パネルの製造方法
|
|
US11554984B2
(en)
|
2018-02-22 |
2023-01-17 |
Corning Incorporated |
Alkali-free borosilicate glasses with low post-HF etch roughness
|
|
US11992894B2
(en)
|
2018-02-23 |
2024-05-28 |
Corning Incorporated |
Method of separating a liquid lens from an array of liquid lenses
|
|
US12202759B2
(en)
|
2018-02-26 |
2025-01-21 |
Corning Incorporated |
Methods for laser forming transparent articles from a transparent mother sheet and processing the transparent articles in-situ
|
|
US11401195B2
(en)
*
|
2018-03-29 |
2022-08-02 |
Corning Incorporated |
Selective laser processing of transparent workpiece stacks
|
|
TWI677395B
(zh)
*
|
2018-03-31 |
2019-11-21 |
財團法人工業技術研究院 |
硬脆材料切割方法及其裝置
|
|
US11344973B2
(en)
|
2018-04-19 |
2022-05-31 |
Corning Incorporated |
Methods for forming holes in substrates
|
|
DE102018110211A1
(de)
|
2018-04-27 |
2019-10-31 |
Schott Ag |
Verfahren zum Erzeugen feiner Strukturen im Volumen eines Substrates aus sprödharten Material
|
|
WO2019226886A1
(en)
*
|
2018-05-25 |
2019-11-28 |
Corning Incorporated |
Scribing thin ceramic materials using beam focal line
|
|
US11059131B2
(en)
*
|
2018-06-22 |
2021-07-13 |
Corning Incorporated |
Methods for laser processing a substrate stack having one or more transparent workpieces and a black matrix layer
|
|
US11524366B2
(en)
*
|
2018-07-26 |
2022-12-13 |
Coherent Munich GmbH & Co. KG |
Separation and release of laser-processed brittle material
|
|
CN109693046B
(zh)
*
|
2019-03-07 |
2021-03-16 |
大族激光科技产业集团股份有限公司 |
一种双层基板的孔结构激光加工方法
|
|
US11054574B2
(en)
|
2019-05-16 |
2021-07-06 |
Corning Research & Development Corporation |
Methods of singulating optical waveguide sheets to form optical waveguide substrates
|
|
CN114556163A
(zh)
*
|
2019-08-15 |
2022-05-27 |
康宁股份有限公司 |
结合基材以及通过结合部分离所结合的基材的一部分的方法，例如制造液体透镜阵列以及将阵列分离为独立的液体透镜
|
|
CN110723900A
(zh)
*
|
2019-09-16 |
2020-01-24 |
深圳市裕展精密科技有限公司 |
玻璃复合件、玻璃复合件的制备方法以及激光焊接设备
|
|
DE102019135283A1
(de)
*
|
2019-12-19 |
2021-06-24 |
Trumpf Laser- Und Systemtechnik Gmbh |
Verfahren zur Lasermaterialbearbeitung und Laserbearbeitungsanlage
|
|
KR20230020534A
(ko)
*
|
2020-06-10 |
2023-02-10 |
코닝 인코포레이티드 |
탑햇 에너지 분포를 사용하여 코팅 기판을 레이저 가공하는 방법
|
|
BR112023003143A2
(pt)
*
|
2020-08-21 |
2023-04-04 |
Araujo Dayrell Ivan |
Padrão de filtragem para feixes de laser adequados para a produção de supercapacitores
|
|
CN114178710B
(zh)
*
|
2020-08-24 |
2024-11-26 |
奥特斯(中国)有限公司 |
部件承载件及其制造方法
|
|
DE102020213776A1
(de)
|
2020-11-03 |
2022-05-05 |
Q.ant GmbH |
Verfahren zum Spalten eines Kristalls
|
|
EP4011846A1
(en)
|
2020-12-09 |
2022-06-15 |
Schott Ag |
Method of structuring a glass element and structured glass element produced thereby
|
|
CN112719628B
(zh)
*
|
2020-12-18 |
2023-08-29 |
浙江泰仑电力集团有限责任公司 |
基于异物透明度的复色激光异物清除装置及方法
|
|
US12304005B2
(en)
|
2021-02-01 |
2025-05-20 |
Corning Incorporated |
Sacrificial layers to enable laser cutting of textured substrates
|
|
JP7700265B2
(ja)
*
|
2021-04-23 |
2025-06-30 |
ショット アクチエンゲゼルシャフト |
レーザービームの線状焦点を用いて基板内に導入されるエネルギー分布を制御するための方法および基板
|
|
FR3125292B1
(fr)
*
|
2021-07-16 |
2023-12-29 |
Saint Gobain |
Procédé de découpage d’un panneau de verre feuilleté
|
|
FR3125293B1
(fr)
*
|
2021-07-16 |
2023-12-29 |
Saint Gobain |
Procédé de découpage d’un panneau de verre feuilleté
|
|
WO2023096776A2
(en)
*
|
2021-11-29 |
2023-06-01 |
Corning Incorporated |
Laser cutting methods for multi-layered glass assemblies having an electrically conductive layer
|
|
CN114309987A
(zh)
*
|
2022-01-13 |
2022-04-12 |
武汉华工激光工程有限责任公司 |
一种显示面板激光切割方法及设备
|
|
CN114425665B
(zh)
*
|
2022-02-14 |
2023-11-10 |
上海赛卡精密机械有限公司 |
水导激光系统和双层材料切割方法
|
|
CN114633035B
(zh)
*
|
2022-05-11 |
2022-08-12 |
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一种正极极片的制片方法、制片系统及正极极片
|
|
CN115647606B
(zh)
*
|
2022-11-15 |
2024-12-13 |
上海赛卡精密机械有限公司 |
一种水导激光阻断防护方法
|
|
WO2025042557A1
(en)
|
2023-08-23 |
2025-02-27 |
Corning Incorporated |
Systems and methods for separating continuous glass tubing into individual lengths of glass tubes
|
|
CN117182351B
(zh)
*
|
2023-11-03 |
2024-01-30 |
江苏迅镭激光科技有限公司 |
激光切割平台和激光切割方法
|