JP2017502484A5 - - Google Patents

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Publication number
JP2017502484A5
JP2017502484A5 JP2016546884A JP2016546884A JP2017502484A5 JP 2017502484 A5 JP2017502484 A5 JP 2017502484A5 JP 2016546884 A JP2016546884 A JP 2016546884A JP 2016546884 A JP2016546884 A JP 2016546884A JP 2017502484 A5 JP2017502484 A5 JP 2017502484A5
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JP
Japan
Prior art keywords
vacuum housing
electron beam
electron
vacuum
orifice
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Pending
Application number
JP2016546884A
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English (en)
Japanese (ja)
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JP2017502484A (ja
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Priority claimed from PCT/US2014/058899 external-priority patent/WO2015051175A2/en
Publication of JP2017502484A publication Critical patent/JP2017502484A/ja
Publication of JP2017502484A5 publication Critical patent/JP2017502484A5/ja
Pending legal-status Critical Current

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JP2016546884A 2013-10-03 2014-10-02 検査、テスト、デバッグ、及び表面の改変のための電子ビーム誘導プラズマプローブの適用 Pending JP2017502484A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361886625P 2013-10-03 2013-10-03
US61/886,625 2013-10-03
PCT/US2014/058899 WO2015051175A2 (en) 2013-10-03 2014-10-02 Application of electron-beam induced plasma probes to inspection, test, debug and surface modifications

Publications (2)

Publication Number Publication Date
JP2017502484A JP2017502484A (ja) 2017-01-19
JP2017502484A5 true JP2017502484A5 (enExample) 2017-11-09

Family

ID=52779296

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016546884A Pending JP2017502484A (ja) 2013-10-03 2014-10-02 検査、テスト、デバッグ、及び表面の改変のための電子ビーム誘導プラズマプローブの適用

Country Status (6)

Country Link
US (1) US20160299103A1 (enExample)
JP (1) JP2017502484A (enExample)
KR (1) KR20160066028A (enExample)
CN (1) CN105793716A (enExample)
TW (1) TW201530602A (enExample)
WO (1) WO2015051175A2 (enExample)

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WO2013012616A2 (en) 2011-07-15 2013-01-24 Orbotech Ltd. Electrical inspection of electronic devices using electron-beam induced plasma probes
US10590919B2 (en) * 2013-11-04 2020-03-17 Aerojet Rocketdyne, Inc. Ground based systems and methods for testing reaction thrusters
CN104962863B (zh) * 2015-05-06 2018-05-25 中国科学院广州能源研究所 一种原子级真空气态3d打印系统
WO2016205719A1 (en) * 2015-06-19 2016-12-22 Applied Materials, Inc. Additive manufacturing with electrostatic compaction
US20170333897A1 (en) 2016-05-19 2017-11-23 Plasmotica, LLC Self-flowing microfluidic analytical chip
CN106199392B (zh) * 2016-06-27 2019-02-12 中国科学院深圳先进技术研究院 芯片单粒子效应探测方法及装置
MX395430B (es) * 2016-06-29 2025-03-26 Tae Tech Inc Bucle de flujo combinado aislado mineral y alambre de punto b
JP7042071B2 (ja) * 2016-12-20 2022-03-25 エフ・イ－・アイ・カンパニー ｅビーム操作用の局部的に排気された容積を用いる集積回路解析システムおよび方法
WO2019025188A1 (en) 2017-08-02 2019-02-07 Asml Netherlands B.V. SYSTEMS AND METHODS FOR INFLATION OF CHARGED PARTICLES FOR ENHANCEMENT OF A VOLTAGE CONTRAST DEFECT SIGNAL
KR102399898B1 (ko) * 2017-09-26 2022-05-19 에이에스엠엘 네델란즈 비.브이. 후방 산란 입자에 의한 매립된 피쳐의 검출
US11179808B1 (en) 2018-07-11 2021-11-23 Rosemount Aerospace Inc. System and method of additive manufacturing
KR102697291B1 (ko) * 2018-12-31 2024-08-22 에이에스엠엘 네델란즈 비.브이. 멀티 빔을 갖는 인-렌즈 웨이퍼 사전-충전 및 검사
US11491575B2 (en) 2019-04-16 2022-11-08 Arcam Ab Electron beam melting additive manufacturing machine with dynamic energy adjustment
WO2021081804A1 (en) * 2019-10-30 2021-05-06 Yangtze Memory Technologies Co., Ltd Method for calibrating verticality of particle beam and system applied to semiconductor fabrication process
CN114599934B (zh) * 2019-10-31 2024-10-11 卡尔蔡司Smt有限责任公司 用于测量har结构的形状偏差的fib-sem 3d断层成像术
KR102411068B1 (ko) * 2020-08-14 2022-06-22 주식회사 아이에스시 피검사 디바이스의 온도 조절을 위한 온도 조절 장치
EP4200890A1 (en) 2020-08-21 2023-06-28 ASML Netherlands B.V. Detector module comprising printed circuit board for sealing vacuum chamber
US11664189B2 (en) * 2020-10-04 2023-05-30 Borries Pte. Ltd. Apparatus of charged-particle beam such as scanning electron microscope comprising plasma generator, and method thereof
DE102020216518B4 (de) * 2020-12-22 2023-08-17 Carl Zeiss Smt Gmbh Endpunktbestimmung mittels Kontrastgas
CN114678246B (zh) * 2020-12-24 2025-10-14 中微半导体设备(上海)股份有限公司 用于电容耦合等离子处理器阻抗特性测量的测量装置和方法
CN114256058B (zh) * 2021-07-08 2025-09-09 宁波伯锐锶电子束科技有限公司 一种亲水性基片制作方法及装置
CN117740892B (zh) * 2022-09-14 2026-04-17 中国科学院宁波材料技术与工程研究所 在静水压力下原位测试样品微区电化学性能的装置

Family Cites Families (9)

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Publication number Priority date Publication date Assignee Title
US5902741A (en) * 1986-04-18 1999-05-11 Advanced Tissue Sciences, Inc. Three-dimensional cartilage cultures
US6172363B1 (en) * 1996-03-05 2001-01-09 Hitachi, Ltd. Method and apparatus for inspecting integrated circuit pattern
US6952108B2 (en) * 2003-09-16 2005-10-04 Micron Technology, Inc. Methods for fabricating plasma probes
EP1798751A1 (en) * 2005-12-13 2007-06-20 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Protecting aperture for charged particle emitter
JP2008292372A (ja) * 2007-05-25 2008-12-04 Oht Inc 検査支援システムを搭載する回路検査装置とその検査支援方法
US20100068408A1 (en) * 2008-09-16 2010-03-18 Omniprobe, Inc. Methods for electron-beam induced deposition of material inside energetic-beam microscopes
US20130245505A1 (en) * 2011-04-08 2013-09-19 The Board of Trustees of the Leland Stanford Junior University Noninvasive Ultrasound-Based Retinal Stimulator: Ultrasonic Eye
WO2013012616A2 (en) * 2011-07-15 2013-01-24 Orbotech Ltd. Electrical inspection of electronic devices using electron-beam induced plasma probes
US8716673B2 (en) * 2011-11-29 2014-05-06 Fei Company Inductively coupled plasma source as an electron beam source for spectroscopic analysis

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