JP2017228379A - バイパス電極付き保護素子 - Google Patents
バイパス電極付き保護素子 Download PDFInfo
- Publication number
- JP2017228379A JP2017228379A JP2016122203A JP2016122203A JP2017228379A JP 2017228379 A JP2017228379 A JP 2017228379A JP 2016122203 A JP2016122203 A JP 2016122203A JP 2016122203 A JP2016122203 A JP 2016122203A JP 2017228379 A JP2017228379 A JP 2017228379A
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- Prior art keywords
- bypass electrode
- electrode
- fuse element
- bypass
- insulating substrate
- Prior art date
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- 239000000463 material Substances 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 18
- 229910052751 metal Inorganic materials 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims description 41
- 230000001681 protective effect Effects 0.000 claims description 19
- 239000011521 glass Substances 0.000 claims description 15
- 238000010438 heat treatment Methods 0.000 claims description 15
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 12
- 238000002844 melting Methods 0.000 claims description 12
- 230000008018 melting Effects 0.000 claims description 12
- 239000007769 metal material Substances 0.000 claims description 11
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- 229910052709 silver Inorganic materials 0.000 claims description 10
- 239000004332 silver Substances 0.000 claims description 10
- 238000005245 sintering Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 229910000765 intermetallic Inorganic materials 0.000 abstract description 5
- 238000009792 diffusion process Methods 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 3
- 230000004927 fusion Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 9
- 230000004907 flux Effects 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 7
- 230000002159 abnormal effect Effects 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000013021 overheating Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000003303 reheating Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
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- Fuses (AREA)
Abstract
Description
11、21、31・・・絶縁基板、
12、22、32・・・パターン電極、
13、23、33・・・バイパス電極、
14、24、34・・・ヒューズエレメント、
15、25、35・・・蓋体、
26、36・・・抵抗発熱素子、
17、27、37・・・ハーフ・スルーホール。
Claims (5)
- 絶縁基板と、この絶縁基板に設けた複数のパターン電極と、所定の前記パターン電極間を電気接続した低抵抗材からなるバイパス電極と、所定の前記パターン電極の間を橋設すると共に前記バイパス電極と近接して設けたヒューズエレメントとを備え、前記バイパス電極は、前記絶縁基板に設けられ、前記ヒューズエレメントよりも溶融温度が高く、溶融した前記ヒューズエレメントに溶解性の金属材から構成されたことを特徴とするバイパス電極付き保護素子。
- 前記絶縁基板の片面にさらに抵抗発熱素子を設けたことを特徴とする請求項1に記載のバイパス電極付き保護素子。
- 前記バイパス電極は、金属ペーストを焼結して形成された焼結電極からなることを特徴とする請求項1または請求項2に記載のバイパス電極付き保護素子。
- 前記金属ペーストは、ガラスフリット含有量を未添加ないし2質量%未満のものを用いたことを特徴とする請求項3に記載のバイパス電極付き保護素子。
- 前記バイパス電極は、銅、銀、銅合金、銀合金の群から選択された少なくとも1つの溶解性の金属材を用いたことを特徴とする請求項1または請求項2に記載のバイパス電極付き保護素子。
Priority Applications (1)
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JP2016122203A JP6711704B2 (ja) | 2016-06-21 | 2016-06-21 | バイパス電極付き保護素子 |
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JP2016122203A JP6711704B2 (ja) | 2016-06-21 | 2016-06-21 | バイパス電極付き保護素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017228379A true JP2017228379A (ja) | 2017-12-28 |
JP6711704B2 JP6711704B2 (ja) | 2020-06-17 |
Family
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JP2016122203A Active JP6711704B2 (ja) | 2016-06-21 | 2016-06-21 | バイパス電極付き保護素子 |
Country Status (1)
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JP (1) | JP6711704B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102022117805A1 (de) | 2021-07-16 | 2023-01-19 | Schott Japan Corporation | Sicherheitseinheit, Batteriepack und elektrisches Gerät |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001052593A (ja) * | 1999-08-09 | 2001-02-23 | Daito Tsushinki Kk | ヒューズおよびその製造方法 |
JP2004185960A (ja) * | 2002-12-03 | 2004-07-02 | Kamaya Denki Kk | 回路保護素子とその製造方法 |
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2016
- 2016-06-21 JP JP2016122203A patent/JP6711704B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001052593A (ja) * | 1999-08-09 | 2001-02-23 | Daito Tsushinki Kk | ヒューズおよびその製造方法 |
JP2004185960A (ja) * | 2002-12-03 | 2004-07-02 | Kamaya Denki Kk | 回路保護素子とその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102022117805A1 (de) | 2021-07-16 | 2023-01-19 | Schott Japan Corporation | Sicherheitseinheit, Batteriepack und elektrisches Gerät |
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