JP2017224734A - Cleaning method and cleaning device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cleaning method and a cleaning device which can bring about desired removal of an object to be cleaned from a member to be cleaned better than before.SOLUTION: A cleaning method and a cleaning device removes objects to be cleaned, formed in multiple members to be cleaned, by jetting process liquid from a process liquid injection port in a state where the multiple members to be cleaned and the process liquid injection port are immersed in the process liquid, and in a state where any one of relative horizontal reciprocation or vertical reciprocation of the multiple members to be cleaned and process liquid injection port has been done, and discharges the objects to be cleaned thus removed, together with the process liquid in which the multiple members to be cleaned had been immersed, and the process liquid jetted from the process liquid injection port.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a cleaning method and a cleaning apparatus for a member to be cleaned such as a semiconductor substrate.

  For example, one method for producing a metal thin film pattern on a semiconductor substrate is a lift-off method. In the lift-off method, after forming a resist pattern on a semiconductor substrate, a metal thin film is further formed, and then the resist pattern formed on the semiconductor substrate and the metal thin film formed on the resist pattern are removed. A metal thin film pattern is produced by performing a cleaning process.

  In such a lift-off cleaning process, a plurality of semiconductor substrates can be cleaned at the same time, and a situation in which the metal thin film removed during the cleaning process is reattached to the semiconductor substrate is avoided. In order to make it possible, a processing tank for immersing a plurality of members to be cleaned in a processing liquid and an upper portion of the processing tank and injecting the processing liquid toward the plurality of members to be cleaned arranged in the processing tank And a discharge means for discharging the processing liquid in the processing tank, and a plurality of members to be cleaned are submerged in the processing liquid in the processing tank. A cleaning device is disclosed that controls to eject the processing liquid from the ejection unit and to discharge the processing liquid from the ejection unit while holding (see Patent Document 1).

JP 2014-239141 A

  According to the cleaning method disclosed in Patent Document 1, the treatment liquid is ejected from the ejection means and the treatment liquid is ejected from the discharge means while maintaining a state in which a plurality of members to be cleaned are submerged in the treatment liquid. Therefore, the object to be cleaned (unnecessary object) removed from the member to be cleaned by the sprayed processing liquid can be discharged together with the processing liquid that sunk the member to be cleaned and the sprayed processing liquid. It is possible to prevent reattachment to the member to be cleaned in a floating state, and it is possible to process multiple members to be cleaned at a time unlike the cleaning method for each single wafer, thus increasing the processing capacity. And

  By the way, in the present situation where the diversification of required products is progressing, the materials constituting the semiconductor substrate, resist and metal thin film, and the metal thin film pattern formed on the semiconductor substrate tend to be diverse. There is a further need for a cleaning method and apparatus that can provide better removal of the objects to be cleaned even if they are different.

  When the constituent material and the metal thin film pattern are different, the resist portion and the metal thin film are peeled from the semiconductor substrate in a piecewise strip shape, which causes the resist portion and the metal thin film on the resist portion to be removed. In some cases, such as when it progresses in a continuous sheet form, it progresses in different modes, and the force required for peeling differs depending on the peeling mode.

  In a state where a plurality of semiconductor substrates to be cleaned are submerged in the processing liquid, the processing liquid is sprayed toward the plurality of semiconductor substrates to remove the resist portion on each semiconductor substrate and the metal thin film on the resist portion. In order to make it possible to achieve desired removal even if the constituent material and the metal thin film pattern are different in the apparatus for performing the process, the resist portion on each semiconductor substrate and the metal thin film on the resist portion are provided. Thus, it is an issue to realize a certain high-pressure force evenly and reliably.

  As a means for solving such a problem, a processing liquid injection port of a nozzle for injecting a processing liquid is more reliably and uniformly provided in each space between adjacent semiconductor substrates, It is conceivable to arrange each of the spaces between adjacent semiconductor substrates.

  However, when such measures are taken, depending on the size of the space between adjacent semiconductor substrates, it may be necessary to design and manufacture a custom nozzle according to the size of the space. And mass productivity is an issue.

  In view of the above problems, the present invention is directed to a material constituting the member to be cleaned by spraying the processing liquid toward the member to be cleaned in a state where the member to be cleaned such as a plurality of semiconductor substrates is submerged in the processing solution. Provided is a cleaning method and a cleaning apparatus which can bring about the desired removal of the object to be cleaned more reliably and are excellent in cost regardless of the form of the object to be cleaned formed on the member to be cleaned. For the purpose.

According to the first aspect of the present invention, the to-be-cleaned member arrangement in which a plurality of to-be-cleaned members arranged adjacent to each other at a predetermined interval are submerged in the processing liquid in a vertically upright posture. Steps,
A treatment liquid ejection port disposing step in which a treatment liquid ejection port of a treatment liquid ejection unit that ejects a treatment liquid toward the plurality of members to be cleaned is submerged in the treatment liquid and disposed above the plurality of members to be cleaned;
While the state where the plurality of members to be cleaned and the processing liquid ejection ports are submerged in the processing liquid is maintained, the plurality of the plurality of members to be cleaned are ejected from the processing liquid ejection ports toward the plurality of members to be cleaned. A cleaning step of removing the object to be cleaned formed on the plurality of members to be cleaned by discharging the processing liquid that has sunk the member to be cleaned and the processing liquid ejected from the processing liquid ejection port; Have
The cleaning step periodically performs reciprocation of at least one of a horizontal reciprocation and a vertical reciprocation of the plurality of members to be cleaned and the treatment liquid ejection port relative to each other in the treatment liquid. A reciprocating step to be provided, and the jetting of the processing liquid toward the plurality of members to be cleaned in the cleaning step is performed by reciprocating at least one of the relative horizontal reciprocating motion and the vertical reciprocating motion. A cleaning method is provided that is performed as is.

  That is, according to the first aspect of the present invention, when the object to be cleaned formed on the plurality of members to be cleaned is removed and cleaned, the plurality of members to be cleaned and the processing liquid injection port are submerged in the processing liquid. While being held, the processing liquid is ejected from the processing liquid ejection port toward the plurality of members to be cleaned, and the processing liquid that has sunk the plurality of members to be cleaned and the processing liquid ejected from the processing liquid ejection port are discharged. By doing so, it is possible to discharge the object to be cleaned together with these processing liquids, so that the object to be cleaned floating in the liquid is reattached to the member to be cleaned. It is possible to suppress such a situation that the cleaning member can be cleaned better.

  Further, in the first aspect of the present invention, the spray of the processing liquid toward the plurality of members to be cleaned in the cleaning step is performed with respect to the relative horizontal relative to each other of the plurality of members to be cleaned and the processing liquid injection port in the processing liquid. By performing it in a state where at least one of the reciprocating motion in the direction and the reciprocating motion in the vertical direction is made, there is no need for custom design and manufacturing of the nozzle that becomes the processing liquid ejecting means, and more A uniform and strong (high pressure) jet of processing liquid can be provided toward a plurality of members to be cleaned, and the material constituting the member to be cleaned and the form of the object to be cleaned formed on the member to be cleaned Regardless of this, it is possible to provide a desired removal of an object to be cleaned better, and to provide a cleaning method with excellent cost.

According to invention of Claim 2, the said washing | cleaning method has a dipping step before the said washing | cleaning step,
In the dipping step, ultrasonic waves are directed toward the plurality of members to be cleaned that are arranged in a state where adjacent members to be cleaned are juxtaposed at predetermined intervals and submerged in the processing liquid in a vertically upright posture. An ultrasonic irradiation step for irradiating; and a reciprocating step for periodically causing reciprocation of at least one of a horizontal reciprocation and a vertical reciprocation of the plurality of members to be cleaned in the treatment liquid,
Irradiation of ultrasonic waves toward the plurality of members to be cleaned in the dipping step is performed in a state where at least one of a horizontal reciprocation and a vertical reciprocation of the plurality of members to be cleaned is performed. A cleaning method according to claim 1 is provided.

  That is, in the second aspect of the present invention, the ultrasonic wave is irradiated in a state where at least one of the horizontal reciprocation and the vertical reciprocation of the plurality of members to be cleaned is performed before the treatment liquid is ejected. As a result, it is possible to improve the cleaning ability of the member to be cleaned, and when the present invention is applied to the lift-off method, it is possible to bring about better swelling of the resist portion and removal of the object to be cleaned. .

According to invention of Claim 3, the processing tank which arrange | positions the to-be-cleaned member in the state immersed in the process liquid,
A storage means for storing the members to be cleaned of the plurality of members to be cleaned in parallel in a vertically standing posture at a predetermined interval; ,
A treatment liquid ejecting means that is disposed above the treatment tank and has a treatment liquid ejection port that ejects a treatment liquid toward the plurality of members to be cleaned. Liquid ejecting means;
A treatment liquid discharging means disposed at a lower portion of the treatment tank and discharging the treatment liquid in the treatment tank;
A cleaning device comprising:
Reciprocating means for periodically causing reciprocation of at least one of the horizontal reciprocation and the vertical reciprocation of the plurality of members to be cleaned and the treatment liquid injection port relative to each other;
A control means for controlling the treatment liquid ejection means, the treatment liquid discharge means, and the reciprocating means;
The control means is in a state in which the plurality of members to be cleaned and the processing liquid ejection port are submerged in the processing liquid, and the relative horizontal reciprocation and vertical reciprocation are maintained. In a state where at least one of the reciprocating motions is performed, the processing liquid is ejected from the processing liquid ejection port, thereby removing the objects to be cleaned formed on the plurality of objects to be cleaned, and the plurality of objects to be cleaned. A cleaning device that controls the processing liquid ejecting means, the reciprocating means, and the processing liquid discharging means to discharge together with the processing liquid that has sunk the cleaning member and the processing liquid ejected from the processing liquid ejection port. Provided.

According to a fourth aspect of the present invention, the cleaning apparatus includes an ultrasonic irradiation unit configured to irradiate ultrasonic waves toward the plurality of members to be cleaned which are accommodated by the accommodating unit and submerged in the processing liquid. ,
The control means is in a state in which at least one of the horizontal reciprocation and the vertical reciprocation of the plurality of members to be cleaned is reciprocated before the treatment liquid is ejected by the treatment liquid ejection means. The cleaning apparatus according to claim 3, wherein the reciprocating means and the ultrasonic irradiation means are controlled so as to apply ultrasonic waves toward the plurality of members to be cleaned.

  According to the invention described in each claim, in a cleaning method or a cleaning apparatus that removes an object to be cleaned from a member to be cleaned, a situation in which the object to be cleaned is reattached to the member to be cleaned is suppressed. In addition, there is no need for custom design and manufacture of the nozzles that serve as the processing liquid injection means, and more uniform and powerful (high pressure) submerged jets of processing liquid can be supplied to a plurality of members to be cleaned. Regardless of the material constituting the member to be cleaned and the form of the object to be cleaned formed on the member to be cleaned, making it possible to achieve the desired removal of the object to be cleaned better. , Has a common effect. In particular, it is suitable for a lift-off method in which the resist portion formed on the member to be cleaned is peeled and removed to leave only a desired metal pattern.

It is a typical lineblock diagram showing one embodiment of a cleaning device concerning the present invention. It is typical explanatory drawing which shows the structure in a processing tank. It is explanatory drawing which shows the front form which injects a process liquid from the nozzle used as a process liquid injection means to the to-be-cleaned member accommodated in the accommodating means. It is explanatory drawing which shows the side surface form which injects a process liquid from a nozzle to the to-be-cleaned member accommodated in the accommodating means. It is the top view which looked at the processing tank from the upper side. It is explanatory drawing of each step of the washing | cleaning method. It is explanatory drawing of the lift-off method. It is a schematic diagram which shows operation | movement of the horizontal direction reciprocation of the accommodating means by a reciprocation means, and a vertical direction reciprocation.

  Hereinafter, an embodiment of a cleaning method and a cleaning apparatus according to the present invention will be described with reference to the drawings. The present invention can be variously modified as long as it has the technical features, and is not limited to the specific embodiments described below.

  The member to be cleaned that can be applied to the cleaning method and the cleaning apparatus according to the present invention is not particularly limited, and various objects can be set as objects to be cleaned. For example, as described with reference to FIG. 7, a processing substrate that can be applied to the lift-off method may be used. The processing substrate has a resist portion 52 provided on the semiconductor substrate 51 and a metal thin film 53 provided on the resist portion 52. In addition, it may be another object to be cleaned, for example, various circuit boards represented by a printed board or the like, or a circuit board in which a TFT circuit is provided on a glass substrate or a silicon substrate. Alternatively, other substrates may be used. In any case, the object to be cleaned, in FIG. 7, the unnecessary object which is the object to be cleaned 54 composed of the resist portion 52 and the metal thin film 53 provided thereon is reattached to the member to be cleaned. Any member to be cleaned may be used as long as it is desired to simultaneously process a plurality of members to be cleaned and increase the processing capacity.

  Hereafter, each step which comprises the washing | cleaning method is demonstrated, demonstrating the structure in the washing | cleaning apparatus 10 which becomes one Embodiment of this invention shown by FIG.1, FIG2 and FIG.6 etc. FIG.

  The cleaning method according to the present invention generally includes a member-to-be-cleaned arrangement step in which a plurality of members to be cleaned are placed in a state of being submerged in a processing liquid, and a processing liquid injection port of a processing liquid injection unit above the plurality of members to be cleaned A treatment liquid injection port arrangement step to be arranged, and a cleaning step for removing the object to be cleaned formed on the plurality of members to be cleaned. In this embodiment, the processing liquid is further provided before the cleaning step. And a dipping step for improving the cleaning ability by sufficiently dipping the member to be cleaned.

(To-be-cleaned member placement step)
In the cleaning method of the present embodiment, first, the member to be cleaned 1 stored in the storage cassette 15 is set at a predetermined position in the processing tank 11, and then, as shown in FIG. A member-to-be-cleaned step is performed in which 2 is filled so as to cover the member to be cleaned 1.

  A cleaning apparatus 10 according to an embodiment of the present invention shown in FIGS. 1, 2, and 6 includes a processing tank 11 in which a plurality of members to be cleaned 1 are placed in a processing liquid, and a plurality of objects to be cleaned. Each of the members to be cleaned of the member 1 is a storage unit that stores and arranges the members to be cleaned in a vertically upright posture at a predetermined interval, and realizes an efficient batch process. In the step of arranging the member to be cleaned, the plurality of members to be cleaned are stored in a storage cassette 15 which is a component of the storage unit and submerged in the processing liquid in the processing tank 11. Placed in a state where That is, in the member-to-be-cleaned arrangement step, a plurality of members to be cleaned are arranged in the processing liquid in a state where they are juxtaposed at predetermined intervals in a vertical upright posture.

  As the accommodation cassette 15, for example, a cassette as shown in FIGS. 2 and 3 is preferably used. The size, shape, and material of the storage cassette 15 are not particularly limited, and are selected in consideration of the number and size of the cleaning target members 1 to be stored, the type of processing liquid, and the like. It may be a general general-purpose product or a custom-made product designed exclusively. For example, a metal molded product such as stainless steel or a resin molded product such as polycarbonate can be used. Thus, since the to-be-cleaned member 1 is accommodated in the accommodating cassette 15, it can convey for every accommodating cassette 15, As a result, efficiency improvement of a washing | cleaning process can be implement | achieved and processing capacity can be improved. .

  Of the processing substrates that can be applied to the lift-off method, when the object 54 to be cleaned including the metal thin film 53 and the resist portion 52 is to be peeled as large as possible, a preferable storage cassette 15 is a processing liquid passage shown in FIG. It is preferable that an opening corresponding to the opening 29 is provided in the lower part of the storage cassette 15. The entire opening may be open or may have a perforated shape such as punching metal. By providing such an opening in the lower part of the storage cassette 15, the object to be cleaned 54 peeled off in a large state can be collected by the collection net 41 as a collection means without being destroyed. Note that the side wall of the storage cassette 15 may or may not have a hole or a slit.

  In the present embodiment, the treatment tank 11 is configured to be used as the treatment tank 11 in which the plurality of members to be cleaned 1 are sufficiently immersed in the treatment liquid 2 before the treatment liquid 2 is sprayed toward the member 1 to be cleaned. Is done. However, the present invention is not limited to this, and the plurality of members to be cleaned 1 may be sufficiently immersed in the treatment liquid 2 in a treatment tank different from the treatment tank 11.

  The upper part of the processing tank 11 is open, and the storage cassette 15 that stores the member to be cleaned 1 is put into the processing tank from the opened part. As shown in FIG. 3, the loaded storage cassette 15 is placed on a cassette receiving member 14 provided in the processing tank. The cassette receiving member 14 is usually formed of stainless steel or the like similar to that of the processing tank 11, and the surface thereof is usually provided with a hole such as a punching metal, but is not limited thereto.

  Although the shape and material of the treatment tank 11 are not particularly limited, it is usually preferable to select a chemical resistant material such as stainless steel. For example, when patterning the semiconductor substrate 51 by the lift-off method, it is preferable to select in consideration of the type of processing liquid used for the processing.

  Reference numeral 14 a is a cassette guide that guides the storage cassette 15 to a predetermined position, and reference numeral 16 is a cassette holding member that holds the storage cassette 15.

(Immersion step)
In the cleaning method according to the present embodiment, the dipping step is performed following the member to be cleaned placing step.

  The cleaning apparatus 10 is configured to arrange the plurality of members to be cleaned 1 at predetermined positions with respect to the processing tank 11 and periodically reciprocate at least one of the horizontal reciprocation and the vertical reciprocation of the plurality of members 1 to be cleaned. The reciprocating means 17 for the member to be cleaned is configured to be capable of providing In the present embodiment, as shown in FIG. 8, the cassette holding member 16 that is a component of the storage unit and that holds the storage cassette 15 is reciprocated to move the plurality of members to be cleaned 1. However, the present invention is not limited to this, and the cassette holding member 16 is immovable. The accommodation cassette 15 may be configured to reciprocate.

  Further, in the cleaning apparatus 10, an ultrasonic cleaning apparatus 35 serving as an ultrasonic irradiation unit is disposed below the processing tank 11. The ultrasonic cleaning device 35 can be arbitrarily operated according to the mode of the cleaning process of the member 1 to be cleaned. In particular, the effect is great when used in combination with a processing liquid deaerator 91 described later. When applied to the lift-off method, the ultrasonic cleaning device 35 may be operated as a means for promoting the swelling of the resist portion 52. Note that the ultrasonic cleaning device 35 is a powerful cleaning auxiliary means, and can be preferably applied to the separation of the resist portion 52 and the metal thin film 53 on the semiconductor substrate 51, and the metal thin film 53 is broken finely. Therefore, when the metal thin film 53 is to be peeled as large as possible, the ultrasonic cleaning device 35 can not be operated.

  In the immersion step, the plurality of members to be cleaned 1 are sufficiently immersed in the treatment liquid 2 before the treatment liquid 2 is sprayed. Further, in the dipping step of the cleaning method in the present embodiment, the control means performs a plurality of objects to be cleaned in a state where at least one of the horizontal reciprocation and the vertical reciprocation of the plurality of members to be cleaned is performed. The reciprocating means 17 and the ultrasonic irradiation means 35 are controlled so that the ultrasonic waves can be irradiated toward the cleaning member.

  According to such an immersion step, it is possible to improve the cleaning effect by irradiating the member to be cleaned 1 submerged in the processing liquid with ultrasonic waves. In addition, when applied to the lift-off method, it is possible to promote swelling of the resist portion by ultrasonic irradiation, and to apply ultrasonic waves toward the plurality of members to be cleaned. The bias of the swelling effect due to the influence of standing waves generated in the liquid by ultrasonic irradiation is performed in a state where at least one of the horizontal reciprocating motion and the vertical reciprocating motion is performed. It is possible to suppress (unevenness) and bring about a better and uniform swelling effect over the entire resist portion without damaging the member to be cleaned. As a result, it is possible to easily peel the object to be cleaned 54 including the resist portion 52 provided on the semiconductor substrate 51 and the metal thin film 53 provided on the resist portion 52, and patterning the semiconductor substrate 51. Can be performed with high processing efficiency without causing the floating substrate to reattach to the semiconductor substrate 51.

(Processing liquid injection port arrangement step)
In the cleaning method according to the present embodiment, following the dipping step, the processing liquid ejecting means 21 is set so that the processing liquid ejecting means 21 descends from above and is set near the top of the member 1 to be cleaned.

  The cleaning apparatus 10 includes a processing liquid ejecting unit 21 that ejects a processing liquid toward a plurality of members 1 to be cleaned, and the processing liquid ejecting unit 21 is disposed on the upper portion 12 of the processing tank 11. The processing liquid injection port for injecting the processing liquid toward the member 1 to be cleaned is provided so as to be movable with respect to the processing tank 11.

  As shown in FIG. 1 and the like, the treatment liquid ejecting means 21 is preferably a plurality of shower nozzles arranged evenly toward the plurality of members to be cleaned 1. As the shower nozzle, a straight nozzle, a flat cone nozzle, a full cone nozzle, or the like can be used. A shower nozzle having a preferable shape can be selected from these shower nozzles. Of the processing substrates used in the lift-off method shown in FIG. 7, it is preferable to use a full cone nozzle when the object to be cleaned 54 composed of the metal thin film 53 and the resist portion 52 is to be peeled off as large as possible.

  As shown in FIGS. 1 to 4, a plurality of the treatment liquid ejecting means 21 are arranged above the member to be cleaned 1. For example, when the member 1 to be cleaned is the semiconductor substrate 1 accommodated in the accommodation cassette 15, a plurality (four in the illustrated example) are arranged and accommodated in the radial direction of the semiconductor substrate 1 (also referred to as the substrate surface direction). A plurality (eight in the illustrated example) are also arranged in the longitudinal direction of the cassette 15 (also referred to as the direction in which the semiconductor substrates 1 are arranged). It is preferable that the number and arrangement of the shower nozzles are arbitrarily set depending on the size of the member 1 to be cleaned and the arrangement of the member 1 to be cleaned in the storage cassette 15.

  In the illustrated example, eight processing liquid ejecting means (shower nozzles) 21 are attached to the nozzle pipe 22 at regular intervals. The nozzle pipes 22 to which the shower nozzles 21 are attached are arranged at equal intervals in four rows in the radial direction of the semiconductor substrate 1. The four rows of nozzle pipes 22 are integrally held by a holding member 23 and attached to a reciprocating means 27 for a processing liquid ejecting means.

  Further, the reciprocating means 27 for the processing liquid ejecting means is disposed at a predetermined position of the processing liquid ejection port with respect to the member 1 to be cleaned, and the horizontal reciprocation and vertical reciprocation of the processing liquid ejection port of the processing liquid ejecting means 21. It is configured to be able to provide periodic reciprocation of at least one of the movements.

  The injection amount of the treatment liquid injection unit 21 can be arbitrarily controlled for each shower pipe 22. Such control can be adjusted by opening and closing the valves of each shower pipe. As a result, in the illustrated example, it is possible to increase or decrease any shower piping in the four rows. For example, as shown in FIG. 3, out of four rows of shower piping, the flow rate of the two rows of shower piping on both sides is increased to increase the injection amount of the shower nozzles 21a and 21d, or the flow rate is decreased to decrease the shower nozzle. The injection amount of 21a and 21d can be reduced. The treatment liquid ejection control may be automatic control or manual control. The treatment liquid ejection time is arbitrarily set, and may be, for example, 1, 2 seconds, 5, 6 seconds, or 10 seconds or more.

(Washing step)
In the cleaning method according to the present embodiment, a cleaning step for removing the objects to be cleaned formed on the plurality of members to be cleaned is executed following the processing liquid ejection port arranging step.

  The cleaning apparatus 10 is disposed at the lower part of the processing tank 11 together with the processing liquid ejecting means 21, the reciprocating means 17 for the member to be cleaned, and the reciprocating means 27 for the processing liquid ejecting means. A processing liquid discharge means 31 for discharging the liquid and a control means for controlling each of these means are configured.

  As shown in FIG. 1 and the like, the processing liquid discharge means 31 can include a discharge port provided below the processing tank 11. Usually, the lower side wall of the processing tank 11 is inclined obliquely, and the discharge port 31 is provided at the lowest point. The storage cassette 15 that stores the member to be cleaned 1 has a processing liquid passage port 29 opened below, and the processing liquid 2 sprayed from the shower nozzle 21 is processed after the member 1 to be cleaned is cleaned. It flows downward from the passage port 29. The processing liquid 2 that has passed through the processing liquid passage port 29 is discharged from the discharge port 31 of the processing tank 11.

  The size and shape of the discharge port 31 are arbitrarily set according to the injection amount and the discharge speed. The discharged processing liquid 2 flows into the circulation tank 81 as shown in FIG. The cleaning target 54 contained in the processing liquid 2 that has flowed into the circulation tank 81 is collected by the collection net 41 as necessary. After the cleaning process is completed, the processing liquid 2 can be circulated through the circulation pump 82, the filters 83, 84, 85, and the heat exchanger 86, and the fine object 54 contained in the processing liquid 2 is removed by the filter. Thus, it can be used for the next cleaning process.

  The control means maintains a state in which the plurality of members to be cleaned 1 and the processing liquid ejection ports are submerged in the processing liquid, and the plurality of members to be cleaned and the processing liquid ejection ports are relatively relative to each other. In a state where at least one of the horizontal reciprocating motion and the vertical reciprocating motion is being reciprocated, the liquid to be cleaned is formed on the plurality of members to be cleaned by injecting the processing liquid from the processing liquid injection port. The processing liquid ejecting means 21 and the member to be cleaned are removed so that the object to be cleaned is discharged together with the processing liquid submerged in the plurality of members to be cleaned and the processing liquid ejected from the processing liquid ejection port. The reciprocating means 17 for processing, the reciprocating means 27 for processing liquid ejecting means, and the processing liquid discharging means 31 are controlled.

  The control means of the present embodiment is configured to gradually increase the amount of treatment liquid ejected by the treatment liquid ejection means 21 and gradually increase the amount of treatment liquid discharged from the treatment liquid discharge means 31. The According to the control of the injection amount and the discharge amount, the discharge amount can be gradually increased and the discharge amount can be gradually increased while maintaining the state in which the plurality of members to be cleaned 1 are submerged in the treatment liquid 2. The cleaning of the member to be cleaned 1 can be performed gently without being rapidly performed by spraying the processing liquid from the liquid spraying means 21. Such control is preferable particularly in the initial stage of cleaning. As a result, when the semiconductor substrate 1 is processed by the lift-off method, it is possible to peel the object to be cleaned 54 composed of the metal thin film 53 and the resist portion 52 in a state as large as possible.

  In the cleaning step of the present embodiment, the processing liquid is directed toward the plurality of members to be cleaned while maintaining the state in which the plurality of members to be cleaned 1 and the processing liquid ejection ports of the processing liquid ejecting means 21 are submerged in the processing liquid. While the processing liquid is ejected from the ejection port, the processing liquid that has sunk the plurality of members to be cleaned and the processing liquid ejected from the processing liquid ejection port are discharged to form the plurality of members to be cleaned. Remove the object to be cleaned.

  Furthermore, in the cleaning step of the present invention, at least one of a horizontal reciprocation and a vertical reciprocation relative to each other of the plurality of members to be cleaned in the processing liquid and the processing liquid injection port of the processing liquid injection means. A reciprocating step that periodically brings one reciprocating motion, and the injection of the treatment liquid toward the plurality of members to be cleaned is at least one of the relative horizontal reciprocating motion and the vertical reciprocating motion. It is performed in a state where reciprocation is made.

  According to such a cleaning step, the treatment liquid ejection and the treatment liquid discharge are performed while maintaining the state in which the plurality of members to be cleaned and the treatment liquid ejection ports are submerged in the treatment liquid. The removed cleaning object can be discharged together with the processing liquid submerged in the cleaning member and the processing liquid sprayed from the processing liquid jet port, and thus the removed cleaning target floating in the liquid. It is possible to suppress a situation in which an object is reattached to the member to be cleaned, and it is possible to perform better cleaning of the member to be cleaned.

  Further, according to such a cleaning step, the jetting of the processing liquid toward the plurality of members to be cleaned can be performed in the horizontal direction relative to each other of the plurality of members to be cleaned and the processing liquid jets in the processing liquid. By performing in a state where at least one of the reciprocating motion and the vertical reciprocating motion is performed, a more uniform and strong (high pressure) submerged jet of treatment liquid is supplied to a plurality of members to be cleaned. Regardless of the material constituting the member to be cleaned and the form of the object to be cleaned formed on the member to be cleaned, making it possible to achieve the desired removal of the object to be cleaned better. .

  The processing liquid discharge control may be automatic control or manual control. In the present embodiment, as shown in FIG. 6B, the treatment liquid ejection and the treatment liquid discharge are performed while maintaining the state in which the plurality of members to be cleaned 1 are submerged in the treatment liquid 2, so that the treatment liquid is discharged. The discharge amount of the treatment liquid 2 in the above and the introduction amount of the treatment liquid 2 in the treatment liquid injection described above are set within a range in which the immersed state can be maintained, and the amount is the same amount or almost the same amount. Controlled. When the discharge amount and the introduction amount are the same or substantially the same, the treatment liquid discharge time is arbitrarily set in accordance with the treatment liquid injection time described above. For example, when the treatment liquid ejection is for 1 to 2 seconds, the treatment liquid discharge performed while keeping the member 1 to be cleaned submerged in the treatment liquid 2 is also 1 to 2 seconds, and the treatment liquid ejection is 5, 6 In the case of the second, the treatment liquid discharge performed while keeping the member 1 to be cleaned submerged in the treatment liquid 2 is also 5 or 6 seconds.

  As shown in FIG. 6B, after the processing liquid is discharged and processed with the same amount or almost the same amount of introduction in the processing liquid ejection and that in the processing liquid discharge as shown in FIG. 6B. Further, the discharge amount of the treatment liquid discharge is increased more than the introduction amount of the treatment liquid injection, and the water level of the treatment liquid 2 is lowered. As a result of such treatment, if there is an object 54 to be cleaned that floats in the treatment liquid 2 while the water level of the treatment liquid 2 is going down, even if the object 54 to be cleaned adheres to the member 1 to be cleaned. The cleaning object 54 can be washed away with the processing liquid 2 sprayed from the shower nozzle 21. Finally, as shown in FIG. 6D, the shower nozzle 21 is lifted upward, and then the storage cassette 15 is also lifted.

  While the water level of the processing liquid 2 is decreasing, only the processing liquid 2 may be injected from the injection nozzle, or the processing liquid 2 and gas (air, nitrogen, etc.) may be mixed and injected at the same time. Further, even when the level of the processing liquid 2 being discharged is lower than the member to be cleaned 1 (for example, a semiconductor substrate), only the processing liquid 2 may be injected from the injection nozzle, or the processing liquid 2 and the gas (Air, nitrogen, etc.) may be mixed and injected at the same time, but only gas may be injected. When only gas is injected, the member to be cleaned 1 can be drained.

(Recovery step)
In the case where the object to be cleaned 54 is recovered, the recovery step may be performed together with the cleaning step. In the cleaning apparatus 10 according to the present embodiment, a recovery unit that recovers the cleaning object 54 generated by cleaning the member to be cleaned 1 is further provided. This recovery means is provided as necessary depending on the type and size of the object 54 to be cleaned. When the object to be cleaned 54 is the object to be cleaned 54 composed of the metal thin film 53 and the resist portion 52 to be removed by the lift-off method described above, it is preferable to provide a recovery net 41 (see FIG. 1) as recovery means. Such a recovery net 41 can be a stainless steel net, and the mesh (mesh) can be selected according to the size of the removed metal thin film 53.

  By providing such recovery means, when the member to be cleaned 1 is, for example, the semiconductor substrate 51 on which the resist portion 52 and the metal thin film 53 are formed, the metal thin film 53 peeled off together with the resist portion 52 is efficiently used as the object to be cleaned 54. It can be recovered. As a result, the recovered metal thin film 53 can be reused as a resource.

  Furthermore, in the present embodiment, an overflow tank 18 is attached to the processing tank 11 and can accommodate the processing liquid that has unexpectedly overflowed from the processing tank 11, and the processing liquid from the lower side of the processing tank 11. Is circulated to raise the liquid level of the processing liquid, so that floating substances such as metal sludge floating near the liquid surface of the processing liquid flow into the overflow tank 18 and reattach the floating substances to the member to be cleaned. It is also configured to make it possible to prevent.

(Other)
The processing liquid 2 is arbitrarily selected according to the purpose of cleaning and the type of the member 1 to be cleaned, and may be an organic processing liquid such as an organic solvent, or may be an inorganic processing liquid. Such a treatment liquid 2 is normally used by circulating in the path shown in FIG. 1 by arbitrarily operating the valve shown in FIG. Circulation of the treatment liquid 2, supply to the treatment tank 11, and supply to the shower nozzle 21 can be performed by various methods.

  For example, at the stage of the treatment liquid immersion, the treatment liquid 2 can be supplied to the treatment tank 11 by pump circulation. On the other hand, at the stage of processing liquid injection, the processing liquid 2 placed in the canister 71 is pressurized (usually about 0.2 MPa to 0.6 MPa) with a gas (air, nitrogen gas, etc.), and from the canister 71 in a high pressure state. It is preferable to send it out at a stretch and discharge it from the treatment liquid jet at the tip of the shower nozzle 21. Since the treatment liquid 2 sent from the canister 71 is shower-jetted at a high pressure, even a thin film can be peeled off instantaneously.

  Further, the processing liquid 2 may be processed by the processing liquid degassing device 91. The treatment liquid 2 deaerated by the treatment liquid deaerator 91 is likely to penetrate into the gaps between the fine patterns, for example. As a result, cleaning using the treatment liquid 2 can be performed effectively. In particular, it is preferable when the ultrasonic cleaning device 35 is used, and the cleaning efficiency can be improved. As an application example using the degassed treatment liquid 2, it is possible to shorten the treatment time by increasing the effect of ultrasonic cleaning, or to improve the yield by spreading the effect of ultrasonic cleaning to every corner. Or the processing temperature can be lowered as compared with a processing solution that is not processed.

1 Member to be cleaned (semiconductor substrate)
2 treatment liquid 10 cleaning device 11 treatment tank 15 accommodation means (accommodation cassette)
17 Reciprocating means (for cleaned member)
18 Overflow tank 21 Treatment liquid injection means (nozzle)
27 Reciprocating means (for processing liquid injection means)
31 Treatment liquid discharge means (discharge port)
35 Ultrasonic irradiation means (ultrasonic cleaning equipment)
41 Collection means (collection network)
51 Semiconductor substrate 52 Resist part 53 Metal thin film 54 Object to be cleaned (unnecessary object)

Claims (4)

A member-to-be-cleaned arrangement step that arranges a plurality of members to be cleaned arranged adjacent to each other at predetermined intervals in a state where the members to be cleaned are submerged in the processing liquid in a vertical upright posture;
A treatment liquid ejection port disposing step in which a treatment liquid ejection port of a treatment liquid ejection unit that ejects a treatment liquid toward the plurality of members to be cleaned is submerged in the treatment liquid and disposed above the plurality of members to be cleaned;
While the state where the plurality of members to be cleaned and the processing liquid ejection ports are submerged in the processing liquid is maintained, the plurality of the plurality of members to be cleaned are ejected from the processing liquid ejection ports toward the plurality of members to be cleaned. A cleaning step of removing the object to be cleaned formed on the plurality of members to be cleaned by discharging the processing liquid that has sunk the member to be cleaned and the processing liquid ejected from the processing liquid ejection port; Have
The cleaning step periodically performs reciprocation of at least one of a horizontal reciprocation and a vertical reciprocation of the plurality of members to be cleaned and the treatment liquid ejection port relative to each other in the treatment liquid. A reciprocating step to be provided, and the jetting of the processing liquid toward the plurality of members to be cleaned in the cleaning step is performed by reciprocating at least one of the relative horizontal reciprocating motion and the vertical reciprocating motion. A cleaning method performed in a state where it is made. The cleaning method includes a dipping step before the cleaning step,
In the dipping step, ultrasonic waves are directed toward the plurality of members to be cleaned that are arranged in a state where adjacent members to be cleaned are juxtaposed at predetermined intervals and submerged in the processing liquid in a vertically upright posture. An ultrasonic irradiation step for irradiating; and a reciprocating step for periodically causing reciprocation of at least one of a horizontal reciprocation and a vertical reciprocation of the plurality of members to be cleaned in the treatment liquid,
Irradiation of ultrasonic waves toward the plurality of members to be cleaned in the dipping step is performed in a state where at least one of a horizontal reciprocation and a vertical reciprocation of the plurality of members to be cleaned is performed. The cleaning method according to claim 1, which is performed. A treatment tank in which a plurality of members to be cleaned are submerged in the treatment liquid; and
A storage means for storing the members to be cleaned of the plurality of members to be cleaned in parallel in a vertically standing posture at a predetermined interval; ,
A treatment liquid ejecting means that is disposed above the treatment tank and has a treatment liquid ejection port that ejects a treatment liquid toward the plurality of members to be cleaned. Liquid ejecting means;
A treatment liquid discharging means disposed at a lower portion of the treatment tank and discharging the treatment liquid in the treatment tank;
A cleaning device comprising:
Reciprocating means for periodically causing reciprocation of at least one of the horizontal reciprocation and the vertical reciprocation of the plurality of members to be cleaned and the treatment liquid injection port relative to each other;
A control means for controlling the treatment liquid ejection means, the treatment liquid discharge means, and the reciprocating means;
The control means is in a state in which the plurality of members to be cleaned and the processing liquid ejection port are submerged in the processing liquid, and the relative horizontal reciprocation and vertical reciprocation are maintained. In a state where at least one of the reciprocating motions is performed, the processing liquid is ejected from the processing liquid ejection port, thereby removing the objects to be cleaned formed on the plurality of objects to be cleaned, and the plurality of objects to be cleaned. A cleaning apparatus that controls the processing liquid ejecting means, the reciprocating means, and the processing liquid discharging means so as to be discharged together with the processing liquid submerged in the cleaning member and the processing liquid ejected from the processing liquid ejection port. The cleaning apparatus includes an ultrasonic irradiation unit that irradiates ultrasonic waves toward the plurality of members to be cleaned that are stored in the storage unit and submerged in the processing liquid.
The control means is in a state in which at least one of the horizontal reciprocation and the vertical reciprocation of the plurality of members to be cleaned is reciprocated before the treatment liquid is ejected by the treatment liquid ejection means. The cleaning apparatus according to claim 3, wherein the reciprocating means and the ultrasonic irradiation means are controlled so as to apply ultrasonic waves toward the plurality of members to be cleaned.

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