JP2017212470A - Light-emitting device and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a highly reliable and long life light-emitting device, by enhancing adhesion of a coating member applied to a side face of a light-emitting element, and a translucent member on an upper surface of the light-emitting element and the coating member.SOLUTION: A light-emitting device 100 includes a light-emitting element 1, a coating member 3 applied to a side face so as to expose a light emission surface thereof, and a translucent member 5 having an end face, substantially flush with the end face of the coating member, on an upper surface in a light emission direction of the light-emitting element and the coating member. In the light-emitting device, the coating member 3 has a recess 4 or a protrusion on the upper surface. Peeling of the coating member 3 and the translucent member 5 due to deterioration is prevented, by fitting the recess 4 or the protrusion and the translucent member 5.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a light emitting device including a covering member that covers a side surface of a light emitting element, a light emitting element and a translucent member on an upper surface of the covering member, and a method for manufacturing the same.

  Light-Emitting Diodes (LEDs) have many features such as low power consumption, long life, and high reliability, and various types of lighting and backlights have been developed through the practical use of white LEDs that combine blue LEDs and phosphors. Widely used in various applications such as light sources. In recent years, with the spread of demand, further improvement in light emission output and light emission efficiency of LEDs is expected, and a light source with high output and high reliability is required.

  The light emitting device obtained from the manufacturing method of Patent Document 1 is an LED die having a connection electrode on the bottom surface, the reflective layer extending downward on the side surface, and the phosphor layer on the top surface of the LED die. And covers the top of the reflective layer. According to this configuration, the extended portion of the reflective layer blocks light leaking from the side and bottom after mounting, so it is possible to achieve high light extraction efficiency and manufacture a high-brightness LED die with high productivity. can do.

  In the light emitting device of Patent Document 2, the side surfaces of the light emitting element and the wavelength conversion member disposed thereon are covered with a covering member containing a light reflective material. Further, the light transmitting member is arranged to face the light source unit and is configured to fit within the covering member. As a result, it is possible to reduce the size while maintaining the extraction efficiency of the light emitted from the light emitting element, and to obtain light emission characteristics with suppressed color unevenness and luminance unevenness.

  Further, in the configuration of the light emitting device as in Patent Document 2, the object is to improve the light extraction efficiency while avoiding a decrease in reliability due to deterioration of the constituent members. It is a light-emitting device as described in above. In this light emitting device, by providing the gap and the first reflecting surface in the separation region between the light emitting element and the light transmitting member, the return light is reflected again while preventing the adhesive made of resin and the light transmitting member from deteriorating. A reduction in the optical coupling efficiency to the transmission member is suppressed.

JP 2012-253223 A JP 2010-238846 A JP 2010-283281 A

  With the light emitting devices described in Patent Documents 1 and 2, the light extraction efficiency can be increased by covering the light reflecting member. And by setting it as a light-emitting device like patent document 3, it is possible to ease deterioration of an adhesive agent and a light transmissive member. However, it is difficult to completely avoid the deterioration of components in an LED for which further improvement in light extraction efficiency is desired in the future, and there is a concern about a decrease in reliability.

  The present invention has been made in view of the above problems, and improves the adhesion between the covering member that covers the side surface of the light emitting element and the light transmitting element and the translucent member on the upper surface of the covering member, and has high reliability. An object is to provide a light-emitting device having a long lifetime.

  A light-emitting device according to the present invention includes a light-emitting element, a covering member that covers a side surface of the light-emitting element, and a transparent surface that has an end face that is substantially flush with the end face of the covering member on the upper surface of the light-emitting element and the covering member in the light emission direction. A light-emitting device comprising: a light-emitting member, wherein the covering member has a concave portion or a convex portion on an upper surface thereof, and the light emitting surface of the light-emitting element and the upper surface of the covering member other than the concave portion or the convex portion are substantially on the same surface. In addition, the translucent member is characterized by being fitted into a concave portion or a convex portion of the covering member.

  A method of manufacturing a light-emitting device comprising: a light-emitting element; a covering member that covers a side surface of the light-emitting element; and a light-transmitting member that is on the upper surface of the light-emitting element and the light-emitting direction of the covering member. A first step of forming the upper surface so as to be substantially flush with the light emitting surface of the light-emitting element, and forming a recess or projection on the upper surface, and a light-transmitting property so as to fit the recess or projection It has the 2nd process of forming a member, and the 3rd process of cut | disconnecting the end surface of a coating | coated member and a translucent member so that it may become substantially on the same surface.

  Thereby, in the light emitting device having a configuration in which the end surfaces of the constituent members are substantially on the same surface and are likely to be peeled off, the adhesion between the covering member and the translucent member is improved, thereby maintaining the reliability and extending the life.

1a is a plan view of the light emitting device according to Embodiment 1 of the present invention, and FIG. 1b is a cross-sectional view taken along the line AA of FIG. 1a. FIG. 1c is an example in which the recess is different from FIG. 1b, and FIG. 1d is an example in which the recess is different from FIG. 1a. However, FIG. 1a and FIG. 1d are the states before forming a translucent member. 2a is a plan view of the light-emitting device according to Embodiment 2 of the present invention, and FIG. 2b is a cross-sectional view taken along the line AA of FIG. 2a. FIG. 2c is an example in which the light emitting element and the recess are different from those in FIG. 2a. However, FIG. 2a and FIG. 2c are the states before forming a translucent member. 3A is a plan view of a light emitting device according to Embodiment 3 of the present invention, and FIG. 3B is a cross-sectional view taken along the line AA of FIG. 3A and a partially enlarged view of a recess. However, FIG. 3A is a state before forming a translucent member. FIG. 4A is a schematic diagram illustrating a manufacturing process of the light-emitting device according to Embodiment 1 of the present invention. FIG. 4B is a cross-sectional view of the light emitting device formed by the manufacturing process. FIG. 5 is a cross-sectional view of a light emitting device according to Embodiment 4 of the present invention and a partially enlarged view of a convex portion, which is an example having a convex portion on a covering member. 6a to 6c are partial enlarged views in a cross-sectional view of the recess according to the embodiment of the present invention, and show examples of the recess. FIG. 6d is a partially enlarged view in a cross-sectional view of the convex portion according to the embodiment of the present invention, showing an example of the concave portion. FIG. 7 is a cross-sectional view of a light emitting device according to Example 2 of the present invention and a partially enlarged view of a recess.

  Embodiments of the invention will be described below with reference to the drawings as appropriate. However, the light-emitting device described below is for embodying the technical idea of the present invention, and the present invention is not limited to the following. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the components described below are merely illustrative examples, and are not intended to limit the scope of the present invention unless otherwise specified. Note that the size, positional relationship, and the like of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, each element constituting the present invention may be configured such that a plurality of elements are constituted by the same member and the plurality of elements are shared by one member, and conversely, the function of one member is constituted by a plurality of members. It can also be realized by sharing. Similarly, the embodiments described below can be applied by appropriately combining the components and the like unless otherwise specified.

<Embodiment 1>
1a is a plan view of the light-emitting device according to Embodiment 1 of the present invention, and FIG. 1b is a cross-sectional view taken along the line AA of FIG. 1a. A light emitting device 100 shown in FIG. 1 mainly includes a light emitting element 1, a conductive wiring 2, a covering member 3, and a translucent member 5. The light emitting element 1 is flip-chip mounted on the conductive wiring 2. Further, on the conductive wiring, a covering member 3 that covers the side surface so as to expose the light emitting surface of the light emitting element 1 and has a concave portion 4 on the upper surface in contact with the translucent member 5 is disposed. And the translucent member 5 coat | covers continuously the upper surface of the light emission direction of the coating | coated member 3 which has a recessed part. In addition, the coating | coated member in this embodiment contains the light reflection material, and the translucent member contains the wavelength conversion member. The upper surface of the covering member 3 other than the recess and the light emitting surface of the light emitting element 1 are substantially on the same surface, but may not be completely on the same surface.

  With the above configuration, light leaking from the light emitting element to the side surface can be reflected by the light reflecting material to the light emitting surface, and can be emitted after wavelength conversion by the light transmissive member as the wavelength converting member. . Further, the covering member 3 and the translucent member 5 having the same end face are arranged by arranging the translucent member 5 such as a sheet on the upper surface of the light emitting element 1 and the covering member 3, and combining the covering member and the translucent member. It can be easily formed by cutting.

  Further, a concave portion 4 is provided on the upper surface of the covering member 3 in contact with the translucent member 5, and the concave portion 4 is fitted with the translucent member 5. By fitting the recess 4 and the translucent member 5, the adhesion between the covering member 3 and the translucent member 5 is increased. The concave portion 4 of the covering member is not a gradual curve, arc, or the like over the entire surface, which is formed by surface tension or the like due to resin potting, but is a coating that is substantially flush with the light emitting surface of the light emitting element 1 A concave portion (for example, a depth of about 30 to 50 μm) in which a hole or a groove is formed with respect to the upper surface of the member, and the translucent member 5 enters deeply into the concave portion 4, thereby further improving the adhesion. Can do. Moreover, although the recessed part 4 and the translucent member 5 are fitted, when it observes finely, it may not be fitted in part and there may be a part which is not contacting completely. Most preferably, the concave portion 4 and the translucent member 5 are in close contact with each other without any gaps. However, when the translucent member is difficult to enter the fine irregularities or voids of the rough surface, the concave portion, etc. There may be a non-fitting region, and it is only necessary that the two are fitted to such an extent that the adhesion between them can be maintained. The case where the translucent member is difficult to enter the recess is, for example, when the recess is deep as shown in FIG. 6c (depth is about 50 μm or more), or the opening surface of the recess is shifted from the bottom as shown in FIG. The opening surface is spaced from the light emitting element, but the bottom part is directed toward the light emitting element), and the concave part is widened toward the bottom as shown in FIG. 6b.

As described above, the light-emitting device of the present invention includes a light-emitting element, a covering member that at least partially covers the side surface of the light-emitting element at substantially the same height as the light-emitting surface of the light-emitting element, and the light-emitting element and the covering member A translucent member having an end surface substantially flush with the end surface of the covering member on the upper surface in the light emitting direction of the covering member, the covering member having a recess on the upper surface, and the recessed portion is fitted with the translucent member. It is characterized by. Similarly, the upper surface of the covering member has a convex portion, and the convex portion is fitted with the light reflective member.
In the present invention, in addition to the deterioration of the member due to heat and light from the light emitting element, the light emitting surface of the light emitting element, the upper surface of the covering member other than the concave portion or the convex portion, and the end surfaces of the covering member and the translucent member are substantially each. By being on the same plane, the translucent member is more easily peeled off. Therefore, a thin and highly reliable light-emitting device with improved adhesion without interposing an adhesive between the two members by fitting the translucent member with the concave or convex portion on the upper surface of the covering member, can do.

  Next, each component of the light emitting device of the present invention will be described in detail below.

(Light emitting element)
The light-emitting element 1 can be a known one, specifically a semiconductor light-emitting element. Particularly, when a GaN-based compound semiconductor is used for the light-emitting element structure, short-wavelength visible light or ultraviolet light that can efficiently excite the phosphor can be emitted. It is. A specific emission peak wavelength is about 240 nm to 560 nm, preferably about 380 nm to 470 nm. In addition, ZnSe-based, InGaAs-based, and AlInGaP-based semiconductor light emitting devices may be used.

(Light emitting element structure)
The light emitting element structure with a semiconductor layer is preferably composed of at least a first conductivity type (n-type) layer and a second conductivity type (p-type) layer and having an active layer therebetween. In addition, the electrode structure is preferably the same surface side electrode structure in which both the first conductivity type and the second conductivity type electrodes are provided on one main surface side, but the electrodes are provided to face each main surface of the semiconductor layer. A counter electrode structure may be used. In the same-surface electrode structure, flip-chip mounting is preferable in which the electrode formation surface is a mounting surface and the substrate side facing it is a main light emitting surface. When flip chip mounting is used, there is no electrode or wire on the surface of the light emitting element facing the phosphor layer, so that light extraction efficiency is good. Performance can be ensured and the mounting area can be reduced. Note that the growth substrate of the semiconductor layer may be removed, and a structure in which, for example, a conductive substrate or another translucent member or a substrate is bonded to the semiconductor layer from which the growth substrate has been removed may be employed. The growth substrate can be removed by mounting or holding on a support, apparatus, or submount, peeling, polishing, or LLO (Laser Lift Off). In addition, the light emitting element can have a light reflecting structure. Specifically, of the two main surfaces of the semiconductor layer facing each other, the other main surface facing the light emitting surface is the light reflecting side, and this light A light reflection structure is provided in the semiconductor layer on the reflection side or in an electrode. Examples of the light reflection structure include a structure in which a multilayer film reflection layer is provided in the semiconductor layer, or a structure in which an electrode or a reflection layer having a highly light reflective metal film such as Ag or Al or a dielectric multilayer film is provided.

  An example of the light-emitting element 1 in FIG. 1 will be described. In the light-emitting element 1, an n-type semiconductor layer that is a first nitride semiconductor layer, a light-emitting layer that is an active layer, and a p-type semiconductor layer that is a second nitride semiconductor layer are sequentially formed on a light-transmitting sapphire substrate. Are stacked. An n-type pad electrode, which is a first electrode, is provided in a part of the n-type layer that is exposed, and a light-reflecting conductive layer such as Ag or the like is formed on almost the entire surface of the p-type layer. A p-type pad electrode as a second electrode is provided, a protective film is provided as an n-type, and a surface of the p-type pad electrode is exposed to cover the semiconductor layer. As the substrate of the light emitting element, an insulating substrate such as sapphire or a semiconductor conductive substrate such as silicon carbide, Si, ZnS, ZnO, GaN, or AIN can be used. In the case where the substrate of the light emitting element serves as a light emitting surface, it is preferable that the substrate is light transmissive such as sapphire or SiN.

(Translucent member)
The light emitting device 100 of FIG. 1 includes a light transmissive member 5 that transmits at least part of light from the light emitting element 1 on the upper surface of the light emitting element 1 and the covering member 3 that covers the side surfaces of the light emitting element 1. The translucent member 5 is disposed on the upper surface of the light emitting element 1 and the concave portion 4 of the covering member, is fitted to the concave portion 4, and the shape is particularly limited as long as the end surface is substantially flush with the end surface of the covering member. Not. Therefore, the lower surface of the translucent member 5 has a convex shape that fits into the concave portion 4 in a region in contact with the concave portion 4 of the covering member. Moreover, when the coating | coated member 3 has a convex part, the lower surface of the translucent member 5 becomes a concave shape which fits a convex part. The concave shape and the convex shape of the translucent member 5 are preferably completely corresponding, but the non-corresponding portion may be complemented with an adhesive or the like, and may be fitted in part. It doesn't matter if there is no part. Further, the upper surface of the translucent member 5 (the surface not in contact with the light emitting element and the covering member) has a gentle concave shape or convex shape corresponding to the region where the concave portion or convex portion of the covering member 3 is located. (That is, when the translucent member 5 is laminated in a flexible state, it may be deformed along the concave portion or the convex portion of the covering member 3 below the translucent member 5).

  Further, the number of the light emitting elements 1 to be bonded to the translucent member 5 is not particularly limited, and may be one or plural. A plurality of beams are preferable because the amount of light flux can be increased. In the case of a plurality, it is easy to obtain a preferable light distribution if they are arranged regularly or periodically such as in a line or a lattice at equal intervals.

As the material of the translucent member, for example, a resin, glass, an inorganic material, or the like can be used. Specifically, a glass plate, a single crystal body, a polycrystal body, an amorphous body, a ceramic body, etc. are mentioned.
In addition, it is composed of a sintered body, an aggregate, a porous body, a material in which a light-transmitting member such as a light-transmitting resin is mixed and impregnated, a molded body of the light-transmitting resin, and the like.

  The translucent member 5 is preferably an inorganic material such as glass rather than an organic material such as a resin from the viewpoint of heat resistance. However, in the present invention, the covering member 3 and the translucent member 5 need to be fitted, so that it is easy. A resin or the like that can form a desired shape is preferred. For example, if it is set as the sheet-like translucent member 5 comprised with a silicone resin, when it arrange | positions on the upper surface of the coating | coated member 3 which has a recessed part or a convex part in a semi-hardened flexible state (for example, elastic modulus about 1 MPa or less). And since it deform | transforms along the shape of the recessed part or convex part, the translucent member 5 and a recessed part or convex part can be easily fitted. Thereafter, since the resin sheet is fully cured, the resin sheet becomes harder than the flexible state at the time of arrangement after the light emitting device is completed, and both mass productivity and reliability can be achieved. Even if it is not a sheet, it can be suitably used as long as it has flexibility. For example, the translucent member 5 may be formed by forming a film and performing a lamination process.

Furthermore, the translucent member 5 may be formed by spraying. By doing so, a recess that cannot be fitted by placing a resin or the like in a flexible state, that is, a recess having a deep recess as shown in FIG. It is possible to form a translucent member that can be easily fitted even to a concave portion in which the opening surface and the bottom portion are shifted (inclined as viewed in a cross-sectional view). Similarly, when the covering member has a convex portion, the convex portion can be easily fitted even if the convex portion is high or has a complicated shape (such as being slanted in the sectional view).
In addition, spraying is preferable because fine thickness adjustment can be performed by repeating spraying a plurality of times until a desired film thickness is obtained. In particular, as in this embodiment, when the translucent member contains a wavelength conversion member such as a phosphor, a desired luminescent color can be easily obtained by repeating spraying.

  In addition, by using a light-transmitting member that is hard (for example, an elastic modulus of about 10 MPa or more), deterioration over time can be reduced, and the light-emitting device 100 having a longer life can be obtained. For example, a desired sintered body can be processed so as to be fitted to the concave portion or the convex portion, and can be disposed opposite to the upper surfaces of the light emitting element 1 and the covering member 3. In the case of arranging after processing, it is necessary to maintain high processing accuracy. However, when it is not possible to completely fit, an adhesive is provided between the translucent member 5 and the covering member 3. It doesn't matter.

  Although the translucent member 5 may be comprised only with said material, it contains the fluorescent substance which can carry out wavelength conversion of at least one part of the emitted light from the light emitting element 1 like this embodiment. The desired emission color can be obtained. In this case, the translucent member 5 becomes a base material containing a phosphor. Moreover, the translucent member 5 may be comprised only with fluorescent substance. Typical phosphors that can emit white light in combination with a blue light emitting element are YAG phosphors (yttrium, aluminum, garnet) activated by cerium with a garnet structure and LAG phosphors (lutetium, aluminum, garnet). Etc.) are preferred. In addition, phosphors such as BAM, BAM: Mn, (Zn, Cd) Zn: Cu, CCA, SCA, and red phosphor nitride phosphors (SCESN, SESN, CESN, CASBN, and CaAlSiN3: Eu) can be used. When a reddish component is increased using a nitride-based phosphor having yellow to red light emission, illumination with a high average color rendering index Ra, a light bulb color LED, or the like can be realized. The phosphor can be provided not only in the phosphor layer but also between the light emitting element 1 and the covering member 3 in an adhesive interposed between the constituent members, for example.

  As the translucent member 5 containing a phosphor, a material containing the above-described translucent member as a base material and containing a phosphor can be used. For example, phosphor sheet, phosphor glass, phosphor sintered Examples include the body.

(Coating member)
The covering member 3 covers the side surface of the light emitting element 1 as shown in FIG. More specifically, the light emitting surface of the light emitting element 1 is exposed and covered so that the side surface of the light emitting element 1 is embedded. That is, at least a part of the light emitting surface of the light emitting element 1 and the upper surface of the covering member other than the concave portion 4 are substantially on the same plane, and the heights of both are substantially equal. However, they may not be completely the same height, and may have a slight height difference of about 10 to 50 μm. As shown in FIG. 1 c, the covering member 3 may not cover all the side surfaces of the light emitting element 1.

  Further, the covering member 3 has a concave portion or a convex portion on the upper surface in contact with the translucent member 5. The concave portion or the convex portion is not a gentle curve over the entire surface of the covering member 3, but has a deep hole or groove (for example, a depth of about 30 to 70 μm, more preferably about 50 μm) or a large protrusion (height). About 30 to 70 μm, more preferably about 50 μm) can enhance the adhesion to the translucent member 5. The width of the concave portion or the convex portion in the short direction is preferably about 100 μm or less because the fitting property with the translucent member 5 does not deteriorate.

  As described above, the concave portion can be a hole or a groove, and the convex portion can be a protrusion protruding from the light emitting surface of the light emitting element 1. The concave portions or the convex portions may be continuous as shown in FIG. 1a, divided as shown in FIG. 1d, or distributed unevenly. Even if the concave portion or the convex portion is unevenly distributed in a complicated shape, it can be easily fitted by arranging a flexible translucent member. When the concave portion or the convex portion surrounds about 50% or more of the outer edge of the light emitting element 1, the light transmissive member 5 is hardly peeled off. Adhesion with the member 5 can be effectively increased.

  By the way, when forming a covering member using a mold, a release sheet may be disposed between the mold, the light emitting element, and the covering member in order to easily peel the mold from the light emitting element and the covering member. However, the recess 4 of the covering member can be formed by utilizing the looseness of the release sheet. The loosening of the release sheet occurs when the release sheet is pressed against the light emitting element, and the release sheet of the portion pressed against the light emitting element and the mold is loosened toward the covering member. The slack forms a recess in the covering member. When the mold sheet is pressed and the elastic modulus of the release sheet is greater than the elastic modulus of the covering member, for example, if the covering member 3 is made of a liquid resin or the like, a recess can be formed. is there. In this case, the concave portion 4 is often along the light emitting element, but a concave portion separated from the light emitting element can also be formed. Further, the depth of the concave portion is often about twice the thickness of the release sheet. For example, when the thickness of the release sheet is about 50 μm, a concave portion having a depth of about 20 to 100 μm is formed. Cheap.

  From the above, the thicker the release sheet, the deeper the recesses become, but when the release sheet is twisted using a thin release sheet, the twist forms a relatively narrow opening with a relatively narrow opening surface. It is also possible to do. Further, in this case, the concave portion is formed at a position separated from the light emitting element, and often has a shape in which the bottom portion is displaced in the light emitting element direction with respect to the opening surface of the concave portion. Such a recess is suitable because the translucent member of the recess is sandwiched between the upper part and the lower part of the covering member, and thus the translucent member is more difficult to peel off.

  Further, when a plurality of light emitting elements are arranged and the arrangement interval is narrowed (for example, about 100 to 1000 μm apart), the looseness of the release sheet pressed against the adjacent light emitting elements synergizes between the light emitting elements, A deeper recess (for example, a depth of about 50 μm or more) can be formed, and a recess along the light emitting element is easily formed.

  It is the constituent member in the region where the amount of light emission is large, that is, the translucent member 5 in the portion that is in direct contact with the light emitting element 1, where deterioration is most likely to occur and peeling is likely to occur. Therefore, when the concave portion 4 or the convex portion 54 along the light emitting element as shown in FIG. 1B or FIG. 5 is formed and fitted with the translucent member, the adhesion between the covering member 3 and the translucent member 5 is effectively improved. Enhanced. When a mold and a release sheet are used for forming the covering member, a desired recess along the light emitting element is formed by adjusting the pressing pressure of the mold, the thickness of the release sheet, the arrangement of the light emitting element, and the like. It is efficient and preferable. It is also possible to form a recess as shown in FIG. In this recess 4, the looseness of the release sheet is pressed in the direction of the light emitting element of the covering member, and the side surface of the recess 4 is formed by the side surface of the light emitting element 1 and the covering member 3. As described above, when the side surface of the light emitting element 1 is partially exposed and the translucent member 5 has a concave shape so as to sandwich the light emitting element 1, the translucent member 5 is more difficult to peel off.

  In the present embodiment, one light-emitting element 1 having a rectangular shape in plan view is used, and a circumferential groove-shaped recess 4 is provided along the periphery of all four sides of the light-emitting element 1. The concave portion along the light emitting element refers to a state in which the concave portion 4 is in contact with the light emitting element when seen in a plan view as shown in FIG. Since the recesses are along the entire periphery of the light emitting element, the contact state between the covering member 3 and the translucent member 5 becomes uniform, and the two members are less likely to peel off. Moreover, since the light radiate | emitted from the light emitting element 1 to the translucent member 5 is permeate | transmitted uniformly, it is preferable. In particular, when the translucent member contains a fluorescent substance, wavelength conversion can be performed uniformly, so that uneven color can be prevented. In the case where a convex portion is formed on the entire periphery of the light emitting element, the convex portion has a frame shape surrounding the light emitting element. In addition, as long as the recessed part 4 or the convex part fits the translucent member 5 in the upper surface of the coating | coated member 3, even if it is spaced apart from the light emitting element 1, it does not need to be formed in all the periphery, and formation position Is not particularly limited. The same applies when a plurality of light emitting elements are arranged.

  As a material of the covering member 3, for example, a light-transmitting base material containing a light reflective material can be used. It is preferable that the covering member is a light reflecting member because the light emitted from the light emitting element 1 can be reflected to the upper light transmitting member without leaking from the side surface. Further, the covering member may be composed of only a light-transmitting base material that does not have light reflectivity, and may contain a wavelength conversion member such as the phosphor described above. As long as the forming process is different, the material may be partially different from or completely the same as that of the translucent member 5. In addition, the light absorption at the time of wavelength conversion can be reduced by making either one of a translucent member and a covering member contain a wavelength conversion member and making one translucent not containing a wavelength conversion member. Thus, a light emitting device with high light extraction efficiency can be obtained. As the wavelength conversion member to be contained in the base material, a phosphor is particularly preferable, and the phosphors mentioned as the wavelength conversion member to be contained in the translucent member are preferably used.

  The substrate is, for example, a resin material, and a translucent silicone resin composition, a modified silicone resin composition, or the like can be used. In addition, an insulating resin composition having translucency such as an epoxy resin composition, a modified epoxy resin composition, and an acrylic resin composition can also be used, and is excellent in weather resistance, such as a hybrid resin containing at least one of these resins. A sealing member can also be used. When the base material is a resin as described above, a concave portion or a convex portion can be easily formed on the upper surface of the covering member, and the controllability, sealing performance, and airtightness of the covering region (side surface of the light emitting element) can be improved. Therefore, an inorganic material having excellent light resistance such as glass and silica gel can be used. Furthermore, when the base material has high heat resistance, it can cope with heat from the light emitting element and the translucent member. In the first embodiment, a silicone resin is used as a resin that is a base material constituting the covering member 3. Silicone resins have high heat resistance and light resistance and are preferably used.

The light reflective material has high light reflectivity, and the material is one oxide selected from the group consisting of Ti, Zr, Nb, Al, and Si, or at least one of AlN and MgF. Specifically, at least one selected from the group consisting of TiO ₂ , ZrO ₂ , Nb ₂ O ₅ , Al ₂ O ₃ , MgF, AlN, and SiO ₂ can be used. When the light-reflective material particles are one kind of oxide selected from the group consisting of Ti, Zr, Nb, and Al, light absorption can be suppressed while having high light reflectivity, and refraction with the base material. This is preferable because the rate difference can be increased. The covering member 3 can also be formed of a molded body made of the light reflective material, and specifically, a porous material such as an aggregate obtained by agglomerating the particles or a sintered body. In addition, a molded body by a sol-gel method may be used. This increases the refractive index difference between the light reflective material and the air in the porous body, so that the light reflectivity can be improved. Furthermore, since it can be comprised with an inorganic material, reliability increases and it can also be set as a composite molded object.

  In the covering member 3 containing the light reflective material in the base material described above, the light leakage differs depending on the concentration of the light reflective material, and therefore, it may be appropriately adjusted according to the shape and size of the light emitting device. For example, in the case where the width and thickness of the covering member are formed thin with a relatively small light emitting device (for example, the thickness of the light emitting device is about 50 μm or less), it is preferable to provide a high-concentration light reflective material. On the other hand, the same particle size as that of a conventional filler or the like can be used so as to be suitable for manufacturing raw materials for the covering member 3, application, molding and the like. As an example, it is preferable that the concentration of the light reflecting material is 20 weight percent or more and the thickness of the covering member is about 20 μm or more. Within this range, productivity is good, and emission light with high brightness and high directivity can be obtained from the light exit surface. Furthermore, you may add another filler in the base material which is resin. For example, a heat conductive material can be added, heat generated by the light emitting element can be diffused efficiently, and reliability and output can be improved. Specifically, a thermal conductivity of 0.8 W / K · m or more is preferable as the thermally conductive material, and examples thereof include metal materials such as Ag and Cu, and ceramic materials such as diamond, alumina, and AlN. You may mix and contain. Further, pigments can be mixed and colored to absorb light of a specific wavelength.

  Although the covering region of the covering member 3 is as described above, it is preferable that the covering member 3 is also provided between the light emitting element and the pair of conductive wirings. More specifically, it is provided so as to fill a space between the p-pad electrode, the n-pad electrode and the conductive adhesive on the bottom surface of the light-emitting element 1 mounted with flip chip. Thereby, it is possible to insulate the pair of conductive wirings, further improve the light extraction efficiency and the wavelength conversion efficiency, and improve heat dissipation.

(Mounting board)
The mounting substrate is a substrate on which the light emitting element is mounted and electrically connected, and examples thereof include a substrate having a conductive wiring on a support substrate and a substrate made of only a conductive wiring. Furthermore, the mounting substrate consisting only of conductive wiring initially has a supporting substrate, but it is peeled off during the manufacturing process and finally becomes only conductive wiring, and one that is formed only from conductive wiring from the beginning ( For example, it is classified into a lead electrode and the like. In any case, a conductive adhesive such as solder, Ag paste, or Au bump may be used for mounting with the light emitting element.

First, a mounting substrate having conductive wiring on a support substrate will be described in detail. The conductive wiring on the support substrate is formed of a metal layer such as Au, Cu, or Al, and two or more layers of different metals may be stacked.
The thickness of the conductive wiring is not particularly limited, but is preferably about 1 to 50 μm. The support substrate is preferably formed of a material having low light transmittance. Specific examples include ceramics (Al ₂ O ₃ , AlN, etc.), or resins such as phenol resin, epoxy resin, polyimide resin, BT resin, polyphthalamide (PPA). Moreover, the metal substrate which formed the insulating layer on the surface may be sufficient. A mounting substrate having conductive wiring on the support substrate as described above is preferable because light emitted from the light-emitting element is less likely to escape below the substrate and the light extraction efficiency of the light-emitting device is improved. Therefore, when the conductive wiring is a thin film of about several μm, or when the covering member does not have light reflectivity, it is suitably used for preventing light leakage.

  Next, a mounting substrate made of only conductive wiring will be described. When the support substrate is removed during the manufacturing process, the conductive wiring is made of a metal such as Cu, Al, Au, Ag, W, Mo, Fe, Ni, Co, or an alloy thereof (Fe-Ni alloy, etc.), phosphor bronze, It is formed of Fe-containing Cu, ITO or the like. The film thickness is preferably about 25 to 200 μm, for example, and more preferably about 50 to 100 μm. The conductive wiring having such a thickness is particularly preferably a plating layer laminated with plating.

  As the support substrate to be removed, in addition to a conductive metal plate such as a SUS plate, a substrate in which a conductive film is formed by sputtering or vapor deposition on an insulating plate such as polyimide can be used. Alternatively, an insulating plate member that can be attached with a metal thin film or the like may be used. Further, since it is necessary to peel off the conductive wiring, it is necessary to use a bendable member, and it is preferable to use a plate-like member having a film thickness of about 10 to 300 μm depending on the material. Examples of the material for the support substrate include a metal sheet such as Fe, Cu, Ag, Co, and Ni, and a resin sheet made of polyimide to which a metal thin film can be attached, in addition to the SUS. In this manner, since there is no supporting substrate and the conductive wiring forms the outer surface of the light emitting device 100, a small light emitting device can be obtained.

  Here, it is preferable to control the difference between the linear expansion coefficients of the conductive wiring and the covering member to be small. The difference is preferably about 40% or less, more preferably about 20% or less. Thereby, peeling of a conductive wiring and a coating | coated member can be suppressed and it can be set as the light-emitting device excellent in reliability. Further, it is preferable that the difference in coefficient of linear expansion between the covering member and the support substrate to be removed is smaller. The difference is preferably about 30% or less, more preferably about 10% or less. When a SUS plate is used as the support substrate finally removed, the difference in linear expansion coefficient is preferably about 20 ppm or less, more preferably about 10 ppm or less. Thereby, the residual stress of a coating | coated member and a SUS board can be relieved, and the curvature of the aggregate | assembly of the light-emitting device after SUS board peeling can be relieve | moderated. By reducing the warpage, it is possible to reduce internal damage such as cutting of the wire, and to suppress the positional deviation at the time of singulation, and to manufacture with high yield.

  An example of the mounting substrate formed only from the conductive wiring from the beginning is a lead electrode. As the material of the lead electrode, Fe, Cu, Fe-containing Cu, Tin-containing Cu, Al or the like is preferable in consideration of electric resistance. By punching such a metal flat plate, it is possible to form a lead frame having a plurality of pairs of projecting portions serving as a pair of positive and negative lead electrodes. The surface of the lead electrode is preferably coated with a metal made of Ag, Au, or Pd by plating, sputtering, or the like, since the light reflectance can be improved.

(Frame)
The light emitting device may have a frame body that holds the covering member. The frame can be formed of ceramic or resin. As the material, alumina having high light reflectivity is preferably used, but the material is not limited to this as long as a reflective film is formed on the surface. In addition, you may form by screen-printing or adhere | attaching the molded object separately shape | molded on a support substrate. The frame may be colored according to the purpose. In addition, this frame can also be removed after filling or molding the covering member. When not removed, it functions as a light reflective member. When the covering member has light reflectivity, it has the same function and may be regarded as a part of the covering member. When the frame is also considered as a part of the covering member, the end face of the translucent member is formed so as to be substantially flush with the end face of the frame.

(adhesive)
An adhesive may be appropriately interposed between the light emitting element, the covering member, the translucent member, the mounting substrate, and the frame body in order to strengthen the adhesion between the members. In the first embodiment, an adhesive is not provided in consideration of cost and productivity.

  The adhesive is preferably made of a material that can effectively guide the emitted light from the light emitting element to the translucent member side and optically connect both members. Examples of the material include resin materials used for the respective members. As an example, a translucent adhesive material such as a silicone resin is used. In addition, you may provide the same translucent adhesive agent between other members on an optical path. The coating method is not particularly limited, and may be ejected by a dispenser or a low-viscosity resin may be spin-coated with a spin coater. According to the dispenser, it is easy to adjust the application amount and the application area, but spin coating can easily provide an adhesive with a uniform thickness over a wide range.

(Method for manufacturing light emitting device)
An example of a method for manufacturing the light emitting device 100 shown in FIG. 1 will be described below with reference to FIG. As shown in FIG. 4a, bumps are formed on the light emitting element 41, and the light emitting element 41 is flip-chip mounted on the conductive wiring 42 on the support substrate through the bumps. In this example, one light-emitting element 41 is mounted side by side in a region corresponding to one light-emitting device (however, the number of light-emitting elements can be changed as appropriate). The support substrate is removed during the manufacturing process, and the conductive wiring is used as a mounting substrate.

(First step)
In the first step, the upper surface of the covering member is formed so as to be substantially flush with the light emitting surface of the light emitting element, and a recess is formed on the upper surface. Specifically, the light emitting surface side of the light emitting element 41 is sandwiched by the upper mold 50 and the lower surface side of the support substrate 49 is sandwiched by the lower mold 60, and the covering member 43 is formed of a resin containing a light reflective material. .

  When the mold is used as described above, the release sheet 48 can be disposed in close contact with the upper mold. By doing so, the interference between the light emitting element 41 and the mold is alleviated, and the mold and the member are not easily separated, but the part of the release sheet that is pressed against the light emitting element and the upper mold by the stress during pressing. 48 is loosened in the direction of the covering member 43 on the periphery of the light emitting element, so that a groove-like recess 44 along the light emitting element can be formed. That is, the covering member 43 and the recess 44 can be formed simultaneously. Increasing the pressure during pressing increases the looseness of the release sheet, and it is possible to form deep recesses in the covering member. The concave portion or the convex portion is preferably provided around the light emitting element that is easily affected by light or heat, and most preferably along the light emitting element. If the release sheet 48 is used, the cost applied to the mold can be reduced, and a recess along the light emitting element can be formed without fear of damaging the light emitting element. In addition to using the looseness of the release sheet, the concave portion can be formed by a convex structure of the upper mold, etching, cutting, blasting, or the like, and a concave portion separated from the light emitting element can also be formed. The first step is performed before the translucent member 45 is formed.

(Second step)
In the second step, a translucent member 45, here a phosphor sheet containing phosphor, is directly disposed on the upper surface of the light emitting element 41 and the covering member 43 in the light emitting direction, and is fitted to the recess 44 of the covering member. . By disposing a relatively flexible and adhesive translucent member containing a phosphor in a resin, the wavelength of light emitted from the light exit surface can be converted into a desired emission color, and Since it is easy to deform together, fitting becomes easy. In addition, the translucent member 45 can be formed by a coating method, a squeegee, a mold, or the like.

(Third step)
Finally, if the support substrate 49 is peeled off from the conductive wiring 42, and the end faces of the covering member 43 and the translucent member 45 are substantially on the same plane, they are diced together at a desired position and separated into individual pieces. A device similar to the light emitting device 100 in FIG. 1 can be obtained. For example, as shown by the dotted line in FIG. 4a, the dicing position may be in the middle of the concave or convex portion when the mounting interval between the light emitting elements is narrow or has a concave or convex portion that is separated from the light emitting element. Absent. In this case, it becomes the recessed part 44 as shown to the light-emitting device 400 of FIG. 4b, and becomes a shape where the recessed part was cut | disconnected in the middle. Thereby, a small light-emitting device can be manufactured with high productivity.

<Embodiment 2>
2a is a plan view of the light emitting device according to Embodiment 2 of the present invention, and FIG. 2b is a cross-sectional view taken along the line AA of FIG. 2a. The mounting substrate is the lead electrode 22, a plurality of light emitting elements 21 (two in the figure) are arranged, and a recess is formed so as to surround the entire light emitting elements. It shall be manufactured by a structure and a manufacturing method. The plurality of light emitting elements 21 not only increases the amount of light flux but also synergizes the loosening of the release sheet between adjacent light emitting elements, so that the recesses between the light emitting elements are more than the recesses not sandwiched between the light emitting elements. Also deeply formed. Moreover, it is preferable that the mounting substrate is the lead electrode 22 because the process of peeling the support substrate can be reduced. The light-emitting device of FIG. 2c is equipped with four light-emitting elements, and a plurality of recesses are formed along each light-emitting element.

<Embodiment 3>
3A is a plan view of the light emitting device according to Embodiment 3 of the present invention, and FIG. 3B is a cross-sectional view taken along the line AA of FIG. 3A and a partially enlarged view of the recess. In the partially enlarged view, the upper surface of the translucent member 5 is gently depressed corresponding to the groove of the recess 4 of the covering member. The covering member 33 of the present embodiment does not have light reflectivity, and is formed of a light-transmitting resin such as silicone resin. The recess 34 is separated from the light emitting element 31 and surrounds the periphery thereof. An adhesive 37 is provided between the adhesive members 35. Moreover, the conductive wiring 32 and the frame 36 are provided on the upper surface of the support substrate 39, and the upper surface of the covering member is formed slightly lower than the light emitting surface of the light emitting element. Other structures except the above are substantially the same as those of the first embodiment, and the description of the same configuration will be omitted as appropriate.

  In the light emitting device 300, the light emitting elements 31 are connected side by side on the conductive wiring 32 formed on the upper surface of the support substrate 39, and a desired frame body 36 is provided around the light emitting element 31. Since the covering member 33 is partitioned by the frame body 36, it is easy to pot the covering member 33 with a dispenser (liquid dispensing apparatus) or the like. Furthermore, since the frame body 36 has light reflectivity, it can reflect the emitted light from the side of the light emitting element that has passed through the covering member and guide it toward the upper light transmissive member. In the drawing, the height of the frame body 36 is substantially the same as the light emitting surface of the light emitting element 31, but it may be higher or lower than that.

  In the third embodiment, the adhesive layer 37 is in the recess, and bonds the covering member 33 and the translucent member 35. When the adhesive 37 is provided between the covering member 33 and the translucent member 35, the translucent member 35 can be effectively prevented from being peeled without reducing the light transmission efficiency. The adhesive layer 37 may be used when the translucent member 35 is hard and not sticky, such as a ceramic or phosphor sintered plate, or when the concave portion 34 is deep and the translucent member 35 is difficult to fit. In some cases, it is preferably used to ensure fitability. The application range is not limited to the concave portion 34, but can be disposed on the upper surface of the light-transmitting member other than the light emitting element and the concave portion. The wider the application range, the higher the adhesion of the light-transmitting member.

  Like this embodiment, the translucent member 35 does not need to be arrange | positioned on the upper surface of the frame 36 which has light reflectivity. However, when the covering member 33 has light reflectivity, the frame body 36 is regarded as a part of the covering member 33, and the end faces of the translucent member 35 and the frame body 36 are formed to be substantially the same surface. Good.

  Here, although the recessed part 34 is not what followed the light emitting element 31, it forms using the slack of a release sheet. In addition, such a concave portion 34 can be formed by polishing, etching, blasting into a desired concave shape using a jig, or by a convex structure of an upper mold. Moreover, you may provide a some recessed part combining the said method. According to polishing, etching, and blasting, the detailed shape, depth, and position of the recess 34 can be selected. In addition, Embodiment 3 has a structure having a support substrate, and the conductive wiring 32 provided on the upper surface of the support substrate is connected to the conductive wiring on the back surface of the support substrate by the conductive wiring provided in the thickness direction of the support substrate. Connected. It is preferable to have a support substrate because a process of peeling the support substrate can be reduced and further light leakage to the lower side of the substrate can be prevented.

Here, the covering member 33 may contain a phosphor. For example, when using a light-emitting element 31 of blue (emission wavelength 430Nm～490nm), it is excited in the blue light for the covering member 33 for emitting red light _{(Sr, Ca) AlSiN 3:} SCASN phosphor such as Eu, CaAlSiN ₃ : When a CASN phosphor such as Eu is contained and a YAG phosphor that emits green light is contained in the translucent member 35, light is emitted by RGB (red, green, blue), and white with higher color rendering properties The light emitting device 300 that emits light can also be used.

<Embodiment 4>
In the light-emitting device 500 illustrated in FIG. 5, the covering member has a convex portion. The light emitting device 500 according to the present embodiment is the light emitting device according to the first embodiment in which the structure and the manufacturing method of other constituent members have a concave portion except that the translucent member has a concave shape that fits the convex portion. Can be substantially the same.

  Similarly to the concave portion, the convex portion can be effectively prevented from peeling off the translucent member due to deterioration of the member as it is closer to the light emitting element 51. However, in consideration of the adhesion between the light emitting element 51 and the translucent member 55, it is preferable that the convex portion be separated from the light emitting element 51 when the translucent member is disposed in a relatively hard state. This is because if the light-transmitting member in a relatively hard state is disposed, the light-transmitting member is not partially aligned with the light exit surface due to the convex portion, and in this case, the emitted light is not easily transmitted uniformly. However, by arranging the translucent member in a flexible state, the translucent member can be formed in close contact with the light emitting surface of the light emitting element. In this case, it is more preferable that the convex portion is also along the light emitting element.

  The convex portion 54 is generally formed by a concave structure of the upper mold. However, when the covering member is formed, a thin release sheet is used, and the separation generated when the mounting interval between the plurality of light emitting elements is narrowed. It can also be formed by tearing the mold sheet. When the tear of the release sheet is used, it can be formed simultaneously with the filling of the covering member and along the light emitting element in the same manner as the formation of the concave portion, but often has a distorted shape as shown in FIG.

  As another method of forming the convex portion, the covering member is previously provided higher than the light reflecting surface of the light emitting element, the light emitting element and its peripheral edge are masked, and the unmasked portion is the light emitting surface of the light emitting element. After forming the covering member so that it is almost flush with the light emitting surface by a die or potting, etc. Examples include a method of forming at a desired position. Moreover, you may provide a some convex part combining the above-mentioned method suitably. In any case, the formation of the convex portion is less likely to damage the light emitting element, but it is preferable that the covering member has a concave portion because the light emitting device can be thinned.

<Example 1>
Hereinafter, a process of forming the light emitting device 100 in Example 1 will be described. First, a support substrate made of a metal such as SUS is prepared, and a resist having an opening is formed by applying and exposing a resist. Next, after plating a metal with a desired thickness in the opening, the resist is removed to form a pair of conductive wirings (thickness of about 30 to 100 μm, particularly preferably about 70 μm) that are separated from each other. As the plating method, electrolytic plating, electroless plating, or the like can be used. In particular, electrolytic plating is preferable because the resist is easily removed and the shape of the conductive wiring is easily formed.

  In Example 1, a substantially rectangular light emitting element having a planar view shape of about 0.8 m × 0.3 mm (light emission wavelength: about 455 nm, thickness) as a light emitting element on a plurality of pairs of positive and negative electrodes spaced apart from each other. About 120 μm) are each flip-chip mounted. The distance between adjacent light emitting elements is about 1500 μm.

Subsequently, a support substrate on which a plurality of light emitting elements are mounted is sandwiched in a mold composed of an upper mold and a lower mold, and a covering member is formed by compression molding or the like. At this time, the release sheet is disposed so as to be in close contact with the upper mold, and then the covering member is filled. The release sheet has a thickness of about 20 to 100 μm, preferably about 50 μm. In consideration of thermal durability, wettability, low cost, etc., ETFE (tetrafluoroethylene (C ₂ F ₄ ) and ethylene (C ₂ H ₄₎ using the copolymer). The heating temperature, the heating time, the pressure, the thickness of the release sheet, and the like by the mold can be appropriately adjusted depending on the composition of the resin to be used, the desired recess of the covering member, and the like.

In Example 1, a covering member made of a silicone resin containing a light-reflecting material which is a fine particle of TiO _{2 having} a particle diameter of about 270 nm at a concentration of about 23 weight percent is formed. The covering member is formed so as to cover all the side surfaces of the light emitting element and expose the light emitting surface with substantially the same thickness (about 120 μm) as the light emitting element, and is also provided between the pair of electrodes and below the light emitting element. . Moreover, the recessed part along a light emitting element is provided in the upper surface of the light emission direction of a coating | coated member by loosening of a release sheet. The looseness is formed almost simultaneously with the formation of the covering member because the release sheet in the region that comes into contact with the light emitting element at the time of pressing is pressed in the direction of the covering member using the silicone resin as a base material. The concave portion is not a gentle curve over the surface of the covering member, but has a groove shape (depth of about 50 μm, width of about 100 μm or less).

  Then, the exposed surface of the light emitting element and the upper surface of the covering member on which the recesses are formed are directly covered with a phosphor sheet (thickness: about 50 μm) containing a YAG phosphor that is a translucent member. In the case where the covering member is formed up to the light emitting surface of the light emitting element, the light transmitting surface may be disposed after the light emitting surface is appropriately exposed by polishing or the like. The concave portions of the phosphor sheet and the covering member are fitted. The translucent member does not have to be in the form of a sheet, and can be formed of a resin or the like using a mold. The support substrate is removed after the translucent member is formed. Subsequently, the light emitting device 100 having a substantially rectangular shape with a thickness of about 0.26 mm is obtained by dicing so that the shape in plan view is about 2.2 mm × 0.5 mm and includes one light emitting element at the center.

  As described above, in Example 1, it is possible to provide a light-emitting device that has substantially the same effect as that of Embodiment 1.

<Example 2>
The light emitting device 600 according to the second embodiment illustrated in FIG. 7 includes a mounting substrate in which the concave portion 64 of the covering member is separated from the light emitting element 61 and the conductive wiring 62 is provided on the support substrate 69. Further, the translucent member 65 is formed by spraying and is fitted into the recess 64 of the covering member. Except for the above, the light emitting device 600 has a structure substantially similar to that of the first embodiment. A description of the same configuration will be omitted as appropriate.

  First, Cu is plated at a desired position on a ceramic support substrate (thickness: about 500 μm) to form a pair of positive and negative conductive wires (thickness: about 50 μm). Then, the light emitting element 61 is flip-chip mounted on the upper surface, and the covering member 63 is provided by compression molding using a mold or the like as in the first embodiment.

  At this time, a release sheet that is thinner than the release sheet used in Example 1 (thickness: about 30 μm) is used, the interval between the light emitting elements is narrowed (for example, the separation distance is about 300 μm), and the press pressure of the mold is increased. Thereby, the recessed part 64 spaced apart from the light emitting element 61 can be formed. The concave portion 64 has a shape in which the opening surface is separated from the light emitting element as viewed in a plan view and extends in the light emitting element direction from the opening surface toward the bottom.

Further, the translucent member 65 is formed by spraying a liquid silicone resin containing a YAG phosphor on the light emitting surface of the light emitting element and the upper surface of the covering member 63 in which the concave portion 64 is formed.
Since the opening 64 and the bottom of the recess 64 in the present embodiment are misaligned when viewed in a cross-sectional view, it is difficult to fit the translucent member 65, but the translucent member 65 is sprayed to spray the translucent member 65. It is fitted. The angle and the number of times of spraying can be adjusted as appropriate. When sprayed from an oblique direction, the translucent member is preferably formed in the recess. By injecting a plurality of times, the translucent member can be laminated to a desired thickness, and can be adjusted to a different thickness at various places. Furthermore, it is possible to laminate resins containing different kinds of phosphors.

  Finally, as in Example 1, the light emitting device 600 is obtained by dicing into pieces.

  The light emitting device of the present invention can be suitably used for backlight light sources such as illumination light sources, LED displays, liquid crystal display devices, traffic lights, illumination switches, various sensors, various indicators, and the like.

100, 200, 300, 400, 500, 600 ... light emitting devices 1, 21, 31, 41, 51, 61 ... light emitting element 22 ... lead electrodes 2, 32, 42, 52, 62 ... conductive wiring 39, 49, 69 ... Support substrate 3, 23, 33, 43, 53, 63 ... coating member 4, 24, 34, 44, 64 ... concave portion 5, 25, 35, 45, 55, 65 ... translucent member 54 ... convex portion 36 ... frame Body 37 ... Adhesive 50 ... Upper mold 60 ... Lower mold

Claims (14)

A light-emitting element; a covering member that covers a side surface of the light-emitting element; and a light-transmitting member that has an end surface that is substantially flush with an end surface of the covering member on an upper surface of the light-emitting element and the covering member in a light emitting direction. A light emitting device comprising:
The covering member has a concave portion or a convex portion on the upper surface,
The light emitting surface of the light emitting element and the upper surface of the covering member other than the concave portion or the convex portion are substantially on the same plane,
The light transmitting device, wherein the translucent member is fitted to the concave portion or the convex portion.   The light emitting device according to claim 1, wherein the concave portion or the convex portion is along the light emitting element.   The light emitting device according to claim 1, wherein the concave portion or the convex portion is separated from the light emitting element.   The light emitting device according to claim 1, wherein the covering member is a resin containing a light reflective material.   The light-emitting device according to claim 1, wherein the translucent member contains a phosphor. A manufacturing method of a light emitting device comprising: a light emitting element; a covering member that covers a side surface of the light emitting element; and a light transmissive member on an upper surface of the light emitting element and the light emitting direction of the covering member.
Forming a top surface of the covering member so as to be substantially flush with a light emitting surface of the light emitting element, and forming a concave portion or a convex portion on the top surface;
A second step of forming the translucent member so as to be fitted to the concave portion or the convex portion;
And a third step of cutting the end faces of the covering member and the translucent member so as to be substantially on the same plane.   The method for manufacturing a light emitting device according to claim 6, wherein the concave portion or the convex portion is formed along the light emitting element.   The method for manufacturing a light emitting device according to claim 6, wherein the concave portion or the convex portion is formed apart from the light emitting element.   9. The method for manufacturing a light emitting device according to claim 6, wherein in the first step, the covering member is formed of a resin containing a light reflective material.   In the said 2nd process, the said translucent member is a manufacturing method of the light-emitting device of any one of Claim 6 to 9 containing fluorescent substance.   The method for manufacturing a light emitting device according to claim 6, wherein a mold is used in the first step.   The method for manufacturing a light emitting device according to claim 11, wherein a release sheet is used in the first step.   The method for manufacturing a light emitting device according to any one of claims 6 to 12, wherein the concave portion or the convex portion is formed by loosening or tearing the release sheet using a mold and a release sheet.   A light-emitting device manufactured by the method for manufacturing a light-emitting device according to claim 6.

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