JP2017210625A5 - - Google Patents
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- Publication number
- JP2017210625A5 JP2017210625A5 JP2017154363A JP2017154363A JP2017210625A5 JP 2017210625 A5 JP2017210625 A5 JP 2017210625A5 JP 2017154363 A JP2017154363 A JP 2017154363A JP 2017154363 A JP2017154363 A JP 2017154363A JP 2017210625 A5 JP2017210625 A5 JP 2017210625A5
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- resin composition
- parts
- weight
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229920001187 thermosetting polymer Polymers 0.000 claims 18
- 239000011342 resin composition Substances 0.000 claims 12
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 7
- 229910052809 inorganic oxide Inorganic materials 0.000 claims 6
- 229920005989 resin Polymers 0.000 claims 6
- 239000011347 resin Substances 0.000 claims 6
- 239000003822 epoxy resin Substances 0.000 claims 5
- 238000004519 manufacturing process Methods 0.000 claims 5
- 229920000647 polyepoxide Polymers 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 4
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 claims 3
- 238000000465 moulding Methods 0.000 claims 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims 3
- 238000001721 transfer moulding Methods 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- LSDYBCGXPCFFNM-UHFFFAOYSA-M dimethyl phosphate;tributyl(methyl)phosphanium Chemical compound COP([O-])(=O)OC.CCCC[P+](C)(CCCC)CCCC LSDYBCGXPCFFNM-UHFFFAOYSA-M 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims 2
- 238000002156 mixing Methods 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 239000004408 titanium dioxide Substances 0.000 claims 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims 1
- 150000008065 acid anhydrides Chemical class 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims 1
- 238000004898 kneading Methods 0.000 claims 1
- 150000002903 organophosphorus compounds Chemical class 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
- 150000003918 triazines Chemical class 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017154363A JP6337996B2 (ja) | 2017-08-09 | 2017-08-09 | 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017154363A JP6337996B2 (ja) | 2017-08-09 | 2017-08-09 | 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016000101A Division JP6191705B2 (ja) | 2016-01-04 | 2016-01-04 | 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017210625A JP2017210625A (ja) | 2017-11-30 |
| JP2017210625A5 true JP2017210625A5 (https=) | 2018-01-18 |
| JP6337996B2 JP6337996B2 (ja) | 2018-06-06 |
Family
ID=60475362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017154363A Active JP6337996B2 (ja) | 2017-08-09 | 2017-08-09 | 光反射用熱硬化性樹脂組成物、光半導体素子搭載用基板及びその製造方法、並びに光半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6337996B2 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4802666B2 (ja) * | 2005-11-08 | 2011-10-26 | 住友金属鉱山株式会社 | エポキシ樹脂接着組成物及びそれを用いた光半導体用接着剤 |
| JP2008143981A (ja) * | 2006-12-07 | 2008-06-26 | Three M Innovative Properties Co | 光反射性樹脂組成物、発光装置及び光学表示装置 |
| JP5608955B2 (ja) * | 2007-02-06 | 2014-10-22 | 日亜化学工業株式会社 | 発光装置及びその製造方法並びに発光装置用成形体 |
-
2017
- 2017-08-09 JP JP2017154363A patent/JP6337996B2/ja active Active
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