JP2017209761A5 - - Google Patents

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Publication number
JP2017209761A5
JP2017209761A5 JP2016105552A JP2016105552A JP2017209761A5 JP 2017209761 A5 JP2017209761 A5 JP 2017209761A5 JP 2016105552 A JP2016105552 A JP 2016105552A JP 2016105552 A JP2016105552 A JP 2016105552A JP 2017209761 A5 JP2017209761 A5 JP 2017209761A5
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JP
Japan
Prior art keywords
wire
processing unit
articulated robot
guide pulley
guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016105552A
Other languages
Japanese (ja)
Other versions
JP2017209761A (en
JP6709457B2 (en
Filing date
Publication date
Priority claimed from JP2016105552A external-priority patent/JP6709457B2/en
Priority to JP2016105552A priority Critical patent/JP6709457B2/en
Application filed filed Critical
Priority to PCT/JP2016/083941 priority patent/WO2017086339A1/en
Priority to EP16866340.9A priority patent/EP3391994A4/en
Priority to US15/776,298 priority patent/US20180326590A1/en
Publication of JP2017209761A publication Critical patent/JP2017209761A/en
Publication of JP2017209761A5 publication Critical patent/JP2017209761A5/ja
Publication of JP6709457B2 publication Critical patent/JP6709457B2/en
Application granted granted Critical
Priority to US17/353,084 priority patent/US11504857B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Description

次に、テーブル２０の吸引室３０内を負圧にして、被加工部材Ｗをテーブル２０上に固定する。続いて、多関節ロボット３に搭載した加工ユニット５（本実施形態ではワイヤソー）を制御し、テーブル２０に保持した被加工部材Ｗに加工ユニット５の走行するワイヤ６を押し付ける。このとき、噴射ノズル７から冷却風を噴射し、ワイヤ６の冷却を行うと共に切断屑を吹き飛ばして除去する。また、加工ユニット５は、必要に応じて、多関節ロボット３の先端軸３ａを正逆回転させて、ワイヤ６を揺動円弧運動させる。 Next, negative pressure is applied to the inside of the suction chamber 30 of the table 20 to fix the workpiece W on the table 20. Subsequently, the processing unit 5 (in the present embodiment, a wire saw) mounted on the articulated robot 3 is controlled to press the traveling wire 6 of the processing unit 5 against the workpiece W held on the table 20. At this time, cooling air is injected from the injection nozzle 7 to cool the wire 6 and blow off and remove cutting waste. In addition, the processing unit 5 rotates the distal end shaft 3a of the articulated robot 3 in the forward and reverse directions, as required, to swing the wire 6 in an arc motion.

Ｗ 被加工部材（ハニカムコア部材）
Ｓ 非通気性シート
１ 加工装置
２ 機台
３ 多関節ロボット
３ａ 先端軸
４ ツールチェンジャー
５ 加工ユニット
５ａ 軸
６ ワイヤ
７ 噴射ノズル
８ フレーム
９ ガイドプーリ
９ａ ガイドプーリ
９ｂ ガイドプーリ
１０ セル
１１ セル壁
２０ テーブル
２１ 内側テーブル
２２ 外側筐体
２３ 吸引孔
２４ カバー
２５ 吸引アダプタ
２６ ガイド部材
２６ａ 弾性部材
２７ ストッパ
２８ 昇降ピン
２９ ガイド部材
２９ａ 弾性部材
３０ 吸引室 W Processed member (honeycomb core member)
S Non-breathable sheet 1 Processing device 2 Machine base 3 Articulated robot 3a Tip shaft 4 Tool changer 5 Processing unit 5a Axis 6 Wire 7 Spray nozzle 8 Frame
9 Guide pulley
9a Guide pulley
9b Guide pulley 10 Cell 11 Cell wall 20 Table 21 Inner table 22 Outer case 23 Suction hole 24 Cover 25 Suction adapter 26 Guide member 26a Elastic member 27 Stopper 28 Lifting pin 29 Guide member 29a Elastic member 30 Suction chamber

JP2016105552A 2015-11-16 2016-05-26 Processing method and processing apparatus for workpiece Active JP6709457B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016105552A JP6709457B2 (en) 2016-05-26 2016-05-26 Processing method and processing apparatus for workpiece
PCT/JP2016/083941 WO2017086339A1 (en) 2015-11-16 2016-11-16 Wire saw device, and processing method and processing device for workpiece
EP16866340.9A EP3391994A4 (en) 2015-11-16 2016-11-16 Wire saw device, and processing method and processing device for workpiece
US15/776,298 US20180326590A1 (en) 2015-11-16 2016-11-16 Wire saw device, and processing method and processing device for workpiece
US17/353,084 US11504857B2 (en) 2015-11-16 2021-06-21 Wire saw device, and processing method and processing device for workpiece

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016105552A JP6709457B2 (en) 2016-05-26 2016-05-26 Processing method and processing apparatus for workpiece

Publications (3)

Publication Number Publication Date
JP2017209761A JP2017209761A (en) 2017-11-30
JP2017209761A5 true JP2017209761A5 (en) 2019-04-18
JP6709457B2 JP6709457B2 (en) 2020-06-17

Family

ID=60474314

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016105552A Active JP6709457B2 (en) 2015-11-16 2016-05-26 Processing method and processing apparatus for workpiece

Country Status (1)

Country Link
JP (1) JP6709457B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113500508B (en) * 2021-06-29 2023-01-20 吉安职业技术学院 Intelligent workpiece clamping system of grinding machine

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5963437U (en) * 1982-10-19 1984-04-26 東京エレクトロン株式会社 Semiconductor wafer suction holding device
JP2547395Y2 (en) * 1990-11-22 1997-09-10 セイコー電子工業株式会社 Dial surface processing equipment
JPH0740236A (en) * 1993-07-26 1995-02-10 Hitachi Ltd Flatening method for multilayer wiring substrate
JPH10217239A (en) * 1996-12-02 1998-08-18 Atsusato Kitamura Slicing method and wire sawing device
US6279564B1 (en) * 1997-07-07 2001-08-28 John B. Hodsden Rocking apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
JP4080401B2 (en) * 2003-09-05 2008-04-23 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
JP4178129B2 (en) * 2004-05-20 2008-11-12 日本ファステム株式会社 Wire saw cutting apparatus and cutting method
JP4649307B2 (en) * 2005-09-30 2011-03-09 株式会社東芝 Mechanical cutting device and cutting method using this device
RU2404047C2 (en) * 2005-10-04 2010-11-20 Нихон Сориоку Кикаи Ко., Лтд. Ultrasound cutter and method of ultrasound cutting
JP2014231099A (en) * 2013-05-28 2014-12-11 日立工機株式会社 Attachment and hand-held wire saw
JP2014040001A (en) * 2013-11-26 2014-03-06 Ihi Corp Workpiece processing device and control method for the same
JP2015155119A (en) * 2014-02-20 2015-08-27 株式会社タカトリ Wire saw and cutting work method

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