JP2017202546A - Cutting device - Google Patents

Cutting device Download PDF

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JP2017202546A
JP2017202546A JP2016095253A JP2016095253A JP2017202546A JP 2017202546 A JP2017202546 A JP 2017202546A JP 2016095253 A JP2016095253 A JP 2016095253A JP 2016095253 A JP2016095253 A JP 2016095253A JP 2017202546 A JP2017202546 A JP 2017202546A
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Prior art keywords
cutting
unit
blade
light
cutting blade
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JP6707396B2 (en
Inventor
剛史 笠井
Takeshi Kasai
剛史 笠井
雅史 佐藤
Masafumi Sato
雅史 佐藤
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2016095253A priority Critical patent/JP6707396B2/en
Priority to TW106110731A priority patent/TWI705490B/en
Priority to KR1020170052775A priority patent/KR102251265B1/en
Priority to CN201710291163.3A priority patent/CN107379290B/en
Publication of JP2017202546A publication Critical patent/JP2017202546A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/24—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising with cutting discs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0052—Means for supporting or holding work during breaking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a cutting device which can accurately detect a cutting edge position of a cutting blade.SOLUTION: Blade detection means 60 includes a light emitting part 64 and light receiving part 65 which are opposite with a blade intrusion part 63, in which a cutting blade 31 intrudes, arranged therebetween. A control device 6 includes: a threshold registration part 80 which registers a threshold for defining a proper range of a light receiving amount of the light receiving part 65, which receives light from the light emitting part 64, in a retreat state that the cutting blade 31 separates from the blade intrusion part 63; and a determination part 81 which makes the cutting blade 31 intrude in the blade intrusion part 63 and perform detection operation of detecting a tip end position of the cutting blade 31 when the light receiving amount in the retreat state is in the proper range, and makes the cutting blade stand by for the detection operation until the light receiving amount, which is lowered by affect of mist as an atmosphere containing mist of cutting water is discharged, becomes within the proper range when the light receiving amount in the retreat state is out of the proper range.SELECTED DRAWING: Figure 5

Description

本発明は、被加工物を切削する切削ブレードを有する切削装置に関する。   The present invention relates to a cutting apparatus having a cutting blade for cutting a workpiece.

一般に、半導体ウエーハや樹脂パッケージ基板などの被加工物を所定の分割ラインに沿って分割する際に、この分割ラインに沿って被加工物を切削する切削ブレードを有する切削装置が用いられている。この種の切削装置では、被加工物を保持するチャックテーブルと切削ブレードとを、チャックテーブルの保持面と平行な方向（加工送り方向）に相対的に移動することで、被加工物に切削溝を加工する。また、被加工物に対して切削ブレードを鉛直方向（切り込み送り方向）に上下動させることで、切削溝の切り込み深さが調整される。一方、切削ブレードは、使用により摩耗するため、鉛直方向における切削ブレードの刃先位置（先端位置）の管理が重要となる。   In general, when a workpiece such as a semiconductor wafer or a resin package substrate is divided along a predetermined dividing line, a cutting apparatus having a cutting blade that cuts the workpiece along the dividing line is used. In this type of cutting apparatus, a chuck table and a cutting blade for holding a workpiece are moved relative to each other in a direction parallel to the holding surface of the chuck table (machining feed direction), whereby a cutting groove is formed in the workpiece. Is processed. Moreover, the cutting depth of the cutting groove is adjusted by moving the cutting blade up and down in the vertical direction (cutting feed direction) with respect to the workpiece. On the other hand, since the cutting blade is worn by use, management of the cutting edge position (tip position) of the cutting blade in the vertical direction is important.

このため、従来、発光部及び受光部を有し、この発光部と受光部との間に切削ブレードを侵入させ、該切削ブレードの刃先位置の検出を行う構成が知られている（例えば、特許文献１参照）。この構成では、受光部で受光した光量を電圧に変換し、切削ブレードの刃先が光を遮ることにより、電圧が所定の値に減少した際の切削ブレードの刃先位置から該切削ブレードの原点位置（中心位置）を割り出している。   For this reason, conventionally, there has been known a configuration having a light emitting portion and a light receiving portion, a cutting blade entering between the light emitting portion and the light receiving portion, and detecting the cutting edge position of the cutting blade (for example, a patent) Reference 1). In this configuration, the amount of light received by the light receiving unit is converted into a voltage, and the cutting edge of the cutting blade when the voltage is reduced to a predetermined value by blocking the light from the cutting edge of the cutting blade (the cutting blade origin position ( The center position is determined.

特許第４５９００６０号公報Japanese Patent No. 4590060

ところで、上記した切削装置では、チャックテーブルに保持された被加工物に純水などの切削水を供給しつつ切削加工を行うため、チャックテーブル及び切削ブレードを囲む加工室と、この加工室内の雰囲気を排気する排気部とを備えた構成が想定される。この場合、受光部は、発光部からの光の受光量を利用して、切削ブレードの刃先位置をセンシングしているが、これら発光部及び受光部が設置される加工室の雰囲気に大量にミスト（切削水）が含まれていると、受光量がミストに遮られたり、ミストで乱反射したりして変動するおそれがある。このため、切削ブレードの原点位置を誤って割り出し、被加工物への切り込み深さが異なってしまうおそれがあった。   By the way, in the above-described cutting apparatus, in order to perform cutting while supplying cutting water such as pure water to the workpiece held on the chuck table, a processing chamber surrounding the chuck table and the cutting blade, and an atmosphere in the processing chamber The structure provided with the exhaust part which exhausts air is assumed. In this case, the light receiving unit senses the cutting edge position using the amount of light received from the light emitting unit, but a large amount of mist is generated in the atmosphere of the processing chamber in which the light emitting unit and the light receiving unit are installed. If (cutting water) is contained, the amount of received light may be blocked by mist or may be irregularly reflected by mist and fluctuate. For this reason, there is a possibility that the origin position of the cutting blade is erroneously determined and the depth of cut into the workpiece is different.

本発明は、上記に鑑みてなされたものであって、切削ブレードの刃先位置を精度良く検出できる切削装置を提供することを目的とする。   This invention is made | formed in view of the above, Comprising: It aims at providing the cutting device which can detect the blade-tip position of a cutting blade accurately.

上述した課題を解決し、目的を達成するために、本発明は、被加工物を保持面で保持するチャックテーブルと、該チャックテーブルに保持された被加工物に切削液を供給しながら切削ブレードで切削する切削ユニットと、該保持面と直交する切り込み送り方向の該切削ブレードの先端位置を検出する刃先位置検出ユニットと、該チャックテーブルと該切削ユニットと該刃先位置検出ユニットとを囲繞する加工室と、該加工室内の雰囲気を排気する排気ユニットと、各構成要素を制御する制御手段と、を備える切削装置であって、該刃先位置検出ユニットは、該切削ブレードが侵入するブレード侵入部を挟んで対面する発光部と該発光部からの光を受光する受光部とを有し、該制御手段は、該切削ブレードが該ブレード侵入部から離れた退避状態で、該発光部からの光を受光した該受光部の受光量の適正範囲を規定する閾値を登録する閾値登録部と、該退避状態での該受光量が該適正範囲内にある場合に、該切削ブレードを該ブレード侵入部に侵入させて該切削ブレードの先端位置を検出する検出動作を実施させ、該退避状態での該受光量が該適正範囲外の場合に、該切削液のミストを含む該雰囲気が排気され該受光量が該適正範囲内になるまで該検出動作の開始を待機する判断部と、を有することを特徴とする。   In order to solve the above-described problems and achieve the object, the present invention provides a chuck table for holding a workpiece on a holding surface, and a cutting blade while supplying a cutting fluid to the workpiece held on the chuck table. A cutting unit that cuts with a cutting edge, a cutting edge position detection unit that detects the tip position of the cutting blade in a cutting feed direction orthogonal to the holding surface, and a process that surrounds the chuck table, the cutting unit, and the cutting edge position detection unit. A cutting device comprising a chamber, an exhaust unit for exhausting the atmosphere in the processing chamber, and a control means for controlling each component, wherein the blade edge position detection unit has a blade intrusion portion into which the cutting blade enters. A light-emitting portion facing each other and a light-receiving portion that receives light from the light-emitting portion, and the control means is configured to retract the cutting blade away from the blade intrusion portion. Then, a threshold value registration unit that registers a threshold value that defines an appropriate range of the received light amount of the light receiving unit that has received light from the light emitting unit, and the received light amount in the retracted state is within the appropriate range, Detecting the tip position of the cutting blade by causing the cutting blade to enter the blade intrusion portion, and when the amount of received light in the retracted state is outside the proper range, the mist of the cutting fluid is removed. And a determination unit that waits for the start of the detection operation until the atmosphere is exhausted and the amount of received light is within the appropriate range.

この構成によれば、刃先位置検出ユニットの受光部の受光量に応じて、加工室内の雰囲気が、刃先位置の検出に適している状態か否かを判断するため、刃先位置を精度良く検出することができる。   According to this configuration, in order to determine whether or not the atmosphere in the processing chamber is suitable for detection of the cutting edge position according to the amount of light received by the light receiving portion of the cutting edge position detection unit, the cutting edge position is detected with high accuracy. be able to.

この構成において、該閾値登録部は、単位時間あたりの該適正範囲内の受光量が測定される時間の閾値を登録してもよい。   In this configuration, the threshold value registration unit may register a threshold value for a time during which the amount of received light within the appropriate range per unit time is measured.

本発明によれば、刃先位置検出ユニットの受光部の受光量に応じて、加工室内の雰囲気が、刃先位置の検出に適している状態か否かを判断するため、刃先位置を精度良く検出することができるという効果を奏する。   According to the present invention, in order to determine whether or not the atmosphere in the processing chamber is suitable for detection of the cutting edge position according to the amount of light received by the light receiving portion of the cutting edge position detection unit, the cutting edge position is detected with high accuracy. There is an effect that can be.

図１は、本実施形態に係る加工装置の斜視図である。FIG. 1 is a perspective view of a processing apparatus according to this embodiment. 図２は、加工装置の加工室内の側断面図である。FIG. 2 is a sectional side view of the inside of the processing chamber of the processing apparatus. 図３は、加工装置の加工室内の平面図である。FIG. 3 is a plan view of the processing chamber of the processing apparatus. 図４は、ブレード検出ユニットを示す斜視図である。FIG. 4 is a perspective view showing the blade detection unit. 図５は、ブレード検出ユニットを制御する制御装置のブロック図である。FIG. 5 is a block diagram of a control device that controls the blade detection unit. 図６は、ミスト雰囲気下における検出機構の検出値の時間変化を示す図である。FIG. 6 is a diagram illustrating a change over time in the detection value of the detection mechanism in a mist atmosphere. 図７は、切削ブレードのＺ軸方向の位置に応じた検出機構の検出値の変化を示す図である。FIG. 7 is a diagram illustrating a change in the detection value of the detection mechanism according to the position of the cutting blade in the Z-axis direction.

本発明を実施するための形態（実施形態）につき、図面を参照しつつ詳細に説明する。以下の実施形態に記載した内容により本発明が限定されるものではない。また、以下に記載した構成要素には、当業者が容易に想定できるもの、実質的に同一のものが含まれる。さらに、以下に記載した構成は適宜組み合わせることが可能である。また、本発明の要旨を逸脱しない範囲で構成の種々の省略、置換又は変更を行うことができる。   DESCRIPTION OF EMBODIMENTS Embodiments (embodiments) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited by the contents described in the following embodiments. The constituent elements described below include those that can be easily assumed by those skilled in the art and those that are substantially the same. Furthermore, the structures described below can be combined as appropriate. Various omissions, substitutions, or changes in the configuration can be made without departing from the scope of the present invention.

図１は、本実施形態に係る加工装置の斜視図である。加工装置１は、例えば円板状の半導体ウエーハや光デバイスウエーハなどのウエーハＷ（被加工物）に対して切削加工を行う装置である。被加工物には、円板形状のウエーハＷだけでなく、矩形状に形成されたパッケージ基板、セラミクス基板、ガラス基板などが含まれる。加工装置１は、図１に示すように、直方体状の基台２に配置され、上記ウエーハＷを有するウエーハユニット（被加工物ユニット）ＷＵを保持するチャックテーブル１０と、チャックテーブル１０に保持されたウエーハユニットＷＵのウエーハＷに対して切削加工をする切削ユニット３０とを備える。また、加工装置１は、基台２上に搭載され、チャックテーブル１０及び切削ユニット３０を覆う加工室３を備える。また、加工装置１は、チャックテーブル１０及び切削ユニット３０を含む各構成要素の動作を制御する制御装置（制御手段）６を備える。   FIG. 1 is a perspective view of a processing apparatus according to this embodiment. The processing apparatus 1 is an apparatus that performs a cutting process on a wafer W (workpiece) such as a disk-shaped semiconductor wafer or an optical device wafer. The workpiece includes not only the disk-shaped wafer W but also a package substrate, a ceramic substrate, a glass substrate and the like formed in a rectangular shape. As shown in FIG. 1, the processing apparatus 1 is disposed on a rectangular parallelepiped base 2 and holds a wafer unit (workpiece unit) WU having the wafer W, and is held by the chuck table 10. And a cutting unit 30 for cutting the wafer W of the wafer unit WU. In addition, the processing apparatus 1 includes a processing chamber 3 that is mounted on the base 2 and covers the chuck table 10 and the cutting unit 30. The processing apparatus 1 also includes a control device (control means) 6 that controls the operation of each component including the chuck table 10 and the cutting unit 30.

ウエーハユニットＷＵは、円環状に形成されたフレームＦと、このフレームＦの開口Ｆａに配置される円板形状に形成されたウエーハＷと、このウエーハＷ及びフレームＦの裏面に貼着された粘着テープＴとを備える。本実施形態では、ウエーハＷは、粘着テープＴによってフレームＦの開口Ｆａに保持される。ウエーハＷは、その表面に格子状に形成されたストリート（分割予定ライン）によって区画された多数の領域にＩＣ、ＬＳＩ等のデバイスが形成されている。   The wafer unit WU includes a frame F formed in an annular shape, a wafer W formed in a disk shape disposed in the opening Fa of the frame F, and an adhesive adhered to the back surface of the wafer W and the frame F. A tape T; In the present embodiment, the wafer W is held in the opening Fa of the frame F by the adhesive tape T. In the wafer W, devices such as ICs and LSIs are formed in a number of regions partitioned by streets (scheduled division lines) formed on the surface of the wafer W.

チャックテーブル１０は、上記した基台２に、Ｘ軸方向（加工送り方向）に移動可能に設けられている。チャックテーブル１０は、ウエーハユニットＷＵが載置されて吸引される保持面１１を有している。また、チャックテーブル１０は、図示しない回転機構によってＺ軸方向を回転軸にして回動可能に構成されている。   The chuck table 10 is provided on the base 2 so as to be movable in the X-axis direction (machining feed direction). The chuck table 10 has a holding surface 11 on which the wafer unit WU is placed and sucked. The chuck table 10 is configured to be rotatable about a Z-axis direction as a rotation axis by a rotation mechanism (not shown).

また、基台２の上面には、Ｙ軸方向（割出方向）に沿って延在するとともに、加工室３を跨いで配置される門型の支持構造４が設けられている。加工装置１は、支持構造４に設けられ、切削ユニット３０をＹ軸方向（割出方向）に移動可能に支持する割出送り機構（割出送り手段）１３と、切削ユニット３０をチャックテーブル１０の保持面１１と直交するＺ軸方向（切り込み送り方向）に移動可能に支持する切り込み送り機構（切り込み送り手段）１４とを備える。割出送り機構１３は、支持構造４の側面に固定されてＹ軸方向に延びる一対のガイドレール１５と、これらガイドレール１５と平行に配設されたボールねじ１６と、このボールねじ１６に螺合するナット（不図示）を内部に有し、ガイドレール１５に沿って移動するＹ軸スライド板１７とを備える。ボールねじ１６の一端には、該ボールねじ１６を回転させるパルスモータ（不図示）が連結され、ボールねじ１６の回転によって、Ｙ軸スライド板１７は、ガイドレール１５に沿ってＹ軸方向に移動する。   In addition, a gate-type support structure 4 is provided on the upper surface of the base 2 so as to extend along the Y-axis direction (indexing direction) and to be disposed across the processing chamber 3. The processing apparatus 1 is provided in the support structure 4 and supports an index feed mechanism (index feed means) 13 that supports the cutting unit 30 so as to be movable in the Y-axis direction (index direction), and the cutting unit 30 as a chuck table 10. And a notch feed mechanism (notch feed means) 14 that is movably supported in the Z-axis direction (notch feed direction) orthogonal to the holding surface 11. The index feeding mechanism 13 includes a pair of guide rails 15 that are fixed to the side surface of the support structure 4 and extend in the Y-axis direction, a ball screw 16 that is disposed in parallel to the guide rails 15, and a screw that is threaded on the ball screw 16. A nut (not shown) that fits inside is provided, and a Y-axis slide plate 17 that moves along the guide rail 15 is provided. A pulse motor (not shown) that rotates the ball screw 16 is connected to one end of the ball screw 16, and the Y-axis slide plate 17 moves in the Y-axis direction along the guide rail 15 by the rotation of the ball screw 16. To do.

切り込み送り機構１４は、Ｙ軸スライド板１７の側面に固定されて、Ｚ軸方向に延びる一対のガイドレール１８と、これらガイドレール１８と平行に配設されたボールねじ１９と、このボールねじ１９に螺合するナット（不図示）を内部に有し、ガイドレール１８に沿って移動するＺ軸スライド板２０とを備える。ボールねじ１９の一端には、該ボールねじ１９を回転させるパルスモータ２１が連結され、ボールねじ１９の回転によって、Ｚ軸スライド板２０は、ガイドレール１８に沿ってＺ軸方向に移動する。   The cutting feed mechanism 14 is fixed to the side surface of the Y-axis slide plate 17 and extends in the Z-axis direction, a pair of guide rails 18, a ball screw 19 disposed in parallel to the guide rails 18, and the ball screw 19. And a Z-axis slide plate 20 that moves along the guide rail 18. A pulse motor 21 that rotates the ball screw 19 is connected to one end of the ball screw 19, and the Z-axis slide plate 20 moves in the Z-axis direction along the guide rail 18 by the rotation of the ball screw 19.

切削ユニット３０は、Ｚ軸スライド板２０の下端部に連結される。このため、切削ユニット３０は、割出送り機構１３の動作により、Ｚ軸スライド板２０とともにＹ軸方向に移動して、ウエーハＷに対する切削位置が調整され、切り込み送り機構１４の動作により、Ｚ軸方向に移動して、ウエーハＷへの切り込み深さが調整される。   The cutting unit 30 is connected to the lower end portion of the Z-axis slide plate 20. For this reason, the cutting unit 30 moves in the Y-axis direction together with the Z-axis slide plate 20 by the operation of the index feed mechanism 13, and the cutting position with respect to the wafer W is adjusted. The depth of cut into the wafer W is adjusted by moving in the direction.

図２は、加工装置の加工室内の側断面図であり、図３は、加工装置の加工室内の平面図である。加工室３は、チャックテーブル１０及び切削ユニット３０を覆う箱型形状に形成される。具体的には、矩形状の天板３Ａと、この天板３ＡのＸ軸方向（加工送り方向）に沿った縁部からそれぞれ下方に延びる一対の側板３Ｂと、該天板３ＡのＹ軸方向（割出方向）に沿った縁部からそれぞれ下方に延びる一対の側板３Ｃとを備える。加工室３は、Ｘ軸方向中ほどに配設された仕切板３Ｄにより、チャックテーブル１０にウエーハＷを着脱する着脱領域５Ａと、チャックテーブル１０に保持されたウエーハＷを切削加工する加工領域５Ｂとに仕切られている。仕切板３Ｄの下部にはチャックテーブル１０の通過を許容する開口部３Ｅが形成されている。   FIG. 2 is a side sectional view of the machining chamber of the machining apparatus, and FIG. 3 is a plan view of the machining chamber of the machining apparatus. The processing chamber 3 is formed in a box shape covering the chuck table 10 and the cutting unit 30. Specifically, a rectangular top plate 3A, a pair of side plates 3B extending downward from edges along the X-axis direction (processing feed direction) of the top plate 3A, and the Y-axis direction of the top plate 3A A pair of side plates 3C each extending downward from the edge along the (indexing direction). The processing chamber 3 includes an attaching / detaching region 5A for attaching / detaching the wafer W to / from the chuck table 10 and a processing region 5B for cutting the wafer W held by the chuck table 10 by a partition plate 3D disposed in the middle in the X-axis direction. It is divided into and. An opening 3E that allows passage of the chuck table 10 is formed in the lower part of the partition plate 3D.

加工装置１は、図２に示すように、加工室３内にチャックテーブル１０をＸ軸方向（加工送り方向）に移動する加工送り機構（加工送り手段）４０を備える。加工送り機構４０は、Ｘ軸方向に沿って移動するテーブルベース４１と、このテーブルベース４１上に立設する支持基台４２とを備え、この支持基台４２にチャックテーブル１０が支持される。チャックテーブル１０の周囲には、図３に示すように、防水カバー４３が設けられ、この防水カバー４３には、加工送り機構４０を保護するための蛇腹４４が連結されている。また、加工装置１は、図２に示すように、加工室３内における切削ユニット３０の下方にブレード検出ユニット（刃先位置検出ユニット）６０を備える。このブレード検出ユニット６０は、鉛直方向における切削ブレード３１の先端位置（鉛直方向の下端位置）を検出するものである。   As shown in FIG. 2, the machining apparatus 1 includes a machining feed mechanism (machining feed means) 40 that moves the chuck table 10 in the X-axis direction (machining feed direction) in the machining chamber 3. The processing feed mechanism 40 includes a table base 41 that moves along the X-axis direction, and a support base 42 that stands on the table base 41, and the chuck table 10 is supported on the support base 42. As shown in FIG. 3, a waterproof cover 43 is provided around the chuck table 10, and a bellows 44 for protecting the processing feed mechanism 40 is connected to the waterproof cover 43. Further, as shown in FIG. 2, the machining apparatus 1 includes a blade detection unit (blade edge position detection unit) 60 below the cutting unit 30 in the machining chamber 3. The blade detection unit 60 detects the tip position (the lower end position in the vertical direction) of the cutting blade 31 in the vertical direction.

切削ユニット３０は、図２に示すように、回転駆動される回転スピンドル（不図示）に装着された切削ブレード３１と、この切削ブレード３１の略上半分を覆うホイールカバー３２とを備える。ホイールカバー３２には、接続パイプ３３，３４が取り付けられており、これらの接続パイプ３３，３４はホースを介して、切削ユニット３０に切削水（切削液）を供給する切削水供給源（不図示）に接続されている。接続パイプ３３を介して供給された切削水は、切削水ノズル３５から切削ブレード３１の刃先に向かって供給され、接続パイプ３４を介して供給された切削水は、切削ブレード３１の両側に配設されたブレードクーラーノズル３６から加工点に向かって供給される。切削水は、例えば、純水が用いられる。また、切削ユニット３０は、切削ブレード３１と並べて設けられ、チャックテーブル１０上のウエーハＷを撮像する撮像手段３７を備える。   As shown in FIG. 2, the cutting unit 30 includes a cutting blade 31 mounted on a rotary spindle (not shown) that is driven to rotate, and a wheel cover 32 that covers a substantially upper half of the cutting blade 31. Connection pipes 33, 34 are attached to the wheel cover 32, and these connection pipes 33, 34 are a cutting water supply source (not shown) that supplies cutting water (cutting fluid) to the cutting unit 30 via a hose. )It is connected to the. The cutting water supplied via the connection pipe 33 is supplied from the cutting water nozzle 35 toward the cutting edge of the cutting blade 31, and the cutting water supplied via the connection pipe 34 is arranged on both sides of the cutting blade 31. The blade cooler nozzle 36 is supplied toward the processing point. For example, pure water is used as the cutting water. Further, the cutting unit 30 is provided side by side with the cutting blade 31, and includes an imaging unit 37 that images the wafer W on the chuck table 10.

本実施形態では、切削ユニット３０は、チャックテーブル１０に保持されたウエーハＷを切削加工する際に、切削水ノズル３５及びブレードクーラーノズル３６から切削水を噴出しながらチャックテーブル１０をＸ軸方向（加工送り方向）に加工送りする。この場合、切削屑を含んだ切削水（切削液）３８（図２）は、切削ブレード３１の高速回転により該回転方向の下流側に飛散する。このため、加工室３は、加工領域５Ｂ側の側板３Ｂの上端部に、該加工室３内の雰囲気を排気する排気口３Ｆを備え、この排気口３Ｆには、図３に示すように排気ユニット３９が接続されている。この排気ユニット３９は、排気管３９Ａを介して、排気口３Ｆに接続され、加工室３内の雰囲気を外部に排気する。排気ユニット３９としては、例えば、加工装置１が設置される加工エリアに設けられた排気設備や、排気管３９Ａもしくは排気口３Ｆに接続される排気ファンなどを用いることができる。   In the present embodiment, when the cutting unit 30 cuts the wafer W held on the chuck table 10, the cutting unit 30 moves the chuck table 10 in the X axis direction while ejecting cutting water from the cutting water nozzle 35 and the blade cooler nozzle 36. Process feed in the process feed direction). In this case, the cutting water (cutting fluid) 38 (FIG. 2) containing cutting waste is scattered to the downstream side in the rotation direction by the high speed rotation of the cutting blade 31. For this reason, the processing chamber 3 is provided with an exhaust port 3F for exhausting the atmosphere in the processing chamber 3 at the upper end portion of the side plate 3B on the processing region 5B side, and the exhaust port 3F is exhausted as shown in FIG. A unit 39 is connected. The exhaust unit 39 is connected to the exhaust port 3F via the exhaust pipe 39A, and exhausts the atmosphere in the processing chamber 3 to the outside. As the exhaust unit 39, for example, an exhaust facility provided in a processing area where the processing apparatus 1 is installed, an exhaust fan connected to the exhaust pipe 39A or the exhaust port 3F, or the like can be used.

また、加工室３は、図１に示すように、割出送り機構（割出送り手段）１３のボールねじ１６を切削水の飛沫から保護する保護蛇腹５０が設けられている。この保護蛇腹５０は、一端部５２が支持構造４の一方の立設部に固定され、中間部５４がＹ軸スライド板１７の一端部に取り付けられ、蛇腹５０の他端部５６が支持構造４の他方の立設部に固定される。図１では明瞭化のために、保護蛇腹５０は所定位置に取り付けない状態が示されているが、実際には図２に示すような位置に取り付けられる。   Further, as shown in FIG. 1, the processing chamber 3 is provided with a protective bellows 50 that protects the ball screw 16 of the index feeding mechanism (index feeding means) 13 from the splash of cutting water. The protective bellows 50 has one end 52 fixed to one standing portion of the support structure 4, an intermediate portion 54 attached to one end of the Y-axis slide plate 17, and the other end 56 of the bellows 50 being the support structure 4. It is fixed to the other standing part of the. For the sake of clarity, FIG. 1 shows a state in which the protective bellows 50 is not attached at a predetermined position, but in reality, it is attached at a position as shown in FIG.

次に、ブレード検出ユニット６０について説明する。図４は、ブレード検出ユニットを示す斜視図である。図５は、ブレード検出ユニットを制御する制御装置のブロック図である。ブレード検出ユニット６０は、図４に示すように、防水カバー４３及び蛇腹４４（図３）を挟んで対向配置される内壁２Ａに固定される支持部材６１と、この支持部材６１に支持される検出機構６２とを備える。検出機構６２は、Ｚ軸方向（切り込み送り方向）において、切削ブレード３１の先端位置（鉛直方向の下端位置）を検出する。   Next, the blade detection unit 60 will be described. FIG. 4 is a perspective view showing the blade detection unit. FIG. 5 is a block diagram of a control device that controls the blade detection unit. As shown in FIG. 4, the blade detection unit 60 includes a support member 61 fixed to the inner wall 2 </ b> A disposed opposite to the waterproof cover 43 and the bellows 44 (FIG. 3), and a detection supported by the support member 61. And a mechanism 62. The detection mechanism 62 detects the tip position (lower end position in the vertical direction) of the cutting blade 31 in the Z-axis direction (cutting feed direction).

検出機構６２は、図４に示すように、支持部材６１に固定される基台部６２Ａと、この基台部６２Ａに立設する取付部材６２Ｂとを備える。この取付部材６２Ｂは、水平部６２Ｂ１と２つの垂直部６２Ｂ２，６２Ｂ２とを備えてＵ形状に形成され、これら垂直部６２Ｂ２，６２Ｂ２間にブレード侵入部６３が画成される。また、垂直部６２Ｂ２，６２Ｂ２には、ブレード侵入部６３を挟んで対向する発光部６４と、この発光部６４からの光を受光する受光部６５とを備える。図５に示すように、発光部６４は光ファイバー６６を介して光源６７に接続されており、受光部６５は光ファイバー６６を介して光電変換部６８に接続されている。検出機構６２は、切り込み送り方向において、ブレード侵入部６３、すなわち発光部６４と受光部６５との間に切削ブレード３１が侵入することで、受光部６５が検出する受光量の変化に基づき切削ブレード３１の先端位置を検出する。   As shown in FIG. 4, the detection mechanism 62 includes a base portion 62A that is fixed to the support member 61, and an attachment member 62B that stands on the base portion 62A. The mounting member 62B is formed in a U shape including a horizontal portion 62B1 and two vertical portions 62B2 and 62B2, and a blade intrusion portion 63 is defined between the vertical portions 62B2 and 62B2. Further, the vertical portions 62B2 and 62B2 include a light emitting portion 64 that faces the blade intrusion portion 63 and a light receiving portion 65 that receives light from the light emitting portion 64. As shown in FIG. 5, the light emitting unit 64 is connected to the light source 67 through the optical fiber 66, and the light receiving unit 65 is connected to the photoelectric conversion unit 68 through the optical fiber 66. In the cutting feed direction, the detection mechanism 62 is based on a change in the amount of received light detected by the light receiving unit 65 when the cutting blade 31 enters between the blade intruding unit 63, that is, the light emitting unit 64 and the light receiving unit 65. The tip position of 31 is detected.

また、検出機構６２は、基台部６２Ａに設けられ、発光部６４及び受光部６５の端面に恒温調整された洗浄水を供給する洗浄水供給ノズル６９と、発光部６４及び受光部６５の端面にエアを供給するエア供給ノズル７０とを備える。発光部６４及び受光部６５に洗浄水及びエアを吹き付けることにより、発光部６４及び受光部６５に水滴などが付着することを防止し、検出精度の向上を実現できる。また、検出機構６２は、基台部６２Ａにヒンジ部７１を介して接続され、取付部材６２Ｂ（発光部６４及び受光部６５）を覆うカバー７２を備える。このカバー７２は、検出機構６２を使用する場合に開いて発光部６４及び受光部６５を露出させ、検出機構６２を使用しない場合には閉じて、発光部６４及び受光部６５を覆う。   Further, the detection mechanism 62 is provided on the base portion 62A, and a cleaning water supply nozzle 69 for supplying cleaning water whose temperature is adjusted to the end surfaces of the light emitting unit 64 and the light receiving unit 65, and end surfaces of the light emitting unit 64 and the light receiving unit 65. And an air supply nozzle 70 for supplying air to the apparatus. By spraying cleaning water and air onto the light emitting unit 64 and the light receiving unit 65, it is possible to prevent water droplets from adhering to the light emitting unit 64 and the light receiving unit 65, thereby improving detection accuracy. The detection mechanism 62 includes a cover 72 that is connected to the base portion 62A via the hinge portion 71 and covers the attachment member 62B (the light emitting portion 64 and the light receiving portion 65). The cover 72 is opened when the detection mechanism 62 is used to expose the light emitting unit 64 and the light receiving unit 65, and is closed when the detection mechanism 62 is not used to cover the light emitting unit 64 and the light receiving unit 65.

さて、加工装置１では、チャックテーブル１０及び切削ユニット３０を囲む加工室３を設け、この加工室３内でチャックテーブル１０に保持されたウエーハＷに切削水を供給しつつ切削加工を行っている。このため、検出機構６２の発光部６４及び受光部６５は、ミスト（切削水）を大量に含んだ雰囲気に曝されることにより、受光部６５が検出する受光量がミストに遮られたりミストで乱反射したりして変動するおそれがある。このため、切削ブレード３１の先端位置を誤って検出する結果、切削ブレード３１の原点位置を誤って割り出し、ウエーハＷへの切り込み深さが異なってしまうおそれがあった。   The processing apparatus 1 includes a processing chamber 3 that surrounds the chuck table 10 and the cutting unit 30, and performs cutting while supplying cutting water to the wafer W held by the chuck table 10 in the processing chamber 3. . For this reason, when the light emitting unit 64 and the light receiving unit 65 of the detection mechanism 62 are exposed to an atmosphere containing a large amount of mist (cutting water), the amount of received light detected by the light receiving unit 65 is blocked by the mist. There is a risk of fluctuation due to irregular reflection. For this reason, as a result of erroneously detecting the tip position of the cutting blade 31, there is a possibility that the origin position of the cutting blade 31 is erroneously determined and the depth of cut into the wafer W is different.

発明者の鋭意研究によれば、検出機構６２を用いて切削ブレード３１の先端位置を検出する際に所定時間（例えば４〜５秒間）、検出を待機することにより、受光部６５が検出する受光量が安定する傾向にあることが判明した。しかし、先端位置の検出のたびに、必ず所定時間（例えば４〜５秒間）待機する構成では、その分、加工時間が延びるために歩留まりが低減する問題がある。このため、本構成では、受光部６５が検出する受光量に基づき、最適な待機時間を判断することで、加工時間の延長を抑えつつ、刃先の先端位置を精度良く検出している。   According to the inventor's earnest research, when the tip position of the cutting blade 31 is detected using the detection mechanism 62, the light reception unit 65 detects light reception by waiting for detection for a predetermined time (for example, 4 to 5 seconds). It was found that the amount tended to be stable. However, in the configuration in which the standby position is always waited for a predetermined time (for example, 4 to 5 seconds) every time the tip position is detected, there is a problem in that the yield is reduced because the machining time is increased accordingly. For this reason, in this configuration, the tip end position of the cutting edge is accurately detected while suppressing an increase in the processing time by determining the optimum standby time based on the amount of light received by the light receiving unit 65.

このため、制御装置６は、図５に示すように、閾値登録部８０、判断部８１、基準電圧設定部８２、電圧比較部８３、端部位置検出部８４、算出部８５及び位置補正部８６を備える。閾値登録部８０は、切削ブレード３１がブレード侵入部６３から離れた退避状態で、発光部６４からの光を受光した受光部６５の受光量の適正範囲を規定する閾値を登録する。本実施形態では、閾値登録部８０は、受光量の適正範囲を規定する上限閾値及び下限閾値をそれぞれ電圧値に変換して登録する。判断部８１は、光電変換部６８で変換された電圧値を取得し、上記した退避状態での受光量（電圧値）が適正範囲内にある場合に、切削ブレード３１をブレード侵入部６３に侵入させて切削ブレード３１の刃先の先端位置の検出動作を許可する判断をする。具体的には、判断部８１は、退避状態での受光量が上限閾値以上下限閾値以下であるか否かを判定することで適正範囲内にあるか否かを判定する。また、判断部８１は、退避状態での受光量（電圧値）が適正範囲外の場合には、該受光量が適正範囲内となるまで該検出動作を待機させる判断をする。この場合、検出動作を待機することにより、加工室３から切削水のミストを含む雰囲気が排気されることにより、該ミストの影響で低下していた該受光量が適正範囲内に回復する。この構成によれば、受光部６５が検出する受光量がミストに遮られたり、ミストで乱反射したりして変動した場合においても、受光量が適正範囲内に回復するまで検出動作を待機させるため、切削ブレード３１の先端位置を正確に検出することができる。   Therefore, as shown in FIG. 5, the control device 6 includes a threshold value registration unit 80, a determination unit 81, a reference voltage setting unit 82, a voltage comparison unit 83, an end position detection unit 84, a calculation unit 85, and a position correction unit 86. Is provided. The threshold value registration unit 80 registers a threshold value that defines an appropriate range of the amount of light received by the light receiving unit 65 that has received light from the light emitting unit 64 in a retracted state where the cutting blade 31 is separated from the blade intrusion unit 63. In the present embodiment, the threshold value registration unit 80 converts and registers an upper limit threshold value and a lower limit threshold value that define an appropriate range of received light amount into voltage values. The determination unit 81 acquires the voltage value converted by the photoelectric conversion unit 68, and when the received light amount (voltage value) in the retracted state is within an appropriate range, the cutting blade 31 enters the blade intrusion unit 63. Thus, it is determined that the detection operation of the tip position of the cutting edge of the cutting blade 31 is permitted. Specifically, the determination unit 81 determines whether or not the amount of received light in the retracted state is within an appropriate range by determining whether or not the amount of light received in the retracted state is greater than or equal to an upper limit threshold and less than or equal to a lower limit threshold. In addition, when the received light amount (voltage value) in the retracted state is outside the appropriate range, the determining unit 81 determines to wait for the detection operation until the received light amount falls within the appropriate range. In this case, by waiting for the detection operation, the atmosphere containing the mist of the cutting water is exhausted from the processing chamber 3, so that the amount of received light that has been reduced due to the influence of the mist is recovered within an appropriate range. According to this configuration, even when the amount of received light detected by the light receiving unit 65 is blocked by the mist or fluctuated by the mist, the detection operation is waited until the amount of received light is recovered within the appropriate range. The tip position of the cutting blade 31 can be accurately detected.

本実施形態では、退避状態での受光量が適正範囲内となるまで検出動作を待機させることに加え、判断部８１は、所定のサイクル時間（例えば１００ｍｓ）ごとに、受光量の検出を複数回（例えば５回）行い、先に検出した受光量（電圧値）との変化量が所定の閾値範囲内にあるか否かを判断し、検出した複数回すべてにおいて、変化量が閾値範囲内にあれば検出動作を許可する。この構成では、図６に示すように、検出した受光量（電圧値）の変動が生じている場合には検出を待機し、検出した受光量（電圧値）の変動が抑えられてある値に収束してきた場合に検出動作を許可するため、過不足のない最適な待機時間を判断することができ、加工時間の延長を抑えつつ、刃先の先端位置を精度良く検出することができる。この構成では、閾値登録部８０には、受光量（電圧値）の適正範囲を規定する上限閾値、下限閾値、並びに、受光量（電圧値）との変化量を規定する範囲が閾値として設定されている。   In the present embodiment, in addition to waiting for the detection operation until the received light amount in the retracted state falls within an appropriate range, the determination unit 81 detects the received light amount a plurality of times every predetermined cycle time (for example, 100 ms). (E.g., 5 times), it is determined whether or not the amount of change from the previously received light amount (voltage value) is within a predetermined threshold range, and the amount of change is within the threshold range at all the detected multiple times. If there is, the detection operation is permitted. In this configuration, as shown in FIG. 6, when the detected amount of received light (voltage value) varies, the detection is waited for, and the detected amount of received light (voltage value) is suppressed to a value that is suppressed. Since the detection operation is permitted when it has converged, it is possible to determine an optimal standby time without excess or deficiency, and to accurately detect the tip position of the blade edge while suppressing an extension of the machining time. In this configuration, the threshold value registration unit 80 is set with an upper limit threshold value and a lower limit threshold value that define an appropriate range of the received light amount (voltage value), and a range that defines the amount of change from the received light amount (voltage value) as threshold values. ing.

また、上記した適正範囲内の受光量（電圧値）が、単位時間あたり所定割合以上検出されたら、検出動作を許可してもよい。この場合、閾値登録部８０には、所定の単位時間（例えば５０ｍｓ）あたりの適正範囲内の受光量が測定される時間の閾値（例えば４０ｍｓ）が登録される。この構成では、受光量（電圧）の変動が多少みられる場合であっても、所定の単位時間では受光量（電圧）が安定していると判断できるため、加工時間の延長を抑えつつ、刃先の先端位置を精度良く検出することができる。   In addition, the detection operation may be permitted when the amount of received light (voltage value) within the appropriate range is detected at a predetermined rate or more per unit time. In this case, the threshold value registration unit 80 registers a threshold value (for example, 40 ms) for measuring the amount of received light within an appropriate range per predetermined unit time (for example, 50 ms). In this configuration, even if there is some fluctuation in the amount of received light (voltage), it can be determined that the amount of received light (voltage) is stable in a predetermined unit time, so the cutting edge can be reduced while suppressing an increase in processing time. The tip position can be detected with high accuracy.

判断部８１は、検出動作を許可した場合には、検出した受光量（電圧値）を電圧比較部８３に出力する。基準電圧設定部８２は、検出機構６２が切削ブレード３１の侵入を検出する際の基準電圧値（例えば３Ｖ）を設定し、この設定された基準電圧値は、電圧比較部８３に出力される。電圧比較部８３は、判断部８１から出力された受光量（電圧値）と、基準電圧設定部８２によって設定された基準電圧値とを比較し、判断部８１からの出力が基準電圧値に達したとき、その旨の信号を端部位置検出部８４に出力する。より詳細に説明すると、切削ブレード３１のＺ軸方向（切り込み送り方向）の基準位置を検出する場合は、切り込み送り機構１４のパルスモータ２１を駆動して、切削ブレード３１をブレード検出手段６０のブレード侵入部６３に上方から侵入させていく。   When the determination unit 81 permits the detection operation, the determination unit 81 outputs the detected amount of received light (voltage value) to the voltage comparison unit 83. The reference voltage setting unit 82 sets a reference voltage value (for example, 3 V) when the detection mechanism 62 detects the intrusion of the cutting blade 31, and the set reference voltage value is output to the voltage comparison unit 83. The voltage comparison unit 83 compares the received light amount (voltage value) output from the determination unit 81 with the reference voltage value set by the reference voltage setting unit 82, and the output from the determination unit 81 reaches the reference voltage value. When this occurs, a signal to that effect is output to the end position detector 84. More specifically, when the reference position of the cutting blade 31 in the Z-axis direction (cutting feed direction) is detected, the pulse motor 21 of the cutting feed mechanism 14 is driven so that the cutting blade 31 is the blade of the blade detection means 60. The intrusion part 63 is invaded from above.

この場合、切削ブレード３１が発光部６４と受光部６５との間を全く遮っていない場合は受光部６５が受光する光量は最大であり、この光量に対応する光電変換部６８（判断部８１）からの出力は、例えば図７に示すように５Ｖに設定されている。   In this case, when the cutting blade 31 does not block between the light emitting unit 64 and the light receiving unit 65, the light amount received by the light receiving unit 65 is the maximum, and the photoelectric conversion unit 68 (determination unit 81) corresponding to this light amount. The output from is set to 5 V, for example, as shown in FIG.

切削ブレード３１がブレード侵入部６３に侵入されるのに従って、切削ブレード３１が発光部６４から出射される光を遮る量が徐々に増加するので、受光部６５が受光する光量は徐々に減少し、光電変換部６８からの出力電圧は、図７に示すように徐々に減少する。   As the cutting blade 31 enters the blade intrusion portion 63, the amount of light that the cutting blade 31 blocks the light emitted from the light emitting portion 64 gradually increases, so the amount of light received by the light receiving portion 65 gradually decreases. The output voltage from the photoelectric conversion unit 68 gradually decreases as shown in FIG.

そして、切削ブレード３１の刃先が発光部６４と受光部６５の中心を結ぶ位置に達したとき、光電変換部６８からの出力電圧が例えば３Ｖになるように設定されている。従って、光電変換部６８の出力電圧が３Ｖになったとき、電圧比較部８３は、光電変換部６８の出力電圧が基準電圧値に達した旨の信号を端部位置検出部８４に出力する。   Then, when the cutting edge of the cutting blade 31 reaches a position connecting the centers of the light emitting unit 64 and the light receiving unit 65, the output voltage from the photoelectric conversion unit 68 is set to 3 V, for example. Therefore, when the output voltage of the photoelectric conversion unit 68 reaches 3 V, the voltage comparison unit 83 outputs a signal to the end position detection unit 84 that the output voltage of the photoelectric conversion unit 68 has reached the reference voltage value.

端部位置検出部８４は、先端位置（端部位置）を検出した旨の信号をパルスモータ２１に送信し、パルスモータ２１の駆動を停止する。この時、端部位置検出部８４は、切削ブレード３１のＺ軸方向（切り込み送り方向）の高さ位置座標を先端位置として記憶する。   The end position detection unit 84 transmits a signal indicating that the tip position (end position) has been detected to the pulse motor 21 and stops driving the pulse motor 21. At this time, the end position detection unit 84 stores the height position coordinate of the cutting blade 31 in the Z-axis direction (cutting feed direction) as the tip position.

本構成では、切削ブレード３１は切削加工を行うに連れて摩耗するため、定期的に、切削ブレード３１の先端位置を検出することで、ウエーハＷに施される切削溝の切り込み深さの精度を高めている。具体的には、算出部８５は、端部位置検出部８４が記憶した切削ブレード３１の先端位置の高さ位置座標と、前回測定された切削ブレード３１の先端位置の高さ位置座標との差からチャックテーブル１０の保持面１１に対する切削ブレード３１の回転中心の基準高さ位置（原点位置）の補正量を算出する。位置補正部８６は、算出した補正量に基づき、切削ブレード３１の原点位置を補正する。このため、制御装置６は、補正した原点位置に基づいて、ウエーハＷに加工する目標切り込み量となるように、切り込み送り機構１４を制御するため、実際にウエーハＷに加工される切削溝の切り込み深さの精度を高めることができる。   In this configuration, the cutting blade 31 is worn as the cutting process is performed. Therefore, by periodically detecting the tip position of the cutting blade 31, the accuracy of the cutting depth of the cutting groove applied to the wafer W can be improved. It is increasing. Specifically, the calculation unit 85 calculates the difference between the height position coordinate of the tip position of the cutting blade 31 stored by the end position detection unit 84 and the height position coordinate of the tip position of the cutting blade 31 measured last time. From this, the correction amount of the reference height position (origin position) of the rotation center of the cutting blade 31 with respect to the holding surface 11 of the chuck table 10 is calculated. The position correction unit 86 corrects the origin position of the cutting blade 31 based on the calculated correction amount. Therefore, the control device 6 controls the cutting feed mechanism 14 based on the corrected origin position so as to obtain a target cutting amount to be processed into the wafer W, so that the cutting groove cut actually processed into the wafer W is cut. The depth accuracy can be increased.

以上、説明したように、ウエーハＷを保持面１１で保持するチャックテーブル１０と、該チャックテーブル１０に保持されたウエーハＷに切削水を供給しながら切削ブレード３１で切削する切削ユニット３０と、保持面１１と直交する切り込み送り方向の切削ブレード３１の先端位置を検出するブレード検出手段６０と、チャックテーブル１０と切削ユニット３０とブレード検出手段６０とを囲繞する加工室３と、該加工室３内の雰囲気を排気する排気ユニット３９と、各構成要素を制御する制御装置６とを備え、ブレード検出手段６０は、切削ブレード３１が侵入するブレード侵入部６３を挟んで対面する発光部６４と発光部６４からの光を受光する受光部６５とを有し、制御装置６は、切削ブレード３１がブレード侵入部６３から離れた退避状態で、発光部６４からの光を受光した受光部６５の受光量の適正範囲を規定する閾値を登録する閾値登録部８０と、退避状態での受光量が適正範囲内にある場合に、切削ブレード３１をブレード侵入部６３に侵入させて切削ブレード３１の先端位置を検出する検出動作を実施させ、退避状態での該受光量が適正範囲外の場合に、該切削水のミストを含む該雰囲気が排気され該ミストの影響で低下していた該受光量が適正範囲内となるまで該検出動作を待機させる判断部８１と、を有するため、ブレード検出手段６０の受光部６５の受光量に応じて、加工室３内の雰囲気が、切削ブレード３１の刃先の先端位置の検出に適している状態か否かを判断することができ、先端位置を精度良く検出できる。   As described above, the chuck table 10 that holds the wafer W on the holding surface 11, the cutting unit 30 that cuts with the cutting blade 31 while supplying cutting water to the wafer W held on the chuck table 10, and the holding Blade detecting means 60 for detecting the tip position of the cutting blade 31 in the cutting feed direction orthogonal to the surface 11, the processing chamber 3 surrounding the chuck table 10, the cutting unit 30 and the blade detecting means 60, and the inside of the processing chamber 3 The blade detecting means 60 includes a light emitting portion 64 and a light emitting portion facing each other with a blade intrusion portion 63 into which the cutting blade 31 enters. And the light receiving unit 65 that receives light from 64, the control device 6 is configured such that the cutting blade 31 is separated from the blade intrusion unit 63. In the avoiding state, when the threshold value registering unit 80 registers a threshold value that defines the appropriate range of the received light amount of the light receiving unit 65 that has received the light from the light emitting unit 64, and when the received light amount in the retracted state is within the appropriate range, A detection operation for detecting the tip position of the cutting blade 31 by causing the cutting blade 31 to enter the blade intrusion portion 63 is performed, and when the received light amount in the retracted state is out of the proper range, the mist including the cutting water mist is included. And a determination unit 81 that waits for the detection operation until the amount of received light that has been reduced by the influence of the mist is within an appropriate range. Therefore, the amount of light received by the light receiving unit 65 of the blade detection unit 60 is Accordingly, it can be determined whether or not the atmosphere in the processing chamber 3 is suitable for detecting the tip position of the cutting edge of the cutting blade 31, and the tip position can be detected with high accuracy.

また、閾値登録部８０は、単位時間あたりの該閾値以上の受光量が測定される時間の閾値が登録されるため、受光量（電圧）の変動が多少みられる場合であっても、所定の単位時間では受光量（電圧）が安定していると判断できるため、加工時間の延長を抑えつつ、刃先の先端位置を精度良く検出することができる。   In addition, since the threshold value registration unit 80 registers a threshold value of the time during which the amount of light received that is equal to or greater than the threshold value per unit time is registered, even if there is some variation in the amount of received light (voltage), Since it can be determined that the amount of received light (voltage) is stable in unit time, it is possible to accurately detect the tip position of the cutting edge while suppressing an increase in processing time.

以上、本発明の一実施形態について説明したが、上記実施形態は、例として提示したものであり、発明の範囲を限定することは意図していない。   As mentioned above, although one Embodiment of this invention was described, the said embodiment was shown as an example and is not intending limiting the range of invention.

１ 加工装置
３ 加工室
６ 制御装置（制御手段）
１０ チャックテーブル
１１ 保持面
１４ 切り込み送り機構
３０ 切削ユニット
３１ 切削ブレード
３８ 切削水（切削液）
３９ 排気ユニット
６０ ブレード検出手段（刃先位置検出手段）
６２ 検出機構
６３ ブレード侵入部
６４ 発光部
６５ 受光部
８０ 閾値登録部
８１ 判断部
Ｗ ウエーハ（被加工物） DESCRIPTION OF SYMBOLS 1 Processing apparatus 3 Processing chamber 6 Control apparatus (control means)
DESCRIPTION OF SYMBOLS 10 Chuck table 11 Holding surface 14 Cutting feed mechanism 30 Cutting unit 31 Cutting blade 38 Cutting water (cutting fluid)
39 Exhaust unit 60 Blade detection means (blade edge position detection means)
62 Detection Mechanism 63 Blade Intrusion Unit 64 Light Emitting Unit 65 Light Receiving Unit 80 Threshold Registration Unit 81 Judgment Unit W Wafer (Workpiece)

Claims (2)

被加工物を保持面で保持するチャックテーブルと、該チャックテーブルに保持された被加工物に切削液を供給しながら切削ブレードで切削する切削ユニットと、該保持面と直交する切り込み送り方向の該切削ブレードの先端位置を検出する刃先位置検出ユニットと、該チャックテーブルと該切削ユニットと該刃先位置検出ユニットとを囲繞する加工室と、該加工室内の雰囲気を排気する排気ユニットと、各構成要素を制御する制御手段と、を備える切削装置であって、
該刃先位置検出ユニットは、
該切削ブレードが侵入するブレード侵入部を挟んで対面する発光部と該発光部からの光を受光する受光部とを有し、
該制御手段は、
該切削ブレードが該ブレード侵入部から離れた退避状態で、該発光部からの光を受光した該受光部の受光量の適正範囲を規定する閾値を登録する閾値登録部と、
該退避状態での該受光量が該適正範囲内にある場合に、該切削ブレードを該ブレード侵入部に侵入させて該切削ブレードの先端位置を検出する検出動作を実施させ、該退避状態での該受光量が該適正範囲外の場合に、該切削液のミストを含む該雰囲気が排気され該受光量が該適正範囲内になるまで該検出動作の開始を待機する判断部と、
を有することを特徴とする切削装置。 A chuck table for holding a workpiece on a holding surface, a cutting unit for cutting with a cutting blade while supplying a cutting fluid to the workpiece held on the chuck table, and a cutting feed direction orthogonal to the holding surface. A cutting edge position detection unit for detecting the tip position of the cutting blade, a processing chamber surrounding the chuck table, the cutting unit, and the cutting edge position detection unit, an exhaust unit for exhausting the atmosphere in the processing chamber, and each component A cutting device comprising a control means for controlling
The cutting edge position detection unit is
A light-emitting part facing the blade intrusion part into which the cutting blade enters, and a light-receiving part that receives light from the light-emitting part,
The control means includes
A threshold value registering unit that registers a threshold value that defines an appropriate range of the amount of light received by the light receiving unit that receives light from the light emitting unit in a retracted state in which the cutting blade is separated from the blade intruding unit;
When the amount of light received in the retracted state is within the appropriate range, a detection operation for detecting the tip position of the cutting blade by causing the cutting blade to enter the blade intrusion portion is performed. A determination unit that waits for the start of the detection operation until the atmosphere containing the mist of the cutting fluid is exhausted and the received light amount falls within the appropriate range when the received light amount is outside the appropriate range;
A cutting apparatus comprising: 該閾値登録部は、
単位時間あたりの該適正範囲内の受光量が測定される時間の閾値も登録されることを特徴とする請求項１に記載の切削装置。 The threshold value registration unit
The cutting apparatus according to claim 1, wherein a threshold value for measuring the amount of light received within the appropriate range per unit time is also registered.
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