JP2017200722A5 - - Google Patents

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Publication number
JP2017200722A5
JP2017200722A5 JP2017086849A JP2017086849A JP2017200722A5 JP 2017200722 A5 JP2017200722 A5 JP 2017200722A5 JP 2017086849 A JP2017086849 A JP 2017086849A JP 2017086849 A JP2017086849 A JP 2017086849A JP 2017200722 A5 JP2017200722 A5 JP 2017200722A5
Authority
JP
Japan
Prior art keywords
grinding
workpiece
sensor
detection value
surface roughness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017086849A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017200722A (ja
Filing date
Publication date
Application filed filed Critical
Publication of JP2017200722A publication Critical patent/JP2017200722A/ja
Publication of JP2017200722A5 publication Critical patent/JP2017200722A5/ja
Pending legal-status Critical Current

Links

JP2017086849A 2016-04-28 2017-04-26 研削盤システム Pending JP2017200722A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016091861 2016-04-28
JP2016091861 2016-04-28

Publications (2)

Publication Number Publication Date
JP2017200722A JP2017200722A (ja) 2017-11-09
JP2017200722A5 true JP2017200722A5 (cg-RX-API-DMAC10.html) 2020-07-16

Family

ID=60264796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017086849A Pending JP2017200722A (ja) 2016-04-28 2017-04-26 研削盤システム

Country Status (1)

Country Link
JP (1) JP2017200722A (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120724728B (zh) * 2025-09-01 2025-10-28 湖南科技大学 一种混合粒径cbn砂轮磨削表面形貌的仿真方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01219607A (ja) * 1988-02-29 1989-09-01 Sanyo Electric Co Ltd 加工機の粗さ計測装置
JPH0295543A (ja) * 1988-09-30 1990-04-06 Omron Tateisi Electron Co 研削盤制御装置
JPH031758U (cg-RX-API-DMAC10.html) * 1989-05-29 1991-01-09
JP3362952B2 (ja) * 1993-11-01 2003-01-07 トーヨーエイテック株式会社 適応制御研削方法及びその装置
US7463994B2 (en) * 2004-09-10 2008-12-09 Okayama University Method and device for detecting surface state of work piece
JP2008044074A (ja) * 2006-08-17 2008-02-28 Ntn Corp 研削モニタ装置
JP5711015B2 (ja) * 2011-03-22 2015-04-30 株式会社東京精密 定寸装置
EP2642242B1 (en) * 2012-03-22 2020-01-08 Balance Systems S.r.L. Measuring device including feeler for workpieces

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