JP2017200722A5 - - Google Patents
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- Publication number
- JP2017200722A5 JP2017200722A5 JP2017086849A JP2017086849A JP2017200722A5 JP 2017200722 A5 JP2017200722 A5 JP 2017200722A5 JP 2017086849 A JP2017086849 A JP 2017086849A JP 2017086849 A JP2017086849 A JP 2017086849A JP 2017200722 A5 JP2017200722 A5 JP 2017200722A5
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- workpiece
- sensor
- detection value
- surface roughness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 230000003746 surface roughness Effects 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims 2
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016091861 | 2016-04-28 | ||
| JP2016091861 | 2016-04-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2017200722A JP2017200722A (ja) | 2017-11-09 |
| JP2017200722A5 true JP2017200722A5 (OSRAM) | 2020-07-16 |
Family
ID=60264796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017086849A Pending JP2017200722A (ja) | 2016-04-28 | 2017-04-26 | 研削盤システム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2017200722A (OSRAM) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120724728B (zh) * | 2025-09-01 | 2025-10-28 | 湖南科技大学 | 一种混合粒径cbn砂轮磨削表面形貌的仿真方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01219607A (ja) * | 1988-02-29 | 1989-09-01 | Sanyo Electric Co Ltd | 加工機の粗さ計測装置 |
| JPH0295543A (ja) * | 1988-09-30 | 1990-04-06 | Omron Tateisi Electron Co | 研削盤制御装置 |
| JPH031758U (OSRAM) * | 1989-05-29 | 1991-01-09 | ||
| JP3362952B2 (ja) * | 1993-11-01 | 2003-01-07 | トーヨーエイテック株式会社 | 適応制御研削方法及びその装置 |
| EP1804021A4 (en) * | 2004-09-10 | 2012-05-09 | Univ Okayama | METHOD FOR DETECTING THE SURFACE CONDITION OF WORK AND DEVICE FOR DETECTING THE SURFACE CONDITION |
| JP2008044074A (ja) * | 2006-08-17 | 2008-02-28 | Ntn Corp | 研削モニタ装置 |
| JP5711015B2 (ja) * | 2011-03-22 | 2015-04-30 | 株式会社東京精密 | 定寸装置 |
| EP2642242B1 (en) * | 2012-03-22 | 2020-01-08 | Balance Systems S.r.L. | Measuring device including feeler for workpieces |
-
2017
- 2017-04-26 JP JP2017086849A patent/JP2017200722A/ja active Pending
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