JP2017196689A - Wire saw device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wire saw device capable of preventing a damage in a transparent part for inspecting the inside of a processing chamber visually.SOLUTION: A wire saw device comprises: a processing chamber 10 for processing a work-piece; a cover 20 for covering said processing chamber 10; and a transparent part 21 formed in at least a portion of said cover 20. The wire saw device has a cleaning unit 40 arranged to face the upper portion of the internal surface 20a of the cover 20. The cleaning unit 40 comprises: a washing liquid channel 41 extending along the transverse direction of the transparent part 21; a washing liquid outflow port 42 disposed in the washing liquid channel 41; a washing liquid receiving groove 43 opened upward below the washing liquid outflow port 42 extending along the transverse direction of the transparent part 21; and a washing liquid guide part 44 extending along the opening edge 43a of the washing liquid receiving groove 43 and extending obliquely downward to the cover 20.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a wire saw device.

  2. Description of the Related Art Conventionally, an invention related to a guide roller cover for preventing the processing fluid from scattering of a wire saw that cuts brittle materials such as silicon, glass, and ceramics is known (see Patent Document 1 below). The wire saw described in Patent Document 1 is formed by winding a wire around a plurality of groove rollers to form a wire row, causing the wire to travel and pressing a workpiece while supplying a machining fluid to the wire row. An apparatus for cutting into wafers.

  The wire saw guide roller cover is characterized by comprising a cover provided in the vicinity of a plurality of guide rollers around which a wire is wound in an overhead wire chamber adjacent to a wire saw processing chamber for cutting a workpiece. . The cover is configured to receive the processing liquid splashed from the wire and the guide roller and the cleaning liquid for cleaning the wire and to flow into the processing chamber (see Patent Document 1, Claim 1 and the like).

  Patent Document 1 describes that an observation window for observing the cutting state is provided in a wire saw processing chamber, and an injection nozzle for injecting a wiper or a cleaning liquid toward the observation window is provided in the observation window. (See paragraph 0017, FIG. 2, etc.). The wiper and the injection nozzle operate when the machining liquid adheres to the observation window and the inside becomes invisible.

JP 2000-167760 A

  The wire saw described in Patent Document 1 uses a wiper or a spray nozzle to remove the processing liquid adhering to the observation window. However, since the machining fluid contains chips and abrasive particles, the removal of the machining fluid may damage the observation window due to the chips and abrasive particles contained in the machining fluid, and the inside of the machining chamber may be visually observed. May be difficult.

  This invention is made | formed in view of the said subject, and it aims at providing the wire saw apparatus which can prevent that the transparent part for visually observing the inside of a processing chamber gets damaged.

  In order to achieve the above object, a wire saw device of the present invention is a wire saw device including a processing chamber for processing a workpiece, a cover that covers the processing chamber, and a transparent portion that is provided in at least a part of the cover. A cleaning unit disposed opposite to an upper surface of the inner surface of the cover, the cleaning unit extending along a transverse direction of the transparent portion, and a cleaning liquid outlet provided in the cleaning liquid channel A cleaning liquid receiving groove that opens upward below the cleaning liquid outlet and extends along the transverse direction, and a cleaning liquid guide that extends along the opening edge of the cleaning liquid receiving groove and extends obliquely downward toward the cover And a portion.

  The wire saw device of the present invention is characterized in that it includes a cleaning liquid unit for cleaning a transparent portion provided on at least a part of the cover. Therefore, in the wire saw device of the present invention, a known configuration can be adopted for equipment installed inside the processing chamber, equipment installed inside the overhead wire room adjacent to the processing chamber, and the like.

  Specifically, the wire saw device of the present invention includes, for example, a plurality of work rollers, a wire laid in parallel with the plurality of work rollers, and a work supporting the work toward the wires. And a workpiece feeding portion that feeds the machining fluid containing abrasive grains to the wire. Further, the wire saw device of the present invention includes, for example, a pair of wire reels for winding a wire, a motor for rotating the wire reel in the forward and reverse directions, and a wire wound around the wire reel. And a plurality of rollers for guiding the formed wire to a plurality of work rollers in the processing chamber.

  With such a configuration, the wire saw device of the present invention reciprocates the wire spanned in parallel with the work roller inside the processing chamber, for example, by rotating the wire reel forward and backward by a motor in the overhead wire chamber. Then, a workpiece such as a wafer is supported by the workpiece feeding unit and fed toward the wire, and the machining fluid is sprayed onto the wire by the machining fluid nozzle, thereby cutting the workpiece. At this time, the processing liquid containing abrasive grains and chips scatters toward the cover covering the processing chamber.

  In the wire saw device of the present invention, a transparent portion is provided on at least a part of the cover covering the processing chamber. The transparent portion can be provided in a window shape in a part of the opaque cover at a position where the state in which the workpiece is cut inside the processing chamber can be viewed from the outside. Moreover, it is good also considering the whole cover which covers a process chamber as a transparent part. More specifically, a wall surface is provided on one side of the processing chamber for attaching equipment used for processing the workpiece, a cover that covers the three sides of the processing chamber excluding the direction of the wall surface is provided, and the entire cover may be a transparent portion. Good. In this case, it is preferable that the inner surface of the cover facing the processing chamber is substantially parallel to the vertical direction.

  As described above, the wire saw device of the present invention is characterized by including the cleaning unit disposed opposite to the upper inner surface of the cover. The cleaning unit includes a cleaning liquid channel extending along the transverse direction of the transparent portion, and a cleaning liquid outlet provided in the cleaning liquid channel. Here, the transverse direction of the transparent part is, for example, a direction along the inner surface of the transparent part, and a direction transverse to the inner surface of the transparent part.

  The cleaning liquid outlet can be provided below the center in the vertical direction of the cleaning liquid flow path, and may be provided at the bottom or lower end of the cleaning liquid flow path. The cleaning liquid outlet may be a through-hole penetrating the cleaning liquid flow path, or a slit extending through the cleaning liquid flow path in the transverse direction of the transparent portion. The cleaning liquid flow path may have a plurality of through holes or slits spaced in the transverse direction of the transparent part, or may have a single slit continuous in the transverse direction of the transparent part. From the viewpoint of equalizing the amount of cleaning liquid supplied from the cleaning liquid outlet in the transverse direction of the transparent part, that is, in the extending direction of the cleaning liquid path, the sectional area of the cleaning liquid channel is compared with the total sectional area of the cleaning liquid outlet. It is preferable to set it to be sufficiently large.

  Further, the cleaning unit has a cleaning liquid receiving groove that opens upward below the cleaning liquid outlet and extends along the transverse direction of the transparent portion. The cleaning liquid receiving groove receives the cleaning liquid flowing out from the cleaning liquid outlet through an opening facing upward below the cleaning liquid outlet, and temporarily stores the cleaning liquid by a hook-shaped portion extending in the transverse direction of the transparent portion. The cleaning liquid receiving groove causes the temporarily stored cleaning liquid to overflow from one opening edge extending in the transverse direction of the transparent portion.

  Further, the cleaning unit has a cleaning liquid guide portion extending along the opening edge of the cleaning liquid receiving groove and extending obliquely downward toward the cover. The cleaning liquid guide portion is, for example, a bowl-shaped or lip-shaped member that is provided at one opening edge of the cleaning liquid receiving groove that overflows the cleaning liquid and has an inclined surface that is inclined downward from the opening edge toward the inner surface of the cover. It is. The front end portion of the cleaning liquid guide portion on the cover side can be opposed to the inner surface of the cover with a uniform spacing along the transverse direction of the transparent portion. The distance between the tip of the cleaning liquid guide and the inner surface of the cover can be set to about 1 mm to 2 mm, for example.

  With the above-described configuration, the wire saw device of the present invention causes the cleaning liquid to flow along the inner surface of the cover from the upper portion of the inner surface of the cover downward by the cleaning unit disposed opposite to the upper surface of the inner surface of the cover. More specifically, when the cleaning liquid is caused to flow through the cleaning liquid channel extending along the transverse direction of the transparent part above the transparent part, the cleaning liquid flows out from the cleaning liquid outlet provided in the cleaning liquid channel. The cleaning liquid flowing out from the cleaning liquid outlet flows into the cleaning liquid receiving groove that opens upward below the cleaning liquid outlet, and is temporarily stored in the cleaning liquid receiving groove along the transverse direction of the transparent portion.

  When the volume of the cleaning liquid flowing into the cleaning liquid receiving groove exceeds the capacity of the cleaning liquid receiving groove, the cleaning liquid stored in the cleaning liquid receiving groove overflows beyond the opening edge of the cleaning liquid receiving groove extending in the transverse direction of the transparent portion. The cleaning liquid overflowing beyond the opening edge of the cleaning liquid receiving groove is guided by the cleaning liquid guide portion extending along the opening edge of the cleaning liquid receiving groove and obliquely downward toward the cover, and extends in the transverse direction of the transparent portion. Then, it touches the inner surface of the cover and flows downward along the inner surface of the cover from the upper surface of the inner surface of the cover. Thereby, the flow of the wide curtain-shaped washing | cleaning liquid which flows from upper direction to the downward direction can be formed along the inner surface of the cover including the inner surface of a transparent part.

  Therefore, even if the machining liquid containing abrasive grains and chips scatters toward the cover that covers the machining chamber by machining the workpiece in the machining chamber, the scattered machining liquid touches the cleaning liquid flowing on the inner surface of the transparent part, Flow down with cleaning solution. Therefore, according to the wire saw device of the present invention, the processing liquid containing abrasive grains and chips does not directly adhere to the inner surface of the transparent portion, and the visibility of the inside of the processing chamber through the transparent portion is reduced. Can be prevented.

  In addition, before the abrasive grains and chips adhere to the inner surface of the transparent part, the abrasive grains and chips can be washed away by the cleaning liquid flowing on the inner surface of the transparent part. There is no need to remove chips with a wiper or spray nozzle. Therefore, according to the wire saw device of the present invention, it is possible to prevent the transparent portion from being damaged by removing abrasive grains and chips adhering to the inner surface of the transparent portion with a wiper or a spray nozzle.

  As can be understood from the above description, according to the present invention, it is possible to provide a wire saw device capable of preventing the transparent portion for visually observing the inside of the processing chamber from being damaged.

The perspective view of the wire saw apparatus which concerns on embodiment of this invention. The cross-sectional view which follows the II-II line of the wire saw apparatus shown in FIG. The expansion perspective view of the washing | cleaning unit of the wire saw apparatus shown in FIG. FIG. 4 is an enlarged longitudinal sectional view taken along line IV-IV of the cleaning unit shown in FIG. 3. FIG. 4 is an enlarged longitudinal sectional view taken along line VV of the cleaning unit shown in FIG. 3.

  Hereinafter, embodiments of the wire saw device of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view of a wire saw device 100 according to an embodiment of the present invention. FIG. 2 is a cross-sectional view taken along line II-II of the wire saw device 100 shown in FIG. FIG. 3 is an enlarged perspective view of the cleaning unit 40 of the wire saw device 100 shown in FIG.

  The wire saw device 100 of the present embodiment is a device for cutting a brittle material such as silicon, glass, ceramics, for example, a processing chamber 10 for processing a workpiece, a cover 20 covering the processing chamber 10, And a main body 30 provided on the rear side of the processing chamber 10. In FIG. 1 and FIG. 3, in order to show the internal configuration of the processing chamber 10, the illustration of the cover 20 is omitted, and the outline shape of the cover 20 is represented by a two-dot chain phantom line.

  The wire saw device 100 of the present embodiment is characterized by including a cleaning unit 40 that is disposed opposite to the upper portion of the inner surface 20a of the cover 20. Therefore, in the wire saw device 100 of the present embodiment, the devices installed inside the processing chamber 10, the devices installed inside the main body 30 adjacent to the processing chamber 10, etc. can adopt a known configuration. Therefore, the description is omitted as appropriate.

  The processing chamber 10 is a space that is covered by the cover 20 on the front and left and right sides, and that is defined by the wall surface of the main body 30 on the back. The wire saw device 100 includes, for example, a plurality of work rollers 11, wires laid in parallel to the plurality of work rollers 11, and a work feed that supports the work W and sends the work W toward the wire. The part 12 and the process liquid nozzle which injects the process liquid containing an abrasive grain to a wire can be provided. Each device inside the processing chamber 10 is attached to the wall surface of the main body 30, for example.

  In the wire saw device 100 according to the present embodiment, the entire cover 20 is a transparent portion 21 so that the inside of the processing chamber 10 can be visually recognized through the cover 20. Note that the cover 20 is not limited to a configuration in which the entirety is the transparent portion 21. For example, a transparent portion 21 that can visually recognize the inside of the processing chamber 10 may be provided in a part of the opaque cover 20. The cover 20 and the transparent part 21 can be configured by appropriately combining various transparent glasses, resin materials, sealing materials, metal parts, and the like.

  The cover 20 is provided, for example, so as to cover the front and left and right sides of the processing chamber 10, and has a generally U-shaped shape having arc-shaped corners in a cross section along the horizontal direction shown in FIG. ing. In the cover 20, for example, an inner surface 20 a that faces the processing chamber 10 and an outer surface 20 b that faces the external space are respectively provided substantially parallel to the vertical direction. Note that the cover 20 is not limited to a shape that covers three sides of the processing chamber 10. For example, the cover 20 that covers the front or side of the processing chamber 10 or the two directions of the front and side of the processing chamber 10 are provided. The cover 20 having a L-shaped cross section that covers the horizontal direction may be used.

  Although not shown in the drawings, the main body 30 is formed, for example, by processing a pair of wire reels around which a wire is wound, a motor for rotating the wire reel in the forward and reverse directions, and a wire wound around the wire reel. And a plurality of rollers leading to the plurality of work rollers 11 in the chamber 10. Moreover, the cleaning unit 40 is attached to the wall surface of the main body 30 via, for example, a support member 31.

  The cleaning unit 40 is supported by, for example, the support member 31 and is disposed to face the upper portion of the inner surface 20a of the cover 20. As shown in FIGS. 2 and 3, the cleaning unit 40 is provided so as to cross the cover 20 in a substantially horizontal direction along the inner surface 20 a of the cover 20. In other words, the cleaning unit 40 extends along the inner surface 20a of the transparent portion 21 constituting the entire cover 20 in a transverse direction substantially parallel to the horizontal direction across the transparent portion 21, and the wire saw device 100 shown in FIG. In the cross section along the horizontal direction, the shape of the cover 20 is substantially U-shaped corresponding to the shape of the cover 20.

  FIG. 4 is an enlarged longitudinal sectional view taken along line IV-IV of the cleaning unit 40 shown in FIG. FIG. 5 is an enlarged longitudinal sectional view taken along line VV of the cleaning unit 40 shown in FIG. The cleaning unit 40 mainly includes a cleaning liquid channel 41, a cleaning liquid outlet 42, a cleaning liquid receiving groove 43, and a cleaning liquid guide portion 44.

  The cleaning liquid channel 41 is, for example, a tubular member that faces the inner surface 20 a of the cover 20 above the transparent portion 21 and extends along the transverse direction of the transparent portion 21. Here, the transverse direction of the transparent portion 21 is, for example, a direction along the inner surface 20a of the transparent portion 21 and a direction transverse to the inner surface 20a of the transparent portion 21 in the horizontal direction. A cleaning liquid supply port 41 a for supplying the cleaning liquid to the cleaning liquid flow path 41 is provided at one end of the cleaning liquid flow path 41, and a cleaning liquid for discharging the cleaning liquid from the cleaning liquid flow path 41 at the other end of the cleaning liquid flow path 41. A discharge port 41b is provided.

  The cleaning liquid outlet 42 is provided in the cleaning liquid channel 41 and is, for example, a through hole or a slit that penetrates the cleaning liquid channel 41. The cleaning liquid outlet 42 can be provided, for example, below the center of the cleaning liquid channel 41 in the vertical direction. In the example shown in FIGS. 4 and 5, the cleaning liquid outlet 42 is provided at the bottom of the cleaning liquid flow path 41 and is provided at intervals in the extending direction of the cleaning liquid flow path 41, that is, in the transverse direction of the transparent portion 21. A plurality of through holes. The total cross-sectional area of the cleaning liquid outlet 42 is preferably sufficiently smaller than the cross-sectional area of the cleaning liquid channel 41 from the viewpoint of equalizing the amount of cleaning liquid supplied from the cleaning liquid outlet 42.

  As shown in FIG. 5, the cleaning liquid receiving groove 43 opens upward below the cleaning liquid outlet 42. As shown in FIGS. 3 and 4, the cleaning liquid receiving groove 43 enters the cleaning liquid flow path 41 below the cleaning liquid flow path 41. In parallel, it extends along the transverse direction of the transparent portion 21. The end of the cleaning liquid receiving groove 43 opposite to the cover 20 is connected to and supported by the cleaning liquid flow path 41 by a connecting portion 41 c extending downward from the cleaning liquid flow path 41.

  The cleaning liquid guide 44 extends along the opening edge 43a on the cover 20 side of the cleaning liquid receiving groove 43 as shown in FIGS. 3 and 4, and toward the upper portion of the inner surface 20a of the cover 20 as shown in FIG. Extending diagonally downward. The cleaning liquid guide part 44 is provided at the opening edge 43a of the cleaning liquid receiving groove 43 opposite to the end of the cleaning liquid receiving groove 43 connected to the connecting part 41c, from the opening edge 43a toward the inner surface 20a of the cover 20. It is a bowl-shaped or lip-shaped member having an inclined surface inclined downward. The front end portion of the cleaning liquid guide portion 44 on the cover 20 side extends along the transverse direction of the transparent portion 21 and faces the upper portion of the inner surface 20a of the cover 20 with a uniform interval. The distance between the tip of the cleaning liquid guide 44 and the inner surface 20a of the cover 20 can be set to about 1 mm to 2 mm, for example.

  Hereinafter, the operation of the wire saw device 100 of the present embodiment will be described.

  As described above, the wire saw device 100 according to the present embodiment includes the processing chamber 10 for processing the workpiece W, the cover 20 that covers the processing chamber 10, and the transparent portion 21 provided in at least a part of the cover 20. I have. For example, the wire saw device 100 rotates the wire reel forward and backward by a motor inside the main body 30 to reciprocate the wire spanned in parallel with the work roller 11 inside the processing chamber 10. Then, the workpiece W such as a wafer is supported by the workpiece feeding unit and fed toward the wire, and the machining liquid is sprayed onto the wire by the machining liquid nozzle, so that the workpiece W is cut. At this time, the processing liquid containing abrasive grains and chips scatters toward the cover 20 that covers the processing chamber 10.

  Here, the wire saw device 100 according to the present embodiment includes a cleaning unit 40 disposed to be opposed to the upper portion of the inner surface 20a of the cover 20. As described above, the cleaning unit 40 has the cleaning liquid channel 41 extending above the transparent portion 21 along the transverse direction of the transparent portion 21 and the cleaning liquid outlet 42 provided in the cleaning liquid channel 41. ing. The cleaning unit 40 further opens upward below the cleaning liquid outlet 42, extends along the transverse direction of the transparent portion 21, and extends along the opening edge 43 a of the cleaning liquid receiving groove 43. And a cleaning liquid guide 44 extending obliquely downward toward the cover 20.

  With this configuration, the cleaning liquid supplied from the cleaning liquid supply port 41a of the cleaning liquid flow channel 41 to the cleaning unit 40 flows in the cleaning liquid flow channel 41 from the cleaning liquid supply port 41a toward the cleaning liquid discharge port 41b. In the process, a part of the cleaning liquid flows out from the cleaning liquid outlet 42, and the remaining cleaning liquid is discharged from the cleaning liquid discharge port 41b. As the cleaning liquid supplied to the cleaning liquid channel 41, for example, water or coolant can be used.

  The cleaning liquid flowing out from the cleaning liquid outlet 42 flows into the bowl-shaped cleaning liquid receiving groove 43 extending along the transverse direction of the transparent portion 21 from the opening of the cleaning liquid receiving groove 43 facing upward below the cleaning liquid outlet 42. It is temporarily stored by the receiving groove 43. When the cleaning liquid receiving groove 43 is filled with the cleaning liquid flowing in from the cleaning liquid outlet 42, the cleaning liquid extends in the transverse direction of the transparent portion 21 and exceeds the opening edge 43 a of the cleaning liquid receiving groove 43 facing the upper portion of the inner surface 20 a of the cover 20. Then, the liquid overflows from the cleaning liquid receiving groove 43 toward the cleaning liquid guide 44 provided along the opening edge 43a.

  The cleaning liquid overflowing from the opening edge 43a of the cleaning liquid receiving groove 43 to the cleaning liquid guide section 44 is guided by the cleaning liquid guide section 44 extending along the opening edge 43a of the cleaning liquid receiving groove 43 and extending obliquely downward toward the cover 20. Then, it contacts the upper part of the inner surface 20a of the cover 20 across the transverse direction of the transparent portion 21, and flows downward from the upper part of the inner surface 20a of the cover 20 along the inner surface 20a of the cover 20. Here, by setting the distance between the tip of the cleaning liquid guide 44 and the inner surface 20a of the cover 20 to an appropriate distance of about 1 mm to 2 mm, for example, the surface tension of the cleaning liquid guides the cleaning liquid guide 44. The cleaning liquid flowing through the tip and the cleaning liquid flowing through the inner surface 20a of the cover 20 can be connected by the cleaning liquid.

  Thus, the cleaning unit 40 can form a wide curtain-like cleaning liquid flow that flows downward from the upper surface of the inner surface 20a along the inner surface 20a of the cover 20 including the inner surface 20a of the transparent portion 21. Therefore, as described above, even if the machining fluid containing abrasive grains and chips is scattered toward the cover 20 covering the machining chamber 10 by machining the workpiece W inside the machining chamber 10, the scattered machining fluid. Touches the cleaning liquid flowing on the inner surface 20a of the transparent portion 21, and flows down together with the cleaning liquid. Therefore, according to the wire saw device 100 of the present embodiment, the processing liquid containing abrasive grains and chips does not directly adhere to the inner surface 20a of the transparent portion 21, and the inside of the processing chamber 10 through the transparent portion 21. It is possible to prevent the visibility of.

  In addition, before the abrasive grains and chips adhere to the inner surface 20a of the transparent part 21, the abrasive grains and chips can be washed away by the cleaning liquid flowing on the inner surface 20a of the transparent part 21, and the inner surface 20a of the transparent part 21 It is not necessary to remove abrasive grains and chips adhering to the surface by a wiper or a spray nozzle. Therefore, according to the wire saw device 100 of the present embodiment, the transparent portion 21 can be prevented from being damaged by removing abrasive grains and chips adhering to the inner surface 20a of the transparent portion 21 with a wiper or a spray nozzle. .

  As described above, according to the wire saw device 100 of the present embodiment, it is possible to prevent the transparent portion 21 for viewing the inside of the processing chamber 10 from being scratched, and the processing via the transparent portion 21 is possible. The visibility inside the chamber 10 can be ensured over a long period of time. In addition, the amount of the cleaning liquid used can be reduced as compared with the injection nozzle that injects the cleaning liquid toward the transparent portion 21, and the cleaning liquid can be constantly supplied to the inner surface 20 a of the transparent portion 21.

  Therefore, even if the fine chips generated when cutting the workpiece W such as silicon carbide scatters toward the transparent part 21, the scattered chips come into contact with the cleaning liquid on the surface of the transparent part 21 and flowed as it is. Chips do not adhere to the transparent part 21, and the clouding of the transparent part 21 can be prevented. Therefore, the damage | wound which generate | occur | produces when wipe | wiping off fine chips with a wiper can also be prevented. Furthermore, according to the wire saw device 100 of the present embodiment, since the cleaning liquid can be distributed without depending on the inclination, the space can be saved and the supply pressure of the cleaning liquid can be minimized.

  The embodiment of the present invention has been described in detail with reference to the drawings, but the specific configuration is not limited to this embodiment, and there are design changes and the like without departing from the gist of the present invention. They are also included in the present invention.

DESCRIPTION OF SYMBOLS 10 Processing chamber 20 Cover 21 Transparent part 20a Inner surface 40 Cleaning unit 41 Cleaning liquid flow path 42 Cleaning liquid outlet 43 Cleaning liquid receiving groove 43a Open edge 44 Cleaning liquid guide part 100 Wire saw apparatus W Workpiece

Claims (1)

A wire saw device comprising a processing chamber for processing a workpiece, a cover that covers the processing chamber, and a transparent portion that is provided on at least a part of the cover,
A cleaning unit disposed opposite to the upper inner surface of the cover;
The cleaning unit includes a cleaning liquid flow path extending along a transverse direction of the transparent portion, a cleaning liquid outlet provided in the cleaning liquid flow path, and opens upward below the cleaning liquid outlet and extends in the transverse direction. A wire saw device comprising: a cleaning liquid receiving groove extending along the cleaning liquid; and a cleaning liquid guide portion extending along an opening edge of the cleaning liquid receiving groove and extending obliquely downward toward the cover.

Images