JP2017186422A - Foamable styrene resin particle - Google Patents
Foamable styrene resin particle Download PDFInfo
- Publication number
- JP2017186422A JP2017186422A JP2016075215A JP2016075215A JP2017186422A JP 2017186422 A JP2017186422 A JP 2017186422A JP 2016075215 A JP2016075215 A JP 2016075215A JP 2016075215 A JP2016075215 A JP 2016075215A JP 2017186422 A JP2017186422 A JP 2017186422A
- Authority
- JP
- Japan
- Prior art keywords
- styrene resin
- resin particles
- weight
- expandable
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 title claims abstract description 259
- 239000002245 particle Substances 0.000 title claims abstract description 169
- 229920005989 resin Polymers 0.000 title claims abstract description 124
- 239000011347 resin Substances 0.000 title claims abstract description 124
- 238000000465 moulding Methods 0.000 claims abstract description 43
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000004088 foaming agent Substances 0.000 claims abstract description 11
- 238000005187 foaming Methods 0.000 claims description 30
- 238000004519 manufacturing process Methods 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 22
- 239000002344 surface layer Substances 0.000 claims description 21
- 229920001890 Novodur Polymers 0.000 claims description 19
- 150000001875 compounds Chemical class 0.000 claims description 13
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 claims description 12
- IJDNQMDRQITEOD-UHFFFAOYSA-N sec-butylidene Natural products CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 claims description 10
- 125000000217 alkyl group Chemical group 0.000 claims description 8
- QWTDNUCVQCZILF-UHFFFAOYSA-N isopentane Chemical compound CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 claims description 8
- CRSOQBOWXPBRES-UHFFFAOYSA-N neopentane Chemical compound CC(C)(C)C CRSOQBOWXPBRES-UHFFFAOYSA-N 0.000 claims description 8
- 239000003505 polymerization initiator Substances 0.000 claims description 8
- 239000004604 Blowing Agent Substances 0.000 claims description 7
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims description 6
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000001282 iso-butane Substances 0.000 claims description 6
- 229920006248 expandable polystyrene Polymers 0.000 claims description 5
- AFABGHUZZDYHJO-UHFFFAOYSA-N dimethyl butane Natural products CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 claims description 4
- 239000001294 propane Substances 0.000 claims description 3
- 230000004927 fusion Effects 0.000 abstract description 18
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 abstract description 12
- 239000008096 xylene Substances 0.000 abstract description 12
- 238000000034 method Methods 0.000 description 21
- 238000006116 polymerization reaction Methods 0.000 description 21
- 238000011156 evaluation Methods 0.000 description 16
- 230000007423 decrease Effects 0.000 description 15
- 239000006260 foam Substances 0.000 description 14
- JXCAHDJDIAQCJO-UHFFFAOYSA-N (1-tert-butylperoxy-2-ethylhexyl) hydrogen carbonate Chemical compound CCCCC(CC)C(OC(O)=O)OOC(C)(C)C JXCAHDJDIAQCJO-UHFFFAOYSA-N 0.000 description 11
- 239000000047 product Substances 0.000 description 11
- -1 alkylene glycol dimethacrylate Chemical compound 0.000 description 9
- 239000003431 cross linking reagent Substances 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
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- 239000000178 monomer Substances 0.000 description 7
- UEXCJVNBTNXOEH-UHFFFAOYSA-N Ethynylbenzene Chemical group C#CC1=CC=CC=C1 UEXCJVNBTNXOEH-UHFFFAOYSA-N 0.000 description 6
- 235000014113 dietary fatty acids Nutrition 0.000 description 5
- 229930195729 fatty acid Natural products 0.000 description 5
- 239000000194 fatty acid Substances 0.000 description 5
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- 239000000706 filtrate Substances 0.000 description 5
- 239000003999 initiator Substances 0.000 description 5
- 239000002270 dispersing agent Substances 0.000 description 4
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- 150000003254 radicals Chemical class 0.000 description 4
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- 239000001506 calcium phosphate Substances 0.000 description 3
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- 239000006185 dispersion Substances 0.000 description 3
- 150000004665 fatty acids Chemical class 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000003839 salts Chemical class 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 229910052708 sodium Inorganic materials 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 3
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 2
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical compound C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 235000019482 Palm oil Nutrition 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 239000007900 aqueous suspension Substances 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- 239000001273 butane Substances 0.000 description 2
- 229910000389 calcium phosphate Inorganic materials 0.000 description 2
- 235000011010 calcium phosphates Nutrition 0.000 description 2
- UOCJDOLVGGIYIQ-PBFPGSCMSA-N cefatrizine Chemical group S([C@@H]1[C@@H](C(N1C=1C(O)=O)=O)NC(=O)[C@H](N)C=2C=CC(O)=CC=2)CC=1CSC=1C=NNN=1 UOCJDOLVGGIYIQ-PBFPGSCMSA-N 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000010097 foam moulding Methods 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 239000002540 palm oil Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 150000003440 styrenes Chemical class 0.000 description 2
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 2
- VMPHSYLJUKZBJJ-UHFFFAOYSA-N trilaurin Chemical compound CCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCC)COC(=O)CCCCCCCCCCC VMPHSYLJUKZBJJ-UHFFFAOYSA-N 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- HGTUJZTUQFXBIH-UHFFFAOYSA-N (2,3-dimethyl-3-phenylbutan-2-yl)benzene Chemical compound C=1C=CC=CC=1C(C)(C)C(C)(C)C1=CC=CC=C1 HGTUJZTUQFXBIH-UHFFFAOYSA-N 0.000 description 1
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- XLYMOEINVGRTEX-ONEGZZNKSA-N (e)-4-ethoxy-4-oxobut-2-enoic acid Chemical compound CCOC(=O)\C=C\C(O)=O XLYMOEINVGRTEX-ONEGZZNKSA-N 0.000 description 1
- LVGUZGTVOIAKKC-UHFFFAOYSA-N 1,1,1,2-tetrafluoroethane Chemical compound FCC(F)(F)F LVGUZGTVOIAKKC-UHFFFAOYSA-N 0.000 description 1
- HSLFISVKRDQEBY-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclohexane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1 HSLFISVKRDQEBY-UHFFFAOYSA-N 0.000 description 1
- XQKQZOLAVMIQHZ-UHFFFAOYSA-N 1,1-dibromo-3-(3,3-dibromopropoxy)propane Chemical compound BrC(Br)CCOCCC(Br)Br XQKQZOLAVMIQHZ-UHFFFAOYSA-N 0.000 description 1
- NPNPZTNLOVBDOC-UHFFFAOYSA-N 1,1-difluoroethane Chemical compound CC(F)F NPNPZTNLOVBDOC-UHFFFAOYSA-N 0.000 description 1
- XUMFBUWGVLTWTH-UHFFFAOYSA-N 1,2-dibromo-3-(2,3-dibromo-2-methylpropoxy)-2-methylpropane Chemical compound BrCC(Br)(C)COCC(C)(Br)CBr XUMFBUWGVLTWTH-UHFFFAOYSA-N 0.000 description 1
- LDVVTQMJQSCDMK-UHFFFAOYSA-N 1,3-dihydroxypropan-2-yl formate Chemical compound OCC(CO)OC=O LDVVTQMJQSCDMK-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- DXIJHCSGLOHNES-UHFFFAOYSA-N 3,3-dimethylbut-1-enylbenzene Chemical compound CC(C)(C)C=CC1=CC=CC=C1 DXIJHCSGLOHNES-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
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- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
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- PVNIQBQSYATKKL-UHFFFAOYSA-N tripalmitin Chemical compound CCCCCCCCCCCCCCCC(=O)OCC(OC(=O)CCCCCCCCCCCCCCC)COC(=O)CCCCCCCCCCCCCCC PVNIQBQSYATKKL-UHFFFAOYSA-N 0.000 description 1
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- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
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Abstract
Description
本発明は発泡性スチレン系樹脂粒子、及びその製造方法に関する。さらには、発泡性スチレン系樹脂粒子を発泡して得られる予備発泡粒子、及び予備発泡粒子を型内成形して得られる発泡成形体に関する。 The present invention relates to expandable styrene resin particles and a method for producing the same. Furthermore, the present invention relates to pre-expanded particles obtained by foaming expandable styrenic resin particles, and foam-molded products obtained by in-mold molding of pre-expanded particles.
従来、発泡性スチレン系樹脂粒子から得られる発泡成形体は、軽量性、断熱性、強度、衛生性に優れ、食品容器、緩衝材、断熱材、住宅用建材などに広く利用されている。例えば、住宅用建材分野では床暖房用途で使用されている。この床暖房用途では、パイプを埋め込む箇所があり、この箇所にいたっては数mmの厚みにする必要があるため、高い強度が求められている。 Conventionally, foamed molded articles obtained from expandable styrene resin particles are excellent in lightness, heat insulation, strength, and hygiene, and are widely used for food containers, cushioning materials, heat insulating materials, residential building materials, and the like. For example, it is used for floor heating in the residential building materials field. In this floor heating application, there is a part where a pipe is embedded, and since it is necessary to make this part a thickness of several millimeters, high strength is required.
一方、最近では環境問題への関心の高まりから、より省エネルギーへの要望が高まっており、型内成形時の温度を低温にすることにより、少ない蒸気使用量で発泡可能な樹脂が求められている。 On the other hand, recently, there has been an increasing demand for energy saving due to increased concern about environmental problems, and there is a demand for a resin that can be foamed with a small amount of steam used by lowering the temperature during molding. .
しかしながら、発泡時の温度を低温にすると、加熱時に発生した蒸気のドレンの溜りにより発泡が抑制され、得られた成形体は予備発泡粒子同士が充分に融着しないものとなる。この場合、曲げ強度や圧縮強度などの強度が悪化傾向にある。更には、金型壁面付近の予備発泡粒子の充填状態が悪い為に空隙率が高く、この部分のドレンの発生も多くなり、成形体の表面には粒子間隙が発生するなどの問題がある。 However, if the temperature at the time of foaming is lowered, foaming is suppressed by the accumulation of vapor drain generated during heating, and in the obtained molded product, the pre-foamed particles are not sufficiently fused together. In this case, the strength such as bending strength and compressive strength tends to deteriorate. Furthermore, since the filling state of the pre-expanded particles in the vicinity of the mold wall surface is poor, the porosity is high, and the generation of drain in this part increases, and there is a problem that a particle gap is generated on the surface of the molded body.
特許文献1では、強度改善のため、架橋剤添加により樹脂粒子表層部と樹脂粒子全体の比率(Mz1/Mz2=1.05〜1.5)を調整した方法が開示されている。しかし、樹脂粒子表層部の分子量(Mz=130〜200万)を樹脂粒子全体(Mz=120〜190万)の分子量より高くしているため成形時の蒸気温度が低いと、融着が悪化し、十分な強度を確保することが難しくなることが問題であった。 Patent Document 1 discloses a method in which the ratio (Mz1 / Mz2 = 1.05 to 1.5) of the resin particle surface layer part and the entire resin particle is adjusted by adding a crosslinking agent to improve the strength. However, since the molecular weight (Mz = 1.3 to 2 million) of the resin particle surface layer is higher than the molecular weight of the entire resin particle (Mz = 1.2 to 1.9 million), if the steam temperature during molding is low, the fusion deteriorates. The problem is that it is difficult to ensure sufficient strength.
特許文献2では、耐熱性改善のため、架橋剤添加による樹脂粒子表層部と樹脂粒子全体の比率調整(Mz1/Mz2=1.05〜2.9)及び平均気泡径150〜300μmと最外壁の粒界壁の厚さが2.0〜10.0μmを調整した方法が開示されている。この方法においても強度は上がるが、樹脂粒子表層部の分子量(Mz=115〜250万)が樹脂粒子全体(Mz=85〜110万)の分子量より高く、更に最外壁の粒界が厚いため、成形時の蒸気温度が低いと、融着が悪化し、十分な強度を確保することが難しくなることが問題であった。 In Patent Document 2, in order to improve heat resistance, the ratio of the resin particle surface layer to the entire resin particle is adjusted by adding a crosslinking agent (Mz1 / Mz2 = 1.05 to 2.9) and the average cell diameter is 150 to 300 μm and the outermost wall A method is disclosed in which the grain boundary wall thickness is adjusted to 2.0 to 10.0 μm. In this method, the strength is increased, but the molecular weight of the resin particle surface layer (Mz = 115 to 2.5 million) is higher than the molecular weight of the entire resin particle (Mz = 85 to 1.1 million), and the grain boundary of the outermost wall is thick, When the steam temperature at the time of molding is low, the fusion deteriorates, and it is difficult to ensure sufficient strength.
特許文献3では、油分や色素の滲みだしを抑制するため、架橋剤を添加し、ゲル分10〜50質量%となる樹脂粒子の調整方法が開示されている。この方法では、文献で規定したゲル分:溶剤不溶分(10〜50質量%)では、成形時の蒸気温度が低いと、融着が悪化するため、十分な強度を確保することが難しくなることが問題であった。 Patent Document 3 discloses a method for adjusting resin particles in which a crosslinking agent is added and the gel content is 10 to 50% by mass in order to suppress oil and pigment bleeding. In this method, the gel content: solvent insoluble content (10 to 50% by mass) specified in the literature is difficult to ensure sufficient strength because the fusion deteriorates when the steam temperature during molding is low. Was a problem.
特許文献4では、粒子径:200〜600μm、残存スチレン量:1000ppm以下、発泡剤量:2〜6重量%、発泡倍率3〜30倍となる調整方法が開示されている。この方法では、低圧での成形性は良好であるものの、十分な強度が得られないため、改善の余地があった。 Patent Document 4 discloses an adjustment method in which the particle size is 200 to 600 μm, the amount of residual styrene is 1000 ppm or less, the amount of blowing agent is 2 to 6% by weight, and the expansion ratio is 3 to 30 times. Although this method has good formability at low pressure, there is room for improvement because sufficient strength cannot be obtained.
特許文献1〜4のように低圧の成形条件における融着性、表面性及び強度すべてを満たすものは見出せていなかった。 As in Patent Documents 1 to 4, no material satisfying all of the fusion property, surface property and strength under low pressure molding conditions has been found.
本発明の目的は、低圧の成形条件において、良好な融着性、表面性、強度を有する発泡性スチレン系樹脂粒子を提供することにある。 An object of the present invention is to provide expandable styrenic resin particles having good fusion properties, surface properties, and strength under low pressure molding conditions.
本発明者らは、鋭意検討の結果、特定のキシレン不溶分、表層と全体の分子量比を採用することで、低圧の成形条件において良好な融着性、表面性、強度を有する発泡性スチレン系樹脂粒子を得ることがが出来ることを見出し本発明の完成に至った。すなわち、本発明は、以下のとおりである。 As a result of intensive studies, the present inventors have adopted a specific xylene-insoluble component, a surface layer and a molecular weight ratio of the whole, so that a foamable styrene system having good fusion properties, surface properties, and strength under low-pressure molding conditions. The inventors have found that resin particles can be obtained and have completed the present invention. That is, the present invention is as follows.
[1]昜揮発性発泡剤を含む発泡性スチレン系樹脂粒子であって、該発泡性スチレン系樹脂粒子のスチレン系樹脂が、ジビニルベンゼンをスチレン単量体100重量部に対して0.010〜0.020重量部含み、該発泡性スチレン系樹脂粒子のキシレン不溶分が1.5%未満であり、該発泡性スチレン系樹脂粒子の表層部のZ平均分子量(Mz1)が60万〜100万であり、全体のZ平均分子量(Mz2)が70万〜115万であり、かつMz1とMz2との比率(Mz1/Mz2)が0.85〜0.95であることを特徴とする発泡性ポリスチレン系樹脂粒子。 [1] Expandable styrene resin particles containing a volatile foaming agent, wherein the styrene resin of the expandable styrene resin particles is 0.010 to 100 parts by weight of divinylbenzene. 0.020 part by weight, the xylene-insoluble content of the expandable styrene resin particles is less than 1.5%, and the Z average molecular weight (Mz1) of the surface layer of the expandable styrene resin particles is 600,000 to 1,000,000 A foamable polystyrene having an overall Z-average molecular weight (Mz2) of 700,000 to 1.15 million and a ratio of Mz1 to Mz2 (Mz1 / Mz2) of 0.85 to 0.95 Resin particles.
[2]昜揮発性発泡剤が、プロパン、イソブタン、ノルマルブタン、イソペンタン、ノルマルペンタン、ネオペンタンからなる群の少なくとも1種であり、スチレン系樹脂粒子100重量部に対して、2〜7重量部含むことを特徴とする[1]の発明に記載の発泡性ポリスチレン系樹脂粒子。 [2] The volatile blowing agent is at least one member selected from the group consisting of propane, isobutane, normal butane, isopentane, normal pentane, and neopentane, and includes 2 to 7 parts by weight with respect to 100 parts by weight of the styrene resin particles. The expandable polystyrene resin particle according to the invention of [1], which is characterized in that
[3][1]又は[2]の発明に記載の発泡性スチレン系樹脂粒子を発泡して得られる予備発泡粒子。 [3] Pre-expanded particles obtained by foaming the expandable styrenic resin particles according to the invention of [1] or [2].
[4][3]の発明に記載の予備発泡粒子を型内成形して得られる発泡成形体。 [4] A foam molded article obtained by in-mold molding the pre-expanded particles according to the invention of [3].
[5]発泡成形体の密度が0.05〜0.2g/cm3であることを特徴とする[4]の発明に記載の発泡成形体。 [5] The foam molded article according to the invention of [4], wherein the density of the foam molded article is 0.05 to 0.2 g / cm 3 .
[6][1]又は[2]の発明に記載の発泡性スチレン系樹脂粒子の製造方法。 [6] The method for producing expandable styrene resin particles according to the invention of [1] or [2].
[7]スチレン系樹脂種粒子とスチレン系単量体の総量100重量部に対して、一般式(1)に示される化合物0.040重量部〜0.180重量部を重合開始剤として使用することを特徴とする[6]の発明に記載の発泡性スチレン系樹脂粒子の製造方法。 [7] 0.040 parts by weight to 0.180 parts by weight of the compound represented by the general formula (1) is used as a polymerization initiator with respect to 100 parts by weight of the total amount of the styrene resin seed particles and the styrene monomer. The method for producing expandable styrene resin particles according to the invention of [6], wherein
(式中のR1は分岐アルキル基、R2は分岐鎖又は直鎖のアルキル基を表す。)
[8]ジビニルベンゼンを添加後、115〜130℃、2時間〜7時間、加熱処理することを特徴とする[6]または[7]の発明に記載の発泡性スチレン系樹脂粒子の製造方法。
(In the formula, R 1 represents a branched alkyl group, and R 2 represents a branched or straight chain alkyl group.)
[8] The method for producing expandable styrenic resin particles according to [6] or [7], wherein after the addition of divinylbenzene, heat treatment is performed at 115 to 130 ° C. for 2 to 7 hours.
[9]スチレン系単量体の全量の90%〜100%が添加された時点で、ジビニルベンゼンを添加することを特徴とする[6]〜[8]のいずれかに記載の発泡性スチレン系樹脂粒子の製造方法。 [9] The expandable styrene system according to any one of [6] to [8], wherein divinylbenzene is added when 90% to 100% of the total amount of the styrene monomer is added. A method for producing resin particles.
低圧の成形条件において、良好な融着性、表面性、強度を有する発泡性ポリスチレン系樹脂粒子を得ることが出来る。 Under low-pressure molding conditions, expandable polystyrene resin particles having good fusing properties, surface properties, and strength can be obtained.
以下,本発明の実施の形態をより詳細に説明する。 Hereinafter, embodiments of the present invention will be described in more detail.
本発明は、昜揮発性発泡剤を含む発泡性スチレン系樹脂粒子であって、該発泡性スチレン系樹脂粒子のスチレン系樹脂が、ジビニルベンゼンをスチレン単量体100重量部に対して0.010〜0.020重量部含み、該発泡性スチレン系樹脂粒子のキシレン不溶分が1.5%未満であり、該発泡性スチレン系樹脂粒子の表層部のZ平均分子量(Mz1)が60万〜100万であり、全体のZ平均分子量(Mz2)が70万〜115万であり、かつMz1とMz2との比率(Mz1/Mz2)が0.85〜0.95であることを特徴とする発泡性スチレン系樹脂粒子である。 The present invention relates to expandable styrene resin particles containing a volatile foaming agent, wherein the styrene resin of the expandable styrene resin particles contains divinylbenzene in an amount of 0.010 with respect to 100 parts by weight of styrene monomer. -0.020 parts by weight, the xylene-insoluble content of the expandable styrene resin particles is less than 1.5%, and the Z average molecular weight (Mz1) of the surface layer of the expandable styrene resin particles is 600,000-100 The foaming property is characterized in that the entire Z average molecular weight (Mz2) is 700,000 to 1,150,000, and the ratio of Mz1 to Mz2 (Mz1 / Mz2) is 0.85 to 0.95. Styrenic resin particles.
本発明に用いるスチレン系樹脂粒子は、一般的に知られているスチレン系樹脂の粒状物で、スチレン、及び、α−メチルスチレン、パラメチルスチレン、t−ブチルスチレン、クロルスチレンなどのスチレン系誘導体が挙げられ、さらにスチレンと共重合が可能な成分、例えばメチルアクリレート、ブチルアクリレート、メチルメタクリレート、エチルメタクリレート、セチルメタクリレートなどのアクリル酸及びメタクリル酸のエステル、あるいはアクリロニトリル、ジメチルフマレート、エチルフマレートなどの各種単量体、ジビニルベンゼン、アルキレングリコールジメタクリレートなどの2官能性単量体も包含する。これら共重合が可能な成分を1種又は2種以上使用し共重合に供しても良い。 The styrene resin particles used in the present invention are generally known styrene resin granules, and are styrene and styrene derivatives such as α-methylstyrene, paramethylstyrene, t-butylstyrene, chlorostyrene, and the like. In addition, components that can be copolymerized with styrene, such as esters of acrylic acid and methacrylic acid such as methyl acrylate, butyl acrylate, methyl methacrylate, ethyl methacrylate, cetyl methacrylate, acrylonitrile, dimethyl fumarate, ethyl fumarate, etc. And various functional monomers such as divinylbenzene and alkylene glycol dimethacrylate. One or more of these copolymerizable components may be used for copolymerization.
スチレン中のフェニルアセチレン量は0〜250ppmが好ましい。フェニルアセチレン量が250ppmを超える場合には、開始剤の使用量を増やす必要があるが、その反面、得られた発泡性スチレン系樹脂粒子の分子量が大きく低下する傾向にある。その結果、強度や成形性が低下することが問題となる。 The amount of phenylacetylene in styrene is preferably 0 to 250 ppm. When the amount of phenylacetylene exceeds 250 ppm, it is necessary to increase the amount of the initiator used. On the other hand, the molecular weight of the obtained expandable styrene resin particles tends to be greatly reduced. As a result, there is a problem that strength and formability are lowered.
本発明におけるスチレン系樹脂粒子は、水性懸濁液中に分散したスチレン系樹脂種粒子にスチレン系単量体を添加して該種粒子に含浸させながら重合せしめる、いわゆる懸濁シード重合法によって製造されたものを使用することができる。 The styrene resin particles in the present invention are produced by a so-called suspension seed polymerization method in which a styrene monomer is added to styrene resin seed particles dispersed in an aqueous suspension and polymerized while impregnating the seed particles. Can be used.
懸濁シード重合法に用いる樹脂種粒子は、(1)通常の懸濁重合法、(2)重合性単量体を規則的な振動下にノズルを通すことにより液滴群として水性媒体中に分散させ、合着および付加的な分散を生じせしめることなく重合させる方法、などによって得ることができる。 The resin seed particles used in the suspension seed polymerization method are (1) a normal suspension polymerization method, and (2) a polymerizable monomer is passed through a nozzle under regular vibration to form droplets in an aqueous medium. It can be obtained by a method of dispersing, polymerizing without causing coalescence and additional dispersion.
スチレン系樹脂種粒子の量は、目的とするスチレン系樹脂粒子の量に対して5〜60重量%であることが好ましい。5重量%未満になる場合、水性懸濁液に添加する重合性単量体が樹脂種粒子内で重合せずに、単独で重合する割合が増える傾向にあり、60重量%を超える場合は、一回の重合工程でより多くのモノマーを重合させることが出来ずに、不経済である。 The amount of the styrene resin seed particles is preferably 5 to 60% by weight with respect to the target amount of the styrene resin particles. When the amount is less than 5% by weight, the polymerizable monomer added to the aqueous suspension does not polymerize within the resin seed particles, and the proportion of polymerization alone tends to increase. When the amount exceeds 60% by weight, More monomers cannot be polymerized in one polymerization step, which is uneconomical.
発泡性スチレン系樹脂粒子の粒子径は200〜600μmであることが好ましい。粒子径が200μmを下回ると、重合時の収率が極端に悪化しコストアップが避けられないのに加え、発泡剤の保持性が低下してビーズライフが短くなる傾向を有するため好ましくなく、600μmを越えると、床下地材を成形する際、金型への充填性が悪くなる傾向を有するため好ましくない。発泡性スチレン系樹脂粒子の粒子径を200〜600μmとするために、スチレン系樹脂種粒子の粒径は200〜300μmが好ましい。 The particle diameter of the expandable styrene resin particles is preferably 200 to 600 μm. If the particle size is less than 200 μm, the yield during polymerization is extremely deteriorated and cost increase is unavoidable. In addition, the retention of the foaming agent tends to be lowered and the bead life tends to be shortened. Exceeding the range is not preferable because the mold filling property tends to deteriorate when the floor base material is molded. In order to set the particle diameter of the expandable styrene resin particles to 200 to 600 μm, the particle diameter of the styrene resin seed particles is preferably 200 to 300 μm.
本発明で使用する分散剤としては、一般的に懸濁重合に用いられている分散剤、例えば、燐酸カルシウム、ハイドロキシアパタイト、ピロリン酸マグネシウムなどの難水溶性無機塩が挙げられる。これら、難水溶性無機塩を用いる場合には、α−オレフィンスルフォン酸ソーダ、ドデシルベンゼンスルフォン酸ソーダなどのアニオン性界面活性剤を併用すると、分散安定性が増すので効果的である。また、難溶性無機塩は得られる発泡性スチレン系樹脂粒子の粒子径を調節するために、重合中に1回以上追加することもある。 Examples of the dispersant used in the present invention include dispersants generally used for suspension polymerization, such as poorly water-soluble inorganic salts such as calcium phosphate, hydroxyapatite, and magnesium pyrophosphate. When these poorly water-soluble inorganic salts are used, the use of an anionic surfactant such as α-olefin sodium sulfonate or dodecylbenzene sodium sulfonate is effective because the dispersion stability increases. Further, the hardly soluble inorganic salt may be added one or more times during the polymerization in order to adjust the particle diameter of the resulting expandable styrene resin particles.
発泡性スチレン系樹脂粒子の製造において、一般的には、主に樹脂を形成するための開始剤と主に残存スチレン量を低下させるための開始剤を併用させることが通常行われている。ここに、樹脂を形成するための重合開始剤としては、過酸化ベンゾイル、t−ブチルパーオキシベンゾエート、イソプロピル−t−ブチルパーオキシカーボネート、過安息香酸ブチルのような有機化酸化物やアゾビスイソブチロニトリル等のアゾ化合物などが例示される。これら重合開始剤を1種或いは2種以上併用することにより、重合温度、重合時間、樹脂の分子量等の選択幅をより広げた上で、残存スチレン量を低減した良好な製品を得ることができるので、併用することは極めて好ましい実施態様である。 In the production of expandable styrenic resin particles, generally, an initiator mainly for forming a resin and an initiator mainly for reducing the amount of residual styrene are generally used in combination. Here, as a polymerization initiator for forming a resin, organic oxides such as benzoyl peroxide, t-butyl peroxybenzoate, isopropyl t-butyl peroxycarbonate, butyl perbenzoate and azobisiso Examples include azo compounds such as butyronitrile. By using one or more of these polymerization initiators in combination, it is possible to obtain a good product in which the amount of residual styrene is reduced while further widening the selection range such as polymerization temperature, polymerization time, resin molecular weight and the like. Therefore, using together is a very preferable embodiment.
残存スチレンを低下させるための重合開始剤は、一般式(1)で示される化合物であり、R1は分岐アルキル基であり、R2は分岐鎖又は直鎖のアルキル基構造をもつものである。 The polymerization initiator for reducing the residual styrene is a compound represented by the general formula (1), R 1 is a branched alkyl group, and R 2 has a branched or straight chain alkyl group structure. .
(式中のR1は分岐アルキル基、R2は分岐鎖又は直鎖のアルキル基を表す。)
一般式(1)のR1構造がt−ブチル基あるいはt−アミル基であり、R2構造が2−エチルヘキシル基、あるいはイソプロピル基であることが、残存スチレン量低減の点で好ましい。
(In the formula, R 1 represents a branched alkyl group, and R 2 represents a branched or straight chain alkyl group.)
The R 1 structure of the general formula (1) is preferably a t-butyl group or a t-amyl group, and the R 2 structure is preferably a 2 -ethylhexyl group or an isopropyl group from the viewpoint of reducing the amount of residual styrene.
具体的には、t−ブチルパーオキシ−2−エチルヘキシルモノカーボネート、t−アミルパーオキシ−2−エチルヘキシルモノカーボネート、t−ヘキシルパーオキシイソプロピルモノカーボネート、t−ブチルパーオキシイソプロピルモノカーボネート等があげられる。 Specific examples include t-butyl peroxy-2-ethylhexyl monocarbonate, t-amyl peroxy-2-ethylhexyl monocarbonate, t-hexyl peroxyisopropyl monocarbonate, t-butyl peroxyisopropyl monocarbonate, and the like. .
特に、一般式(1)の化合物の中で、t−ブチルパーオキシ−2−エチルヘキシルモノカーボネート(10時間半減期温度99℃)が、最終製品である発泡性スチレン系樹脂粒子の残存スチレン量を低減でき、更に安価であるため好ましい。 In particular, among the compounds of the general formula (1), t-butylperoxy-2-ethylhexyl monocarbonate (10 hour half-life temperature 99 ° C.) determines the residual styrene content of the expandable styrene resin particles as the final product. This is preferable because it can be reduced and is cheaper.
前記重合開始剤の使用量は、スチレン系樹脂種粒子とスチレン系単量体の総量100重量部に対して、0.040重量部以上0.180重量部以下である。重合開始剤の使用量が、当該範囲内であると、適度な分子量の樹脂が得られ、かつ、残存スチレン量を低減させることが出来る。0.040重量部未満では、残存スチレン量が多くなり、また残存スチレン量の可塑効果で耐熱性や強度が低下する傾向にある。0.180重量部を超える場合、残存スチレン系単量体量を低減させる効果は十分であるが、樹脂の分子量が低下する傾向があり、強度悪化や成形時の条件幅が狭くなるなどの問題が発生する。 The amount of the polymerization initiator used is 0.040 parts by weight or more and 0.180 parts by weight or less based on 100 parts by weight of the total amount of the styrene resin seed particles and the styrene monomer. When the amount of the polymerization initiator used is within this range, a resin having an appropriate molecular weight can be obtained, and the amount of residual styrene can be reduced. If the amount is less than 0.040 parts by weight, the amount of residual styrene tends to increase, and the heat resistance and strength tend to decrease due to the plastic effect of the amount of residual styrene. If it exceeds 0.180 parts by weight, the effect of reducing the amount of residual styrene monomer is sufficient, but the molecular weight of the resin tends to decrease, causing problems such as strength deterioration and narrowing of the condition range at the time of molding. Occurs.
前記一般式(1)については10時間半減期温度が96℃以上110℃以下である事が好ましい。この範囲であれば重合中の開裂量を極力抑制し、115〜130℃で加熱処理する熱処理あるいは発泡剤含浸工程中に効率よく残存スチレン量を減少させる事ができる。10時間半減期温度が96℃未満の場合、重合中の開裂量が増加し、樹脂の分子量を低下させるため好ましくない。この問題の解決方法として、重合温度を下げることも可能であるが、その場合重合時間が延びるため、工業生産上好ましくない。また、逆に10時間半減期温度が110℃を超える場合、熱処理、あるいは発泡剤含浸中に開裂する開始剤の量が不足し、十分に残存スチレン量を減少させることができない。 In the general formula (1), the 10-hour half-life temperature is preferably 96 ° C. or higher and 110 ° C. or lower. If it is this range, the amount of cleavage during superposition | polymerization can be suppressed as much as possible, and the amount of residual styrene can be reduced efficiently during the heat treatment which heat-processes at 115-130 degreeC, or a foaming agent impregnation process. A 10-hour half-life temperature of less than 96 ° C. is not preferable because the amount of cleavage during polymerization increases and the molecular weight of the resin decreases. As a solution to this problem, it is possible to lower the polymerization temperature. However, in this case, the polymerization time is extended, which is not preferable for industrial production. Conversely, when the 10-hour half-life temperature exceeds 110 ° C., the amount of initiator that cleaves during heat treatment or foaming agent impregnation is insufficient, and the amount of residual styrene cannot be reduced sufficiently.
また、一般式(1)の化合物を使用する場合は、ジビニルベンゼンを添加後に115℃以上130℃以下で加熱処理を実施することが好ましい。 Moreover, when using the compound of General formula (1), it is preferable to heat-process at 115 degreeC or more and 130 degrees C or less after adding divinylbenzene.
熱処理や発泡剤含浸工程中の加熱温度は115℃以上130℃以下の場合、特に、前記一般式(1)の10時間半減期温度が96℃以上110℃以下である化合物を使用する為、効率よく、スチレン系単量体を低減できる。しかし、115℃未満の場合、一般式(1)の化合物のラジカル発生が少なくなり、生産性が低下する。130℃を超えると、重合機の内圧が高くなり、重装備の耐圧を有する重合機が必要となる。更に、分子量の低下量が大きくなり、その結果、強度悪化や成形時の条件幅が狭くなるなどの問題が発生する。 When the heating temperature during the heat treatment and the blowing agent impregnation step is 115 ° C. or higher and 130 ° C. or lower, in particular, a compound having a 10-hour half-life temperature of 96 ° C. or higher and 110 ° C. or lower is used. Well, styrene monomer can be reduced. However, when the temperature is lower than 115 ° C., radical generation of the compound of the general formula (1) is reduced and productivity is lowered. When the temperature exceeds 130 ° C., the internal pressure of the polymerization apparatus becomes high, and a polymerization apparatus having a pressure resistance of heavy equipment is required. Furthermore, the amount of decrease in molecular weight increases, resulting in problems such as deterioration in strength and narrowing of the condition range during molding.
また、加熱時間は2〜7時間が好ましい。この範囲であれば、効率よく、スチレン系単量体を低減できる。しかし、加熱時間が2時間未満の場合、一般式(1)の化合物のラジカル発生が少なくなり、残存スチレン量が高くなる傾向にある。加熱時間が7時間を超える場合は、分子量の低下量が大きくなり、その結果、強度悪化や成形時の条件幅が狭くなるなどの問題が発生する。 The heating time is preferably 2 to 7 hours. If it is this range, a styrene-type monomer can be reduced efficiently. However, when the heating time is less than 2 hours, radical generation of the compound of the general formula (1) decreases and the amount of residual styrene tends to increase. When the heating time exceeds 7 hours, the amount of decrease in the molecular weight increases, resulting in problems such as deterioration in strength and narrowing of the condition range during molding.
残存スチレンを低下させるための一般式(1)の化合物の追加方法は、種樹脂が水中に分散した状態なら、重合開始前に追加しても良いし、重合後半に追加しても良い。例えば、重合工程への昇温前に追加する場合、又は重合時間が6時間で終了する処方において重合5時間目に追加する場合においても十分に残存スチレン量が十分に低下する。但し、一般式(1)の化合物を追加する際には水中に燐酸カルシウムなどのような無機物系の分散剤を存在させる必要がある。無機物系分散剤がないと、重合開始剤が媒体となり、種樹脂同士が凝集する。又は、一般式(1)の化合物の分散が悪化し、粒子間での一般式(1)の化合物の含有バラツキが大きくなる。この場合、残存スチレン量が多くなる傾向にあり、好ましくない。 The method for adding the compound of the general formula (1) for reducing the residual styrene may be added before the start of polymerization or may be added in the latter half of the polymerization as long as the seed resin is dispersed in water. For example, when it is added before the temperature rise to the polymerization step, or when it is added at the 5th polymerization time in a prescription in which the polymerization time is 6 hours, the residual styrene amount is sufficiently reduced. However, when adding the compound of the general formula (1), an inorganic dispersant such as calcium phosphate needs to be present in water. Without the inorganic dispersant, the polymerization initiator becomes a medium, and the seed resins agglomerate. Or dispersion | distribution of the compound of General formula (1) deteriorates, and the content variation of the compound of General formula (1) between particle | grains becomes large. In this case, the amount of residual styrene tends to increase, which is not preferable.
得られた本発明の発泡性スチレン系樹脂粒子は、残存スチレン系単量体量が300ppm以下であり、好ましくは250pm以下である。下限は、実用的には0ppmになり難いので敢えて表示するなら1ppm以上である。 The obtained expandable styrene resin particles of the present invention have a residual styrene monomer content of 300 ppm or less, preferably 250 pm or less. The lower limit is practically less than 0 ppm, so it is 1 ppm or more if dare to display.
一般式(1)の化合物は115〜130℃の加熱中に多くラジカルを発生し、そのラジカル種は残存スチレン低減のほかに、ポリマーを切断し分子量の低下を起こす。そのため、熱処理と発泡剤含浸工程で樹脂粒子全体のZ平均分子量の低下量は5〜30の間で制御する必要がある。この低下量にするためには、前記記載の一般式(1)の追加量は、スチレン系樹脂種粒子とスチレン系単量体の総量100重量部に対して、0.040重量部以上0.180重量部以下である。分子量の低下量がMzで5未満の場合は、発泡性が低くなるため、成形時の蒸気温度が低いと、表面伸びと融着が悪化傾向にある。分子量の低下量がMzで30を超える場合は強度が低下する傾向にある。 The compound of the general formula (1) generates many radicals during heating at 115 to 130 ° C., and the radical species cuts the polymer and lowers the molecular weight in addition to reducing the residual styrene. Therefore, it is necessary to control the amount of decrease in the Z average molecular weight of the entire resin particles between 5 and 30 in the heat treatment and the blowing agent impregnation step. In order to achieve this reduced amount, the additional amount of the general formula (1) described above is 0.040 parts by weight or more and 0.000 part by weight with respect to 100 parts by weight of the total amount of the styrene resin seed particles and the styrene monomer. 180 parts by weight or less. When the molecular weight decrease is less than 5 in Mz, the foaming property is lowered, and therefore, when the steam temperature at the time of molding is low, surface elongation and fusion tend to be deteriorated. When the amount of decrease in molecular weight exceeds 30 in Mz, the strength tends to decrease.
本発明の発泡性スチレン系樹脂粒子全体のZ平均分子量(Mz2)は70万〜115万である。70万未満は、強度が低下する傾向にある。また、成形時の蒸気圧が高くなると表面の樹脂が溶融を起こしやすくなり、表面外観を損なう傾向にある。115万を超える場合は、発泡性が低くなるため、成形時の蒸気温度が低いと、表面伸びと融着が悪化し、その結果十分な強度が得られない。 The Z-average molecular weight (Mz2) of the entire expandable styrene resin particles of the present invention is 700,000 to 1,150,000. If it is less than 700,000, the strength tends to decrease. Moreover, when the vapor pressure at the time of molding becomes high, the resin on the surface tends to be melted and the surface appearance tends to be impaired. If it exceeds 1.15 million, the foaming property will be low, so if the steam temperature at the time of molding is low, surface elongation and fusion will deteriorate, and as a result, sufficient strength will not be obtained.
発泡性スチレン系樹脂粒子の表層部のZ平均分子量(Mz1)は60万〜100万である。60万未満では強度が低下する傾向にある。また、成形時の蒸気圧が高くなると表面の樹脂が溶融を起こしやすくなり、表面外観を損なう傾向にある。100万を超える場合は、発泡性が低くなるため、成形時の蒸気温度が低いと、表面伸びと融着が悪化し、その結果十分な強度も得られない。 The Z average molecular weight (Mz1) of the surface layer portion of the expandable styrene resin particles is 600,000 to 1,000,000. If it is less than 600,000, the strength tends to decrease. Moreover, when the vapor pressure at the time of molding becomes high, the resin on the surface tends to be melted and the surface appearance tends to be impaired. If it exceeds 1,000,000, the foaming property will be low, so if the steam temperature at the time of molding is low, surface elongation and fusion deteriorate, and as a result, sufficient strength cannot be obtained.
尚、発泡性スチレン系樹脂粒子の表層部の分子量を粒子自体から測定することは難しいため、本明細書では、樹脂粒子を予備発泡させて、型内成形した発泡成形体(発泡倍率10倍)の表層部(0.3mm)を発泡性ポリスチレン系樹脂粒子の表層部の分子量とする。 In addition, since it is difficult to measure the molecular weight of the surface layer portion of the expandable styrene resin particles from the particles themselves, in the present specification, a foam molded product obtained by pre-foaming the resin particles and molding in-mold (expanding ratio 10 times) The surface layer portion (0.3 mm) of is the molecular weight of the surface layer portion of the expandable polystyrene resin particles.
樹脂粒子表層のZ平均分子量(Mz1)と全体のZ平均分子量(Mz2)の比Mz1/Mz2は、0.85〜0.95である。0.85未満では、成形する際に表面の樹脂が溶融を起こしやすくなり、表面外観を損なう傾向にある。0.95を超える場合は、発泡性が低くなるため、成形時の蒸気温度が低いと、表面伸びと融着が悪化し、その結果十分な強度も得られない。 The ratio Mz1 / Mz2 between the Z average molecular weight (Mz1) of the resin particle surface layer and the entire Z average molecular weight (Mz2) is 0.85 to 0.95. If it is less than 0.85, the resin on the surface tends to melt during molding, and the surface appearance tends to be impaired. If it exceeds 0.95, the foaming property will be low, so if the steam temperature at the time of molding is low, surface elongation and fusion will deteriorate, and as a result, sufficient strength will not be obtained.
本発明の樹脂粒子のキシレン不溶分は架橋剤添加により調整される。架橋剤の種類としては、ジビニルベンゼン、アルキレングリコールジメタクリレート又はポリエチレングリコールジメタクリレートなどが挙げられる。この中でも、ジビニルベンゼンは安価であり、添加により強度を上がるため好ましい。架橋剤の追加方法としては、スチレン系単量体の全量の90%〜100%が添加された時点で、ジビニルベンゼンを添加することが好ましい。前記架橋剤が添加されるときにスチレン系単量体の全量の90%未満の場合、得られる発泡性スチレン系樹脂粒子において架橋剤によりポリマー分子が架橋される層が厚くなりすぎる傾向がある。この場合に、発泡力が低下し、低圧での成形性が悪化傾向にある。 The xylene-insoluble matter in the resin particles of the present invention is adjusted by adding a crosslinking agent. Examples of the crosslinking agent include divinylbenzene, alkylene glycol dimethacrylate, polyethylene glycol dimethacrylate, and the like. Among these, divinylbenzene is preferable because it is inexpensive and increases the strength when added. As a method for adding the crosslinking agent, it is preferable to add divinylbenzene when 90% to 100% of the total amount of the styrenic monomer is added. When the crosslinking agent is added and the amount is less than 90% of the total amount of the styrenic monomer, the layer of the expandable styrene resin particles obtained by crosslinking the polymer molecules by the crosslinking agent tends to be too thick. In this case, the foaming power is reduced, and the moldability at low pressure tends to deteriorate.
上記方法で得られた発泡性スチレン系樹脂粒子のキシレン不溶分1.5%未満である。1.5%未満の場合、低圧の成形条件においても良好な融着性、表面性、強度を維持できる。特開2007−31641号公報に記載のように溶剤(キシレン)の不溶分1.5%以上の場合は、発泡性が低くなるため、低圧での成形性が悪化しやすくなる(成形時の蒸気温度が低いと、融着が悪化し、その結果十分な強度が得られない)。前記キシレン不要分を得るためには、架橋剤の添加量は0.010〜0.020重量部である。より好ましくは0.012〜0.016重量部である。0.010重量部未満の場合、良好な強度が得られない。0.020重量部を超える場合は、不溶分が1.5%以上となり、低圧での成形性が悪化しやすくなる。 The expandable styrene resin particles obtained by the above method have a xylene insoluble content of less than 1.5%. If it is less than 1.5%, good fusing property, surface property and strength can be maintained even under low pressure molding conditions. As described in JP-A-2007-31641, when the insoluble content of the solvent (xylene) is 1.5% or more, the foamability becomes low, and the moldability at low pressure is likely to deteriorate (the vapor during molding). If the temperature is low, the fusion deteriorates, and as a result, sufficient strength cannot be obtained. In order to obtain the xylene-free component, the amount of crosslinking agent added is 0.010 to 0.020 parts by weight. More preferably, it is 0.012 to 0.016 part by weight. When the amount is less than 0.010 parts by weight, good strength cannot be obtained. When it exceeds 0.020 weight part, an insoluble content will be 1.5% or more, and the moldability in low pressure will deteriorate easily.
本発明において使用する昜揮発性発泡剤としては、プロパン、イソブタン、ノルマルブタン、イソペンタン、ノルマルペンタン、ネオペンタンなど炭素数3以上5以下の炭化水素等の脂肪族炭化水素類、およびジフルオロエタン、テトラフルオロエタンなどのオゾン破壊係数がゼロであるフッ化炭化水素類などの揮発性発泡剤が挙げられる。これらの発泡剤を併用することもできる。これらの昜揮発性発泡剤がイソブタン、ノルマルブタン、イソペンタン、ノルマルペンタン、ネオペンタンからなる群の少なくとも1種であることがスチレン系樹脂粒子内での保持性を高くし、長い間、高い発泡力を維持できる点で好ましい。
また、これら発泡剤のうちでも、ブタンが、安価で発泡力が良好である点から、好ましい。ブタンの比率はノルマルブタン:イソブタンが80:20〜40:60が好ましい。ノルマルブタン比率が高くなるほど平気気泡径が大きくなり、融着しにくい傾向となる。その結果、十分な強度が得づらくなる。ノルマルブタン比率が高くなるほど平均気泡径が小さくなり、成形する際に表面溶融を起こしやすくなり、表面外観を損なう傾向にある。また融着が悪化傾向にあり、その結果、強度も低下傾向にある。
As volatile blowing agents used in the present invention, aliphatic hydrocarbons such as hydrocarbons having 3 to 5 carbon atoms such as propane, isobutane, normal butane, isopentane, normal pentane and neopentane, and difluoroethane and tetrafluoroethane And volatile foaming agents such as fluorinated hydrocarbons having zero ozone depletion coefficient. These foaming agents can be used in combination. These volatile blowing agents are at least one member of the group consisting of isobutane, normal butane, isopentane, normal pentane, and neopentane, which increases the retention in the styrenic resin particles and provides a high foaming power for a long time. It is preferable in that it can be maintained.
Of these foaming agents, butane is preferred because it is inexpensive and has good foaming power. The ratio of butane is preferably normal butane: isobutane of 80:20 to 40:60. The higher the normal butane ratio, the larger the air bubble diameter, and the more difficult it is to fuse. As a result, it is difficult to obtain sufficient strength. The higher the normal butane ratio is, the smaller the average bubble diameter becomes, and surface melting tends to occur during molding, and the surface appearance tends to be impaired. Further, the fusion tends to deteriorate, and as a result, the strength also tends to decrease.
昜揮発性発泡剤の使用量としてはスチレン系樹脂粒子100重量部に対して、好ましくは2重量部以上7量部以下、更に好ましくは3重量部以上6重量部以下である。2重量部より少ないと、予備発泡時間が長くなるとともに成形時の融着率が低下する傾向を有するため好ましくなく、7重量部を越えると、0.05〜0.2g/cm3という比較的低倍率に発泡する際に、粒子間の倍率ばらつきが大きくなる傾向を有するため好ましくない。 The amount of the volatile foaming agent used is preferably 2 to 7 parts by weight, more preferably 3 to 6 parts by weight, based on 100 parts by weight of the styrene resin particles. If it is less than 2 parts by weight, the pre-foaming time becomes longer and the fusion rate at the time of molding tends to decrease, which is not preferable. If it exceeds 7 parts by weight, it is relatively 0.05 to 0.2 g / cm 3. When foaming at a low magnification, there is a tendency for the variation in magnification between particles to increase, such being undesirable.
本発明において使用する添加剤としては、目的に応じて可塑剤、気泡調整剤、難燃剤、難燃助剤等が使用できる。可塑剤としては、例えば、ステアリン酸トリグリセライド、パルミチン酸トリグリセライド、ラウリン酸トリグリセライド、ステアリン酸ジグリセライド、ステアリン酸モノグリセライド等の脂肪酸グリセライド、ヤシ油、パーム油、パーム核油等の植物油、ジオクチルアジペート、ジブチルセバケート等の脂肪族エステル、流動パラフィン、シクロヘキサン等の有機炭化水素等があげられ、これらは併用しても何ら差し支えない。気泡調整剤としては、例えば、メチレンビスステアリン酸アマイド、エチレンビスステアリン酸アマイド等の脂肪族ビスアマイド、ポリエチレンワックス等が挙げられる。難燃剤としては、臭素化スチレン、臭素化ブタジエン・ビニル芳香族共重合体、臭素化ノボラック樹脂アリルエーテル、臭素化ポリ(1,3?シクロアルカジエン)及び臭素化ポリ(4?ビニルフェノールアリルエーテル)などの臭素化ポリマーやポリグリセリンジブロモプロピルエーテル、テトラブロモビスフェノールA、テトラブロモビスフェノール−A−ビス(2,3−ジブロモ−2−メチルプロピルエーテル)等々の低分子化合物が上げられる。難燃助剤としては、例えば、クメンパーオキサイド、ジクミルパーオキサイド、t−ブチルハイドロパーオキサイド、2,3−ジメチルー2,3−ジフェニルブタン等の高温分解型の有機物があげられる。 As the additive used in the present invention, a plasticizer, a bubble adjusting agent, a flame retardant, a flame retardant aid and the like can be used depending on the purpose. Examples of the plasticizer include stearic acid triglyceride, palmitic acid triglyceride, lauric acid triglyceride, stearic acid diglyceride, stearic acid monoglyceride and other fatty acid glycerides, palm oil, palm oil, palm kernel oil and other vegetable oils, dioctyl adipate, dibutyl sebacate And the like, and aliphatic hydrocarbons such as liquid paraffin, and organic hydrocarbons such as cyclohexane. These may be used in combination. Examples of the air conditioner include aliphatic bisamides such as methylene bis stearic acid amide and ethylene bis stearic acid amide, polyethylene wax, and the like. Flame retardants include brominated styrene, brominated butadiene-vinyl aromatic copolymer, brominated novolak resin allyl ether, brominated poly (1,3-cycloalkadiene) and brominated poly (4? Vinylphenol allyl ether). And low molecular weight compounds such as polyglycerin dibromopropyl ether, tetrabromobisphenol A, tetrabromobisphenol-A-bis (2,3-dibromo-2-methylpropyl ether), and the like. Examples of the flame retardant aid include high-temperature decomposition type organic substances such as cumene peroxide, dicumyl peroxide, t-butyl hydroperoxide, and 2,3-dimethyl-2,3-diphenylbutane.
本発明においては、成形時に融着促進効果のあるステアリン酸アミド等の高級脂肪酸アミド、硬化ひまし油、硬化大豆油等の高級脂肪酸グリセライド、予備発泡時の集塊化防止効果のあるステアリン酸亜鉛等の脂肪酸金属塩を使用することができる。これらの添加剤は、発泡性スチレン系樹脂粒子とともにヘンシェルミキサー、スーパーミキサー、ユニバーサルミキサーなどの混合機内で一定時間混合することにより、発泡性スチレン系樹脂粒子表面に被覆または付着させることができる。さらに、帯電防止剤として一般に使用されるグリセリン、ポリエチレングリコール、ポリプロピレングリコール、脂肪酸モノグリセライド、アルキルスルフォン酸ナトリウム、などの1種または2種以上の併用も可能である。 In the present invention, higher fatty acid amides such as stearic acid amide having an effect of promoting fusion at the time of molding, higher fatty acid glycerides such as hardened castor oil and hardened soybean oil, zinc stearate having an effect of preventing agglomeration during pre-foaming, etc. Fatty acid metal salts can be used. These additives can be coated or adhered to the surface of the expandable styrene resin particles by mixing with the expandable styrene resin particles for a predetermined time in a mixer such as a Henschel mixer, a super mixer, or a universal mixer. Furthermore, one type or two or more types of glycerin, polyethylene glycol, polypropylene glycol, fatty acid monoglyceride, sodium alkyl sulfonate, etc. generally used as an antistatic agent can be used.
本発明の発泡性スチレン系樹脂粒子は、公知の方法で発泡させて、スチレン系発泡成形体を得ることが出来る。例えば、一旦予備発泡粒子を作製し、その後型内に該予備発泡粒子を充填し成形する方法(型内成形)や、発泡性スチレン系樹脂粒子を直接型に充填し発泡成型する方法等が挙げられる。本発明のスチレン系発泡成形体は型内成形法にて作製している。つまり、発泡性スチレン系樹脂粒子を回転攪拌式予備発泡装置で、水蒸気を用いて80〜110℃程度で加熱することにより、嵩倍率がの予備発泡粒を得、得られた予備発泡粒子を所望の形状の金型内に充填し、従来より低い水蒸気圧0.05〜0.11MPa程度(従来の水蒸気圧力0.07〜0.1MPa)で加熱することによりスチレン系発泡成形体とすることができる。尚、スチレン系発泡成形体の平均気泡径は40〜70μが好ましい。この範囲であれば、融着性と表面美麗性が良好な発泡成形体が得られる。 The expandable styrene resin particles of the present invention can be foamed by a known method to obtain a styrene foam molded article. For example, a method of once preparing pre-expanded particles and then filling and molding the pre-expanded particles in a mold (in-mold molding), a method of directly filling expandable styrenic resin particles into a mold and performing foam molding, etc. It is done. The styrenic foam molded article of the present invention is produced by an in-mold molding method. That is, by heating the expandable styrene-based resin particles at about 80 to 110 ° C. with water vapor using a rotary stirring pre-foaming device, pre-foamed particles having a bulk ratio are obtained, and the obtained pre-foamed particles are desired. The styrenic foamed molded article can be obtained by filling in a mold having the shape and heating at a lower water vapor pressure of 0.05 to 0.11 MPa (conventional water vapor pressure 0.07 to 0.1 MPa). it can. The average cell diameter of the styrene foam molded article is preferably 40 to 70 μm. If it is this range, the foaming molding with favorable melt | fusion property and surface beauty will be obtained.
このようにして得られた本発明のスチレン系発泡成形体は残存スチレン量も少なく、かつ良好な強度を有するものとなる。 The styrene foam molded article of the present invention thus obtained has a small amount of residual styrene and has good strength.
本発明における発泡性スチレン系樹脂粒子は、発泡成形体とした時の密度が0.05〜0.2g/cm3である事が好ましい。密度が0.2g/cm3を超える場合は、単位体積当りの使用樹脂量が多くなりコストアップとなるだけでなく、粒子同士の融着率が低下する傾向を有するため好ましくなく、0.05g/cm3未満圧縮強度が低下するため好ましくない。 The expandable styrene resin particles in the present invention preferably have a density of 0.05 to 0.2 g / cm 3 when formed into a foamed molded product. When the density exceeds 0.2 g / cm 3 , not only the amount of resin used per unit volume is increased and the cost is increased, but also the fusion rate between particles tends to decrease, which is not preferable. Less than / cm 3 This is not preferable because the compressive strength is lowered.
以下に実施例、及び比較例を挙げるが、本発明はこれによって限定されるものではない。なお、実施例、及び比較例中の分子量、キシレン不溶分、平均気泡径、成形(融着性、表面性)及び強度評価については以下の方法で測定した。なお、「部」「%」は特に断りのない限り重量基準である。 Examples and Comparative Examples are given below, but the present invention is not limited thereby. The molecular weight, xylene insoluble content, average cell diameter, molding (fusibility, surface property) and strength evaluation in the examples and comparative examples were measured by the following methods. “Parts” and “%” are based on weight unless otherwise specified.
(分子量測定法)
樹脂粒子表層部のMzは、発泡成形体(発泡倍率10倍)の表層部として算出する。即ち、発泡成形体は、樹脂粒子を予備発泡させて、型内成形したものであるから、樹脂粒子表層部は発泡成形体表層部に相当し、本発明では樹脂粒子表層部の平均分子量を発泡成形体表層部の平均分子量とする。発泡成形体を35℃で24時間乾燥後、バーティカルスライサーを用いて、発泡成形体の表層を0.3mmカットし、表層部用のサンプルとする。
(Molecular weight measurement method)
Mz of the surface layer portion of the resin particle is calculated as the surface layer portion of the foamed molded product (foaming ratio 10 times). That is, since the foam molded body is obtained by pre-foaming resin particles and molding in-mold, the resin particle surface layer portion corresponds to the foam molded body surface layer portion. In the present invention, the average molecular weight of the resin particle surface layer portion is expanded. The average molecular weight of the surface layer of the molded product is taken. After drying the foamed molded product at 35 ° C. for 24 hours, the surface layer of the foamed molded product is cut by 0.3 mm using a vertical slicer to obtain a sample for the surface layer part.
尚、樹脂粒子全体のMzは、発泡成形体の厚み方向にカットしたものを、全体用のサンプルとする。 In addition, Mz of the whole resin particle makes the thing cut in the thickness direction of the foaming molding into the sample for whole.
得られたサンプル0.02gをテトラヒドロフラン20mlに溶解し、GPC(東ソー(株)製HLC−8020、カラム:TSKgel Super HZM−H、カラム温度:40℃、流速:0.35ml/1min.)にて分子量を測定した。 0.02 g of the obtained sample was dissolved in 20 ml of tetrahydrofuran, and GPC (HLC-8020 manufactured by Tosoh Corporation, column: TSKgel Super HZM-H, column temperature: 40 ° C., flow rate: 0.35 ml / 1 min.). The molecular weight was measured.
(キシレンに対する不溶分測定)
本発明の発泡性スチレン系樹脂粒子のキシレン不溶分の測定は、発泡性スチレン系樹脂粒子1gにつき80gのキシレンを使用し、沸騰キシレンによる抽出を行う。沸騰開始から2時間経過後、200メッシュの金網で濾過を行い、濾液を取り除き、濾物を再び沸騰キシレンによる抽出を沸騰開始から2時間行い、再び200メッシュの金網で濾過を行い、濾液を取り除き、残る濾物を再び沸騰キシレンによる抽出を沸騰開始から1時間行い、200メッシュの金網で濾過を行い、濾物を沸騰キシレンに抽出されないものを不溶分とし、得られた不溶分を150℃の乾燥機で1時間乾燥させ、計量する(W2とする)。もとの発泡性スチレン系樹脂粒子の重量W1に対する割合をキシレン不要分とする。
(Measurement of insoluble matter in xylene)
The xylene-insoluble matter in the expandable styrene resin particles of the present invention is measured by using 80 g of xylene per 1 g of expandable styrene resin particles and extracting with boiling xylene. After 2 hours from the start of boiling, filter through a 200 mesh wire mesh, remove the filtrate, extract the filtrate again with boiling xylene for 2 hours from the start of boiling, filter again through a 200 mesh wire mesh, and remove the filtrate. The remaining filtrate is again extracted with boiling xylene for 1 hour from the start of boiling, filtered through a 200 mesh wire mesh, the filtrate not extracted into boiling xylene is regarded as insoluble matter, and the obtained insoluble matter is heated to 150 ° C. Dry with a dryer for 1 hour and weigh (assum W2). The ratio of the original expandable styrene resin particles to the weight W1 is defined as xylene unnecessary content.
キシレン不溶分(%)=100×W2/W1。 Xylene insoluble matter (%) = 100 × W2 / W1.
(残存スチレン測定法)
発泡性スチレン系樹脂粒子を塩化メチレン(内部標準シクロペンタノール)に溶解し、(株)島津製作所製ガスクロマトグラフィーGC−2014(キャピラリーカラム:GLサイエンス製Rtx−1、カラム温度条件:50→80℃(3℃/min)後、80→180℃昇温(10℃/min)、キャリアガス:ヘリウム)を用いて、発泡性スチレン系樹脂粒子中に含まれる残存スチレン量(ppm)を定量した。
(Residual styrene measurement method)
Expandable styrenic resin particles are dissolved in methylene chloride (internal standard cyclopentanol), and gas chromatography GC-2014 (capillary column: Rtx-1, manufactured by GL Sciences, Inc.), column temperature condition: 50 → 80 ° C. After (3 ° C./min), the amount of residual styrene (ppm) contained in the expandable styrene resin particles was quantified using 80 → 180 ° C. temperature rise (10 ° C./min), carrier gas: helium.
(融着性評価)
低圧0.05MPaで成形して得られた発泡体成形体(発泡倍率10倍)を破断し、破断面を観察して、粒子界面ではなく、粒子が破断している割合を求めて、以下の基準にて、融着性を判定した。
◎:粒子破断の割合が90%以上。
○:粒子破断の割合が80%以上、90%未満。
△:粒子破断の割合が70%以上、80%未満。
×:粒子破断の割合が70%未満。
(Fusability evaluation)
The foam molded body (foaming ratio 10 times) obtained by molding at a low pressure of 0.05 MPa was broken, the fracture surface was observed, and the ratio of the broken particles rather than the particle interface was determined. The fusing property was determined based on the standard.
A: The ratio of particle breakage is 90% or more.
○: The ratio of particle breakage is 80% or more and less than 90%.
(Triangle | delta): The ratio of particle | grain fracture | rupture is 70% or more and less than 80%.
X: The ratio of particle breakage is less than 70%.
(表面性評価)
低圧0.05MPaで成形して得られた発泡体成形体(発泡倍率10倍)の表面状態を目視観察し、以下の基準にて表面性を評価した。
◎:表面の溶融、粒間が無く、非常に美麗。
○:表面の溶融、粒間が少なく、美麗。
△:表面の溶融、粒間があり、外観やや不良。
×:表面の溶融、粒間が多く、外観不良。
(Surface property evaluation)
The surface state of the foam molded body (foaming ratio 10 times) obtained by molding at a low pressure of 0.05 MPa was visually observed, and the surface properties were evaluated according to the following criteria.
A: There is no melting of the surface, no intergranularity, and it is very beautiful.
○: Melting of the surface, little intergranularity, and beautiful.
Δ: Surface melted, intergranular, appearance somewhat poor.
X: Surface melting, intergranularity, and poor appearance.
(平均気泡径の測定)
発泡成形体の平均気泡径は、発泡成形体(発泡倍率10倍)の切断面をマイクロスコープで観察し、切断面の一直線上(60mm)にかかる気泡数から平均気泡径を測定した。また、この測定で得られた平均気泡径を平均弦長という。
(Measurement of average bubble diameter)
The average cell diameter of the foamed molded product was determined by observing the cut surface of the foamed molded product (foaming ratio 10 times) with a microscope and measuring the average cell diameter from the number of cells applied on a straight line (60 mm) of the cut surface. Moreover, the average bubble diameter obtained by this measurement is called average chord length.
平均気泡径(t)=線長/(気泡数×写真の倍率)。 Average bubble diameter (t) = line length / (number of bubbles × photo magnification).
(強度測定:曲げ強度)
低圧0.05MPaで成形して得られた発泡成形体(発泡倍率10倍)を300×750×20(t)mmに切り出したサンプル片を、恒温恒湿室に24時間保管した後、曲げ強度を測定した。。尚、成形時の水蒸気圧力:0.05MPaで得られた発泡成形体で評価をした。
◎:曲げ強度が3.0MPa以上
○:曲げ強度が2.5MPa以上3.0MPa未満
△:曲げ強度が2.0MPa以上2.5MPa未満
×:曲げ強度が2.0MPa未満。
(Strength measurement: bending strength)
A sample piece obtained by molding a foamed molded article (foaming ratio 10 times) obtained by molding at a low pressure of 0.05 MPa to 300 × 750 × 20 (t) mm is stored in a constant temperature and humidity chamber for 24 hours, and then bending strength is obtained. Was measured. . In addition, it evaluated by the foaming molding obtained by the water vapor pressure at the time of shaping | molding: 0.05MPa.
A: Bending strength is 3.0 MPa or more. B: Bending strength is 2.5 MPa or more and less than 3.0 MPa. Δ: Bending strength is 2.0 MPa or more and less than 2.5 MPa. X: Bending strength is less than 2.0 MPa.
(実施例1)
<発泡性スチレン系樹脂粒子の製造>
撹拌機付属の6Lのオートクレーブに、純水重量85重量部、第3リン酸カルシウム0.57重量部、α―オレフィンスルフォン酸ソーダ0.00476重量部、塩化ナトリウム0.1重量部、粒子径が0.2〜0.3mm、残存スチレン量70000〜90000ppm、重量平均分子量18万のスチレン系樹脂種粒子15重量部を仕込んだ後、攪拌を開始した。その後、開始剤として、t−ブチルパーオキシー2−エチルヘキシルモノカーボネート0.04重量部を仕込んだ。続いて、92℃まで昇温させた後、ベンゾイルパーオキサイド30%溶液0.257重量部を4時間50分、フェニルアセチレン濃度80ppmのスチレン単量体85重量部は5時間45分かけて反応器中に仕込みながら重合した。更にスチレン添加終了間際にジビニルベンゼン0.012重量部仕込んだ。その後、30分間92℃を保持した後、直ちに120℃に昇温して1時間保持した。95℃に冷却後、系内にノルマルブタン70%濃度(イソブタン30%濃度)5.7重量部を仕込み更に3時間120℃で保持した後、冷却した。懸濁液を取り出し脱水・乾燥・分級して、粒子径が400〜600μm後、室温まで冷却して、オートクレーブから重合スラリーを取り出した。取り出した重合スラリーを洗浄、脱水・乾燥することにより、残存スチレン量300ppmの発泡性スチレン系樹脂粒子を得た。
Example 1
<Manufacture of expandable styrene resin particles>
In a 6 L autoclave attached to a stirrer, 85 wt. Parts of pure water, 0.57 wt. Parts of tricalcium phosphate, 0.00476 wt. Parts of α-olefin sodium sulfonate, 0.1 wt. Stirring was started after charging 15 parts by weight of styrene resin seed particles having a weight of 2 to 0.3 mm, a residual styrene amount of 70000 to 90000 ppm, and a weight average molecular weight of 180,000. Thereafter, 0.04 parts by weight of t-butylperoxy-2-ethylhexyl monocarbonate was charged as an initiator. Subsequently, after the temperature was raised to 92 ° C., 0.257 parts by weight of a 30% benzoyl peroxide solution was added for 4 hours and 50 minutes, and 85 parts by weight of a styrene monomer having a phenylacetylene concentration of 80 ppm was added to the reactor over 5 hours and 45 minutes. Polymerized while charging inside. Further, 0.012 part by weight of divinylbenzene was charged just before the addition of styrene. Thereafter, after maintaining at 92 ° C. for 30 minutes, the temperature was immediately raised to 120 ° C. and held for 1 hour. After cooling to 95 ° C., 5.7 parts by weight of normal butane 70% concentration (isobutane 30% concentration) was charged into the system, and further maintained at 120 ° C. for 3 hours, and then cooled. The suspension was taken out, dehydrated, dried, and classified. After the particle size was 400 to 600 μm, the suspension was cooled to room temperature, and the polymerization slurry was taken out from the autoclave. The taken-out polymerization slurry was washed, dehydrated and dried to obtain expandable styrene resin particles having a residual styrene content of 300 ppm.
<予備発泡粒子の製造>
これを回転攪拌式予備発泡装置に投入して、約95℃の水蒸気中で嵩密度が100g/L(発泡倍率:10倍)になるまで約2分間発泡して予備発泡粒子を得た。
<Production of pre-expanded particles>
This was put into a rotary stirring type pre-foaming apparatus and foamed for about 2 minutes in water vapor at about 95 ° C. until the bulk density reached 100 g / L (foaming ratio: 10 times) to obtain pre-foamed particles.
<発泡成形体の製造>
得られた予備発泡粒子を室温で約24時間養生乾燥した後、縦450mm×横300mm×厚さ20mmの平板状金型内に充填し、0.05MPaの水蒸気で30秒加熱・冷却して取り出した成形体を30℃均熱乾燥機中で24時間養生した後、恒温恒湿室に更に24時間保管し、平板状発泡成形体を得た。評価結果を表1に示す。
<Manufacture of foam molding>
The pre-expanded particles obtained were cured and dried at room temperature for about 24 hours, then filled into a flat mold having a length of 450 mm × width of 300 mm × thickness of 20 mm, and taken out by heating and cooling with 0.05 MPa steam for 30 seconds. The molded body was cured in a 30 ° C. soaking dryer for 24 hours and then stored in a constant temperature and humidity room for another 24 hours to obtain a flat foam molded body. The evaluation results are shown in Table 1.
(実施例2)
<発泡性スチレン系樹脂粒子の製造>において、t−ブチルパーオキシー2−エチルヘキシルモノカーボネート0.08重量部に変更した以外は、実施例1と同様の操作により、残存スチレン量250ppmの発泡性スチレン系樹脂粒子、予備発泡粒子、型内発泡成形体を得た。評価結果を、表1に示す。
(Example 2)
In <Manufacture of expandable styrene-based resin particles>, expandable styrene having a residual styrene content of 250 ppm was obtained by the same operation as in Example 1 except that t-butylperoxy-2-ethylhexyl monocarbonate was changed to 0.08 parts by weight. System resin particles, pre-expanded particles, and in-mold expanded molded articles were obtained. The evaluation results are shown in Table 1.
(実施例3)
<発泡性スチレン系樹脂粒子の製造>において、t−ブチルパーオキシー2−エチルヘキシルモノカーボネート0.18重量部に変更した以外は、実施例1と同様の操作により、残存スチレン量70ppmの発泡性スチレン系樹脂粒子、予備発泡粒子、型内発泡成形体を得た。評価結果を、表1に示す。
(Example 3)
In <Manufacture of expandable styrene resin particles>, expandable styrene having a residual styrene content of 70 ppm was the same as in Example 1 except that the amount was changed to 0.18 parts by weight of t-butylperoxy-2-ethylhexyl monocarbonate. System resin particles, pre-expanded particles, and in-mold expanded molded articles were obtained. The evaluation results are shown in Table 1.
(実施例4)
<発泡性スチレン系樹脂粒子の製造>において、t−ブチルパーオキシー2−エチルヘキシルモノカーボネート0.08重量部、ジビニルベンゼン0.016重量部に変更した以外は、実施例1と同様の操作により、残存スチレン量260ppmの発泡性スチレン系樹脂粒子、予備発泡粒子、型内発泡成形体を得た。評価結果を、表1に示す。
Example 4
<Production of expandable styrenic resin particles> In the same operation as in Example 1, except that 0.08 parts by weight of t-butylperoxy-2-ethylhexyl monocarbonate and 0.016 parts by weight of divinylbenzene were used. Expandable styrene resin particles having a residual styrene content of 260 ppm, pre-expanded particles, and in-mold expanded molded articles were obtained. The evaluation results are shown in Table 1.
(実施例5)
<発泡性スチレン系樹脂粒子の製造>において、t−ブチルパーオキシー2−エチルヘキシルモノカーボネート0.08重量部、115℃の加熱を合計7時間に変更した以外は、実施例1と同様の操作により、残存スチレン量220ppmの発泡性スチレン系樹脂粒子、予備発泡粒子、型内発泡成形体を得た。評価結果を、表1に示す。
(Example 5)
<Production of expandable styrenic resin particles> In the same operation as in Example 1, except that 0.08 parts by weight of t-butylperoxy-2-ethylhexyl monocarbonate and heating at 115 ° C. were changed to 7 hours in total. Thus, expandable styrene resin particles having a residual styrene content of 220 ppm, pre-expanded particles, and in-mold expanded molded articles were obtained. The evaluation results are shown in Table 1.
(実施例6)
<発泡性スチレン系樹脂粒子の製造>において、t−ブチルパーオキシー2−エチルヘキシルモノカーボネート0.18重量部、125℃の加熱を合計2時間に変更した以外は、実施例1と同様の操作により、残存スチレン量140ppmの発泡性スチレン系樹脂粒子、予備発泡粒子、型内発泡成形体を得た。評価結果を、表1に示す。
(Example 6)
<Production of expandable styrenic resin particles> In the same operation as in Example 1, except that 0.18 parts by weight of t-butylperoxy-2-ethylhexyl monocarbonate and heating at 125 ° C. were changed to 2 hours in total. Thus, expandable styrene resin particles having a residual styrene content of 140 ppm, pre-expanded particles, and in-mold expanded molded articles were obtained. The evaluation results are shown in Table 1.
(実施例7)
<発泡性スチレン系樹脂粒子の製造>において、t−ブチルパーオキシー2−エチルヘキシルモノカーボネート0.18重量部、115℃の加熱を合計7時間に変更した以外は、実施例1と同様の操作により、残存スチレン量100ppmの発泡性スチレン系樹脂粒子、予備発泡粒子、型内発泡成形体を得た。評価結果を、表1に示す。
(Example 7)
<Production of expandable styrenic resin particles> In the same operation as in Example 1, except that 0.18 parts by weight of t-butylperoxy-2-ethylhexyl monocarbonate and heating at 115 ° C. were changed to 7 hours in total. Thus, expandable styrene resin particles having a residual styrene content of 100 ppm, pre-expanded particles, and in-mold expanded molded articles were obtained. The evaluation results are shown in Table 1.
(比較例1)
<発泡性スチレン系樹脂粒子の製造>において、t−ブチルパーオキシー2−エチルヘキシルモノカーボネート0.22重量部に変更した以外は、実施例1と同様の操作により、残存スチレン量50ppmの発泡性スチレン系樹脂粒子、予備発泡粒子、型内発泡成形体を得た。評価結果を、表1に示す。
(Comparative Example 1)
In <Manufacture of expandable styrene resin particles>, expandable styrene having a residual styrene content of 50 ppm was obtained by the same operation as in Example 1 except that t-butylperoxy-2-ethylhexyl monocarbonate was changed to 0.22 parts by weight. System resin particles, pre-expanded particles, and in-mold expanded molded articles were obtained. The evaluation results are shown in Table 1.
(比較例2)
<発泡性スチレン系樹脂粒子の製造>において、t−ブチルパーオキシー2−エチルヘキシルモノカーボネート0.18重量部、ジビニルベンゼン0.016部、110℃の加熱を合計7時間に変更した以外は、実施例1と同様の操作により、残存スチレン量890ppmの発泡性スチレン系樹脂粒子、予備発泡粒子、型内発泡成形体を得た。評価結果を、表1に示す。
(Comparative Example 2)
In <Manufacture of expandable styrenic resin particles>, except that t-butyl peroxy-2-ethylhexyl monocarbonate 0.18 parts by weight, divinylbenzene 0.016 parts, heating at 110 ° C. was changed to a total of 7 hours. By the same operation as in Example 1, expandable styrene resin particles having a residual styrene content of 890 ppm, pre-expanded particles, and in-mold expanded molded articles were obtained. The evaluation results are shown in Table 1.
(比較例3)
<発泡性スチレン系樹脂粒子の製造>において、t−ブチルパーオキシー2−エチルヘキシルモノカーボネート0.18重量部、120℃の加熱を合計8時間に変更した以外は、実施例1と同様の操作により、残存スチレン量10ppmの発泡性スチレン系樹脂粒子、予備発泡粒子、型内発泡成形体を得た。評価結果を、表1に示す。
(Comparative Example 3)
<Production of expandable styrenic resin particles> In the same operation as in Example 1, except that 0.18 parts by weight of t-butylperoxy-2-ethylhexyl monocarbonate and heating at 120 ° C. were changed to 8 hours in total. Thus, expandable styrene resin particles having a residual styrene content of 10 ppm, pre-expanded particles, and in-mold expanded molded articles were obtained. The evaluation results are shown in Table 1.
(比較例4)
<発泡性スチレン系樹脂粒子の製造>において、t−ブチルパーオキシー2−エチルヘキシルモノカーボネート0.08重量部、ジビニルベンゼン0.150重量部に変更した以外は、実施例1と同様の操作により、残存スチレン量200ppmの発泡性スチレン系樹脂粒子、予備発泡粒子、型内発泡成形体を得た。評価結果を、表1に示す。
(Comparative Example 4)
<Production of expandable styrenic resin particles> In the same operation as in Example 1, except that 0.08 parts by weight of t-butylperoxy-2-ethylhexyl monocarbonate and 0.150 parts by weight of divinylbenzene were used. Expandable styrene resin particles having a residual styrene content of 200 ppm, pre-expanded particles, and in-mold expanded molded articles were obtained. The evaluation results are shown in Table 1.
(比較例5)
<発泡性スチレン系樹脂粒子の製造>において、1、1−ビス(t−ブチルパーオキシ)シクロヘキサン0.16重量部、ジビニルベンゼン0.0160重量部に変更した以外は、実施例1と同様の操作により、残存スチレン量300ppmの発泡性スチレン系樹脂粒子、予備発泡粒子、型内発泡成形体を得た。評価結果を、表1に示す。
(Comparative Example 5)
<Manufacture of expandable styrene-based resin particles> In the same manner as in Example 1 except for changing to 0.16 parts by weight of 1,1-bis (t-butylperoxy) cyclohexane and 0.0160 parts by weight of divinylbenzene. By the operation, expandable styrene resin particles having a residual styrene content of 300 ppm, pre-expanded particles, and in-mold expanded molded articles were obtained. The evaluation results are shown in Table 1.
(比較例6)
<発泡性スチレン系樹脂粒子の製造>において、特開2004−155870号公報の実施例1と同じ方法で、発泡性スチレン系樹脂粒子、予備発泡粒子、型内発泡成形体を得た。評価結果を表1に示す。
(Comparative Example 6)
In <Manufacture of Expandable Styrenic Resin Particles>, expandable styrene resin particles, pre-expanded particles, and in-mold foam molded articles were obtained in the same manner as in Example 1 of JP-A No. 2004-155870. The evaluation results are shown in Table 1.
本発明の実施例では、通常条件で成形した成型体だけでなく、低圧の条件で成形した成形体においても、融着性、表面性だけでなく、強度にすぐれたものが得られる。 In the embodiment of the present invention, not only a molded body molded under normal conditions but also a molded body molded under low pressure conditions, not only the fusion and surface properties but also excellent strength can be obtained.
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JPH09221563A (en) * | 1996-02-15 | 1997-08-26 | Kanegafuchi Chem Ind Co Ltd | Preparation of expandable styrene polymer particle |
JP2005008670A (en) * | 2003-06-16 | 2005-01-13 | Jsp Corp | Expandable styrenic resin particle and method for producing the same |
JP2007246606A (en) * | 2006-03-14 | 2007-09-27 | Sekisui Plastics Co Ltd | Expandable polystyrene resin particle, expanded polystyrene resin particle, molded article of expanded polystyrene resin, sliced article of expanded polystyrene resin, and method for preparation of the same |
JP2008201989A (en) * | 2007-02-22 | 2008-09-04 | Sekisui Plastics Co Ltd | Expandable particle of polystyrene-based resin and method for producing the same, expanded particle of polystyrene-based resin and expansion-molded product of polystyrene-based resin |
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JPH09221563A (en) * | 1996-02-15 | 1997-08-26 | Kanegafuchi Chem Ind Co Ltd | Preparation of expandable styrene polymer particle |
JP2005008670A (en) * | 2003-06-16 | 2005-01-13 | Jsp Corp | Expandable styrenic resin particle and method for producing the same |
JP2007246606A (en) * | 2006-03-14 | 2007-09-27 | Sekisui Plastics Co Ltd | Expandable polystyrene resin particle, expanded polystyrene resin particle, molded article of expanded polystyrene resin, sliced article of expanded polystyrene resin, and method for preparation of the same |
JP2008201989A (en) * | 2007-02-22 | 2008-09-04 | Sekisui Plastics Co Ltd | Expandable particle of polystyrene-based resin and method for producing the same, expanded particle of polystyrene-based resin and expansion-molded product of polystyrene-based resin |
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