JP2017183369A - Lead wire encapsulated electron component and method of manufacturing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide: a lead wire encapsulated electron component having high reliability and eliminating the need to fix lead wires by a metal mold even when carrying out injection molding; and a method of manufacturing the same.SOLUTION: A lead wire encapsulated electron component includes: an electron component body 2; a pair of lead wires 3 whose one ends are coupled to the electronic component body; a support bar member 4 made of a resin, which is disposed between the pair of lead wires and extends along the lead wires from near one end to near a base end; and a resin molded part made of a resin so as to cover the lead wires and the support bar member. The support bar member has a plurality of protrusions 4a that protrude beyond both sides of the lead wires and support both sides of the lead wires.SELECTED DRAWING: Figure 3

Description

  The present invention relates to an electronic component such as a thermistor element having a resin-encapsulated lead wire, which has high reliability, and a method for manufacturing the same.

Conventionally, electronic parts such as thermistor elements having lead wires are known which are integrally molded by covering a pair of lead wires with a molding resin by injection molding (for example, Patent Documents 1 to 3).
In these electronic components, by performing injection molding with a pair of lead wires held by a mold, the pair of lead wires is deformed and exposed to the surface of the molding resin during injection molding, or the lead wires contact each other. It prevents that.

When the lead wire is deformed and exposed on the surface of the molding resin as described above, the moisture resistance is lowered or the corrosion wire breakage occurs due to the disconnection of the lead wire or the change of the coating. In other words, the lead wire is deformed or the lead wire coating is peeled off or worn out due to the high temperature and high pressure caused by the resin flowing in during injection molding, so conventionally, injection molding is performed with the lead wire fixed with a mold. Is going.
In order to perform injection molding without pressing the lead wire with a mold, for example, it is necessary to employ a lead wire with an expensive coating having high heat resistance, wear resistance and flexibility, which increases the cost. I will invite you.

JP 2007-101334 A JP 2011-38832 A JP 2003-121269 A

The following problems remain in the conventional technology.
That is, in the above conventional technique, since the lead wire is in contact with the mold at the time of injection molding, there is a possibility that the coating of the lead wire at the contact portion may be peeled off or worn away. There is a disadvantage that there is a risk of short circuiting due to contact, or a decrease in moisture resistance or corrosion breakage due to a change in the coating of the lead wire. In addition, the fixing of the lead wire by the mold requires an advanced fixing operation and a precise mold configuration, which has caused an increase in manufacturing cost. In addition, since a plurality of lead wire fixing positions are required, an increase in the number of processes and an additional inspection process are required, leading to a decrease in productivity.

  The present invention has been made in view of the above-described problems. A lead wire-sealed electronic component having high reliability and a method for manufacturing the same without requiring fixing of a lead wire by a mold even when injection molding is performed are provided. The purpose is to provide.

  The present invention employs the following configuration in order to solve the above problems. That is, the lead wire-sealed electronic component according to the first invention is an electronic component main body, a pair of lead wires having one end connected to the electronic component main body, and the lead wires between the pair of lead wires. A support bar member extending from the vicinity of one end to the vicinity of the base end and formed of a resin, and a resin molding portion formed of resin covering the lead wire and the support bar member, the support bar member comprising: And a plurality of protrusions projecting on both sides of the lead wire to support both sides of the lead wire.

  In the lead wire-sealed electronic component of the present invention, the support rod member extending along the lead wire between the pair of lead wires protrudes on both sides of the lead wire and has a plurality of convex portions that support both sides of the lead wire. Therefore, the pair of lead wires are held in a separated state by the support bar member functioning as an insulator, and the lead wires are supported by the plurality of convex portions, so that deformation of the lead wires can be prevented. For example, even when the resin molded part is formed by injection molding, since the pair of lead wires is positioned and held by a plurality of convex parts, fixing with a mold is unnecessary, and deformation of the lead wire and covering Separation can be prevented. In addition, advanced work and precise mold configuration are not required.

A lead wire-sealed electronic component according to a second invention is the first invention, wherein the support bar member has a columnar half-shaped end portion having a pair of lower groove portions into which the pair of lead wires are fitted on the upper surface. A cylindrical half-shaped member having a pair of upper groove portions on the lower surface, which are installed on the cylindrical half-shaped end portions and fitted with a pair of the lead wires, and the cylindrical half-shaped end portions; The cylindrical half member is provided with a ring member fitted in a press-fitted state.
That is, in this lead-wire-sealed electronic component, the ring member is held in the press-fitted state because it includes the ring member in which the cylindrical half-shaped end and the cylindrical half-shaped member are fitted in the press-fitted state. Thus, it is possible to prevent the short circuit between the lead wires by suppressing the intrusion of water from between the cylindrical half-shaped end portion and the cylindrical half-shaped member and the lead wires sandwiched between them.

In the lead-wire-sealed electronic component according to a third aspect of the present invention, in the second aspect, the ring member is formed of a material having a lower linear expansion coefficient than the cylindrical half-shaped end portion and the cylindrical half-shaped member. It is characterized by.
That is, in this lead-wire-sealed electronic component, the ring member is formed of a material having a lower linear expansion coefficient than the cylindrical half-shaped end and the cylindrical half-shaped member. A watertight state is maintained even in a temperature environment, a gap due to a difference in thermal expansion is unlikely to occur, and the intrusion of moisture from the lead wire can be further suppressed. For example, when the environmental temperature is low, the cylindrical halved end and the cylindrical halved member having a large linear expansion coefficient around the lead wire contract, and the compression stress caused by press-fitting into the ring member having a low linear expansion coefficient Thus, the lead wire is compressed from the surroundings, and the water tightness is improved. In addition, when the environmental temperature is high, even if the cylindrical halved end portion and the cylindrical halved member having a large linear expansion coefficient around the lead wire expand, the expansion is regulated by the ring member having a low linear expansion coefficient, Expansion of the lead wire contact portion is also suppressed, and water tightness is maintained.

A lead wire-sealed electronic component according to a fourth invention is characterized in that, in any one of the first to third inventions, the electronic component body is a thermistor element.
That is, in this lead-wire-sealed electronic component, since the electronic component body is a thermistor element, the temperature sensor is excellent in environmental resistance and can be manufactured at low cost.

A method for manufacturing a lead-wire-sealed electronic component according to a fifth aspect of the present invention is a method for manufacturing a lead-wire-sealed electronic component by covering the periphery of a pair of lead wires, one end of which is connected to the electronic component main body, with a resin by injection molding. And a step of arranging a support rod member formed of resin along the lead wire between a pair of the lead wires, and covering the lead wire and the support rod member with resin by injection molding. And a step of forming a resin molded portion, wherein the support bar member has a plurality of convex portions that protrude on both sides of the lead wire and support both sides of the lead wire.
That is, in this method of manufacturing a lead wire-sealed electronic component, the support rod member has a plurality of convex portions that protrude on both sides of the lead wire and support both sides of the lead wire. When formed by the above, the pair of lead wires are positioned and held by the plurality of convex portions of the support rod member which is a nested member. Therefore, it is not necessary to fix with a mold at the time of injection molding, and deformation of the lead wire, peeling of the coating, etc. can be prevented. Further, the lead wire can be held by a simple process at the time of injection molding, so that skill is not required and a precise mold configuration is not required.

It is a top view which shows one Embodiment of the lead wire sealing electronic component which concerns on this invention. In this embodiment, it is a perspective view which shows a lead wire sealing electronic component. In this embodiment, they are a perspective view (a) which shows the lead wire sealing electronic component except a resin molding part, and a perspective view (b) which shows the state fractured | ruptured by the AA line. It is the perspective view (a) which shows the state fractured | ruptured by the BB line in FIG. 2, and the principal part perspective view (b) which expanded the fracture | rupture part. It is a perspective view shown in order of a process in a manufacturing method of a lead wire sealing electronic component in this embodiment.

  Hereinafter, an embodiment of a lead wire-sealed electronic component and a manufacturing method thereof according to the present invention will be described with reference to FIGS.

  As shown in FIGS. 1 to 3, the lead wire-sealed electronic component 1 of the present embodiment includes an electronic component body 2, a pair of lead wires 3 having one end connected to the electronic component body 2, and a pair of lead wires. 3, the support rod member 4 extending from near one end to the vicinity of the base end along the lead wire 3, and the resin molding molded with the resin covering the lead wire 3 and the support rod member 4. Part 5.

  As shown in FIG. 3, the support bar member 4 has a plurality of convex portions 4 a that protrude on both sides of the lead wire 3 and support both sides of the lead wire 3. These convex portions 4 a are perpendicular to the extending direction of the lead wires 3 from the elongated plate-like main rod portion 4 b disposed between the pair of lead wires 3, and are parallel to the opposing direction of the pair of lead wires 3. Projecting in any direction. Each convex portion 4 a extends along the lead wire 3, and is formed on both sides of each lead wire 3 so as to be spaced apart from each other. Further, the convex portions 4 a disposed on one side of the lead wire 3 and the convex portions 4 a disposed on the other side of the lead wire 3 are alternately arranged in the extending direction of the lead wire 3. ing. That is, the lead wire 3 is in a state of being fitted between the rows of the two rows of convex portions 4a arranged on both sides.

Further, as shown in FIG. 4, the support bar member 4 has a cylindrical half end 4d having a pair of lower grooves 4c into which a pair of lead wires 3 are fitted on the upper surface, at one end of the main bar 4b. Have.
The lead-wire-sealed electronic component 1 of the present embodiment has a cylindrical half-end 4d and a pair of upper grooves 6a installed on the cylindrical half-end 4d and fitted with a pair of lead wires 3 on the bottom surface. A cylindrical half member 6 is provided, and a ring member 7 in which the cylindrical half part 4d and the cylindrical half member 6 are fitted in a press-fitted state.

The ring member 7 is formed of a material having a lower linear expansion coefficient than the resin molded portion 5, the cylindrical half-shaped end portion 4 d, and the cylindrical half-shaped member 6. For example, the resin molded portion 5, the cylindrical half-shaped end portion 4d, and the cylindrical half-shaped member 6 are formed of PA (polyamide resin) or PP (polypropylene) having a linear expansion coefficient of 2.0 × 10 ⁻⁵ / K. The ring portion 7 is made of PPS (polyphenylene sulfide) having a linear expansion coefficient of 1.8 × 10 ⁻⁵ / K. In addition, as a material for the ring portion 7, glass such as PPS, PBT (polybutylene terephthalate), PA having a low linear expansion coefficient, filler-containing material such as carbon, whisker, or metal material can be applied.

The electronic component body 2 is a chip-like thermistor element. As the material of the thermistor element of the electronic component main body 2, there are thermistor materials such as NTC type, PTC type and CTR type. In this embodiment, for example, an NTC type thermistor is adopted. This thermistor material is formed of a thermistor material such as a Mn—Co—Cu-based material or a Mn—Co—Fe-based material.
In particular, the thermistor element of the present embodiment includes, for example, Mn—Co based composite metal oxide (for example, Mn ₃ O ₄ —Co ₃ O ₄ based composite metal oxide) or Mn—Co based composite metal oxide, Ni , Fe, Cu, Al Spinel complex metal oxide comprising a complex metal oxide containing at least one element (for example, Mn ₃ O ₄ —Co ₃ O ₄ —Fe ₂ O ₃ complex metal oxide) It has a material film.

Another example of the material of the thermistor element is a metal oxide sintered body containing a perovskite oxide, for example, a general formula: La _1-y Ca _y (Cr _1-x Mn _x ) O ₃ ( It may be composed of a sintered body containing a composite oxide represented by 0.0 ≦ x ≦ 1.0 and 0.0 <y ≦ 0.7). For example, Y ₂ O ₃ , ZrO ₂ , MgO, Al ₂ O ₃ , or CeO ₂ may be added to the sintered body as an insulator material.
Further, as a material for the thermistor element, a ceramic sintered body containing metal oxides of Mn, Co and Fe, that is, a material formed of a Mn—Co—Fe-based material may be adopted.
In the electronic component main body 2, the thermistor element is covered with an environment resistant coating layer such as glass together with the connecting portion of the lead wire 3.

The resin molded portion 5 has an annular distal end portion 5d formed at the distal end and surrounding and protecting the electronic component main body 2, and a mounting bracket portion 5e formed at the proximal end.
The pair of lead wires 3 has the other end connected to a pair of coated external connection wires 9 which are lead wires for external connection, and the pair of external connection wires 9 are connection wires whose front ends are resin connectors. It is fixed to the fixing member 10.
The connecting wire fixing member 10 is fixed to the base end of the support bar member 4 by the resin molding portion 5. The connecting wire fixing member 10 is made of a material having a low linear expansion coefficient similar to that of the ring member 7.

  In the manufacturing method of the lead wire-sealed electronic component 1 of this embodiment, the lead wire-sealed electronic component is manufactured by covering the periphery of the pair of lead wires 3 whose one ends are connected to the electronic component body 2 with resin by injection molding. A method in which a support rod member 4 formed of resin is disposed along a lead wire 3 between a pair of lead wires 3, and the lead wire 3 and the support rod member 4 are made of resin by injection molding. A step of covering and forming the resin molding portion 5.

  That is, as shown in FIG. 5A, the manufacturing method of the lead wire-sealed electronic component 1 includes a pair of lead wires 3 connected to the electronic component body 2 and an external portion fixed to the connecting wire fixing member 10. What connected the connection wire 9 is prepared, and the support bar member 4 is arranged along the lead wire 3 between the pair of lead wires 3 as shown in FIG. At this time, the lead wire 3 is fitted into the lower groove portion 4c of the cylindrical half-shaped end portion 4d, the lead wire 3 is arranged between the rows of the convex portions 4a arranged in two rows, and the convex portions 4a are formed on both sides of the lead wire 3. The lead wire 3 is extended so as to abut.

Next, as shown in FIG. 5 (c), the columnar half member 6 is placed on the columnar half end 4d, and the lead wire 3 is fitted into the upper groove 6a, so that the columnar half shape is obtained. A pair of lead wires 3 are sandwiched between the end 4d and the cylindrical half member 6. In this state, the connection portion between the lead wire 3 and the external connection wire 9 is also positioned and held.
Further, as shown in FIG. 5 (d), the cylindrical half-shaped end 4 d and the cylindrical half-shaped member 6 are press-fitted into the ring member 7, and the ring member 7 is attached to the tip of the support bar member 4. Thus, a pressure is applied to the pair of lead wires 3 from the surroundings so that the water-tight state is achieved.

  In this state, the resin molded portion 5 is formed by setting in an injection mold and covering the lead wire 3 and the support bar member 4 by injection molding and sealing with resin. At this time, the ring member 7 and the connecting wire fixing member 10 are pressed by an injection mold to perform integral molding. That is, the lead wire 3 is positioned on the support bar member 4 and held in a separated state, and is not in direct contact with the injection mold. In this way, the lead wire-sealed electronic component 1 shown in FIGS. 1 and 2 is manufactured.

  As described above, in the lead wire-sealed electronic component 1 of the present embodiment, the support rod member 4 extending along the lead wire 3 between the pair of lead wires 3 protrudes on both sides of the lead wire 3 to lead wire 3. Therefore, the pair of lead wires 3 are held apart from each other by the support bar member 4 functioning as an insulator, and the lead wires 3 are supported by the plurality of convex portions 4a. Is supported, and deformation of the lead wire 3 can be prevented.

In particular, when the resin molding portion 5 is formed by injection molding, since the pair of lead wires 3 is positioned and held by the plurality of convex portions 4a, fixing with a mold is unnecessary, and deformation of the lead wire 3 is not necessary. And peeling of the coating can be prevented. In addition, advanced work and precise mold configuration are not required.
In addition, since the electronic component main body 2 is a thermistor element, the temperature sensor is excellent in environmental resistance and can be manufactured at low cost.

  Moreover, since the cylindrical half member 4d and the cylindrical half member 6 are provided with the ring member 7 fitted in the press-fitted state, the ring member 7 holds the press-fitted state, so that the cylindrical half It is possible to prevent the short circuit between the lead wires 3 by suppressing the intrusion of water from between the end 4d and the cylindrical half member 6 and the lead wire 3 sandwiched between them.

  Furthermore, since the ring member 7 is formed of a material having a lower linear expansion coefficient than the cylindrical half-shaped end portion 4d and the cylindrical half-shaped member 6, the water-tight state is maintained even in a wide range of operating temperature environments at low and high temperatures. It is held and a gap due to a difference in thermal expansion is unlikely to occur, and moisture intrusion from the lead wire 3 can be further suppressed. For example, when the environmental temperature is low, the cylindrical halved end 4d and the cylindrical halved member 6 having a large linear expansion coefficient around the lead wire 3 are contracted and pressed into the ring member 7 having a low linear expansion coefficient. The lead wire 3 is compressed from the surroundings by the compressive stress caused by the above, and the water tightness is improved. Further, when the environmental temperature is high, even if the cylindrical half split end 4d and the cylindrical half split member 6 having a large linear expansion coefficient around the lead wire 3 are expanded, the ring member 7 is expanded by a low linear expansion coefficient. Is restricted, expansion of the contact portion of the lead wire 3 is also suppressed, and water tightness is maintained.

  In the method for manufacturing the lead wire-sealed electronic component 1 according to the present embodiment, the support bar member 4 has a plurality of convex portions 4 a that protrude from both sides of the lead wire 3 and support both sides of the lead wire 3. Therefore, when the resin molded portion 5 is formed by injection molding, the pair of lead wires 3 are positioned and held by the plurality of convex portions 4a of the support rod member 4 that is a nested member. Therefore, as described above, it is not necessary to fix with a mold at the time of injection molding, and deformation of the lead wire 3, peeling of the coating, or the like can be prevented. Further, the lead wire 3 can be held by a simple process at the time of injection molding, so that skill is not required and a precise mold configuration is not required.

The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.
For example, in the above-described embodiment, the thermistor element is applied to the electronic component main body. However, an IC chip, a chip-shaped RFID, a resistance component or a capacitor component employing a resistor or a capacitor may be used as another electronic component main body.

  DESCRIPTION OF SYMBOLS 1 ... Resin sealing type | mold electronic component, 2 ... Electronic component main body, 3 ... Lead wire, 4 ... Supporting bar member, 4a ... Convex part, 4c ... Lower groove part, 4d ... Cylindrical half split end part, 5 ... Resin molding part 6 ... Cylinder halved member, 6a ... Upper groove portion, 7 ... Ring member

Claims (5)

An electronic component body;
A pair of lead wires having one end connected to the electronic component body;
A support rod member formed between the pair of the lead wires and extending from the vicinity of one end to the vicinity of the base end along the lead wire;
A resin molded portion that is molded of resin so as to cover the lead wire and the support rod member;
The lead-wire-sealed electronic component, wherein the support bar member has a plurality of protrusions that protrude from both sides of the lead wire and support both sides of the lead wire. In the lead-wire-sealed electronic component according to claim 1,
The support bar member has at one end a columnar half-shaped end portion having a pair of lower groove portions fitted with the pair of lead wires on the upper surface,
A cylindrical half-shaped member having a pair of upper groove portions installed on the cylindrical half-shaped end portions and fitted with a pair of the lead wires on the lower surface;
A lead-wire-sealed electronic component comprising: a ring member into which the cylindrical half-shaped end portion and the cylindrical half-shaped member are fitted in a press-fitted state. In the lead-wire-sealed electronic component according to claim 2,
The lead wire-sealed electronic component, wherein the ring member is formed of a material having a lower linear expansion coefficient than the cylindrical half-shaped end portion and the cylindrical half-shaped member. In the lead wire sealing electronic component according to any one of claims 1 to 3,
The lead wire-sealed electronic component, wherein the electronic component body is a thermistor element. A method of manufacturing a lead wire-sealed electronic component by covering the periphery of a pair of lead wires, one end of which is connected to the electronic component body, with resin by injection molding,
A step of arranging a support rod member formed of resin along the lead wire between the pair of lead wires;
Covering the lead wire and the support rod member with a resin by injection molding to form a resin molded portion,
The method of manufacturing a lead-wire-sealed electronic component, wherein the support bar member has a plurality of protrusions that protrude from both sides of the lead wire and support both sides of the lead wire.

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