JPH0869904A - Formation of conjugation of thermistor and electric conductor of temperature sensor - Google Patents
Formation of conjugation of thermistor and electric conductor of temperature sensorInfo
- Publication number
- JPH0869904A JPH0869904A JP7188216A JP18821695A JPH0869904A JP H0869904 A JPH0869904 A JP H0869904A JP 7188216 A JP7188216 A JP 7188216A JP 18821695 A JP18821695 A JP 18821695A JP H0869904 A JPH0869904 A JP H0869904A
- Authority
- JP
- Japan
- Prior art keywords
- thermistor
- temperature sensor
- electric conductor
- injection
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/22—End caps, i.e. of insulating or conductive material for covering or maintaining connections between wires entering the cap from the same end
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/24—Assembling by moulding on contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/66—Structural association with built-in electrical component
- H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
- H01R13/6683—Structural association with built-in electrical component with built-in electronic circuit with built-in sensor
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、温度センサのサーミス
タと電気導線との湿気を通さない接合体を形成するため
の方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a moisture impermeable junction between a temperature sensor thermistor and an electrical conductor.
【0002】[0002]
【従来の技術】温度調節並びに冷凍及び冷却装置の技術
分野においては、蒸発器及び/又は温度調節された部屋
の温度測定には湿気を通さずに結線される温度センサが
必要である。今日この種の温度センサはプラスチックの
スリーブ内に埋込まれている。電気導線とプラスチック
スリーブ内のセンサケース又は埋込体との間の範囲には
湿気を侵入させないようにしなければならないという問
題がある。従ってこの種の接合体は一般に気密な構成を
とっていない。BACKGROUND OF THE INVENTION In the field of temperature regulation and refrigeration and cooling systems, temperature sensors in evaporators and / or temperature regulated rooms require moisture-tight wired temperature sensors. Today, this kind of temperature sensor is embedded in a plastic sleeve. There is the problem that moisture must not penetrate into the area between the electrical conductor and the sensor case or implant in the plastic sleeve. Therefore, this type of bonded body generally does not have an airtight structure.
【0003】この難点は収縮管又はパッキン部材を補助
的に被着したり、接合部分を付加的に接着するなどかな
りの経費をかけなければ満足のいくように解決すること
はできない。This difficulty cannot be satisfactorily solved without considerable expense, such as auxiliary application of shrink tubing or packing members or additional bonding of the joints.
【0004】[0004]
【発明が解決しようとする課題】本発明は、上述の形式
の湿気を通さない接合体を形成するための簡単かつ信頼
できる方法を提供することを課題とする。SUMMARY OF THE INVENTION It is an object of the present invention to provide a simple and reliable method for forming a moisture impermeable joint of the type described above.
【0005】[0005]
【課題を解決するための手段】この課題は本発明によ
り、導線端部及びこの端部にあるサーミスタを導線被覆
材に堅く密着するプラスチック材で射出被覆することに
より解決される。This object is achieved according to the invention by injection coating the end of the wire and the thermistor at this end with a plastic material which adheres tightly to the wire covering.
【0006】[0006]
【実施例】本発明を実施例及び図面に基づき以下に詳述
する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below with reference to embodiments and drawings.
【0007】図1に示すように電気導線1から突出する
心線2及び3にサーミスタ4が電気的及び機械的に装着
される。この装着は、導線の心線2及び3と図示されて
いない電極又はサーミスタ4の接続端子とを例えば温度
変化に安定なろう付け接合、溶接又は収縮により行うこ
とができる。As shown in FIG. 1, a thermistor 4 is electrically and mechanically attached to the core wires 2 and 3 protruding from the electric conductor wire 1. This mounting can be performed, for example, by brazing, welding, or shrinking the core wires 2 and 3 of the conductor wire and a connection terminal of the electrode or thermistor 4 not shown in the figure, which is stable against temperature changes.
【0008】こうして形成された導線1とサーミスタ4
から成るユニットを本発明により射出型に入れ、導線端
部の範囲及びこの端部範囲にあるサーミスタ4を導線被
覆材に堅く密着するプラスチック材5、例えば熱可塑性
材で図示のようにして射出被覆する。こうしてサーミス
タ4の範囲で導線端部にプラスチック材5により形成さ
れたセンサヘッドの湿気を通さない接合体が形成され
る。The conductor 1 and the thermistor 4 thus formed
A unit consisting of the present invention is placed in an injection mold according to the invention and the area of the wire end and the thermistor 4 in this end area is injection coated with a plastic material 5, for example a thermoplastic material, which adheres tightly to the wire covering as shown. To do. In this way, a moisture-impermeable joined body of the sensor head formed of the plastic material 5 is formed at the end of the conductor in the range of the thermistor 4.
【0009】導線被覆材とセンサヘッド材との接合体と
しては例えば次の材料が有利であることが判明してい
る。導線被覆材がポリビニルクロリドである場合には、
センサヘッド材としてはポリブチレンテルフタル酸(P
BT)が適している。導線被覆材がポリプロピレンをベ
ースとして形成されている場合には、センサヘッド材と
してはポリプロピレンか又は高圧ポリエチレンが適して
いる。For example, the following materials have been found to be advantageous as a bonded body of the conductor coating material and the sensor head material. When the wire coating material is polyvinyl chloride,
Polybutylene terephthalic acid (P
BT) is suitable. If the conductor coating is made of polypropylene, polypropylene or high-pressure polyethylene is suitable as the sensor head material.
【0010】センサヘッド内のサーミスタ4の位置決め
に対して比較的高度な要求が設定される場合には、本発
明の他の実施態様により多段階射出工程が行われる。二
段階射出工程で形成されたこの種の温度センサの一実施
例は図2に示されているが、その際図1と同じ部分には
同じ符号が付されている。この実施例では第1の射出被
覆材5上に第2の射出被覆材7が備えられている。導線
1とサーミスタ4から成る接合体を射出型内に一層良好
に位置決めできるように、射出被覆材5には射出型内で
射出被覆材5を直接噴射して形成することができる位置
決め部材6を備えてもよい。If relatively high requirements are set for the positioning of the thermistor 4 within the sensor head, a multi-step injection process is performed according to another embodiment of the invention. An embodiment of this type of temperature sensor formed by a two-step injection process is shown in FIG. 2, in which the same parts as in FIG. 1 are given the same reference numerals. In this embodiment, a second injection coating 7 is provided on the first injection coating 5. A positioning member 6 that can be formed by directly injecting the injection coating material 5 in the injection mold is formed in the injection coating material 5 so that the joined body composed of the conductive wire 1 and the thermistor 4 can be positioned better in the injection mold. You may prepare.
【図1】本発明により製造された接合体の第1の実施例
の断面図。FIG. 1 is a cross-sectional view of a first embodiment of a joined body manufactured according to the present invention.
【図2】本発明により製造された接合体の第2の実施例
の断面図。FIG. 2 is a cross-sectional view of a second embodiment of a joined body manufactured according to the present invention.
1 電気導線 2、3 心線 4 サーミスタ 5、7 プラスチック射出被覆材 6 位置決め部材 1 electric conductor wire 2, 3 core wire 4 thermistor 5, 7 plastic injection coating material 6 positioning member
───────────────────────────────────────────────────── フロントページの続き (71)出願人 390041508 シーメンス、マツシタ、コンポーネンツ、 ゲゼルシヤフト、ミツト、ベシユレンクテ ル、ハフツング、ウント、コンパニ、コマ ンデイート、ゲゼルシヤフト SIEMENS MATSUSHITA COMPONENTS GESELLSC HAFT MIT BESCHRANKT ER HAFTUNG & COMPAN Y KOMMANDITGESELLSC HAFT ドイツ連邦共和国ミユンヘン (番地な し) (72)発明者 ゲラルト クロイバー オーストリア国 8073 グラーツ フエル トキルヒエン ワグニツツシユトラーセ 16 ─────────────────────────────────────────────────── ─── Continuation of the front page (71) Applicant 390041508 Siemens, Matsushita, Components, Gezelshyaft, Mitt, Besilyenktel, Haftung, und, Companion, Comandate, Geselsyaft Siefelt Science Sights, Things, Things, and Things, Things, Things Federal Republic of Germany Miyunchen (No street number) (72) Inventor Geralt Kreiber Austria 8073 Graz Fuertkirchen Wagner Tschyutraße 16
Claims (3)
機械的に電気導線(1)の心線(2、3)と接合して電
気導線(1)と温度センサのサーミスタ(4)との湿気
を通さない接合体を形成するための方法において、導線
端部及びこの端部にあるサーミスタ(4)を導線被覆材
に堅く密着するプラスチック材(5、6、7)で射出被
覆することを特徴とする温度センサのサーミスタと電気
導線との接合体の形成方法。1. First, the connection terminal of the thermistor is electrically and mechanically joined to the core wires (2, 3) of the electric conductor (1) to form moisture between the electric conductor (1) and the thermistor (4) of the temperature sensor. A method for forming a non-permeable joint, characterized in that the wire end and the thermistor (4) at this end are injection-coated with a plastic material (5, 6, 7) that tightly adheres to the wire covering. And method for forming a bonded body of a thermistor of a temperature sensor and an electric wire.
可塑性物質を使用することを特徴とする請求項1記載の
方法。2. Method according to claim 1, characterized in that a thermoplastic material is used as the plastic material (5, 6, 7).
覆を多段階射出工程で実施することを特徴とする請求項
1又は2記載の方法。3. Method according to claim 1, characterized in that the injection coating of the plastic material (5, 6, 7) is carried out in a multi-step injection process.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4423985A DE4423985C2 (en) | 1994-07-07 | 1994-07-07 | Method for producing a moisture-proof connection of an electrical line to a thermistor of a temperature sensor |
DE4423985.8 | 1994-07-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0869904A true JPH0869904A (en) | 1996-03-12 |
JP2815555B2 JP2815555B2 (en) | 1998-10-27 |
Family
ID=6522563
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7188216A Expired - Fee Related JP2815555B2 (en) | 1994-07-07 | 1995-06-30 | Method for forming a joined body between a thermistor and an electric conductor of a temperature sensor |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0691705B1 (en) |
JP (1) | JP2815555B2 (en) |
AT (1) | ATE225087T1 (en) |
DE (2) | DE4423985C2 (en) |
TW (1) | TW387640U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017183369A (en) * | 2016-03-29 | 2017-10-05 | 三菱マテリアル株式会社 | Lead wire encapsulated electron component and method of manufacturing the same |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19631376C1 (en) * | 1996-08-02 | 1997-11-20 | Siemens Matsushita Components | Manufacturing moisture tight temperature sensor esp. for air conditioning, cooling, refrigeration systems |
NL1004802C2 (en) * | 1996-12-17 | 1998-06-18 | Bms Electronics B V | Method for manufacturing a plug at one end of a cable and such a plug. |
DE10044460B4 (en) * | 1999-09-08 | 2008-07-31 | Tyco Electronics Amp Gmbh | Assembly and method for producing the same |
DE10340551A1 (en) * | 2003-09-01 | 2005-04-14 | Siemens Ag | Production of a sensor head for measuring rotation and angles of rotation, e.g. for vehicle wheel, comprises injecting an elastomer directly onto a component support, a sensor and part of a connecting cable |
DE10340636B3 (en) * | 2003-09-03 | 2005-01-13 | Epcos Ag | Moisture-proof sensor manufacturing method, by splitting cable sheath into two halves, connecting cable conductors to sensor head, and heating halves of sheath to form hermetic seal |
DE10356880B4 (en) * | 2003-12-03 | 2011-04-21 | Sontec Sensorbau Gmbh | Method for producing a liquid, gas and vapor-tight electrical and / or optical component |
US7128467B2 (en) | 2004-03-18 | 2006-10-31 | General Electric Company | Thermistor probe assembly and method for positioning and moisture proofing thermistor probe assembly |
DE102008029192A1 (en) | 2008-03-13 | 2009-09-24 | Epcos Ag | Sensor for detecting a physical quantity and method for manufacturing the sensor |
DE102012218206A1 (en) * | 2012-10-05 | 2014-04-10 | Zf Friedrichshafen Ag | Cable connecting and/or cable branching sleeve, has strands branched and/or connected in area of connection device, and positioning device enclosing connection device, where connection and positioning devices are merged in spraying mass |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0197822A (en) * | 1987-07-11 | 1989-04-17 | Stc Plc | Electronic component and manufacture thereof |
JPH06132335A (en) * | 1992-10-16 | 1994-05-13 | Hitachi Cable Ltd | Manufacture of lead frame insert injection molded article |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4032214A (en) * | 1976-04-21 | 1977-06-28 | Schlumberger Technology Corporation | Cable-termination assemblies and methods for manufacturing such assemblies |
DE8120039U1 (en) * | 1981-07-09 | 1982-12-16 | Robert Bosch Gmbh, 7000 Stuttgart | "Connection cable for an electrical device" |
DE3625265A1 (en) * | 1986-07-25 | 1988-02-04 | Basf Ag | Encapsulated passive ceramic components for electronics |
JPH02227624A (en) * | 1989-02-28 | 1990-09-10 | Nippondenso Co Ltd | Temperature sensor |
JP2658772B2 (en) * | 1992-11-16 | 1997-09-30 | 日立電線株式会社 | Temperature sensor sealing structure and sealing method |
-
1994
- 1994-07-07 DE DE4423985A patent/DE4423985C2/en not_active Expired - Fee Related
-
1995
- 1995-05-31 TW TW086208730U patent/TW387640U/en unknown
- 1995-06-30 DE DE59510387T patent/DE59510387D1/en not_active Expired - Lifetime
- 1995-06-30 AT AT95110297T patent/ATE225087T1/en not_active IP Right Cessation
- 1995-06-30 EP EP95110297A patent/EP0691705B1/en not_active Expired - Lifetime
- 1995-06-30 JP JP7188216A patent/JP2815555B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0197822A (en) * | 1987-07-11 | 1989-04-17 | Stc Plc | Electronic component and manufacture thereof |
JPH06132335A (en) * | 1992-10-16 | 1994-05-13 | Hitachi Cable Ltd | Manufacture of lead frame insert injection molded article |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017183369A (en) * | 2016-03-29 | 2017-10-05 | 三菱マテリアル株式会社 | Lead wire encapsulated electron component and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
ATE225087T1 (en) | 2002-10-15 |
DE4423985A1 (en) | 1996-01-11 |
EP0691705B1 (en) | 2002-09-25 |
EP0691705A1 (en) | 1996-01-10 |
TW387640U (en) | 2000-04-11 |
DE4423985C2 (en) | 2002-04-04 |
JP2815555B2 (en) | 1998-10-27 |
DE59510387D1 (en) | 2002-10-31 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |