JP2010123641A - Electronic component device and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component device which does not generate a gap at a joining part between an insulated wire and a resin material even under the environment of larger temperature change, and also to provide a method of manufacturing the same electronic component device. <P>SOLUTION: The electronic component device includes an electronic component such as a thermistor element 1, an insulated wire 3 connected to this electronic component, and a thermosetting resin material 6 covering a part of the thermistor element 1 and the insulated wire 3. A tightening material 5 is provided to tighten an insulated part 3b of the insulated wire 3 from the entire part of external circumference and the thermistor element 1 and a part of the insulated wire 3 connected to the thermistor element 1 are covered with the thermosetting resin material 6 under the condition of including this tightening material 5. Thereby, since the tightening material 5 is arranged to the external circumference of the insulated wire 3 under the condition to tighten the insulated part 3b of the insulated wire 3 from the entire part of the external circumference, namely the condition to apply the tightening force, any gap is never generated at the joining part between the insulated wire 3 and the tightening material 5 even under the environment of large temperature change. <P>COPYRIGHT: (C)2010,JPO&amp;INPIT

Description

  The present invention relates to an electronic component device having an electronic component such as a thermistor sensor used for measuring the temperature of electrical equipment and electronic equipment such as automobiles and home appliances, and in particular, a waterproof / moisture-proof thermistor used in a high-temperature and high-humidity atmosphere. The present invention relates to an electronic component device such as a sensor and a manufacturing method thereof.

  Conventionally, as a thermistor sensor which is one of electronic component devices, as shown in FIGS. 8A and 8B, a thermistor element 52 (or a thermistor element) to which a lead wire 51a of a covered electric wire 51 is connected. A thermistor unit 53) having 52 is sealed with a sealing resin 54 made of hard or soft epoxy resin or the like (Patent Document 1, etc.). This type of thermistor sensor protects the thermistor element 52 and the thermistor unit 53 satisfactorily, and the thermistor element 52 and the thermistor unit 53 with the sealing resin 54 so that the lead wire 51a of the covered electric wire 51 is not exposed to the outside. And the portion of the lead wire 51a of the covered electric wire 51 and the exposed side (connecting portion side) portion of the lead wire 51a in the covered portion of the covered electric wire 51.

As disclosed in Patent Document 2 and the like, a thermistor element 61 to which the lead wire 62a of the covered electric wire 62 is connected is placed in a sensor case 65 made of metal or resin, and sealing resin such as epoxy resin is used. What was sealed with 63 is also widely used.
Japanese Utility Model Publication No. 6-16836 Japanese Patent No. 3198823

  However, when the conventional thermistor sensor shown in FIGS. 8A and 8B is used in an environment with a large temperature change, the sealing resin 54 such as an epoxy resin has a high thermal expansion coefficient. Due to expansion and contraction due to temperature change, a gap may be generated at the joint between the epoxy resin 54 and the covered electric wire 51. In this case, in a humid environment, moisture may permeate from the interface between the epoxy resin 54 and the covered electric wire 51 and cause the performance of the thermistor element 52 to deteriorate.

  In order to improve such a problem, in the thermistor sensor shown in FIG. 9, before covering the thermistor element 61 and the covered electric wire 62 with the sealing resin 63, the outer circumference of the covered electric wire 62 covered with the sealing resin 63 in advance. The resin 64 having good adhesion to both the covered electric wire 62 and the resin 63 is applied to the portion to enhance the adhesion between the covered electric wire 62 and the resin 63.

  However, even in this structure, the resin 64 interposed between the covered electric wire 62 and the molding resin 63 is simply applied to the outer peripheral portion of the covered electric wire 62, Since a force is not acting between the resin 64 and the environment where the temperature change is large, a gap may occur at the joint between the covered electric wire 62 and the resin 64. Moisture permeates into the thermistor element, causing the performance of the thermistor element 61 to deteriorate.

  SUMMARY OF THE INVENTION The present invention solves the above-described problems, and an object thereof is to provide an electronic component device that does not cause a gap in a joint portion between a covered electric wire and a resin even in an environment with a large temperature change, and a manufacturing method thereof. It is.

  In order to achieve the above object, an electronic component device according to the present invention includes an electronic component, a covered electric wire connected to the electronic component, and a thermoplastic resin body that covers the electronic component and the electronic component connecting side portion of the covered electric wire. An electronic component device comprising: a tightening material for tightening a covering portion of the covered electric wire from the entire outer periphery; and including the tightening material, the electronic component and the covered electric wire connected to the electronic component The electronic component connecting side portion is covered with the thermoplastic resin body.

  The electronic component device manufacturing method of the present invention is an electronic component device manufacturing method in which an electronic component and an electronic component connecting side portion of a covered electric wire connected to the electronic component are covered with a thermoplastic resin body. The covered wire was inserted into the fastening material having a diameter smaller than the outer diameter of the covered electric wire from the end of the covered portion, and the covered portion of the covered electric wire was tightened from the outer periphery. Thereafter, the electronic component connecting side portion of the electronic component and the covered electric wire and the fastening material attached to the covered electric wire are covered with the thermoplastic resin body.

  The electronic component device manufacturing method of the present invention includes an electronic component device in which the electronic component and an electronic component connecting side portion of a covered electric wire connected to the electronic component are covered with a thermoplastic resin body for protection and insulation. A thermoplastic resin for forming a tightening material having heat shrinkability is formed on the entire outer periphery of the electronic component connecting side portion of the covered portion of the covered electric wire, and for the subsequent forming of the tightening material. After shrinking the thermoplastic resin in the radial direction of the covered electric wire due to a decrease in temperature, after mounting the fastening material made of the thermoplastic resin for forming the fastening material in a state where the covered portion of the covered electric wire is tightened from the outer periphery, The electronic component, the electronic component connecting side portion of the covered electric wire connected to the electronic component, and the fastening material attached to the covered electric wire are covered with the thermoplastic resin body for protection and insulation.

  Furthermore, in the above configuration and the above method, it is preferable that the fastening material is formed of the same material as the thermoplastic resin body or a material having high adhesion to the thermoplastic resin body. Further, when a thermistor element is used as an electronic component, a thermistor sensor as an electronic component device can be suitably used.

  According to the present invention, the tightening material is disposed on the outer periphery of the covered electric wire in a state where the covered portion of the covered electric wire is tightened from the entire outer periphery, that is, in a state where the tightening force is applied. Thus, even if a gap is generated between the covered electric wire and the thermoplastic resin body covering the covered electric wire, no gap is generated at the joint between the covered electric wire and the fastening material. Therefore, even if moisture permeates from the interface between the coated wire and the thermoplastic resin body in an environment with a large temperature change and in a humid environment, this moisture will remain at the joint between the coated wire and the fastening material. This prevents moisture from entering the electronic component connecting side and the electronic component side of the covered electric wire, thereby preventing performance deterioration of the electronic component.

  If the tightening material is made of the same material as that of the covered portion of the covered electric wire or a material having high adhesion to the thermoplastic resin body, the tightening material and the thermoplastic resin body are in close contact with each other. Intrusion of moisture from between the resin and the thermoplastic resin body can be prevented, and the reliability is further improved.

  Further, even when the electronic component is a thermistor element, it can be used favorably in an environment with a large temperature change or in a humid environment.

Hereinafter, a thermistor sensor as an electronic component according to an embodiment of the present invention will be described with reference to the drawings.
1 is a perspective view of a thermistor sensor according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of the thermistor sensor, FIG. 3A is an exploded side view of the thermistor sensor, and FIG. FIG. 3C is a vertical cross-sectional side view of the thermistor sensor, and FIGS. 4A to 4E are views showing manufacturing steps of the thermistor sensor.

  As shown in FIGS. 1 to 3, the thermistor sensor 10 has a pair of lead terminals 1 a, a thermistor element 1 encapsulated with resin or glass, and a solder terminal 2 on the lead terminal 1 a of the thermistor element 1. And the covered wire 3 to which the lead wire 3a is connected, and the thermistor element 1 and a portion near the end of the covered wire 3 are assembled and held in a primary molded product having a substantially semicircular cross section. The case body 4, the ring-shaped tightening material 5 for tightening the covering portion of the covered electric wire 3 from the entire outer periphery, the thermistor element 1, the electronic component connecting side portion of the covered electric wire 3, the tightening material 5, and the case body 4 And a thermoplastic resin body 6 covering the inner surface side portion. The covered electric wire 3 is of a type having a covering portion 3b made of vinyl chloride and a two-core lead wire 3a.

Here, in particular, the fastening material 5 has a smaller diameter than the outer shape of the covered electric wire 3 and is configured to tighten the covering portion 3b of the covered electric wire 3 from the entire outer periphery.
Further, as shown in FIGS. 1 and 2, the case body 4 is formed into a columnar shape having a relatively small diameter and extending in the longitudinal direction with a rounded tip in a final product state fitted to the thermoplastic resin body 6. The outer portion (lower surface side portion) is the outer portion of the thermistor sensor 10. A thermistor element holding portion 4a for holding the body portion 1b of the thermistor element 1 is formed on the inner side of the distal end portion of the case body 4 so that the thermistor element 1 is positioned at the center of the thermistor sensor 10. The temperature detection unevenness is suppressed. Further, in the central portion in the width direction of the case body 4, a separating portion that separates the lead terminal portion 1 a of the thermistor element 1 and the lead wire 3 a of the covered electric wire 3 by separating the positive electrode lead portion and the negative electrode lead portion. 4b is formed to prevent contact between the positive electrode side lead portion and the negative electrode side lead portion. Further, a portion of the case body 4 near the rear end portion is integrally formed with a covered electric wire holding portion 4c that restricts and holds the end portion of the covered portion 3b of the covered electric wire 3.

  Further, it is more preferable that the thermoplastic resin as the material of the thermoplastic resin body 6 and the thermoplastic resin as the material of the fastening material 5 are formed of the same material, but the present invention is not limited to this. Here, the type of the thermoplastic resin is not particularly limited, but for example, the following materials are used. It can be appropriately selected from general-purpose resins represented by PP, PE and PVC, engineering plastic resins represented by PBT, POM and PA, and super engineering plastic resins represented by PPS, LCP, PAR and PEEK. Furthermore, as this thermoplastic resin, a resin of the same material as the covering portion 3b of the covered electric wire 3 may be used. For example, by using PVC, PE, etc., the covering portion 3b of the covered electric wire 3 and the fastening material 5 Adhesiveness with the thermoplastic resin body 6 (weldability during resin molding described later) can be improved.

  In addition, by using PPS, LCP, etc. with high heat resistance as the thermoplastic resin that is the material of the thermoplastic resin body 6 and the thermoplastic resin that is the material of the fastening material 5, it can be used in a high temperature environment. This is preferable.

  Furthermore, when a resin having excellent fluidity is used as the thermoplastic resin, the operation at the time of injection molding described later can be performed better. Moreover, it is more preferable to use a resin having excellent thermal conductivity as the thermoplastic resin because the sensitivity of the thermistor sensor 10 can be improved.

The thermistor element 1 is not particularly limited, but it is preferable to use a resin- or glass-enclosed thermistor element 1 that is resistant to stress such as resin pressure and heat during injection molding.
The covered electric wire 3 is not particularly limited, and any form can be used. For example, as the covering portion 3b of the covered electric wire 3, polyvinyl chloride, polyethylene, cross-linked polyethylene, or fluororesin is preferably used.

  2 shows that the thermoplastic resin body 6 can be separated as a single unit so that the structure of the thermistor sensor 10 which is an electronic component device can be easily understood. The plastic resin body 6 is injected into the space filling portion of the mold and integrated with the thermistor element 1, the solder portion 2, the tip end portion of the covered electric wire 3, the case body 4, and the fastening material 5, and is commercialized in a state where it cannot be separated. Has been.

Next, a method for manufacturing the thermistor sensor 10 according to the present invention will be described with reference to FIGS.
(Preparation of thermistor sensor according to Example 1)
First, PPS resin (trade name Torelina A504, manufactured by Toray Industries, Inc.) was injection-molded at a cylinder temperature of 310 ° C. using an injection molding machine (trade name EC100NII, manufactured by Toshiba Machine Co., Ltd.), and a donut-shaped ring with an inner diameter of 1.8 mmφ The fastening material 5 made of (outer diameter 3.0 mmφ) is produced.

  Next, as shown in FIGS. 4 (a) and 4 (b), the two fastening members 5 made of the produced donut-shaped ring are connected to a two-core type covered electric wire 3 (covered with a covering portion 3b made of vinyl chloride. Fit the outer periphery of the connection side portion (the portion covered with the thermoplastic resin body 6 to be described later) of the thermistor element 1 of the part outer diameter 2 mmφ, trade name AEX 0.5, manufactured by Yazaki Sogo Co., Ltd. The space | interval between them became 2 mm, for example, and it mounted | wore in the state which pressed the coating | coated part 3b of the covered electric wire 3 by radial direction in the inner part. In parallel with this, PPS resin (trade name Torelina A504, manufactured by Toray Industries, Inc.) is injection molded at a cylinder temperature of 310 ° C. using an injection molding machine (trade name EC100NII, manufactured by Toshiba Machine Co., Ltd.), and consists of a primary molded body. Case body 4 was produced.

  Moreover, as shown in FIG.4 (c), the lead terminal 1a of the thermistor element 1 and the lead wire 3a of the covered electric wire 3 were joined by the solder part 2 (brand name Almit KR-19, Nippon Almit Co., Ltd. product). Next, as shown in FIG. 4 (d), the thermistor element 1 soldered to the lead wire 3 a of the covered electric wire 3 is moved to the left and right by separating the two lead terminals 1 a and the lead wire 3 a by the separating portion 4 b of the case body 4. The thermistor element 1 and the covered electric wire 4 are assembled inside the case body 4 in such a posture that the thermistor element 1 and the covered electric wire 4 are arranged at the front and rear in the thermistor element holding part 4a and the covered electric wire holding part 4c, respectively. And this assembly is set in a mold for molding the thermoplastic resin body 6 as it is, and the cylinder temperature is 340 ° C. using an injection molding machine (trade name EC100NII, manufactured by Toshiba Machine Co., Ltd.). The remaining external shape of the thermistor sensor 10 was produced from the thermoplastic resin body 6 by injection molding. In the above embodiment, the case where the lead terminal 1a of the thermistor element 1 and the covered electric wire 3 are joined after the fastening member 5 is mounted on the covered electric wire 3 is described, but the present invention is not limited to this. The lead terminal 1 a of the thermistor element 1 and the covered electric wire 3 may be joined via the solder portion 2 before the wire is attached to the covered electric wire 3.

(Production of thermistor sensor according to Examples 2 to 4)
Moreover, although it was the same structure, the thermistor sensor 10 of Examples 2-4 shown in Table 1 was produced by varying the combination of the thermoplastic resin body 6 and the covered electric wire 3 of Table 1.

本発明によれば、何れの実施例１〜４に係るサーミスタセンサ１０でも、被覆電線３の外周に、締付け材５を、被覆電線３の被覆部３ｂを外周全周から締め付けた状態、すなわち締付け材５の締付け力が被覆電線３の被覆部３ｂに作用した状態で配設させたので、被覆電線３の被覆部３ｂと締付け材５とが強く密着し、温度変化の大きい環境下で、万一、被覆電線３とこの被覆電線３を覆う熱可塑性樹脂体６との間の界面に隙間を生じた場合でも、被覆電線３と締付け材５との接合部に隙間を生じることがない。また、締付け材５と熱可塑性樹脂体６とを同じ材料や密着性の高い材料で構成することにより、熱可塑性樹脂体６を成形した際に、締付け材５と熱可塑性樹脂体６とが密着するので、締付け材５と熱可塑性樹脂体６との間に隙間を生じて水分が侵入することを防止できる。

According to the present invention, in any of the thermistor sensors 10 according to the first to fourth embodiments, the fastening material 5 is fastened to the outer periphery of the covered electric wire 3 and the covering portion 3b of the covered electric wire 3 is tightened from the outer periphery. Since the fastening force of the material 5 is arranged in a state where it acts on the covering portion 3b of the covered electric wire 3, the covering portion 3b of the covered electric wire 3 and the fastening material 5 are in close contact with each other, Even if a gap is generated at the interface between the covered electric wire 3 and the thermoplastic resin body 6 covering the covered electric wire 3, no gap is generated at the joint between the covered electric wire 3 and the fastening material 5. Moreover, when the fastening material 5 and the thermoplastic resin body 6 are made of the same material or a material having high adhesiveness, the fastening material 5 and the thermoplastic resin body 6 are in close contact with each other when the thermoplastic resin body 6 is molded. Therefore, it is possible to prevent moisture from entering due to a gap between the fastening material 5 and the thermoplastic resin body 6.

  Therefore, even when moisture permeates from the interface between the coated wire 3 and the thermoplastic resin 6 in an environment with a large temperature change and in a humid environment, the moisture is a joint between the coated wire 3 and the fastening material 5. Thus, the performance of the thermistor element 1 can be satisfactorily prevented, and as a result, the reliability of the thermistor sensor 10 can be improved.

  Moreover, according to the said embodiment, since the thermoplastic resin body 6 is formed in the state which the coating | coated part 3b and the fastening material 5 of the covered electric wire 3 were closely_contact | adhered, it pulls out per unit contact area of the covered electric wire 3 The strength can be set to 1.0 MPa or more, and this also prevents the covered electric wire 3 from being pulled out and detached from the thermoplastic resin body 6, thereby improving the reliability as the thermistor sensor.

  In the above embodiment, the covering portion 3b of the covered electric wire 3 is inserted into the fastening member 5 having a smaller diameter than the outer shape of the covered electric wire 3, and the covering portion 3b of the covered electric wire 3 is removed from the outer periphery. Although the case where it mounted | wore in the clamped state was described, it is not restricted to this manufacturing method.

  5 and 6 show thermistor sensors according to other embodiments, and the same components are denoted by the same reference numerals, and the description thereof is omitted. 5A is a perspective view of the thermistor sensor, FIG. 5B is an exploded perspective view of the thermistor sensor, FIG. 6A is a plan sectional view of the thermistor sensor, and FIG. 6B is the thermistor sensor. The longitudinal cross-sectional side view of a sensor and FIG. 7 (a)-(d) are figures which show the manufacturing process of the thermistor sensor, respectively.

  In the thermistor sensor manufacturing method according to this embodiment, as the thermoplastic resin forming the fastening material 5, a material having a so-called heat shrinkability that shrinks when the temperature decreases after molding, and an injection molding machine (trade name EC100NII, Toshiba). Machined), with the covered wire 3 inserted in advance into the injection molding space of the injection molding machine, injection molding is performed at a cylinder temperature of 310 ° C., and the fastening material 5 comprising a donut-shaped ring on the outer periphery of the covered wire 3 Is made. Thereafter, when the temperature returns to room temperature and the temperature decreases, the tightening material 5 contracts, whereby the tightening material 5 can be manufactured with the outer periphery of the covered electric wire 3 being tightened by the tightening material 5.

  Also with this manufacturing method, the fastening material 5 can be disposed on the outer periphery of the covered electric wire 3 in a state where the covering portion 3b of the covered electric wire 3 is tightened from the entire outer periphery. Even in the case where there is a gap at the interface between the coated electric wire 3 and the thermoplastic resin body 6 covering the coated electric wire 3 in an environment where the fastening material 5 is in close contact and the temperature change is large, the coated electric wire 3 There is no gap in the joint between the fastening member 5 and the fastening material 5. Moreover, when the fastening material 5 and the thermoplastic resin body 6 are made of the same material or a material having high adhesiveness, the fastening material 5 and the thermoplastic resin body 6 are in close contact with each other when the thermoplastic resin body 6 is molded. Therefore, it is possible to prevent a gap from being generated between the fastening material 5 and the thermoplastic resin body 6.

  Therefore, even when moisture permeates from the interface between the coated wire 3 and the thermoplastic resin 6 in an environment with a large temperature change and in a humid environment, the moisture is a joint between the coated wire 3 and the fastening material 5. Thus, it is possible to satisfactorily prevent performance degradation of the thermistor element 1.

  In FIG. 5B, the tightening material 5 and the thermoplastic resin body 6 are shown as a single unit so that the structure of the thermistor sensor 10 can be easily understood. The fastening material 5 is formed in a state of being disposed outside the outer periphery of the covered electric wire 3 at the time of molding, and the thermoplastic resin body 6 is formed in the space portion of the mold in the thermistor element 1, the solder portion 2, and the covering. Since the tip of the electric wire 3, the case body 4, and the fastening material 5 are injected and integrated with these components, they are commercialized in a state where they cannot be separated from the covered electric wire 3 and the case body 4, respectively. The

  In the above-described embodiment, the case where the fastening material 5 is disposed at two locations has been described in any case. However, the present invention is not limited to this. If the fastening material 5 is provided at only one location, the fastening material 5 is tightened. Compared with the case where the material 5 is not provided, the above-described effects are obtained. Note that three or more fastening materials 5 may be provided.

  In the above embodiment, the case where the electronic component is a thermistor element and the electronic component device is a thermistor sensor is described. However, the present invention is not limited to this, and an electronic component other than the thermistor element, such as a coil, is used. The same configuration can be applied to electronic components such as magnetic sensors, proximity sensors, displacement sensors, flow sensors, gas sensors, pressure sensors, or various glass-enclosed parts, motors, batteries, batteries, and similar manufacturing methods. Can be used.

It is a perspective view of the thermistor sensor concerning an embodiment of the invention. It is a disassembled perspective view of the thermistor sensor. (A) is an exploded side view of the thermistor sensor, (b) is a plan sectional view of the thermistor sensor, and (c) is a longitudinal sectional side view of the thermistor sensor. (A)-(e) is a figure which shows the manufacturing process of the thermistor sensor, respectively. (A) is a perspective view of the thermistor sensor which concerns on other embodiment of this invention, (b) is a disassembled perspective view of the thermistor sensor. (A) is a sectional plan view of the thermistor sensor, and (b) is a longitudinal sectional side view of the thermistor sensor. (A)-(d) is a top view which shows the manufacturing process of the thermistor sensor, respectively, and has shown the perspective view in addition to the top view only in (b). (A), (b) is sectional drawing of the conventional thermistor sensor, respectively. It is sectional drawing of the other conventional thermistor sensor.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Thermistor element 2 Solder part 3 Covered electric wire 4 Case body (primary molded product)
5 Tightening material 6 Thermoplastic resin body 10 Thermistor sensor

Claims (7)

An electronic component device comprising: an electronic component; a covered electric wire connected to the electronic component; and a thermoplastic resin body that covers the electronic component and the electronic component connecting side portion of the covered electric wire,
A tightening material for tightening the covering portion of the covered electric wire from the entire outer periphery is provided, and the electronic component and the electronic component connecting side portion of the covered electric wire connected to the electronic component are in the state including the tightening material. An electronic component device covered with a plastic resin body.   2. The electronic component device according to claim 1, wherein the fastening material is made of the same material as the thermoplastic resin body or a material having high adhesion to the thermoplastic resin body.   The electronic component device according to claim 1, wherein the electronic component is a thermistor element. An electronic component and a method of manufacturing an electronic component device in which an electronic component connecting side portion of a covered electric wire connected to the electronic component is covered with a thermoplastic resin body,
Insert the covered wire from the end of this covered part into the fastening material having a diameter smaller than the outer diameter of the covered wire, and attach the tightening material with the covered part of the covered wire tightened from the outer periphery. A method of manufacturing an electronic component device, comprising: covering a component, an electronic component connecting side portion of the covered electric wire, and a fastening material attached to the covered electric wire with the thermoplastic resin body. An electronic component and a method of manufacturing an electronic component device in which an electronic component connection side portion of a covered electric wire connected to the electronic component is covered with a thermoplastic resin body for protection and insulation,
A thermoplastic resin for forming a tightening material having heat shrinkability is formed on the entire outer periphery of the electronic component connecting side portion of the covered portion of the covered electric wire, and the subsequent thermoplastic resin for forming the tightening material is reduced in temperature. By shrinking in the radial direction of the covered electric wire, the fastening material made of the thermoplastic resin for forming the fastening material is mounted in a state where the covered portion of the covered electric wire is tightened from the outer periphery, and then the electronic component and the electronic component are attached. A method of manufacturing an electronic component device, comprising: covering an electronic component connecting side portion of a covered covered electric wire and a fastening material attached to the covered electric wire with the thermoplastic resin body for protection and insulation.   6. The method of manufacturing an electronic component device according to claim 4, wherein the fastening material is made of the same material as the thermoplastic resin body or a material having high adhesion to the thermoplastic resin body. .   The method of manufacturing an electronic component device according to any one of claims 4 to 6, wherein the electronic component is a thermistor element.

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