JP2017174913A - Process liquid cooling apparatus and substrate processing apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a process liquid cooling apparatus capable of cooling high temperature process liquid, discharged from a substrate processing apparatus, efficiently, and to provide a substrate processing apparatus including this process liquid cooling apparatus.SOLUTION: A process liquid cooling apparatus includes a first tank 11 and a second tank 12 for temporarily storing high temperature process liquid, discharged from a substrate processing apparatus via discharge lines 51, 54, 57, and a cooler 13 for cooling the process liquid sent from the first tank 11 or the second tank 12. The process liquid is cooled by one path system using the first tank 11 and the second tank 12 selectively, or a continuous system using the first tank 11 and the second tank 12 continuously.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a processing liquid cooling apparatus that cools a high-temperature processing liquid discharged from a substrate processing apparatus with cooling water, and a substrate processing apparatus including the processing liquid cooling apparatus.

  In substrate processing apparatuses for processing substrates such as glass substrates for organic EL display devices, glass substrates for liquid crystal display devices, panel substrates for solar cells, glass substrates for plasma displays, glass substrates for photomasks, substrates for optical disks, and semiconductor wafers. The processing liquid used for processing the substrate is discharged. The temperature of the processing liquid is, for example, a high temperature of 100 degrees Celsius or higher. Therefore, when the processing liquid is discharged to the waste liquid portion, it is necessary to cool the processing liquid in advance by the processing liquid cooling device. Such a processing liquid cooling apparatus may be disposed inside the substrate processing apparatus, but may be installed as an apparatus different from the substrate processing apparatus.

  Patent Document 1 discloses a substrate processing apparatus having a configuration in which a processing liquid flowing down from a processing tank is stored in a buffer tank, and the processing liquid stored in the buffer tank is cooled by a cooling medium flowing in a spiral tube. ing.

  Patent Document 2 discloses a distillation still that performs heat exchange by passing a high-temperature fluid through a heat-exchange channel formed in a low-temperature fluid.

  Further, Patent Document 3 discloses a substrate processing apparatus that cools a pair of film forming units with a cooling gas flowing through a single circulation line.

Japanese Patent No. 3517135 Japanese Patent No. 4249208 JP 2014-236060 A

  In a conventional substrate processing apparatus, generally, as described in Patent Document 1, a spiral pipe is formed in a high-temperature processing liquid stored in a tank, and cooling water is supplied into the spiral pipe. A configuration is adopted in which the processing liquid is cooled by circulation. However, such a cooling device has a problem that it takes a long time to cool the processing liquid because the cooling efficiency of the processing liquid is poor.

  On the other hand, in the case of adopting a configuration in which a high-temperature treatment liquid is passed through the cooling water as in the cooling mechanism described in Patent Document 2, the cooling efficiency is higher than when cooling water is passed through the high-temperature treatment liquid. Can be improved. However, when the temperature of the treatment liquid is lowered, there arises a problem that even if such a highly efficient cooling mechanism is used, the performance cannot be sufficiently exhibited.

  The present invention has been made to solve the above-described problems, and includes a processing liquid cooling apparatus capable of efficiently cooling a high-temperature processing liquid discharged from a substrate processing apparatus, and the processing liquid cooling apparatus. An object is to provide a substrate processing apparatus.

  According to a first aspect of the present invention, in the cooling device that cools the high-temperature processing liquid discharged from the substrate processing apparatus with cooling water, the high-temperature processing liquid can be stored and the processing liquid is cooled. A first tank and a second tank having a cooling water flow passage; a cooler having a treatment liquid flow passage which stores cooling water therein and passes through the cooling water; the first tank; It is characterized by comprising two tanks, a treatment liquid flow passage in the cooler, and a treatment liquid feed conduit for sending the treatment liquid between the waste liquid portion of the treatment liquid.

  According to a second aspect of the present invention, in the first aspect of the present invention, the pump and the plurality of on-off valves disposed in the liquid supply conduit for the processing liquid, and the control for opening / closing the plurality of on-off valves. And the control unit controls the opening and closing of the plurality of on-off valves, thereby controlling the treatment liquid from one of the first tank and the second tank via the cooler. The processing liquid is sent to the waste liquid part.

  According to a third aspect of the present invention, in the second aspect of the present invention, the substrate processing apparatus is controlled by one of the first tank and the second tank by controlling the opening and closing of the plurality of on-off valves. When receiving the high-temperature processing liquid discharged from the tank, the cooler is removed from the tank receiving the high-temperature processing liquid discharged from the substrate processing apparatus of the first tank and the second tank. Then, the processing liquid is fed to the waste liquid portion of the processing liquid.

  According to a fourth aspect of the present invention, the substrate processing apparatus according to the second aspect of the present invention, wherein the substrate processing apparatus is controlled by one of the first tank and the second tank by controlling the opening and closing of the plurality of on-off valves. When receiving the high temperature processing liquid discharged from the first tank and the second tank, the cooler is removed from the tank not receiving the high temperature processing liquid discharged from the substrate processing apparatus. Then, the processing liquid is fed to the waste liquid portion of the processing liquid.

  According to a fifth aspect of the present invention, in the first aspect of the present invention, a pump and a plurality of on-off valves disposed in the liquid supply conduit for the processing liquid, and a control for controlling the on-off of the plurality of on-off valves. And the controller controls the opening and closing of the plurality of on-off valves, so that the high-temperature processing liquid discharged from the substrate processing apparatus by one of the first tank and the second tank is discharged. A tank that does not receive the high temperature processing liquid discharged from the substrate processing apparatus among the cooler and the first tank and the second tank from the tank that receives the processing liquid when receiving Then, the processing liquid is fed to the waste liquid portion of the processing liquid.

  According to a sixth aspect of the present invention, in the fifth aspect of the present invention, the processing in the tank that does not receive the high temperature processing liquid discharged from the substrate processing apparatus of the first tank and the second tank. The liquid is sent to the waste liquid portion of the processing liquid via the cooler.

  According to a seventh aspect of the invention, in the fifth aspect of the invention, the processing in the tank that has not received the high temperature processing liquid discharged from the substrate processing apparatus of the first tank and the second tank. The liquid is fed directly to the waste liquid portion of the processing liquid.

  According to an eighth aspect of the present invention, in the first aspect of the present invention, a pump and a plurality of on-off valves disposed in the processing liquid supply conduit, and a control for opening / closing the plurality of on-off valves. A high-temperature process discharged from the substrate processing apparatus by one of the first tank and the second tank by controlling the opening and closing of the plurality of on-off valves. An operation of sending the processing liquid from any one of the first tank and the second tank to the waste liquid portion of the processing liquid via the cooler when receiving the liquid; When the high-temperature processing liquid discharged from the substrate processing apparatus is received by one of the first tank and the second tank, the processing liquid is received. From the tank, the cooling And an operation of sending the processing liquid to the waste liquid portion of the processing liquid via the tank that does not receive the high-temperature processing liquid discharged from the substrate processing apparatus among the first tank and the second tank. Are sequentially selected and executed.

  The invention according to claim 9 is the invention according to any one of claims 2 to 8, wherein the temperature sensor that detects the temperature of the processing liquid stored in the first tank, and the second tank stores the temperature. A temperature sensor for detecting the temperature of the treated liquid, a liquid level sensor for detecting the liquid level of the processing liquid stored in the first tank, and a liquid level of the processing liquid stored in the second tank. A liquid level sensor, and the control unit controls opening and closing of the plurality of on-off valves based on the detected values of the temperature sensors and the liquid level sensors.

  A tenth aspect of the present invention is a substrate processing apparatus that supplies a processing liquid to a substrate to process the substrate, and includes the processing liquid cooling apparatus according to any one of the first to ninth aspects.

  According to the first and tenth aspects of the present invention, by using the first tank or the second tank and the cooler, the high-temperature processing liquid discharged from the substrate processing apparatus is efficiently cooled. It becomes possible.

  According to the invention according to any one of claims 2 to 4, the first tank and the second tank are alternately used by the one-pass method in which the first tank and the second tank are selectively used. By preferentially introducing the high temperature processing liquid discharged from the substrate processing apparatus into the cooler, the processing liquid can be efficiently cooled.

  According to the invention described in any one of claims 5 to 7, the high-temperature processing liquid discharged from the substrate processing apparatus is preferentially used by the continuous method in which the first tank and the second tank are continuously used. It is possible to efficiently cool the treatment liquid by introducing it into the cooler.

  According to the eighth aspect of the invention, by switching between the one-pass method and the continuous method, the processing liquid can be efficiently cooled according to the state of the processing liquid discharged from the substrate processing apparatus.

  According to the ninth aspect of the present invention, the processing liquid can be cooled by an appropriate method based on the detection values of the temperature sensor and the liquid level sensor.

It is a schematic diagram of the processing liquid cooling device concerning this invention. It is a block diagram which shows the main control systems of the process liquid cooling device which concerns on this invention. It is explanatory drawing which shows typically the operation | movement which cools a process liquid by a one-pass system. It is explanatory drawing which shows typically the operation | movement which cools a process liquid by a one-pass system. It is explanatory drawing which shows typically the operation | movement which cools a process liquid by a 1st continuous system. It is explanatory drawing which shows typically the operation | movement which cools a process liquid by a 1st continuous system. It is explanatory drawing which shows typically the operation | movement which cools a process liquid by a 2nd continuous system. It is explanatory drawing which shows typically the operation | movement which cools a process liquid by a 2nd continuous system. It is explanatory drawing which shows typically the operation | movement which cools a process liquid combining the one pass system and the 1st continuous system. It is explanatory drawing which shows typically the operation | movement which cools a process liquid combining the one pass system and the 1st continuous system. It is explanatory drawing which shows typically the operation | movement which cools a process liquid combining the one pass system and the 1st continuous system. It is explanatory drawing which shows typically the operation | movement which cools a process liquid combining the one pass system and the 1st continuous system. It is explanatory drawing which shows typically the operation | movement which cools a process liquid combining the one pass system and the 1st continuous system or the 2nd continuous system. It is explanatory drawing which shows typically the operation | movement which cools a process liquid combining the one pass system and the 1st continuous system or the 2nd continuous system.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic view of a processing liquid cooling apparatus according to the present invention.

  The processing liquid cooling apparatus includes a first tank 11 and a second tank 12 that temporarily store and cool high-temperature processing liquid discharged from the substrate processing apparatus via the discharge pipes 51, 54, and 57, and And a cooler 13 that cools the processing liquid sent from one tank 11 or the second tank 12 with high heat exchange efficiency. The processing liquid cooling device may be disposed inside the substrate processing apparatus, or may be installed as an apparatus different from the substrate processing apparatus.

  The discharge pipe 51 is, for example, a SPM (sulfur-acid and hydrogen-peroxide mixture) from a standby pod disposed at a standby position of a discharge nozzle that discharges processing liquid onto a substrate in a plurality of processing units in the substrate processing apparatus. This is for discharging the treatment liquid. Treatment liquid from a plurality of standby pods flows into the discharge pipe 51, and this treatment liquid enters the first tank 11 via the pipe line 52 when the on-off valve 36 is opened and the on-off valve 35 is closed. When the on-off valve 36 is closed and the on-off valve 35 is opened, it flows down to the second tank 12 through the pipe line 53.

  The discharge conduit 54 is for discharging processing liquid such as SPM from a cup that captures processing liquid scattered from the substrate in a plurality of processing units in the substrate processing apparatus, for example. The treatment liquid from a plurality of cups flows into the discharge pipe 54, and the treatment liquid flows down to the first tank 11 through the pipe 55 when the on-off valve 34 is opened and the on-off valve 33 is closed. Then, when the on-off valve 34 is closed and the on-off valve 33 is opened, it flows down to the second tank 12 through the pipeline 56.

  The discharge conduit 57 is for discharging, for example, a processing liquid such as sulfuric acid used for cleaning each processing unit in a plurality of processing units in the substrate processing apparatus. The treatment liquid from the plurality of treatment units flows into the discharge pipe 57, and this treatment liquid enters the first tank 11 through the pipe 58 when the on-off valve 32 is opened and the on-off valve 31 is closed. When the on-off valve 32 is closed and the on-off valve 31 is opened, it flows down to the second tank 12 via the pipe line 59.

  A spiral cooling water flow passage 15 is disposed in the first tank 11. Cooling water is supplied from the cooling water inflow conduit 23 to the cooling water flow passage 15, and the cooling water used for cooling the processing liquid in the first tank 11 is discharged from the cooling water flow passage 15 to the cooling water discharge conduit 24. . Further, a spiral cooling water flow passage 16 is disposed in the second tank 12. Cooling water is supplied from the cooling water inflow conduit 25 to the cooling water flow passage 16, and the cooling water used for cooling the processing liquid in the second tank 12 is discharged from the cooling water flow passage 16 to the cooling water discharge conduit 26. . Furthermore, the cooler 13 can store the coolant, and the coolant is supplied from the coolant inflow pipe 21 into the cooler 13, and is used for cooling the treatment liquid flowing through the spiral treatment liquid flow passage 17. The cooled water thus discharged is discharged from the cooler 13 to the cooling water discharge line 22.

  In addition, although illustration is abbreviate | omitted, in the 1st tank 11 and the 2nd tank 12, the bubbling mechanism which cools and diffuses a process liquid by spraying air in a process liquid is arrange | positioned. . In addition to this bubbling mechanism, a pressure reducing mechanism that promotes cooling of the processing liquid by reducing the pressure in the first tank 11 and the second tank 12 may be provided.

  In the first tank 11 and the second tank 12, it is possible to cool a predetermined amount of the processing liquid in the storage state by the action of the cooling water flow passages 15 and 16. On the other hand, in the cooler 13, it is possible to quickly cool the processing liquid having a small capacity passing through the processing liquid flow passage 17 by the cooling water having a large capacity stored therein.

  The pipe 61 connected to the bottom of the first tank 11 is connected to the lower end of the processing liquid flow passage 17 in the cooler 13 via the on-off valve 41, the pipe 63 and the liquid feed pump 27. Further, the pipe line 62 connected to the bottom of the second tank 12 is connected to the lower end part of the processing liquid flow path 17 in the cooler 13 via the on-off valve 42, the pipe line 63 and the liquid feed pump 27. The opening / closing valve 41 and the opening / closing valve 42 are configured such that when one of them is opened, the other is closed.

  The pipe line 67 connected to the bottom of the first tank 11 is connected to the waste liquid part 14 via the on-off valve 43, the waste liquid pump 28, the on-off valve 45, and the pipe line 69. Further, the pipe line 68 connected to the bottom of the second tank 12 is connected to the waste liquid part 14 via the on-off valve 44, the waste liquid pump 28, the on-off valve 45 and the pipe line 69. In addition, when the process liquid discharged | emitted from the 1st tank 11 and the 2nd tank 12 flows down to the waste liquid part 14 with dead weight, you may abbreviate | omit the waste liquid pump 28. FIG.

  In FIG. 1, the pipeline 61 and the pipeline 67 are connected to the bottom of the first tank 11. However, the pipe 61 and the pipe 67 may be connected to the lower side of the side surface of the first tank 11, and the pipe 61 and the pipe 67 enter the first tank 11 from above the first tank 11. And the structure by which the front-end | tip may be arrange | positioned near the bottom face of the 1st tank 11 may be sufficient. Similarly, in FIG. 1, the pipeline 62 and the pipeline 68 are connected to the bottom of the second tank 12. However, the pipe line 62 and the pipe line 68 may be connected below the side surface of the second tank 12, and the pipe line 62 and the pipe line 68 enter the second tank 12 from above the second tank 12. And the structure by which the front-end | tip is arrange | positioned in the bottom face vicinity of the 2nd tank 12 may be sufficient.

  An outlet portion (upper end portion in the present embodiment) of the processing liquid flow passage 17 in the cooler 13 is routed to the first tank 11 via the on-off valve 38 and the pipe 64, and via the on-off valve 39 and the pipe 65. The second tank 12 is branched into a path that reaches the on-off valve 45 via the on-off valve 37 and the pipe 66 and a path that reaches the waste liquid section 14 via the pipe 69. One of the on-off valve 37, the on-off valve 38, and the on-off valve 39 is selectively opened, and the other two are closed.

  In FIG. 1, the processing liquid passing through the cooler 13 circulates from the lower end portion of the processing liquid flow passage 17 toward the upper end portion, but the processing liquid flow passage 17 is directed from the upper end portion to the lower end portion. You may pass through. Further, the treatment liquid flow passage 17 may be formed not in the vertical direction shown in FIG. 1 but in the horizontal direction.

  When the on-off valve 41 and the on-off valve 37 are opened, the processing liquid in the first tank 11 is piped from the first tank 11 through the processing liquid flow passage 17 in the cooler 13 by the action of the liquid feed pump 27. The liquid is sent to the passage 66 and discharged to the waste liquid section 14 through the on-off valve 45 and the pipe 69. Further, the processing liquid in the first tank 11 passes from the first tank 11 through the processing liquid flow passage 17 in the cooler 13 by the action of the liquid feed pump 27 in a state where the on-off valve 41 and the on-off valve 39 are opened. To the second tank 12. Furthermore, when the on-off valve 43 is opened, the processing liquid in the first tank 11 is discharged to the waste liquid section 14 through the on-off valve 45 and the pipe 69 by the action of the waste liquid pump 28.

  When the on-off valve 42 and the on-off valve 37 are opened, the processing liquid in the second tank 12 is piped from the second tank 12 through the processing liquid flow passage 17 in the cooler 13 by the action of the liquid feed pump 27. The liquid is sent to the passage 66 and discharged to the waste liquid section 14 through the on-off valve 45 and the pipe 69. Further, the processing liquid in the second tank 12 passes from the second tank 12 through the processing liquid flow path 17 in the cooler 13 by the action of the liquid feeding pump 27 in a state where the on-off valve 42 and the on-off valve 38 are opened. To the first tank 11. Furthermore, when the on-off valve 44 is opened, the processing liquid in the second tank 12 is discharged to the waste liquid section 14 through the on-off valve 45 and the pipe 69 by the action of the waste liquid pump 28.

  FIG. 2 is a block diagram showing a main control system of the processing liquid cooling apparatus according to the present invention.

  The processing liquid cooling apparatus includes a CPU that executes logical operations, a ROM that stores an operation program necessary for controlling the apparatus, and a RAM that temporarily stores data during control, and controls the entire apparatus. 90. This control unit is connected to the above-described on-off valve 31, 32, 33, 34, 35, 36, 37, 38, 39, 41, 42, 43, 44, 45, and the valve driving unit 91 for opening and closing. Yes. These on-off valves 31, 32, 33, 34, 35, 36, 37, 38, 39, 41, 42, 43, 44, 45 are controlled to be opened and closed by the control unit 90 via the valve drive unit 91. The control unit 90 is connected to the liquid feed pump 27 and the waste liquid pump 28 described above.

  Although not shown in FIG. 1, the first tank 11 includes a temperature sensor 92 that detects the temperature of the processing liquid stored in the first tank 11 and a liquid level of the stored processing liquid. A liquid level sensor 94 is provided. The second tank 12 is provided with a temperature sensor 93 for detecting the temperature of the processing liquid stored in the second tank 12 and a liquid level sensor 95 for detecting the liquid level of the stored processing liquid. ing. In addition, a temperature sensor 96 for detecting the temperature of the processing liquid discharged through the cooler 13 is disposed on the downstream side of the processing liquid flow passage 17. The controller 90 is also connected to these temperature sensors 92, 93, 96 and liquid level sensors 94, 95.

  As the temperature sensors 92, 93, and 96, a resistance temperature detector, a thermocouple, a sensor that measures temperature by detecting infrared rays emitted from the processing liquid, and the like can be used. As the liquid level sensors 94 and 95, a sensor that measures the height of the liquid by detecting capacitance, an optical sensor, or the like can be used.

  Next, the cooling operation of the processing liquid in the above-described processing liquid cooling apparatus will be described. First, the operation of cooling the processing liquid by the one-pass method that selectively uses the first tank 11 and the second tank 12 will be described. 3 and 4 are explanatory views schematically showing the operation of cooling the processing liquid by the one-pass method. In FIGS. 3 and 4, a region in which the processing liquid flows in the processing liquid feeding path is represented by a bold line. The same applies to the following drawings.

  First, a high-temperature processing liquid is discharged from the substrate processing apparatus to the first tank 11. When the temperature of the processing liquid reaches the first tank 11, it is about 100 degrees Celsius, for example. This processing liquid is stored in the first tank 11. The processing liquid stored in the first tank 11 is gradually cooled by the cooling water passing through the spiral cooling water flow passage 15 disposed in the first tank 11. The cooling water supplied to the cooling water flow passage 15 from the cooling water inflow conduit 23 and used for cooling the processing liquid is discharged from the cooling water flow passage 15 to the cooling water discharge conduit 24. The temperature of the processing liquid in the first tank 11 at this time is detected by the temperature sensor 92 shown in FIG. 2, and the liquid level of the processing liquid is detected by the liquid level sensor 94 shown in FIG.

  If the temperature of the processing liquid stored in the first tank 11 reaches about 80 degrees Celsius, the processing liquid in the first tank 11 is transferred to the waste liquid section 14 via the cooler 13 as shown in FIG. Discharge. The temperature of the processing liquid at this time is lowered to about 35 degrees Celsius by the action of the cooler 13 that efficiently cools the processing liquid. On the other hand, when the processing liquid in the first tank 11 is discharged, the high-temperature processing liquid discharged from the substrate processing apparatus is discharged to the first tank 11. Thereby, a high temperature process liquid can be made to pass through the cooler 13 preferentially. FIG. 3 shows such a state.

  Instead of discharging the high temperature processing liquid discharged from the substrate processing apparatus to the first tank 11, the high temperature processing liquid discharged from the substrate processing apparatus may be discharged to the second tank 12. In the case of adopting such a configuration, the processing liquid can be gradually cooled in the second tank 12 while the total amount of the processing liquid passing through the cooler 13 is being suppressed.

  If all of the processing liquid stored in the first tank 11 is discharged and the temperature of the processing liquid discharged from the substrate processing apparatus and stored in the second tank 12 is about 80 degrees Celsius, as shown in FIG. In addition, the processing liquid in the second tank 12 is discharged to the waste liquid part 14 via the cooler 13. The temperature of the processing liquid at this time is also lowered to about 35 degrees Celsius due to the action of the cooler 13 that efficiently cools the processing liquid. When the processing liquid in the second tank 12 is discharged, the high-temperature processing liquid discharged from the substrate processing apparatus is discharged to the second tank 12 as described above.

  In this way, the high-temperature processing liquid discharged from the substrate processing apparatus is preferentially introduced into the cooler 13 by cooling the processing liquid by the one-pass method using the first tank 11 and the second tank 12 alternately. Thus, the processing liquid can be efficiently cooled.

  Next, another embodiment of the processing liquid cooling operation in the above-described processing liquid cooling apparatus will be described. In the second embodiment, an operation for cooling the processing liquid by a continuous method in which the first tank 11 and the second tank 12 are continuously used will be described. 5 and 6 are explanatory diagrams schematically showing an operation of cooling the processing liquid by the first continuous method.

  From the substrate processing apparatus, the high temperature processing liquid is discharged to the first tank 11. When the temperature of the processing liquid reaches the first tank 11, it is about 150 degrees Celsius, for example. This processing liquid is temporarily stored in the first tank 11. The processing liquid stored in the first tank 11 is gradually cooled by the cooling water passing through the spiral cooling water flow passage 15 disposed in the first tank 11. The cooling water supplied to the cooling water flow passage 15 from the cooling water inflow conduit 23 and used for cooling the processing liquid is discharged from the cooling water flow passage 15 to the cooling water discharge conduit 24. The temperature of the processing liquid in the first tank 11 at this time is detected by the temperature sensor 92 shown in FIG. 2, and the liquid level of the processing liquid is detected by the liquid level sensor 94 shown in FIG.

  The processing liquid temporarily stored in the first tank 11 is stored in the second tank 12 via the cooler 13 as shown in FIG. At this time, the temperature of the processing liquid is lowered to 80 degrees Celsius or less by the action of the cooler 13 that cools the processing liquid with high efficiency. When the temperature of the processing liquid stored in the second tank 12 reaches about 60 degrees Celsius, the processing liquid in the second tank 12 is passed through the cooler 13 as shown in FIG. To discharge. The temperature of the processing liquid at this time is also lowered to about 35 degrees Celsius due to the action of the cooler 13 that efficiently cools the processing liquid.

  Next, still another embodiment of the processing liquid cooling operation in the above-described processing liquid cooling apparatus will be described. Also in the third embodiment, an operation of cooling the processing liquid by a continuous method in which the first tank 11 and the second tank 12 are continuously used will be described. 7 and 8 are explanatory views schematically showing the operation of cooling the processing liquid by the second continuous method.

  From the substrate processing apparatus, the high temperature processing liquid is discharged to the first tank 11. When the temperature of the processing liquid reaches the first tank 11, it is about 100 degrees Celsius, for example. This processing liquid is temporarily stored in the first tank 11. The processing liquid stored in the first tank 11 is gradually cooled by the cooling water passing through the spiral cooling water flow passage 15 disposed in the first tank 11. The cooling water supplied to the cooling water flow passage 15 from the cooling water inflow conduit 23 and used for cooling the processing liquid is discharged from the cooling water flow passage 15 to the cooling water discharge conduit 24. The temperature of the processing liquid in the first tank 11 at this time is detected by the temperature sensor 92 shown in FIG. 2, and the liquid level of the processing liquid is detected by the liquid level sensor 94 shown in FIG.

  The processing liquid temporarily stored in the first tank 11 is stored in the second tank 12 via the cooler 13 as shown in FIG. At this time, the temperature of the processing liquid is lowered to about 50 degrees Celsius by adjusting the amount of processing liquid fed using the cooler 13 that cools the processing liquid with high efficiency. Then, when the temperature of the processing liquid stored in the second tank 12 is lowered to about 35 degrees Celsius, the processing liquid in the second tank 12 is directly discharged to the waste liquid section 14 as shown in FIG.

  As in the second embodiment or the third embodiment, the high-temperature processing liquid discharged from the substrate processing apparatus is preferentially cooled by the continuous method in which the first tank 11 and the second tank 12 are continuously used. 13, it becomes possible to efficiently cool the processing liquid.

  Next, still another embodiment of the processing liquid cooling operation in the above-described processing liquid cooling apparatus will be described. In the fourth embodiment, the processing liquid is cooled by combining the one-pass method and the first continuous method described above. 9 to 12 are explanatory diagrams schematically showing an operation of cooling the processing liquid by combining the one-pass method and the first continuous method.

  In the fourth embodiment, at first, the processing liquid is cooled by a one-pass method in which the first tank 11 and the second tank 12 are alternately used, as in the first embodiment shown in FIGS. 3 and 4. FIG. 9 shows that when the processing liquid is cooled by the one-pass method, the processing liquid in the first tank 11 is discharged to the waste liquid portion 14 via the cooler 13 and is discharged from the substrate processing apparatus. The state which discharges the process liquid of this to the 1st tank 11 is shown.

  In this state, when the temperature of the processing liquid stored in the first tank 11 becomes a temperature that cannot be cooled by the one-pass method (for example, 120 degrees Celsius or more), the cooling method of the processing liquid is changed from the one-pass method to the first one. Switch to continuous mode. That is, when the temperature of the processing liquid stored in the first tank 11 is 120 degrees Celsius or higher, the processing liquid in the first tank 11 is passed through the cooler 13 as shown in FIG. The liquid is sent to the second tank 12. When the processing liquid in the second tank 12 approaches the maximum capacity of the processing liquid in the second tank 12, the processing liquid in the second tank 12 is passed through the cooler 13 as shown in FIG. Then, the liquid is fed to the first tank 11. At this time, switching is performed so that the high-temperature processing liquid discharged from the substrate processing apparatus is discharged to the second tank 12.

  Such an operation is repeated until the temperature of the processing liquid stored in the first tank 11 or the second tank 12 reaches about 80 degrees Celsius. When the processing liquid is cooled by such a continuous method, it takes a longer time to cool the processing liquid than when the processing liquid is cooled by the one-pass method. Need to be reduced.

  If the temperature of the processing liquid stored in the first tank 11 or the second tank 12 is about 50 degrees Celsius, the processing liquid stored in the first tank 11 or the second tank 12 is passed through the cooler 13. Then, it is discharged to the waste liquid part 14. FIG. 12 shows a state in which the processing liquid in the first tank 11 is discharged to the waste liquid part 14 via the cooler 13. At this time, switching is performed so that the high-temperature processing liquid discharged from the substrate processing apparatus is discharged to the first tank 11.

  Next, still another embodiment of the processing liquid cooling operation in the above-described processing liquid cooling apparatus will be described. In the fifth embodiment, the processing liquid is cooled by combining the above-described one-pass method and the first continuous method or the second continuous method. FIG. 13 and FIG. 14 are explanatory diagrams schematically showing an operation of cooling the processing liquid by combining the one-pass method and the first continuous method or the second continuous method.

  In the fifth embodiment, at first, similarly to the first embodiment shown in FIGS. 3 and 4, the processing liquid is cooled by a one-pass method using the first tank 11 and the second tank 12 alternately. FIG. 13 shows that when the processing liquid is cooled by the one-pass method, the processing liquid in the first tank 11 is discharged to the waste liquid portion 14 via the cooler 13 and is discharged from the substrate processing apparatus. The state which discharges the process liquid of this to the 2nd tank 12 is shown.

  In this state, when the amount of the processing liquid stored in the second tank 12 increases, an attempt is made to switch the processing liquid cooling method from the one-pass method to the second continuous method. That is, when the total amount of the processing liquid stored in the first tank 11 and the processing liquid stored in the second tank 12 is larger than the capacity of the first tank 11 or the second tank 12, for example, FIG. As shown in FIG. 2, the processing liquid in the first tank 11 is sent to the second tank 12 via the cooler 13. Then, when the temperature of the processing liquid in the second tank 12 reaches about 35 degrees Celsius, the processing liquid in the second tank 12 is directly discharged to the waste liquid section 14 as shown in FIG.

  On the other hand, when the temperature of the processing liquid in the second tank 12 is not sufficiently lowered, the cooling method is switched to the first continuous method. That is, when the processing liquid in the second tank 12 approaches the capacity of the processing liquid in the second tank 12, the processing liquid in the second tank 12 is sent to the first tank 11 via the cooler 13. Liquid. Such an operation is repeated until the temperature of the processing liquid stored in the first tank 11 or the second tank 12 reaches about 50 degrees Celsius. If the temperature of the processing liquid stored in the first tank 11 or the second tank 12 is about 50 degrees Celsius, the processing liquid stored in the first tank 11 or the second tank 12 is passed through the cooler 13. Then, it is discharged to the waste liquid part 14.

  By switching between the one-pass method and the continuous method as in the fourth embodiment or the fifth embodiment, the processing liquid can be efficiently cooled according to the state of the processing liquid discharged from the substrate processing apparatus. Become.

  In addition, instead of cooling the processing liquid by the first tank 11 and the second tank 12 using the above-described one-pass method or the continuous method, the relatively high temperature processing liquid is used in the first tank 11 and the second tank 12. A configuration may be adopted in which the liquid is discharged to one tank and the relatively low temperature processing liquid is discharged to the other of the first tank 11 and the second tank 12.

  Further, when a large amount of processing liquid is discharged from the substrate processing apparatus at a time, the processing liquid may be discharged to both the first tank 11 and the second tank 12.

  Further, in the above-described embodiment, the processing liquid is cooled using the first tank 11 and the second tank 12 and the cooler, but the processing liquid is used using three or more tanks and the coolers. You may make it cool.

DESCRIPTION OF SYMBOLS 11 1st tank 12 2nd tank 13 Cooler 14 Waste liquid part 15 Cooling water flow path 16 Cooling water flow path 17 Processing liquid flow path 21 Cooling water inflow conduit 22 Cooling water discharge conduit 23 Cooling water inflow conduit 24 Cooling water discharge conduit 25 Cooling water inflow pipe 26 Cooling water discharge pipe 27 Liquid feed pump 28 Waste liquid pump 92 Temperature sensor 93 Temperature sensor 94 Liquid level sensor 95 Liquid level sensor 96 Temperature sensor

Claims (10)

In the cooling device that cools the high-temperature processing liquid discharged from the substrate processing apparatus with cooling water,
A first tank and a second tank capable of storing the high-temperature processing liquid and provided with a cooling water flow passage for cooling the processing liquid;
A cooler having a treatment liquid flow passage that stores cooling water therein and passes through the cooling water;
A treatment liquid feed line for sending a treatment liquid between the first tank, the second tank, a treatment liquid flow passage in the cooler, and a waste liquid portion of the treatment liquid;
A treatment liquid cooling apparatus comprising: The substrate cooling apparatus according to claim 1,
A pump and a plurality of on-off valves disposed in the liquid supply pipe for the treatment liquid;
A controller that controls opening and closing of the plurality of on-off valves,
The control unit controls the opening and closing of the plurality of on-off valves, thereby supplying the processing liquid from one of the first tank and the second tank to the waste liquid part of the processing liquid via the cooler. A processing liquid cooling device that sends liquid. The substrate cooling apparatus according to claim 2, wherein
By controlling the opening and closing of the plurality of on-off valves, the first tank and the second tank receive the high-temperature processing liquid discharged from the substrate processing apparatus by one of the first tank and the second tank. Cooling of the processing liquid from the tank receiving the high-temperature processing liquid discharged from the substrate processing apparatus of the tank and the second tank to the waste liquid portion of the processing liquid via the cooler apparatus. The substrate cooling apparatus according to claim 2, wherein
By controlling the opening and closing of the plurality of on-off valves, the first tank and the second tank receive the high-temperature processing liquid discharged from the substrate processing apparatus by one of the first tank and the second tank. Cooling of the processing liquid from the tank that does not receive the high-temperature processing liquid discharged from the substrate processing apparatus of the tank and the second tank to the waste liquid portion of the processing liquid via the cooler apparatus. The substrate cooling apparatus according to claim 1,
A pump and a plurality of on-off valves disposed in the liquid supply pipe for the treatment liquid;
A controller that controls opening and closing of the plurality of on-off valves,
When the control unit receives the high-temperature processing liquid discharged from the substrate processing apparatus by one of the first tank and the second tank by controlling the opening and closing of the plurality of on-off valves, From the tank receiving the processing liquid, through the cooler and the tank not receiving the high temperature processing liquid discharged from the substrate processing apparatus of the first tank and the second tank, A processing liquid cooling device that sends the processing liquid to a waste liquid portion of the processing liquid. The substrate cooling apparatus according to claim 5, wherein
The processing liquid in the tank that has not received the high-temperature processing liquid discharged from the substrate processing apparatus of the first tank and the second tank is sent to the waste liquid portion of the processing liquid via the cooler. Treatment liquid cooling device. The substrate cooling apparatus according to claim 5, wherein
Cooling of the processing liquid that directly sends the processing liquid in the tank that has not received the high temperature processing liquid discharged from the substrate processing apparatus of the first tank and the second tank to the waste liquid portion of the processing liquid. apparatus. The substrate cooling apparatus according to claim 1,
A pump and a plurality of on-off valves disposed in the liquid supply pipe for the treatment liquid;
A controller that controls opening and closing of the plurality of on-off valves,
When the control unit receives high-temperature processing liquid discharged from the substrate processing apparatus by one of the first tank and the second tank by controlling opening and closing of the plurality of on-off valves. In addition, an operation of sending the processing liquid from one of the first tank and the second tank to the waste liquid portion of the processing liquid via the cooler, and opening / closing control of the plurality of on-off valves Thus, when the high temperature processing liquid discharged from the substrate processing apparatus is received by one of the first tank and the second tank, the cooler is received from the tank receiving the processing liquid. And an operation of sending the processing liquid to the waste liquid portion of the processing liquid via the tank that does not receive the high-temperature processing liquid discharged from the substrate processing apparatus among the first tank and the second tank. When Executes sequentially selects processing liquid cooling device. In the processing liquid cooling device in any one of Claims 2-8,
A temperature sensor for detecting the temperature of the processing liquid stored in the first tank;
A temperature sensor for detecting the temperature of the processing liquid stored in the second tank;
A liquid level sensor for detecting a liquid level of the processing liquid stored in the first tank;
A liquid level sensor for detecting the liquid level of the processing liquid stored in the second tank;
Further comprising
The control unit is a processing liquid cooling apparatus that controls opening and closing of the plurality of on-off valves based on detection values of the temperature sensors and the liquid level sensors. A substrate processing apparatus for processing a substrate by supplying a processing liquid to the substrate,
A substrate processing apparatus comprising the processing liquid cooling device according to claim 1.

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