JP2017152649A - Metal mask, printing jig, and method of manufacturing electronic substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a metal mask capable of forming a solder fillet between a terminal of component side face and the pad of a substrate, and to provide a print jig, and a method of manufacturing an electronic substrate.SOLUTION: A metal mask has an opening 24D provided in the lower mask surface 24C covering the lower surface 14A of a component 14, and located at a part corresponding to the lower surface terminal 16A exposed to the lower surface 14A, and a recess 22E provided in the side mask surface 22D covering the side face 14B of the component 14, located at a part corresponding to the side terminal 16B formed on the side face 14B continuously to the lower surface terminal 16A, and connected with the opening 24D.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a metal mask for applying cream solder to a component, a printing jig, and a method for manufacturing an electronic substrate.

  Patent Document 1 discloses a technique for performing solder printing using a metal mask having an alignment hole and a printed board having a pad for forming an alignment reference protrusion. In this technique, the metal mask opening can be aligned with the solder printing position of the printed circuit board by aligning the alignment hole of the metal mask with the alignment protrusion.

JP 2005-223230 A

  An object of this invention is to provide the manufacturing method of the metal mask which can apply | coat cream solder to the terminal of a component side surface, a printing jig, and an electronic substrate.

  The metal mask according to claim 1 is provided on a lower mask surface that covers a lower surface of a component, and is provided on an opening portion that is located in a portion corresponding to the lower surface terminal portion exposed on the lower surface, and a side mask surface that covers a side surface of the component. A recessed portion that is provided at a portion corresponding to the side surface terminal portion formed on the side surface continuously to the lower surface terminal portion and connected to the opening.

  According to a second aspect of the present invention, there is provided a printing jig according to the first aspect, the metal mask according to the first aspect, a nest in which the component is set and the component is positioned on the metal mask, and the nest and the metal mask are fixed in a positioned state. And a frame.

  According to a third aspect of the present invention, there is provided an electronic substrate manufacturing method comprising: printing a cream solder on the component using the metal mask according to the first aspect or the printing jig according to the second aspect; and the cream solder is printed. Placing the component on a substrate and soldering the component to the substrate.

  In the metal mask of claim 1, cream solder can be applied to the terminal on the side surface of the component.

  The printing jig of claim 2 can position the component on the metal mask only by fixing the insert and the metal mask with a frame and setting the component in the insert.

  According to a third aspect of the present invention, there is provided an electronic substrate manufacturing method in which a solder fillet is formed between a side terminal portion of a component and a pad of the substrate.

It is sectional drawing which shows the printing jig | tool of embodiment. (A) is a side view which shows the components used by embodiment, (B) is a bottom view of the components used by embodiment. It is a top view which shows the nesting of embodiment. It is a top view which shows the 1st mask plate of embodiment. It is a top view which shows the 2nd mask plate of embodiment. It is explanatory drawing which shows the printing process of embodiment. It is explanatory drawing which shows the soldering process of embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a view showing a printing jig 12 provided with a metal mask 10 according to the present embodiment. This printing jig 12 is a jig used when paste-like cream solder is applied to the terminals of a component 14. It is.

(parts)
FIG. 2 is a diagram showing a component 14 to be soldered to a substrate (bare board), and the component 14 is formed of a thin and rectangular package. The component 14 can be exemplified by a QFN (Quad Flat No Lead Package) type electronic component in which leads do not extend from the package. On the lower surface 14A of the component 14, a rectangular lower surface terminal portion 16A constituting the terminal 16 of the component 14 is exposed at the edge of each side.

  Moreover, the rectangular side surface terminal part 16B which comprises the terminal 16 is exposed from the side surface 14B of the component 14, and the side surface terminal part 16B is continuously formed in the corresponding lower surface terminal part 16A. In this manner, the component 14 is formed with a plurality of terminals 16 that are exposed in a L-shaped cross section from the lower surface 14A to the side surface 14B.

(Printing jig)
As shown in FIG. 1, the printing jig 12 includes a frame 18, and a nesting 20 and a metal mask 10 that are detachably set on the frame 18. The metal mask 10 includes a first mask plate 22 disposed on the nesting 20 side and a second mask plate 24 stacked on the first mask plate 22.

  The frame body 18 includes a rectangular frame-shaped frame body 26, a rectangular frame-shaped lid body 28 that is stacked on the front surface 26 </ b> H side of the frame body 26, and a back surface that is stacked on the back surface 26 </ b> R side of the frame body 26. And a lid 30. The frame body 26, the lid body 28, and the back lid 30 are connected by a hinge 32, and are configured to be relatively rotatable about a rotation shaft 32 </ b> A of the hinge 32. Accordingly, the lid body 28 and the back lid 30 can be opened and closed with respect to the frame main body 26.

(Frame body)
A rectangular body opening 26A is formed at the center of the frame body 26, and a step 26B is formed on the surface 26H of the frame body 26 so as to be recessed along the opening edge of the body opening 26A. Yes. The step portion 26B is formed in a size that can accommodate the insert 20 and the metal mask 10, and is configured so that the received insert 20 and the metal mask 10 can be positioned.

(Lid)
A rectangular lid opening 28A is formed in the center of the lid 28, and the metal mask 10 supported by the frame body 26 in a state where the lid 28 is overlapped on the surface 26H of the frame body 26. It is comprised so that the part except the peripheral part of can be exposed. Countersink holes 28B and screw-through holes 28C are formed at corners located on the diagonal line of the lid 28 (only one is shown in FIG. 1), and the fixing screw 36 can be passed therethrough.

  Thus, the fixing screw 36 described later is screwed into the screw hole 26 </ b> C of the frame body 26 through the insert 20 and the metal mask 10, so that the insert 20 and the metal mask 10 are positioned between the frame body 26 and the lid body 28. It is configured to be fixed.

(Back cover)
A rectangular back cover opening 30A is formed at the center of the back cover 30, and the nesting 20 supported by the frame body 26 is placed in a state where the back cover 30 is overlaid on the back surface 26R of the frame body 26. It is configured to be exposed. An open / close screw 38 is rotatably held on the free end side of the back cover 30, and the open / close screw 38 is rotated by rotating the open / close screw 38 with the back cover 30 overlapped on the back surface 26 </ b> R of the frame body 26. The screw 38 is configured to be screwed into the screw hole 26 </ b> D of the frame body 26. Thereby, it is comprised so that the state which closed the back cover 30 and was fixed to the frame main body 26 can be formed.

  A tongue piece 30B extending toward the center side of the back cover opening 30A is formed at the opening edge of the back cover opening 30A in the back cover 30. The tongue piece 30B is formed to be thinner than the back cover 30, and a screw hole 30C is provided at a portion of the tongue piece 30B located at the center of the back cover opening 30A. A presser screw 40 is screwed into the screw hole 30C, and the amount of protrusion toward the frame body 26 at the tip of the screw portion 40A can be adjusted by the screwing amount of the presser screw 40.

(Nested)
As shown in FIGS. 1 and 3, the insert 20 is formed of a rectangular metal plate, and a positioning notch 20 </ b> A is formed at one corner. The notch 20A is set in accordance with a positioning portion (not shown) provided in the frame body 18 so that the fixing direction to the frame body 18 is determined. Further, the insert 20 is formed with through holes 20B at four corners so that the fixing screw 36 described above can be passed therethrough.

  A positioning opening 20 </ b> C is formed at the center of the insert 20. The positioning opening 20C is formed in a rectangular shape that matches the component 14 to which the cream solder is to be applied, and as shown by a broken line in FIG. 3, a central opening 20D having a size suitable for the component 14 is provided. have.

  The opening edge surrounding the central opening 20D is formed with an extended portion 20E extending outside the central opening 20D on each side, and the component 14 set in the central opening 20D is centered on the side surface 14B. It is positioned by being supported by a corner 20F formed by the opening edge of the opening 20D.

  As shown in FIGS. 2 and 3, the width dimensions H1 and H2 of each expansion portion 20E are based on the dimensions T1 and T2 from the terminal 16 at one end to the terminal 16 at the other end provided on the corresponding side surface 14B of the component 14. Is also widely set. Thereby, when taking out the component 14 from the nest | insert 20, it is comprised so that the cream solder applied to the side surface terminal part 16B may not interfere with the opening edge of the positioning opening part 20C.

(First mask plate)

  As shown in FIGS. 1 and 4, the first mask plate 22 is formed in a rectangular plate shape, and a notch 22A for positioning is formed at one corner. By setting the notch 22A in accordance with a positioning portion (not shown) provided in the frame body 18, the fixing direction to the frame body 18 and the positional relationship with the insert 20 are determined. Further, the first mask plate 22 is provided with through holes 22B at four corners so that the fixing screw 36 described above can be passed therethrough.

  A component insertion hole 22 </ b> C is formed at the center of the first mask plate 22. The component insertion hole 22C is formed in a rectangular shape suitable for the component 14 to which cream solder is to be applied, and is configured so that the component 14 can be inserted. An opening edge facing the inside of the component insertion hole 22C constitutes a side mask surface 22D that covers the side surface 14B of the component 14 inserted into the component insertion hole 22C. In the side mask surface 22D, a plurality of rectangular recesses 22E for expanding the component insertion holes 22C are formed at portions corresponding to the side terminal portions 16B of the component 14 to be inserted. Openings (through) are made on both sides of the mask plate 22.

(Second mask plate)
As shown in FIGS. 1 and 5, the second mask plate 24 is formed in a rectangular plate shape, and a notch 24A for positioning is formed at one corner. The notch 24A is set in accordance with a positioning portion (not shown) provided in the frame 18 so that the fixing direction to the frame 18 and the positional relationship with the insert 20 and the first mask plate 22 are determined. Has been. Accordingly, the second mask plate 24 can be positioned with respect to the component 14 positioned in the insert 20. The second mask plate 24 is provided with through holes 24B at the four corners so that the fixing screw 36 described above can be passed therethrough.

  As shown in FIG. 1, the back surface of the second mask plate 24 is configured to be in close contact with the lower surface 14 </ b> A of the component 14 set in the insert 20. A lower mask surface 24C to be covered is configured. In the second mask plate 24, a rectangular opening 24 </ b> D is formed at a portion corresponding to the lower surface terminal portion 16 </ b> A (see FIG. 2) exposed on the lower surface 14 </ b> A of the component 14 with the component 14 set in the insert 20. Each opening 24D passes through the second mask plate 24.

  The width dimension H5 of each opening 24D is set to be substantially the same as the width dimension H6 of the lower surface terminal portion 16A, as shown in FIGS. The length dimension S1 in the direction away from the center of the second mask plate 24 is set longer than the length dimension S2 of the lower surface terminal portion 16A. The length dimension S1 is set to a length obtained by adding the length dimension S2 of the lower surface terminal portion 16A and the depth dimension S3 of the recess 22E formed in the first mask plate 22 (see FIG. 4).

  As a result, as shown in FIG. 1, in the state where the second mask plate 24 is laminated on the first mask plate 22 in which the component 14 is inserted, the gap formed between the component 14 and the recess 22E is the second. It is configured to be connected to the opening 24D of the mask plate 24.

<Electronic board manufacturing method>
An electronic board manufacturing method for manufacturing an electronic board by mounting the component 14 on the board will be described below. In the present embodiment, a description will be given by taking as an example a manufacturing method in a repair process in which a component 14 is determined to be defective when the electronic board on which the component 14 is mounted is inspected, and the component 14 is replaced with a non-defective product. However, the present invention is not limited to this. For example, a method of manufacturing an electronic board in which the component 14 is newly mounted on the board may be used.

(Metal mask setting process)
As shown in FIG. 1, when setting the metal mask 10 or the like on the printing jig 12, the fixing screw 36 is removed from the frame 18 and the lid 28 is opened. And the nest | insert 20, the 1st mask plate 22, and the 2nd mask plate 24 are accommodated in order in the level | step-difference part 26B of the frame main body 26, and are laminated | stacked. In this state, the lid 28 is closed, and the fixing screw 36 is screwed into the screw hole 26 </ b> C of the frame body 26 through the insert 20, the first mask plate 22, and the second mask plate 24. As a result, the insert 20, the first mask plate 22, and the second mask plate 24 are fixed in a state of being positioned by being sandwiched between the frame body 26 and the lid body 28.

(Parts setting process)
Then, the opening / closing screw 38 of the back cover 30 is loosened to open the back cover 30, and the non-defective part 14 is set in the positioning opening 20 </ b> C of the nest 20 exposed from the main body opening 26 </ b> A of the frame body 26. At this time, the lower surface 14A where the lower surface terminal portion 16A is exposed is arranged toward the second mask plate 24 side.

  Next, after closing the back cover 30 and screwing the open / close screw 38 to fix the back cover 30 to the frame body 26, the presser screw 40 of the tongue piece 30B is screwed in, and the lower surface of the component 14 set at the tip of the screw portion 40A. 14A is brought into close contact with the second mask plate 24.

(Printing process)
Then, as shown in FIG. 6, the printing jig 12 is arranged with the lid 28 facing up, and the cream solder 50 is supplied onto the second mask plate 24 from the lid opening 28 </ b> A of the lid 28. By moving the cream solder 50 along the second mask plate 24 with the squeegee 52, the cream solder 50 is filled in all the openings 24D of the second mask plate 24.

  At this time, the opening 24D is provided at a portion corresponding to the lower surface terminal portion 16A of the component 14. For this reason, the cream solder 50 filled in the opening 24D is applied to the lower surface terminal portion 16A.

  The first mask plate 22 stacked on the second mask plate 24 is provided with a recess 22E at a portion corresponding to the side terminal portion 16B of the component 14, and the recess 22E is formed on the second mask plate 24. It is connected to the opening 24D. For this reason, the cream solder 50 in the opening 24D is also filled in the recess 22E and applied to the side terminal portion 16B of the component 14. Thereby, the cream solder 50 is applied to the lower surface terminal portion 16A and the side surface terminal portion 16B of the terminal 16 of the component 14.

  In this state, the back cover 30 is turned up, the open / close screw 38 is loosened to open the back cover 30, and the frame 18 is set in a repair device (not shown). In this repair device, the component 14 set in the positioning opening 20C of the insert 20 is sucked by a repair nozzle (suction nozzle) and pulled out straight in the opening direction of the positioning opening 20C.

  At this time, the opening 20C for positioning of the insert 20 is formed with an extended portion 20E that extends outward from the central opening 20D in which the component 14 is set. For this reason, interference between the cream solder 50 applied to the side terminal portion 16B of the component 14 and the opening edge of the positioning opening 20C is prevented. Thereby, detachment | leave of the cream solder 50 apply | coated to the side surface terminal part 16B of the component 14 is suppressed.

(Soldering process)
As shown in FIG. 7, the component 14 is arranged at a portion of the substrate 54 from which the defective component has been removed, and is heated by hot air while covering the component 14 and being isolated from the surrounding mounted components. As a result, the cream solder 50 applied to the terminals 16 of the component 14 is melted and reflow soldered to the pads 56 of the substrate 54.

  At this time, the cream solder 50 is applied to the terminal 16 of the component 14 also to the side terminal portion 16B exposed to the side surface 14B. For this reason, the solder 58 is provided between the side surface terminal portion 16B exposed on the side surface 14B and the pad 56 of the substrate 54, and the solder fillet 60 is formed.

  As described above, in this embodiment, the cream solder 50 is simply applied from the opening 24D provided in the metal mask 10 to the lower surface terminal portion 16A of the lower surface 14A of the component 14 and the side surface terminal portion 16B of the side surface 14B. Cream solder 50 can be applied.

  For this reason, when performing reflow soldering, a solder fillet 60 can be formed between the side terminal portion 16B of the component 14 and the pad 56 of the substrate 54. Thereby, compared with the case where only the lower surface terminal portion 16A is soldered to the pad 56 by the cream solder 50 applied only to the lower surface terminal portion 16A, the bonding failure can be suppressed, and the pass rate at the time of inspection can be increased. Can be increased.

  Further, in the printing jig 12 of the present embodiment, in a state where the insert 20 and the metal mask 10 are fixed by the frame body 18, the component 14 is positioned on the metal mask 10 only by setting the component 14 in the insert 20. Can do. Thereby, compared with the case where the cream solder 50 has to be applied while positioning the component 14 on the metal mask 10, the application of the cream solder 50 is facilitated.

  And according to the manufacturing method of the electronic substrate of this embodiment, the electronic substrate 62 in which the solder fillet 60 is formed between the side terminal portion 16B of the component 14 and the pad 56 of the substrate 54 can be manufactured.

  In the present embodiment, the case where the metal mask 10 includes the first mask plate 22 and the second mask plate 24 has been described as an example, but the present invention is not limited to this. For example, the metal mask 10 may be formed of a single plate. In this case, the side mask surface that covers the side surface 14B of the component 14 and the opening 24D is provided in the lower mask surface 24C that covers the lower surface 14A of the component 14. A recess 22E connected to the opening 24D is provided in 22D.

DESCRIPTION OF SYMBOLS 10 Metal mask 12 Printing jig | tool 14 Component 14A Lower surface 14B Side surface 16A Lower surface terminal part 16B Side surface terminal part 18 Frame 20 Nesting 22D Side mask surface 22E Recessed part 24C Lower mask surface 24D Opening part 50 Cream solder 54 Substrate

Claims (3)

An opening that is provided on a lower mask surface that covers the lower surface of the component and is located at a portion corresponding to the lower surface terminal portion exposed on the lower surface;
A concave portion that is provided on a side mask surface that covers the side surface of the component, is located at a portion corresponding to the side surface terminal portion formed on the side surface continuously to the lower surface terminal portion, and is connected to the opening;
Metal mask with A metal mask according to claim 1;
A nesting that sets the part and positions the part on the metal mask;
A frame for fixing the insert and the metal mask in a positioned state;
Having a printing jig. Printing cream solder on the component using the metal mask according to claim 1 or the printing jig according to claim 2;
Placing the component printed with the cream solder on a substrate, and soldering the component to the substrate;
The manufacturing method of the electronic substrate which has this.