JP2017142127A - Inspection apparatus, inspection method, and inspection program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inspection apparatus, an inspection method, and an inspection program, capable of efficiently performing inspection of a collective substrate including a plurality of substrates to be inspected, including inspection of the substrate to be inspected which is cut into pieces and without causing an increase in cost.SOLUTION: An inspection apparatus includes: a plurality of conductors 32 in contact with each of contact points 56 arranged in each of a plurality of substrates to be inspected 82 included in a collective substrate 80; and inspection means by which detection using a plurality of conductors 32 is executed, all of the plurality of substrates to be inspected 82 are inspected when electrical characteristics predetermined by a plurality of contact points 56 in the plurality of contact points 56 are detected, and a piece substrate 100 on which the contact points 56 are arranged is inspected when the electrical characteristics predetermined by one contact point 56 is detected.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an inspection apparatus, an inspection method, and an inspection program.

  In Patent Document 1, a collective substrate in which a plurality of inspected substrates are gathered in a predetermined arrangement state, and a pseudo substrate different from the inspected substrate is arranged instead of at least one inspected substrate of the collective substrate An inspection apparatus comprising: a determination unit that determines whether or not an inspection target is a pseudo substrate, and an inspection unit that inspects a substrate to be inspected other than the pseudo substrate determined by the determination unit when inspecting the pseudo aggregate substrate Is disclosed.

Japanese Patent No. 5392430

  The present invention provides an inspection apparatus and inspection method capable of efficiently inspecting a collective substrate including a plurality of substrates to be inspected, including inspecting singulated substrates to be inspected without causing an increase in cost. And to provide an inspection program.

  In order to achieve the above object, an inspection apparatus according to claim 1 includes a plurality of electric current bodies that contact each of contact points arranged on each of a plurality of substrates to be inspected included in a collective substrate; When detection using a current-carrying body is performed and predetermined electrical characteristics are detected at a plurality of contact points among the plurality of contact points, all of the plurality of substrates to be inspected are inspected. And inspection means for inspecting a substrate to be inspected on which the contact point is arranged when the predetermined electrical characteristic is detected at the contact point.

  According to a second aspect of the present invention, in the first aspect of the present invention, the inspection means uses the plurality of electrical conductors to determine a potential difference between each of the plurality of contact points and a reference potential of the inspection apparatus. When the detected potential difference is within a predetermined range, the predetermined electrical characteristic is detected.

  The invention according to claim 3 is the invention according to claim 1, wherein each of the contact points is connected to a terminal of a component mounted on the board to be inspected, and the inspection means includes Detection of electrical characteristics at the terminal is performed using a plurality of electrical conductors, and the predetermined electrical characteristics are detected when the detected electrical characteristics are within a predetermined range. .

  The invention according to claim 4 is the invention according to claim 1, wherein the contact point is a pair of contact points including two contact points, and the conductive member is a pair of conductive members including two conductive members. In addition, the inspection means performs detection using the electric conductor by bringing each of the plurality of electric conductor pairs into contact with each of the plurality of contact point pairs.

  According to a fifth aspect of the present invention, in the invention of the fourth aspect, each of the contact point pairs is connected to a terminal pair of a component mounted on the substrate to be inspected, and the inspection means includes , Detecting electrical characteristics of the terminal pairs using a plurality of the current-carrying conductor pairs, and detecting the predetermined electrical characteristics when the detected electrical characteristics are within a predetermined range To do.

  According to a sixth aspect of the present invention, in the fifth aspect of the present invention, the component is a resistor, and the electrical characteristic is a resistance value.

  The invention according to claim 7 is the invention according to any one of claims 1 to 6, wherein a part of the plurality of conductors is one of the substrates to be inspected. A contact point disposed on a surface, and another part of the plurality of current-carrying members contacts a contact point disposed on the other surface of the substrate to be inspected, and the part of the current-carrying members And the other current-carrying members are not opposed to each other.

  In order to achieve the above object, an inspection method according to claim 8 includes an inspection apparatus including a plurality of electric current bodies that contact each of contact points arranged on each of a plurality of substrates to be inspected included in a collective substrate. In the inspection method used, when the detection using the plurality of current-carrying members is performed and a predetermined electrical characteristic is detected at a plurality of contact points among the plurality of contact points, the plurality of contact points are detected. All the substrates to be inspected are inspected, and when the predetermined electrical characteristics are detected at one contact point, the substrate to be inspected on which the contact points are arranged is inspected.

  In order to achieve the above object, an inspection program according to claim 9 includes an inspection apparatus including a plurality of electric current bodies that contact each of contact points arranged on each of a plurality of substrates to be inspected included in a collective substrate. A program for controlling, wherein the computer executes detection using the plurality of current-carrying members, and when predetermined electrical characteristics are detected at a plurality of contact points among the plurality of contact points, Inspecting all of a plurality of substrates to be inspected and, when the predetermined electrical characteristics are detected at one contact point, function as inspection means for inspecting the substrate to be inspected on which the contact points are arranged Is.

  According to the first, seventh, and eighth aspects of the invention, it is possible to increase the cost by inspecting the collective substrate including a plurality of inspected substrates, including inspecting the inspected substrates to be separated. There is an effect that it is possible to provide an inspection apparatus, an inspection method, and an inspection program that can be performed efficiently without incurring.

  According to the second aspect of the present invention, it is possible to obtain an effect that the detection system is simplified as compared with the case where the potential difference between the current-carrying members is detected.

  According to the third aspect of the present invention, compared with the case of using the contact point connected to the wiring pattern, the electrical characteristics of the component are inspected in addition to the discrimination between the collective substrate and the individual substrate. The effect of is obtained.

  According to the fourth aspect of the present invention, compared to the case where a single contact point and a current-carrying member are used, not only the electrical characteristics with respect to the reference potential but also the potential difference between the arbitrary contact points and the components such as the resistance value. It is possible to obtain an effect of detecting the characteristic value of.

  According to the invention described in claim 5, compared to the case where the electrical characteristics of a single terminal of a component are detected by a single current-carrying member, the types of electrical characteristics to be detected are further expanded. An effect is obtained.

  According to the invention described in claim 6, since the resistance value is detected by measuring the voltage and current as compared with the case of using a component other than the resistor, there is no need to use a special measurement system. Is obtained.

  According to the seventh aspect of the present invention, the inspection of both sides of the substrate to be inspected is performed at a time as compared with the case where only the electric current body that contacts the contact point arranged on one surface of the substrate to be inspected is used. In addition, there is an effect that erroneous determination in detection of an inspection object is reduced as compared with a case where some of the current-carrying members and other part of the current-carrying members face each other. .

It is a schematic block diagram which shows an example of a structure of the test | inspection apparatus which concerns on embodiment. It is a block diagram which shows an example of the electrical structure of the test | inspection apparatus which concerns on embodiment. It is a top view which shows an example of the collective board which concerns on embodiment, and an individual board | substrate. It is a perspective view which shows the arrangement | positioning state of the test | inspection apparatus which concerns on embodiment. It is a flowchart which shows the flow of a process of the board | substrate inspection processing program which concerns on embodiment.

  The inspection apparatus, inspection method, and inspection program according to the present embodiment will be described in detail below with reference to FIGS. In the following description, an example in which the inspection apparatus according to the present embodiment is applied to a so-called in-circuit tester that inspects a printed wiring board on which components are mounted will be described.

(Schematic configuration of inspection equipment)
FIG. 1 shows a schematic configuration of an inspection apparatus 12 according to the present embodiment. As shown in the figure, the inspection apparatus 12 according to the present embodiment includes a computer 18, an operation unit 20, a display unit 22, a cable 28, and an inspection jig 30. A portion including the computer 18, the operation unit 20, and the display unit 22 constitutes a main body portion of the inspection apparatus 12. Details of the computer 18 will be described later.

  The inspection jig 30 includes an upper inspection jig 30A and a lower inspection jig 30B. The upper inspection jig 30 </ b> A has a plurality of probe pins (electrical conductors) 32 whose tips extend and contract, and the probe pins 32 are connected to the main body of the inspection apparatus 12 by cables 28.

  The lower inspection jig 30B places and fixes a printed wiring board 40 (inspected board) as an inspection target on which electronic components 42a, 42b and the like are mounted. In the inspection jig 30 according to the present embodiment, the printed wiring board 40 is disposed on the lower inspection jig 30B, and the probe pins 32 of the upper inspection jig 30A are inspected on the printed wiring board 40 (contact points: The inspection is performed by touching an electrical signal input / output point for inspection.

  More specifically, a plurality of solder portions 44 as contact points are formed on the printed wiring board 40, the probe pins 32 are brought into contact with the solder portions 44, and electric signals are transmitted via the probe pins 32. Various tests are performed by applying or detecting.

  The contents of the inspection include, for example, checking the power supply voltage on the printed wiring board 40, opening of the solder, short circuit failure, failure due to incorrect constants such as resistance and capacitor, defective parts such as resistance and capacitor, IC, For example, lead floating failure of a connector or the like, operation check (function test) of a diode or the like can be cited. In the present embodiment, the embodiment in which the solder portion 44 is applied as the contact point has been described as an example. However, the present invention is not limited to this, and the contact point may be a pad, a through hole, a wiring formed on the printed wiring board 40, for example. It may be a pattern or the like.

  Here, in the present embodiment, the embodiment in which the probe pin 32 is provided on the upper inspection jig 30A has been described as an example. However, the present invention is not limited to this, and the lower inspection jig 30B is also added to the upper inspection jig 30A. Even if the probe pin 32 is provided and contacted from below the printed circuit board 40, the present invention may be applied to a form using a pressing device that presses and closely contacts the upper inspection jig 30A and the lower inspection jig 30B. Good.

  However, in the present embodiment, when the probe pins 32 are provided on the upper inspection jig 30A and the lower inspection jig 30B, the probe pins of the upper inspection jig 30A and the probe pins of the lower inspection jig 30B do not face each other. It is desirable to do so. In the present embodiment, as will be described later, when the probe pin of the upper inspection jig 30A and the probe pin of the lower inspection jig 30B face each other, the inspection device 12 detects a short circuit, and there is no substrate to be inspected. Nevertheless, it may be erroneously determined that it exists.

(Electrical configuration of inspection equipment)
Next, the electrical configuration of the inspection apparatus 12 will be described with reference to FIG. FIG. 2 is a block diagram illustrating an outline of the electrical configuration of the inspection apparatus 12. As shown in the figure, the inspection apparatus 12 includes a computer 18.

  The computer 18 includes a CPU (Central Processing Unit) 18A, a ROM (Read Only Memory) 18B, a RAM (Random Access Memory) 18C, a non-volatile memory 18D, an input / output interface (I / O) 18E, etc. via a bus 18F. Each is connected.

  The CPU 18A controls the operation of the entire inspection apparatus 12. The ROM 18B functions as a storage unit that stores in advance a control program for controlling the operation of the inspection apparatus 12, a substrate inspection processing program to be described later, various parameters for inspection, and the like. The RAM 18C is used as a work area when various programs are executed, temporary storage of inspection data, and the like. The nonvolatile memory 18D stores various types of information that must be retained even when the apparatus is turned off.

  The I / O 18E includes an operation unit 20 configured to include operation buttons and the like (keyboard, mouse, etc.) for performing operations related to the inspection, a display unit 22 including a liquid crystal display that performs display related to the inspection, and a print. An inspection jig 30 or the like for contacting the wiring board 40 is connected.

  By the way, the inspection target (substrate to be inspected) of the inspection apparatus 12 is not limited to a single printed wiring board 40, and the printed wiring board 40 as a plurality of substrates to be inspected can be easily divided by, for example, connecting pieces by V grooves. In order to increase the efficiency of the inspection, the collective substrate connected to the target is inspected and collectively inspected by the collective substrate.

  On the other hand, even when an inspection line for the collective substrate is constructed, it may be necessary to inspect a specific one of the collective substrates (hereinafter, “individual substrate”). After the inspection is finished once in the state of the collective board, and the collective board that has been inspected is divided, the specific printed wiring board 40 is suspected of being defective in the next process, for example, the assembly process of the apparatus, and needs to be re-inspected. This is the case.

  In this case, conventionally, as the substrate inspection processing program for executing the substrate inspection processing in the inspection apparatus 12, two substrate inspection processing programs, that is, a substrate inspection processing program for a collective substrate and a substrate inspection processing program for an individual substrate are used. It was. Therefore, since there are a plurality of substrate inspection processing programs in the conventional collective substrate inspection, for example, the collective substrate or the individual substrate is discriminated by a sensor or the like, and the operator switches the program. However, this method inevitably increases the cost due to the addition of a sensor or the like. Further, when changing the contents of debugging or inspection, the plurality of board inspection processing programs have to be changed, which increases the amount of work and makes the management of the board inspection processing program complicated.

  On the other hand, in order to eliminate the complexity of using a different substrate inspection processing program, a pseudo substrate is arranged in an insufficient portion of an individual substrate, which is a substrate to be inspected, with respect to a collective substrate. There is also a method of inspecting with a single substrate inspection processing program by introducing a configuration for determining whether the substrate is a substrate. However, this method requires a cost for preparing the pseudo substrate, and also requires man-hours for setting the pseudo substrate in the inspection apparatus at the time of inspection.

  Therefore, in the present invention, in each of the substrates to be inspected included in the collective substrate, the electrical characteristics of the terminals (contact points) whose electrical characteristics are known in advance for the circuit operation of the substrates to be inspected are measured with the probe pins. Thus, it is determined whether the inspection target is a collective substrate or an individual substrate, and the program is switched. That is, the probe pin is brought into contact with each contact point to be inspected, and when predetermined electrical characteristics are detected at a plurality of contact points (that is, a plurality of substrates to be inspected), a substrate inspection process for the collective substrate When a program is selected and a predetermined electrical characteristic is detected only at one contact point, a substrate inspection processing program for an individual substrate is selected.

  This eliminates the need to add any hardware, including pseudo-boards, and automates the selection of programs. Therefore, it is possible to inspect a collective board that includes multiple boards to be inspected, and to inspect the singulated board to be inspected. In addition, an inspection apparatus, an inspection method, and an inspection program that can be efficiently performed without causing an increase in cost are provided.

(Inspection method)
Hereinafter, an inspection method using the inspection apparatus 12 according to the present embodiment will be described in detail with reference to FIGS. 3 to 5.

  FIG. 3A shows an example of the collective substrate 80 according to the present embodiment, and FIG. 3B shows an example of the individual substrate 100 according to the present embodiment.

  As shown in FIG. 3A, the collective substrate 80 is configured by connecting a plurality (eight in FIG. 3A) of test substrates 82 by connecting pieces 52. Although there is no restriction | limiting in particular in the form of the connection piece 52, In this Embodiment, it is set as the V groove as an example. Each of the substrates to be inspected 82 has an electrical component mounted thereon, and FIG. 3A shows an example in which a resistor 102, a semiconductor element 104, and a capacitor 106 are mounted. In the present embodiment, the resistor 102, the semiconductor element 104, and the capacitor 106 are all surface-mounted components. However, the present invention is not limited to this, and a lead that is mounted by providing a through hole in the substrate. It is good also as a form using components.

  As shown in FIG. 3B, the individual substrate 100 is obtained by separating one of the test substrates 82 in the collective substrate 80 shown in FIG. Similar to the inspection substrate 82, the resistor 102, the semiconductor element 104, and the capacitor 106 are mounted. As shown in FIG. 3B, in the present embodiment, a pair of pads (contact point pairs) 56 are provided via wiring patterns 54 connected to both ends of the resistor 102. In the present embodiment, the probe pin 32 is brought into contact with the pad 56 to detect the electrical characteristics. In the present embodiment, the resistor 106 is not provided exclusively for substrate inspection, but is used for the original circuit operation of the substrate to be inspected 82. Details of detection of electrical characteristics by the probe pin 32 will be described later. Note that a solder leveler (solder coat) may be applied to the surface of the pad 56 so that the pad 56 has the same form as the solder portion 44.

  In the present embodiment, an example in which all the substrates to be inspected 82 included in the collective substrate 80 are the same substrate will be described. However, the present invention is not limited to this, and the collective substrate 80 includes a plurality of types of inspected substrates. It is good also as an included form. In this case, the positions of the pads 56 with which the probe pins 32 are brought into contact may be shared among a plurality of types of substrates to be inspected. Further, in the present embodiment, the configuration in which the number of the substrates to be inspected 82 included in the collective substrate 80 is eight has been described as an example. Good.

  FIG. 4 shows an arrangement state of the inspection apparatus 12 according to the present embodiment. FIG. 4A shows an arrangement state of the probe pins 32 with respect to the same collective substrate 80 as FIG. FIG. 3B shows the arrangement state of the probe pins 32 with respect to the same individual substrate 100 as in FIG. However, FIG. 4A shows four extracted substrates 82 out of the eight inspected substrates 82 in FIG. 3A. In FIG. 4, in order to avoid complication, only the probe pin 32 is shown for the inspection jig 30, and the main body is omitted.

  As shown in FIG. 4A, the collective substrate 80 includes four substrates 82 to be inspected, that is, the substrates to be inspected 82-1 to 82-4, and each of the substrates to be inspected 82 has a pair of probes. The pin 32 can come into contact with the pair of pads 56. That is, in the substrate to be inspected 82-1, a pair of probe pins 32-1 and 32-2 can be in contact with the pads 56-1 and 56-2, and in the substrate to be inspected 82-2, a pair of probes The probe pins 32-3 and 32-4 can be brought into contact with the pads 56-3 and 56-4. In the inspected substrate 82-3, a pair of probe pins 32-5 and 32-6 are connected to the pad 56-. 5 and 56-6 can be brought into contact with each other, and a pair of probe pins 32-7 and 32-8 can be brought into contact with the pads 56-7 and 56-8 in the inspected substrate 82-4. Therefore, in the example of FIG. 4A, at least eight probe pins 32 are provided on the inspection jig 30. A similar electrical signal is output from each pair of probe pins 32 and applied to each of the inspected substrates 82-1 to 82-4, and a similar inspection is executed.

  In the present embodiment, the inspection jig used for the substrate inspection of the collective substrate 80 and the inspection jig used for the substrate inspection of the individual substrate 100 are shared. Therefore, as shown in FIG. 4B, when the inspection target is the individual substrate 100, a pair of probe pins 32 of the eight inspection jigs 30 (in the example of FIG. 4B). Only the probe pins 32-1 and 32-2) can be brought into contact with the individual substrate 100. Since there are no inspection targets for the remaining six (three pairs) probe pins 32-3 to 32-8, the probe pins 32 remain open.

  In this embodiment, an example in which the position of the individual substrate 100 arranged in the inspection jig 30 is a position corresponding to the position of the inspected substrate 82-1 in the collective substrate 80 will be described. However, the present invention is not limited to this, and a position corresponding to any of the other substrates to be inspected 82-2 to 82-4 may be used. Furthermore, in this embodiment, it is not necessary to fix the position where the individual substrate 100 is arranged.

  Under the arrangement state of the inspection apparatus 12 as described above, in the substrate inspection processing according to the present embodiment, electrical signals (voltage, current, etc.) are output from the pair of probe pins 32 to the pair of pads 56, An electrical signal obtained by applying the electrical signal is sent to the computer 18 through a pair of probe pins 32, and electrical characteristics are detected (measured). The electrical characteristics to be detected are not particularly limited, such as a voltage (potential difference), a current, a value of an element of an electrical component, and the like, but in this embodiment, the resistance value of the resistor 102 is detected.

  In the substrate inspection processing of the collective substrate 80, as shown in FIG. 4A, a pair of probe pins 32-1 and 32-2 are paired with a pair of pads 56- arranged on the substrate to be inspected 82-1. 1 and 56-2 and the resistance value of the resistor 102 is measured. When the measured resistance value is within a predetermined range (for example, “100Ω or more, 120Ω or less, etc., hereinafter“ expected value ”)”, it is determined that the inspected substrate 82-1 exists. Similarly, the resistance value of the resistor 102 is also measured on the substrates to be inspected 82-2 to 82-4. If the measured resistance value is within the expected value range, the substrates to be inspected 82-2 to 82-4 are measured. It is determined that each of exists. The predetermined range of the resistance value of the resistor 102 may be set in consideration of manufacturing variation of the resistor 102 and the like.

  In the substrate inspection processing of the collective substrate 80, since the resistors 102 mounted on each of the substrates to be inspected 82-1 to 82-4 are the same, basically the substrates to be inspected 82-1 to 82-4 exist. It is judged. Therefore, when determining that the inspection target is the collective substrate 80, the resistance value of the resistor 102 may be within the range of the expected value in all of the inspected substrates 82-1 to 82-4.

However, in the present embodiment, the resistance value of the resistor 102 is not limited to the expected value range for the four substrates to be inspected 82, and the resistance for a plurality of substrates, that is, two to four substrates 82 to be inspected. That the resistance value of 102 is within the range of the expected value is a determination condition that the inspection target is the collective substrate 80. This is present even though the collective substrate 80 is present because the resistance value of the resistor 102 is larger than the expected value due to a poor contact between the probe pin 32 and the pad 56 or is in an open state. This is a measure to prevent misjudgment that it is not. As a result, in the present embodiment, the occurrence of so-called inspection skipping, in which the substrate inspection is not performed even though the inspected substrate 82 exists, is suppressed.
In the present embodiment, since the individual substrate 100 is a single substrate to be inspected 82, the inspection object is selected as long as a plurality of substrates to be inspected 82 are recognized in the substrate inspection processing of the collective substrate 80. There is no misjudgment as an individual substrate.

  On the other hand, in the substrate inspection process of the individual substrate 100, only the pair of probe pins 32-1 and 32-2 is in contact with the pair of pads 56-1 and 56-2, and the resistance value of the resistor 102 is measured. Is done. For each pair of other probe pins 32, that is, 32-3 and 32-4, 32-5 and 32-6, and 32-7 and 32-8, the measured resistance value is close to infinity, that is, open. Thus, it is determined that there is no inspection object at the position corresponding to the pair of probe pins 32. Therefore, it is determined that the inspection target is the individual substrate 100.

(Board inspection processing)
Next, a substrate inspection process executed by the inspection apparatus 12 will be described with reference to FIG. FIG. 5 is a flowchart showing a processing flow of the board inspection processing program according to the present embodiment. In the process shown in FIG. 5, the collective substrate 80 or the individual substrate 100 to be inspected by the user is set by connecting to the inspection jig 30 of the inspection apparatus 12, and the operation unit 20 or the like is operated to start the inspection. By instructing, the CPU 18A reads the board inspection processing program stored in the ROM 18B or the non-volatile memory 18D, and is executed. That is, when the user starts the inspection by operating the operation unit 20 of the inspection apparatus 12 (executes the substrate inspection processing program), the inspection apparatus 12 applies the probe pin 32 to the pad 56 of the collective substrate 80 or the individual substrate 100. To check the operation of the collective substrate 80 or the individual substrate 100.

  In the present embodiment, the embodiment in which the substrate inspection processing program is stored in advance in the ROM 18B has been described as an example. However, the present invention is not limited to this, and the substrate inspection processing program is stored in a computer-readable storage medium. A form provided in a stored state, a form distributed via wired or wireless communication means, and the like may be applied.

  In the present embodiment, the board inspection process is realized by a software configuration using a computer by executing a program, but the present invention is not limited to this. For example, you may implement | achieve by the hardware structure which employ | adopted ASIC (Application Specific Integrated Circuit), or the combination of a hardware structure and a software structure.

  As shown in FIG. 5, first, in step S100, detection of electrical characteristics by each pair of probe pins 32 is executed. More specifically, each pair of probe pins 32 is moved to a position where it can come into contact with the corresponding pair of pads 56, and a necessary signal is applied to each pair of pads 56 from each pair of probe pins 32. Perform detection of electrical properties between pairs. Since the electrical characteristic according to the present embodiment is the resistance value of the resistor 102, for example, a current is passed between each pair of probe pins 32, the voltage generated at both ends of the resistor 102 is measured, and the current value and the voltage value are calculated. The resistance value of the resistor 102 is calculated.

  In the next step S102, it is determined whether or not the resistance value (electrical characteristic) detected in step S100 is one within the range of the expected value. If the determination is negative, the process proceeds to step S104. If the determination is positive, the process proceeds to step S106.

  In step S104, a collective board inspection program is executed. This is because a plurality of resistance values within the expected value range were confirmed in step S102, and thus the inspection target was determined to be the collective substrate 80.

  In step S106, an individual board inspection program is executed. This is because the resistance value within the range of the expected value is confirmed to be one in step S102, and thus the inspection target is determined to be the individual substrate 100.

  In step S108, it is determined whether or not the substrate inspection has been completed. If the determination is negative, the process returns to step S100 and the substrate inspection process is continued. On the other hand, if the determination is affirmative, the substrate inspection processing program ends. The determination as to whether or not the substrate inspection has ended may be performed based on whether or not a user has input an instruction to end the substrate inspection through the operation unit 20, for example.

  As is clear from the above description, according to the inspection apparatus and inspection method according to the present embodiment, the inspection of the collective substrate 80 and the inspection of the individual substrate 100 are combined, and the substrate inspection processing program is used as one program. Both checks are performed.

  As described above in detail, according to the inspection apparatus and the inspection method according to the present embodiment, the inspection of the collective substrate including a plurality of substrates to be inspected, including the inspection of the separated substrates to be inspected, is cost effective. Provided are an inspection apparatus, an inspection method, and an inspection program that can be efficiently performed without causing an increase.

  In the above-described embodiment, the form in which the electrical characteristics are detected using the pair of pads 32 is described as an example. However, the present invention is not limited to this, and the form in which the electrical characteristics are detected using the single pad 32 is described. It is good. In this case, for example, an electrical characteristic for detecting a potential difference between the pad 32 of each substrate to be inspected 82 and a reference potential (for example, ground (ground)) of the inspection apparatus 12 may be used.

  In the above-described embodiment, an example in which a pair of contact points is arranged on each substrate 82 (individual substrate 100) has been described as an example. However, the present invention is not limited to this. Accordingly, a plurality of contact point pairs may be arranged.

  Moreover, in the said embodiment, although the form which uses the pad connected to the terminal of components as a contact point was illustrated and demonstrated, it is not restricted to this, For example, the terminal itself of a component is good also as a contact point. In this case, there is no need to provide a wiring pattern for inspection on the substrate to be inspected, and there is an advantage that the position of the contact point can be flexibly changed.

In the above embodiment, the resistor is exemplified as the component for detecting the electrical characteristics by the pad 32. However, the present invention is not limited to this, and other components such as the capacitance value of the capacitor 106 or the specification of the semiconductor element 104 are described. The terminal voltage of the other terminal may be used.
In addition, the components for detecting the electrical characteristics of each substrate to be inspected may be different. Specifically, referring to FIG. 4, in the inspected substrate 82-1, a pair of probe pins 32-1 and 32-2 can come into contact with pads 56-1 and 56-2. In the inspected substrate 82-2, a pair of probe pins 32-3 and 32-4 are brought into contact with a pair of terminals of the capacitor 106, respectively. In the substrate to be inspected 82-3, a pair of probe pins 32-5 and 32-6 are in contact with two specific terminals of the semiconductor element 104. In the inspection board 82-4, the pair of probe pins 32-7 and 32-8 are brought into contact with a pair of terminals of other parts (not shown) (for example, other resistors other than the resistor 102). Then, electrical characteristics of different parts are detected for each of the substrates to be inspected 82-1 to 82-4, and it is determined whether or not there is one that is within the range of expected values (different for each part). You may do it. By doing so, when a mounting error occurs for all of the specific components for detecting the electrical characteristics (for example, when a different resistor is mounted at the position of the resistor 102 and the resistance value is outside the expected value). It is possible to prevent the inspection device 12 from malfunctioning.
Furthermore, the target for detecting the electrical characteristics is not limited to the component, and for example, the electrical characteristics of the wiring pattern provided between the pair of pads 32 may be detected. The expected value in this case may be, for example, that the resistance value detected by the pair of pads 32 is not more than a specified value, for example, not more than 5Ω.

  In addition, the configuration of the inspection apparatus 12 described in the above embodiment (see FIGS. 1 and 2) is an example, and unnecessary parts are deleted or new parts are added within the scope not departing from the gist of the present invention. Or you may.

  For example, in each of the above embodiments, the inspection apparatus using the inspection jig 30 provided with the probe pins 32 has been exemplified and described. However, the present invention is not limited to this, and the probe pins are the collective substrate 80, Or you may apply to what is called a fixtureless type | mold inspection apparatus which moves to each contact point of the board | substrate 100, and performs an inspection.

  The processing flow (see FIG. 5) of the substrate inspection processing program described in each of the above embodiments is also an example, and unnecessary steps can be deleted or new steps can be performed without departing from the gist of the present invention. They may be added or the processing order may be changed.

12 Inspection Device 18 Computer 18A CPU
18B ROM
18C RAM
18D non-volatile memory 18E I / O
18F bus 20 operation unit 22 display unit 28 cable 30 inspection jig 30A upper inspection jig 30B lower inspection jig 32, 32-1 to 32-8 probe pin 40 printed wiring boards 42a and 42b electronic component 44 solder part 52 connection Piece 54 Wiring pattern 56 Pad 80 Aggregate substrate 82 Substrate to be inspected 100 Individual substrate 102 Resistor 104 Semiconductor element 106 Capacitor

Claims (9)

A plurality of electrical conductors that contact each of the contact points arranged on each of the plurality of substrates to be inspected included in the collective substrate;
When detection is performed using the plurality of current-carrying members, and predetermined electrical characteristics are detected at a plurality of contact points among the plurality of contact points, all of the plurality of substrates to be inspected are inspected. Inspecting means for inspecting a substrate to be inspected on which the contact point is arranged when the predetermined electrical characteristic is detected at one contact point;
Inspection equipment including The inspection means performs detection of a potential difference between each of the plurality of contact points and a reference potential of the inspection apparatus using the plurality of current-carrying bodies, and the detected potential difference is within a predetermined range. The inspection device according to claim 1, wherein the predetermined electrical characteristic is detected in a case. Each of the contact points is connected to a terminal of a component mounted on the board to be inspected,
The inspection means performs detection of electrical characteristics at the terminal using the plurality of current-carrying members, and the predetermined electrical characteristics when the detected electrical characteristics are within a predetermined range. The inspection apparatus according to claim 1. The contact point is a pair of contact points including two contact points, and the conductive member is a pair of conductive members including two conductive members,
The inspection apparatus according to claim 1, wherein the inspection unit performs detection using the electric conductor by bringing each of the plurality of electric conductor pairs into contact with each of the plurality of contact point pairs. Each of the contact point pairs is connected to a terminal pair of a component mounted on the board to be inspected, and the inspection means detects electrical characteristics in the terminal pair using a plurality of the current-carrying body pairs. The inspection apparatus according to claim 4, wherein the inspection apparatus is executed and detects the predetermined electrical characteristic when the detected electrical characteristic is within a predetermined range. The inspection apparatus according to claim 5, wherein the component is a resistor, and the electrical characteristic is a resistance value. A part of the plurality of conductors is in contact with a contact point disposed on one surface of the substrate to be inspected, and another part of the plurality of conductors is inspected. The inspection device according to any one of claims 1 to 6, wherein the inspection device is in contact with a contact point arranged on the other surface of the substrate, and the one part of the current-carrying member and the other part of the current-carrying member do not face each other. . An inspection method using an inspection apparatus that includes a plurality of current-carrying members that contact each of contact points disposed on each of a plurality of substrates to be inspected included in a collective substrate,
Performing detection using the plurality of electrification bodies;
When a predetermined electrical characteristic is detected at a plurality of contact points among the plurality of contact points, all of the plurality of substrates to be inspected are inspected and the predetermined electrical characteristic is detected at one contact point. An inspection method for inspecting a substrate to be inspected on which the contact point is arranged when a characteristic is detected. A program for controlling an inspection apparatus including a plurality of current-carrying members that contact each of contact points arranged on each of a plurality of substrates to be inspected included in a collective substrate,
Computer
When detection is performed using the plurality of current-carrying members, and predetermined electrical characteristics are detected at a plurality of contact points among the plurality of contact points, all of the plurality of substrates to be inspected are inspected. An inspection program for functioning as an inspection means for inspecting a substrate to be inspected on which the contact point is arranged when the predetermined electrical characteristic is detected at one contact point.