JP2017133883A - Sensor package and sensor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor package which allows a sensor device to be easily miniaturized.SOLUTION: A sensor package 10 includes: a first substrate 1 which has a first mounting part 11a at the center part of an upper surface 11, and which has a second mounting part 12a on a lower surface 12; and a second substrate 2 in which an outer peripheral part of the upper surface 11 of the first substrate 1 is connected to a lower surface 21. The second substrate 2 has a penetration part 3 which penetrates the second substrate 2 in its thickness direction at a portion where the penetration part 3 overlaps with the first mounting part 11a of the first substrate 1 in a planar and perspective view.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a sensor package and a sensor device having an element mounting portion on which a sensor element is mounted.

  As a sensor package in which a sensor element such as a pressure sensor element, a gas sensor element, or an ultrasonic sensor element is mounted, a sensor package having a sensor element mounting portion on an upper surface of a flat plate-like insulating substrate is used. A sensor device is formed by mounting the sensor element on the mounting portion.

  An electronic component mounted on the mounting portion in the sensor device is electrically connected to an external electric circuit via a wiring conductor or the like provided on the insulating substrate. The external electric circuit includes a functional element having functions such as calculation and storage. Signals are transmitted and received between the sensor device and the functional element. Based on this signal, various processes such as detection of physical quantities such as pressure, gas or ultrasonic waves, measurement, and signal transmission to a display or the like are performed.

JP 2007-178133 JP-A-9-145512

  In the prior art, when detecting the physical quantity, a sensor device and an external electric circuit including a functional element are mounted on a circuit board to form a module. Therefore, it is difficult to reduce the area in plan view of a module or the like as a device for detecting a physical quantity.

  A sensor package according to one aspect of the invention includes a first substrate having a top surface and a bottom surface, a first mounting portion at a central portion of the top surface, a bottom surface, and the bottom surface of the first substrate. A second substrate to which the outer peripheral portion of the upper surface is bonded, and the second substrate penetrates in the thickness direction of the second substrate at a portion overlapping the first mounting portion of the first substrate in a plan view. Has a part.

  A sensor device according to one aspect of the present invention includes a sensor package having the above-described configuration, a sensor element mounted on the first mounting portion, and an electronic component mounted on the second mounting portion, The sensor element is located in the penetrating portion of the second substrate.

  According to the sensor package of one aspect of the present invention, electronic components such as sensor elements and functional elements are collectively mounted on the first mounting portion on the upper surface and the second mounting portion on the lower surface of the first substrate. Therefore, it is possible to provide a sensor package capable of manufacturing a sensor device that can easily detect pressure and the like and can be easily downsized in plan view.

  According to the sensor device of one aspect of the present invention, the sensor element is mounted on the first mounting portion of the sensor package having the above configuration, and the electronic component is mounted on the second mounting portion. It is possible to provide a sensor device that is easy to detect and can be easily downsized in plan view.

(A) is a top view which shows the package for sensors and sensor apparatus of embodiment of this invention, (b) is sectional drawing in the AA of (a). It is sectional drawing which shows the modification of the package for sensors shown in FIG. 1, and a sensor apparatus. It is sectional drawing which shows the other modification of the package for sensors shown in FIG. 1, and a sensor apparatus. FIG. 7 is an exploded cross-sectional view showing another modification of the sensor package and the sensor device shown in FIG. 1. It is sectional drawing which shows the other modification of the package for sensors shown in FIG. 1, and a sensor apparatus.

  A sensor package and a sensor device according to embodiments of the present invention will be described with reference to the accompanying drawings. Fig.1 (a) is a top view which shows the package for sensors and the sensor apparatus of embodiment of this invention, FIG.1 (b) is sectional drawing in the AA of Fig.1 (a). In addition, the distinction between the upper and lower sides in the following description is for convenience, and does not specify the upper and lower sides when the sensor package and the sensor device are actually used.

  The sensor package 10 includes a first substrate 1 having an upper surface 11 and a lower surface 12, and a second substrate 2 having a lower surface 21 to which the upper surface 11 of the first substrate 1 is bonded. . The first substrate 1 has a first mounting portion 11a at the center of the upper surface 11 and a second mounting portion 12a on the lower surface 12 thereof. The second substrate 2 has a through portion 3 that penetrates in the thickness direction of the second substrate 2 in a portion that overlaps the first mounting portion 11a of the first substrate 1 in a plan view. As described above, when the first substrate 1 and the second substrate 2 are bonded to each other, the upper surface 11 of the first substrate 1 is formed in the opening on the lower side (the lower surface 21 side of the second substrate 2) of the through-hole 3. A part of is exposed.

  The first substrate 1 has a first mounting portion 11 a on the upper surface 11 and a second mounting portion 12 a on the lower surface 12. In this embodiment, the first mounting portion 11 a is a portion exposed in the opening on the lower side of the through portion 3 on the upper surface 11 of the first substrate 1. The second mounting portion 12a is a portion excluding the outer peripheral portion (frame-like portion) of the lower surface 12 of the first substrate 1. A sensor element 31 is mounted on the first mounting portion 11a, an electronic component 32 is mounted on the second mounting portion 12a, and the upper surface 11 of the first substrate 1 is bonded to the lower surface 21 of the second substrate 2 so that the sensor device 30 is mounted. Is basically configured.

  In the sensor device 30, the penetrating portion 3 of the second substrate 2 is disposed immediately in contact with the first mounting portion 11 a, so that the sensor element 31 mounted on the first mounting portion 11 a is located in the penetrating portion 3. It will be. A sensor element 31 is mounted so that the sensor device 30 can be seen through the through portion 3 when viewed from above.

  The first substrate 1 functions as a mounting substrate for mounting the sensor element 31 and the electronic component 32. The second substrate 2 functions as a connection substrate for electrically connecting the sensor element 31 and the electronic component 32 mounted on the first substrate 1 to an external electric circuit (not shown). In the example shown in FIG. 1, a recess 4 is provided in the center of the lower surface 21 of the second substrate 2, and the first substrate 1 is accommodated in the recess 4. The sensor element 31 and the electronic component 32 mounted on the sensor package 10 are externally connected via, for example, a wiring conductor 5 disposed on a convex portion (not indicated) provided on the outer peripheral portion of the lower surface 21 of the second substrate 2. Electrically connected to the electrical circuit. A specific example of such electrical connection will be described later.

The outer peripheral portion of the upper surface 11 of the first substrate 1 and the central portion (the peripheral portion of the through portion 3) of the lower surface 21 of the second substrate 2 are, for example, a bonding material such as a brazing material, glass or an organic resin-containing adhesive. (Not shown). When a brazing material is used for this joining, a base metal layer for brazing is formed on the outer peripheral portion of the upper surface 11 of the first substrate 1 and the lower surface 21 of the second substrate 2 so as to be opposed to each other. (Not shown) is provided.

  Examples of the sensor element 31 include a pressure sensor element, a gas sensor element, and an ultrasonic sensor element. The sensor element 31 may be a so-called MEMS (Micro Electro Mechanical Systems) element in which a fine electromechanical system is provided on the surface (main surface) of a semiconductor substrate such as a silicon substrate. If the sensor element 31 is a pressure sensor element, a measurement circuit that detects a portion of the main surface of a substrate such as a semiconductor substrate that deforms according to the pressure of a diaphragm, a resistance value that changes according to the deformation, etc. And are provided.

  The electronic component 32 is, for example, a semiconductor integrated circuit element such as an IC or LSI, a piezoelectric element, a capacitive element, a resistor, an inductor element, or the like. A plurality of electronic components 32 may be included, and a plurality of types of electronic components 32 may be included.

  For example, if the sensor element 31 is a pressure sensor element, the sensor element 31 can detect the magnitude of the pressure in the environment where the sensor device 30 is disposed or a change in the pressure. Information on the pressure detected by the sensor element 31 is transmitted as an electric signal to the electronic component 32, and various processing is performed by the electronic component 32.

  In this case, a processing result signal is further transmitted from the electronic component 32 to the external electric circuit, and final processing such as control of the electronic device on which the external electric circuit is mounted or display of the processing result on the display is performed. For example, a change in tire air pressure as a processing result transmitted from the pressure sensor device is used as control information in an automobile control device.

  In the sensor package 10 of the embodiment, the sensor element 31 and the electronic component 32 such as an IC which is a functional element are mounted together on the first mounting portion 11a on the upper surface 11 and the second mounting portion 12a on the lower surface 12 of the first substrate 1. Is done. Therefore, it is possible to provide the sensor package 10 in which the sensor device 30 that can easily detect the pressure and the like and can be easily downsized in plan view can be manufactured.

  In the sensor device 30 of the embodiment, the sensor element 31 is mounted on the first mounting portion 11a of the sensor package 10 having the above configuration, and the electronic component 32 is mounted on the second mounting portion 12a. Therefore, it is possible to provide a sensor device 30 that can easily detect pressure and the like and can be easily downsized in plan view.

  Further, for example, the sensor package 10 and the sensor device 30 in the example shown in FIG. 1 are advantageous in reducing the thickness because the sensor element 31 is accommodated in the through-hole 3. In addition, the sensor package 10 and the sensor device 30 can sense a physical quantity such as an external pressure, temperature, or sound wave through the penetrating portion 3 and are advantageous in terms of securing a sensing function.

  The first substrate 1 has, for example, a rectangular shape (as a whole, a rectangular parallelepiped shape) such as a square shape or a rectangular shape in plan view, and is an aluminum oxide sintered body, a glass ceramic sintered body, an aluminum nitride sintered body, or a mullite. It is formed of a ceramic sintered body such as a quality sintered body.

If the first substrate 1 is made of, for example, an aluminum oxide sintered body, it can be manufactured as follows. That is, first, raw material powders such as aluminum oxide and silicon oxide are formed into a sheet shape together with an appropriate organic binder and an organic solvent to produce a square sheet-like ceramic green sheet. Thereafter, the ceramic green sheet is cut and formed into an appropriate size and fired at a temperature of 1300 to 1600 ° C. Through the above steps, the first substrate 1
Can be produced.

  In this case, a plurality of ceramic green sheets may be laminated to produce a laminated body, and the laminated body may be fired to produce the first substrate 1. The plurality of fired ceramic green sheets become insulating layers (no symbol) that form the first substrate 1. That is, the first substrate 1 may be composed of a plurality of insulating layers.

  The second substrate 2 has, for example, a rectangular shape (as a whole, a rectangular parallelepiped shape) such as a square shape or a rectangular shape in plan view, and is an aluminum oxide sintered body, a glass ceramic sintered body, an aluminum nitride sintered body, or a mullite. It is formed of a ceramic sintered body such as a quality sintered body. In the example shown in FIG. 1, the second substrate 2 is formed by laminating a plurality of insulating layers (no symbols).

  As described above, the second substrate 2 is configured such that the first substrate 1 is accommodated in the concave portion 4 provided in the center portion of the lower surface 21 and the lower end of the convex portion (not indicated) provided in the outer peripheral portion of the lower surface 21. The wiring conductor 5 is externally connected. Therefore, the size of the second substrate 2 is larger than the size of the first substrate 1 in plan view.

  The second substrate 2 can also be manufactured by the same method using the same material as the first substrate 1. That is, first, a raw material powder is molded as described above to produce a ceramic green sheet. Thereafter, the ceramic green sheets cut and formed into appropriate dimensions are laminated, and the laminated ones are fired at a temperature of 1300 to 1600 ° C. The 2nd board | substrate 2 can be manufactured according to the above process.

  In this case, if a through hole corresponding to the through portion 3 is provided in a predetermined portion of the plurality of ceramic green sheets to be the second substrate 2, the second substrate 2 having the through portion 3 can be manufactured. The through hole of the ceramic green sheet can be formed by punching such as mechanical punching or laser processing.

  Moreover, if the opening corresponding to the recessed part 4 is provided in the thing of the lower surface 21 side among the several ceramic green sheets used as the 2nd board | substrate 2, the 2nd board | substrate 2 which has the recessed part 4 can be manufactured. The opening that becomes the recess 4 can also be formed by drilling such as mechanical punching. The opening serving as the recess 4 is not limited to the lowermost ceramic green sheet depending on the depth of the recess 4 or the like, and may be formed in a plurality of ceramic green sheets upward from the lowermost side. .

  Since the penetration part 3 needs to expose the sensor element 31 mounted on the first mounting part 11 a to the outside from the sensor package 10 as described above, the penetration part 3 penetrates from the upper surface 22 to the lower surface 21 of the second substrate 2. It must be. The concave portion 4 is set to a depth larger than the thickness of the first substrate 1 in consideration of effective sealing of the first substrate 1 and the first substrate 1 (second mounting portion 12a).

  In the example shown in FIG. 1, the shape of the penetrating portion 3 and the recessed portion 4 in a plan view is a quadrangular shape. However, the shape is not limited to this, and the shape is not limited to this. A shape appropriately set according to the shape or the like of one substrate 1 may be used. Specifically, the shape of the penetrating part 3 and the recessed part 4 in plan view is a polygonal shape such as a quadrangular shape whose corners are chamfered in an arc shape, a circular shape, an elliptical shape, an elliptical shape, etc. A shape deformed into a shape may be used.

The sensor element 31 mounted on the first mounting portion 11a and the electronic component 32 mounted on the second mounting portion 12a are, for example, wiring conductors (not shown) provided inside and on the surface of the first substrate 1. Are electrically connected to each other. An example of the wiring conductor has a pattern in which one end is positioned on the first mounting portion 11a and the other end is positioned on the second mounting portion 12a. The wiring conductor in this case may include a through conductor (via conductor) (not shown) penetrating at least a part of the first substrate 1 in the thickness direction.

  Electrical connection of the sensor element 31 and the electronic component 32 to the wiring conductor is performed by a conductive connecting material such as a bonding wire or solder. In the example shown in FIG. 1, the sensor element 31 is electrically connected to the wiring conductor by a bonding wire 33. Further, the electronic component 32 is electrically connected to the wiring conductor by solder (no symbol). In the example shown in FIG. 1, a semiconductor integrated circuit element (IC) and a capacitor element (chip capacitor) are mounted on the second mounting portion 12a as the electronic component 32. The semiconductor integrated circuit element is bonded to the wiring conductor by a convex solder (solder bump), and the capacitor element has an electrode disposed at the end of the main body directly attached to the wiring conductor by solder (solder paste).

  The wiring conductor is made of a metal material such as tungsten, molybdenum, manganese, copper, silver, palladium, gold, platinum, nickel, or cobalt. The wiring conductor may be formed of an alloy material containing these metal materials. Such a metal material or the like is provided on the surface of the first substrate 1 as a metal layer in a form appropriately selected from forms such as a metallized layer, a plating layer, and a thin film layer. In the case where the first substrate 1 is composed of a plurality of insulating layers, the metal layer is provided on the surface of these insulating layers or in a through hole described later to become a wiring conductor.

  For example, when the wiring conductor is a tungsten metallized layer, the surface of the ceramic green sheet that becomes the insulating layer of the first substrate 1 or a metal paste prepared by mixing tungsten powder with an organic solvent and an organic binder or In the through-hole previously provided, it can form by the method of printing and baking by methods, such as a screen printing method. This metallized layer is further coated with a plating layer of nickel, gold, or the like by a plating method such as an electrolytic plating method or an electroless plating method on a portion exposed to the outer surface such as the upper surface 11 and the lower surface 12 of the first substrate 1. It may be.

  As described above, the sensor element 31 and the electronic component 32 mounted on the first substrate 1 are connected via the wiring conductor 5 disposed at the lower end of the convex portion provided on the outer peripheral portion of the lower surface 21 of the second substrate 2. Electrically connected to an external electric circuit. The electrical connection between the wiring conductor 5 at the lower end of the convex portion and the sensor element 31 and the electronic component 32 is, for example, from the wiring conductor 5 at the lower end of the convex portion to the center of the lower surface 21 of the second substrate 2 (first substrate 1). This is performed via another wiring conductor (an extension portion of the wiring conductor 5) (not shown) provided over the portion facing the. If the wiring conductor of the first substrate 1 is electrically connected to the extending portion of the wiring conductor 5 via the bonding wire 33, the wiring conductor of the first substrate 1, the bonding wire 33, and the wiring of the second substrate 2 The sensor element 31 and the electronic component 32 and the wiring conductor 5 at the lower end of the convex portion are electrically connected to each other by the extending portion of the conductor 5.

  The wiring conductor 5 at the lower end of the convex portion is electrically connected to an external electric circuit by a conductive connecting material (not shown in FIG. 1) such as solder, a conductive adhesive, or a lead terminal. By this connection, the sensor element 31 and the electronic component 32 and the external electric circuit are electrically connected to each other. As a result, a module or an electronic device (not shown) on which the sensor device 30 capable of detecting pressure or the like is mounted is manufactured.

The convex portion can be manufactured by the same method using the same material as that of the second substrate 2. In this case, a ceramic green sheet to be a convex portion may be further laminated on a laminate of ceramic green sheets to be the second substrate 2, and these may be fired simultaneously. Thereby, the convex portion and the second substrate 2 can be integrally manufactured. In this case, the second substrate 2 can be regarded as having a convex portion on the outer peripheral portion of the lower surface 21. Moreover, it can also be considered that the depth of the recessed part 4 became large by the height of the convex part.

  The wiring conductor 5 at the lower end of the convex portion can be formed by the same method using the same material as the other wiring conductors. For example, the wiring conductor 5 can be formed at the lower end of the convex portion by applying a metal paste such as tungsten to the predetermined pattern of the wiring conductor 5 on the ceramic green sheet to be the convex portion and firing them simultaneously. .

  In this case, for example, a metal paste may be applied or filled into a through-hole penetrating the convex portion in the thickness direction and fired. Thereby, a through conductor (not shown) for electrically connecting the wiring conductor of the second substrate 2 and the wiring conductor 5 at the lower end of the convex portion can be provided in the convex portion. The metal conductor that becomes the wiring conductor 5 of the convex portion and the metal paste that becomes the through conductor can also be fired simultaneously with the metal paste that becomes the wiring conductor of the second substrate 2.

  The sensor device 30 of the embodiment may include a second mounting portion 12a of the first substrate 1 and a sealing material 34 that seals the electronic component 32 mounted on the second mounting portion 12a. The sealing material 34 has a function of protecting the electronic component 32, the conductive connecting material, and the like against the external environment or external force.

  The sealing material 34 is made of, for example, a resin material such as an epoxy resin or a silicon resin. After the first substrate 1 on which the electronic component 32 is mounted is electrically connected to the second substrate 2, the resin material is filled into the spaces inside the concave portions 4 and the convex portions of the second substrate 2, A sealing material 34 can be provided. If the resin material to be filled is an uncured thermosetting resin or the like, it is cured after filling.

  FIG. 2 is a sectional view showing a modification of the sensor package 10 and the sensor device 30 shown in FIG. In FIG. 2, the same parts as those in FIG. In the sensor device 30 of the example shown in FIG. 2, a covering material 35 that covers the sensor element 31 is disposed in the penetrating portion 3 of the second substrate 2. The covering material 35 is filled in the through portion 3.

  The covering material 35 functions as a medium for effectively transmitting pressure or the like to the sensor element 31. For example, when the sensor element 31 is a pressure sensor element, when an external pressure (for example, air pressure in the tire) is applied to the sensor device 30, the pressure applied to the upper end of the covering material 35 is passed through the covering material 35. It is effectively transmitted to the sensor element 31. For this reason, the sensor device 30 can be advantageous for improving the accuracy of detection of a change in pressure or the like.

  The covering material 35 is formed of a resin material such as an epoxy resin or a silicon resin. After the first substrate 1 on which the electronic component 32 is mounted is electrically connected to the second substrate 2, the covering material 35 can be provided by filling a resin material into the through portion 3 of the second substrate 2. it can. If the resin material to be filled is an uncured thermosetting resin or the like, it is cured after filling.

  The covering material 35 does not need to be filled in the through portion 3. The covering material 35 only needs to be disposed so as to cover at least the functional part (diaphragm or the like) of the sensor element 31 that is important in detecting a physical quantity such as pressure. If the functional portion of the sensor element 31 is disposed on the upper surface of the sensor element 31, the upper surface of the sensor element 31 may be covered with the covering material 35.

In the sensor package 10 and the sensor device 30 shown in FIG. 2, the second substrate 2 further includes a hole 2 a provided from the upper surface 22 opposite to the lower surface 21 to the penetrating portion 3.
The hole 2 a functions as a path for introducing the covering material 35 into the through portion 3. For example, an uncured resin material is introduced into the through-hole 3 through the hole 2a. Thereafter, a curing process or the like is performed as necessary.

  If the covering material 35 is introduced into the penetrating part 3 through the hole 2a, the covering material 35 can be inserted from the lower side of the penetrating part 3. Therefore, the possibility that voids are generated in the covering material 35 is reduced as compared with the case where the covering material 35 is inserted from the upper opening of the penetrating portion 3. If the position of the opening end of the hole 2a in the penetrating part 3 is close to the lower end of the penetrating part 3, it is advantageous for enhancing the effect of suppressing the gap.

  In addition, if the hole 2 a having a larger opening than the penetrating part 3 is provided or a plurality of holes 2 a (not shown) are provided, the covering material 35 can be easily introduced into the penetrating part 3. Therefore, it is advantageous in terms of productivity as the sensor device 30.

  Further, in the sensor package 10 and the sensor device 30 shown in FIG. 2, the metal bump 6A is connected to the wiring conductor 5 at the lower end of the convex portion. The metal bump 6A functions as a terminal for external connection, and is, for example, a solder bump made of solder. As the solder, so-called lead-free solder such as tin-silver, tin-silver-copper, or tin-lead eutectic solder can be used. The metal bump 6A may be made of a metal material other than solder, such as copper or a copper alloy.

  After this metal bump 6A is arranged facing a predetermined portion of the external electric circuit, a process such as heating is performed, and the wiring conductor 5 and the external electric circuit are connected to each other through the metal bump 6A. In this case, the metal bump 6A does not have to melt itself. For example, it is only necessary that the connecting member such as solder can join the wiring conductor 5 and the external electric circuit with the metal bump 6A as a core.

  If the metal bumps 6A are arranged on the wiring conductor 5 in advance, it is advantageous in terms of workability when the sensor device 30 is mounted on an external electric circuit.

  FIG. 3 is a cross-sectional view showing another modification of the sensor package 10 and the sensor device 30 shown in FIG. In FIG. 3, the same parts as those in FIG. The sensor device 30 of the example shown in FIG. 3 further includes a convex portion 36 disposed on the upper surface 22 of the second substrate 2. The convex portion 36 has a through hole 36 a connected to the through portion 3 of the second substrate 2.

  The convex portion 36 having the through hole 36a is, for example, a cylindrical pipe. The convex portion 36 as a pipe has a flange at one end, and can be easily joined to the second substrate 2. In the sensor device 30 of this example, the through hole 36 a of the convex portion 36 has a function of improving the efficiency of transmitting external pressure into the through portion 3. If the sensor element 31 is a pressure sensor element, external pressure is introduced into the through-hole 3 through the through-hole 36a of the convex portion 36 and further efficiently transmitted to the sensor element 31.

  The convex portion 36 is formed of, for example, a ceramic material similar to that of the second substrate 2 or a metal material such as an iron-nickel alloy. If the convex part 36 is made of a metal material, a metal material such as a plate or block is processed into a pipe or the like by a predetermined metal processing method, and the end is processed into a flange as necessary. Thus, a member that becomes the convex portion 36 can be produced. This member can be bonded to the upper surface 22 of the second substrate 2 by, for example, bonding with a bonding material such as an adhesive, a metal brazing material or resin, or a bonding method such as welding.

Further, in the sensor package 10 and the sensor device 30 shown in FIG. 3, a lead terminal 6B is connected to the wiring conductor 5 at the lower end of the convex portion. The lead terminal 6B functions as a terminal for external connection, and is a lead pin made of a metal material such as an iron-nickel alloy. The lead terminal 6B is joined to the wiring conductor 5 by, for example, silver solder (JIS standard BAg8 or the like). The lead terminal 6B may be a belt-like lead member that is not limited to a lead pin, or may be a lead member that has a lower end bent in an arc shape.

  After the lead terminal 6B is arranged to face a predetermined part of the external electric circuit, the lead terminal 6B is connected to the external electric circuit by a connecting material (not shown) such as solder. The lower end of the lead terminal 6B may be inserted into an insertion hole provided in advance in a predetermined part of the external electric circuit and connected to the external electric circuit. As a result, the wiring conductor 5 and the external electric circuit are connected to each other via the lead terminal 6B.

  Even when the lead terminal 6B is connected to the wiring conductor 5 in advance, it is advantageous in terms of workability when the sensor device 30 is mounted on an external electric circuit. Further, the deformation of the lead terminal 6B can absorb thermal stress that may be generated between the sensor package 10 and an external substrate (not shown) provided with an external electric circuit.

  FIG. 4 is an exploded sectional view showing another modification of the sensor package 10 and the sensor device 30 shown in FIG. 4, parts similar to those in FIG. 1 are denoted by the same reference numerals. Although the sealing material 34 and the covering material 35 are omitted in FIG. 4, the sensor device 30 of this example may also include the sealing material 34 and the covering material 35 as in the above example.

  In the example shown in FIG. 4, the second substrate 2 has a flat plate shape. Thus, the 2nd board | substrate 2 may not have a recessed part in the lower surface 21 (not shown). In this case, for example, a frame-like member 7 surrounding the first substrate 1 in the bottom view may be disposed on the outer peripheral portion of the lower surface 21 of the second substrate 2 according to the type of the electronic component 32 or the like. . The frame-like member 7 is manufactured as a separate body from the second substrate 2.

  The frame-like member 7 may be provided with a connection conductor 8 from its lower surface to its upper surface. The connection conductor 8 disposed on the lower surface of the frame-shaped member 7 is electrically connected to an external electric circuit, and the connection conductor 8 disposed on the upper surface of the frame-shaped member 7 is electrically connected to the wiring conductor 5 of the second substrate 2. Connected. By this connection, the frame-like member 7 is mechanically connected to the second substrate 2. These connections can be made by a conductive connecting material (not shown) such as solder or a conductive adhesive. The mechanical connection between the frame-shaped member 7 and the second substrate 2 is a bonding material such as a resin or glass that is interposed between the frame-shaped member 7 and the second substrate 2 at a portion other than the connection conductor 8 and the wiring conductor 5. (Not shown) may be reinforced.

  The frame-like member 7 can be manufactured by using the same material as that of the second substrate 2 and using the same method. Further, the connection conductor 8 can be formed on the frame-like member 7 by using the same material as that of the wiring conductor 5 and by the same method.

  Note that when the plurality of electronic components 32 are mounted on the second mounting portion 12a of the lower surface 12 of the first substrate 1 as in the example shown in FIG. Solder for connecting the electronic component 32 can be easily disposed on a plurality of predetermined portions of the second mounting portion 12a by means such as coating. Therefore, it is advantageous for improving the productivity of the sensor device 30. The electronic component 32 mounted on the second mounting portion 12a is effectively protected by the frame-shaped member 7 or the concave portion 4 of the second substrate 2 described above.

  FIG. 5 is a sectional view showing another modification of the sensor package 10 and the sensor device 30 shown in FIG. 5, parts similar to those in FIG. 1 are denoted by the same reference numerals.

  In the example shown in FIG. 5, the lead terminal 6 </ b> B is connected to the wiring conductor 5, and the penetration member 3 is filled with the covering material 35. A ceramic layer 2 b is further disposed on the upper surface 22 of the second substrate 2. The ceramic layer 2 b further closes the upper opening of the penetrating part 3 and covers the upper end of the covering material 35 filled in the penetrating part 3. In other words, the sensor package 10 and the sensor device 30 of this example further include the ceramic layer 2b that covers the upper surface 22 of the second substrate 2 and the upper end of the covering material 35 that fills the through portion 3. .

  When such a ceramic layer 2b is arranged, the sensor element 31 is more effectively protected from the external environment. Examples of the external environment include corrosive gas or liquid. Therefore, for example, when the sensor element 31 is a pressure sensor element, the sensor device 30 can be used as a pressure sensor device for detecting and measuring the pressure of a fluid such as corrosive gas or liquid.

  The ceramic layer 2b can be manufactured by using the same ceramic material as that of the second substrate 2, for example, by the same method (such as firing of a ceramic green sheet). The ceramic layer 2b can be bonded to the second substrate 2 by, for example, glass or an adhesive. Alternatively, the ceramic green sheet to be the ceramic layer 2b and the ceramic green sheet to be the second substrate 2 may be laminated and then fired simultaneously. In this case, for example, a hole (not shown in FIG. 5) as described above is provided in the second substrate 2, and the penetration member 3 is filled with the covering material 35 through the hole. it can. Moreover, you may provide the hole (thing penetrated in the thickness direction) connected with the hole part also in the ceramic layer 2b as needed.

  When the sensor device 30 is a pressure sensor device, the pressure of a fluid or the like needs to be transmitted to the sensor element 31 through the ceramic layer 2b. Therefore, a smaller thickness of the ceramic layer 2b is advantageous in terms of measurement accuracy as the sensor device 30. The thickness of the ceramic layer 2b is set to about 0.1 mm or less when the above measurement accuracy is taken into consideration.

1 ... 1st board
11 ... Upper surface (of the first substrate)
11a: First mounting part
12 ... Lower surface (of the first substrate)
12a ... 2nd mounting part 2 ... 2nd board | substrate 2a ... Hole 2b ... Ceramic layer
21 ... Bottom surface of second substrate
22 ... (second substrate) upper surface 3 ... penetrating portion 4 ... concave portion 5 ... wiring conductor 6A ... metal bump 6B ... lead terminal 7 ... frame-like member 8 ...・ Connection conductor
10 ... Sensor package
30 ... Sensor device
31 ... Sensor element
32 ... Electronic components
33 ... Bonding wire
34 ・ ・ ・ Sealing material
35 ・ ・ ・ Coating material
36 ... convex
36a ... Through hole

Claims (8)

A first substrate having an upper surface and a lower surface, having a first mounting portion at a central portion of the upper surface, and having a second mounting portion on the lower surface;
A second substrate to which the outer peripheral portion of the upper surface of the first substrate is bonded.
The sensor package, wherein the second substrate has a penetrating portion penetrating in a thickness direction of the second substrate at a portion overlapping the first mounting portion of the first substrate in a plan view. The sensor package according to claim 1, wherein the second substrate has a recess in the lower surface in which the first substrate is accommodated. 3. The sensor package according to claim 1, wherein the second substrate further includes a hole provided from the upper surface opposite to the lower surface to the penetrating portion. The sensor package according to any one of claims 1 to 3,
A sensor element mounted on the first mounting portion;
An electronic component mounted on the second mounting portion,
A sensor device in which the sensor element is located in a penetrating portion of the second substrate. The sensor device according to claim 4, wherein a covering material that covers the sensor element is disposed in the penetrating portion of the second substrate. The sensor device according to claim 5, wherein the covering material is filled in the penetrating portion. A convex portion disposed on the upper surface of the second substrate;
The sensor device according to any one of claims 4 to 6, wherein the convex portion has a through hole connected to the through portion of the second substrate. The sensor device according to claim 6, further comprising a ceramic layer coated from the upper surface of the second substrate to an upper end of the covering material.

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