JP2017130607A - Component mounting substrate and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a component mounting substrate having high connection reliability between an electronic component and a circuit board.SOLUTION: A component mounting substrate 10 includes: an electronic component 30 formed of a plurality of arrayed bumps 32; and a circuit board 20 having a resin substrate 21 formed of the lamination of a plurality of resin layers and a plurality of land conductors 22. The plurality of bumps 32 are joined to the plurality of land conductors 22. The electronic component 30 includes a part having a wide gap between neighboring bumps 32. The circuit board 20 includes a protrusion 210, composed of a part of the resin layer, in a part facing a part having a wide gap between bumps 32. The protrusion 210 contacts to the formation surface of the bumps 32 of the electronic component 30.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a component mounting board including a bump connection type electronic component and a circuit board on which the electronic component is mounted, and a method for manufacturing the component mounting board.

  2. Description of the Related Art Conventionally, in various electronic devices, a component mounting board in which an electronic component is mounted on the surface of a circuit board is often used. As an electronic component, there is a bump connection type as shown in Patent Document 1. Land conductors for mounting electronic components are formed on the surface of the circuit board. The electronic component is electrically and physically connected to the circuit board by bonding the bump of the electronic component and the land conductor of the circuit board.

  When mounting such an electronic component on a circuit board, the electronic component is placed on the surface of the circuit board with the bump forming surface (back surface) of the electronic component facing the surface of the circuit board. Thereafter, the electronic component is pressed against the circuit board, and the bump and the land conductor are joined by a predetermined method.

  Generally, in such a bump connection type electronic component, the bumps are arranged at a predetermined pitch on the bump forming surface (back surface) of the electronic component.

  Here, depending on the specifications of the electronic component, there is a portion where the pitch of the bumps is partially wide. In Patent Document 1, dummy bumps are formed at locations where the bump pitch is wide on the electronic component forming surface. Thereby, the pitch of the plurality of bumps constituted by the bumps connected to the lands and the dummy bumps is constant.

JP 2001-358175 A

  However, when the bump and the land conductor are joined, the electronic component is pressed against the circuit board, so that the compressive stress is applied to the bump. Many of the dummy bumps have low strength and may be damaged by compressive stress.

  When such a dummy bump is damaged, the electronic component cannot be stably mounted on the circuit board, and the reliability of the connection between the electronic component and the circuit board is lowered.

  Many electronic parts are distributed without such dummy bumps formed. In such a case, it is not easy to form dummy bumps again at locations where the bump pitch of the electronic component is locally wide. When an electronic component is mounted without forming a dummy bump, the force that is pressed against the circuit board varies between the portion where the bump is formed and the portion where the bump is not formed, and stable bonding cannot be performed. There is a fear.

  Therefore, an object of the present invention is to provide a component mounting board with high reliability of connection between an electronic component and a circuit board even when there is a portion where the pitch of bumps of the electronic component is locally wide.

  A component mounting board according to the present invention includes an electronic component formed by arranging a plurality of bumps, and a circuit board having a resin substrate formed by laminating a plurality of resin layers and having a plurality of land conductors formed thereon. A plurality of bumps are joined to a plurality of land conductors. An electronic component has a portion where the interval between adjacent bumps is wide. The circuit board has a protrusion made of a part of the resin layer at a location facing a location where the gap between the bumps is wide. The protrusion is in contact with the bump formation surface of the electronic component.

  In this configuration, when the electronic component is mounted on the circuit board, the protrusion holds the portion without the bump of the electronic component. Thereby, an electronic component is stably mounted on a circuit board.

  In the component mounting board of the present invention, the resin layer is preferably made of a flexible resin.

  In this configuration, since the protrusion has flexibility, even when the protrusion is pushed into the electronic component when the electronic component is mounted on the circuit board, damage to the protrusion and the electronic component is suppressed.

  Moreover, in the component mounting board | substrate of this invention, it is preferable that the elasticity modulus of a resin layer is 3 GPa or less.

  With this configuration, the above-described protrusion and electronic component are more reliably prevented from being damaged.

  The component mounting board of the present invention preferably has the following configuration. The resin layer and the protrusion that form the surface of the resin substrate on which electronic components are mounted are integrally formed.

  With this configuration, the protrusion can be easily formed.

  In the component mounting board of the present invention, it is preferable that the resin layer forming the surface has a shape that covers the entire area of the portion that surrounds the electronic component and does not overlap with the electronic component in a plan view of the mounting surface of the electronic component. .

  In this configuration, the electronic component is disposed in a recess provided in the resin layer that forms the surface of the resin substrate. Thereby, the height which an electronic component protrudes from the surface of a resin substrate becomes low. Further, in the case of forming an underfill material described later, there is an underfill material blocking effect.

  In the component mounting board of the present invention, the resin layer is preferably made of a thermoplastic resin.

  With this configuration, the resin substrate can be easily formed, and the reliability of bonding between the resin layers can be improved.

  In the component mounting board of the present invention, an underfill material is formed between the electronic component and the circuit board.

  In this configuration, the bonding between the bump of the electronic component and the land conductor of the circuit board is protected, and the reliability is improved.

  In the component mounting board of the present invention, the bump and the land conductor are ultrasonically bonded.

  In this configuration, the bump and the land conductor are joined without applying high heat. Thereby, especially joining in the case of using a thermoplastic resin is stabilized. In ultrasonic bonding, the electronic component is pressed against the circuit board, so that the stability of bonding by the above-described protrusions acts more effectively.

  Moreover, in the component mounting board of this invention, the circuit conductor may be formed in the position which does not overlap with an electronic component in the surface of the resin layer which forms the surface of the side in which the electronic component in a resin substrate is mounted.

  In this configuration, a more multifunctional circuit is realized by the component mounting board without almost increasing the shape.

  In the component mounting board of the present invention, the second mounting component may be mounted on the circuit conductor on the surface of the resin layer that forms the surface of the resin substrate on which the electronic component is mounted.

  In this configuration, a more multifunctional circuit is realized by the component mounting board.

  Also, the present invention provides a resin in which a plurality of land conductors are formed by laminating a plurality of resin layers and a plurality of resin layers, in which a plurality of bumps are arranged and an interval between adjacent bumps is wide. And a circuit board having a substrate, and a method of manufacturing a component mounting board formed by bonding a plurality of bumps to a plurality of land conductors. This method of manufacturing a component mounting board includes a step of providing a protrusion made of a part of a resin layer at a location on a resin substrate corresponding to a location where the interval between bumps of the electronic component is wide when the electronic component is viewed on a circuit board. Have This manufacturing method includes a step of bringing a plurality of bumps and a plurality of land conductors into contact with each other by bringing the protrusions into contact with bump formation surfaces of the electronic component.

  In this manufacturing method, a component mounting board in which an electronic component and a circuit board are stably connected can be easily and reliably manufactured.

Moreover, in the manufacturing method of the component mounting board | substrate of this invention, it is preferable to have the following process. The step of providing the protruding portion includes a step of providing, in the resin layer on the surface layer of the resin substrate, a through-hole having a shape in which the side wall surface is partially protruded so that the plurality of land conductors are exposed. The step of providing the protrusion includes a step of stacking a plurality of resin layers including a surface resin layer to form the resin substrate.
In this manufacturing method, the protrusion is easily formed in the recess provided on the surface side of the resin substrate.

  Moreover, in the manufacturing method of the component mounting board | substrate of this invention, it is preferable to have the following process. The step of providing the protruding portion includes a step of forming a resin substrate by laminating a plurality of resin layers including a surface resin layer. The step of providing the protruding portion includes a step of etching the resin substrate from the surface layer side to form a recess having a shape in which the side wall surface partially protrudes in a shape in which the plurality of land conductors are exposed.

  In this manufacturing method, the protrusion is easily formed in the recess provided on the surface side of the resin substrate. In addition, this manufacturing method can easily realize a structure in which the protrusions are separated from the surface resin layer surrounding the electronic component.

  In the method for manufacturing a component mounting board according to the present invention, it is preferable that the step of bonding the plurality of bumps and the plurality of land conductors is ultrasonic bonding.

  In this manufacturing method, the heat at the time of joining becomes low. Thereby, especially joining in the case of using a thermoplastic resin is stabilized. In ultrasonic bonding, the electronic component is pressed against the circuit board, so that the stability of bonding by the above-described protrusions acts more effectively.

  Moreover, in the manufacturing method of the component mounting board | substrate of this invention, it is preferable to further have the process of filling an underfill material between an electronic component and a resin substrate.

  In this manufacturing method, a component mounting board in which the bonding between the bump and the land conductor is more stable is reliably manufactured.

  According to the present invention, the reliability of the connection between the electronic component and the circuit board can be increased even when the bump pitch of the electronic component is locally wide.

(A) It is side surface sectional drawing which shows the structure of the component mounting board which concerns on the 1st Embodiment of this invention, (B) Exploded side sectional view which shows the structure of the component mounting board which concerns on the 1st Embodiment of this invention It is. (A) It is a top view of the circuit board which concerns on the 1st Embodiment of this invention, (B) It is side sectional drawing of the circuit board which concerns on the 1st Embodiment of this invention. 1 is an exploded side cross-sectional view of a circuit board according to a first embodiment of the present invention. It is a flowchart which shows the 1st aspect of the manufacturing method of the component mounting board | substrate which concerns on the 1st Embodiment of this invention. It is side surface sectional drawing which shows the shape in each process of the 2nd aspect of the manufacturing method of the component mounting board | substrate which concerns on the 1st Embodiment of this invention. It is a flowchart which shows the 2nd aspect of the manufacturing method of the component mounting board | substrate which concerns on the 1st Embodiment of this invention. It is side surface sectional drawing which shows the structure of the component mounting board which concerns on the 2nd Embodiment of this invention.

  A component mounting board and a method for manufacturing the component mounting board according to the first embodiment of the present invention will be described with reference to the drawings. FIG. 1A is a side sectional view showing the configuration of the component mounting board according to the first embodiment of the present invention, and FIG. 1B is the component mounting board according to the first embodiment of the present invention. It is a decomposition side sectional view showing the composition of. 2A is a plan view of the circuit board according to the first embodiment of the present invention, and FIG. 2B is a side sectional view of the circuit board according to the first embodiment of the present invention. . FIG. 3 is an exploded side sectional view of the circuit board according to the first embodiment of the present invention.

  As shown in FIG. 1, the component mounting board 10 includes a circuit board 20, an electronic component 30, and an underfill material 40. The underfill material 40 can be omitted.

  As shown in FIG. 1, the electronic component 30 includes a chip body 31 and a plurality of bumps 32. The plurality of bumps 32 are arranged on the back surface of the chip body 31. The plurality of bumps 32 are formed at substantially equal intervals along the side surface of the chip body 31 except for a part thereof. A portion of the plurality of bumps 32 that is not formed at equal intervals (for example, a substantially central portion in the direction in which the bumps 32 shown in FIG. 1 (B) are arranged) It is wider than approximately equidistant locations.

  As shown in FIGS. 1 and 2, the circuit board 20 includes a resin substrate 21, a plurality of land conductors 22, wiring conductors 23 and 24, an interlayer connection conductor 25, and an external connection conductor 26. As shown in FIG. 3, a plurality of resin layers 200, 201, 202, 203, 204 are laminated. The plurality of resin layers 200, 201, 202, 203, and 204 are a flexible resin and a thermoplastic resin, and include, for example, a liquid crystal polymer as a main component.

  A recess 220 is provided on the surface 21 SF of the resin substrate 21. The plurality of land conductors 22 are formed on the bottom surface 21BF of the recess 220. The concave portion 220 has a shape in which a plurality of bump 32 forming regions of the electronic component 30 are included in a plan view except for a protrusion 210 described later.

  The plurality of land conductors 22 are arranged along the side wall surface 221 of the recess 220. As shown in FIG. 1A, the plurality of land conductors 22 are respectively joined to the plurality of bumps 32 in a state where the electronic component 30 is mounted on the circuit board 20. In other words, the plurality of land conductors 22 are arranged at positions facing the plurality of bumps 32 on the bottom surface 21BF of the recess 220 in a state where the electronic component 30 is mounted on the circuit board 20. Therefore, as with the plurality of bumps 32, the plurality of land conductors 22 are located at substantially equal intervals, and the distance between adjacent land conductors 22 is greater than other portions (portions disposed at approximately equal intervals). And a wide area.

  The wiring conductor 23 is formed in the same layer as the plurality of land conductors 22, and is connected to the plurality of land conductors 22. The wiring conductor 23 is formed so as to cross the side wall surface 221 of the recess 220. In other words, the recess 220 is formed so as to expose only the end portion of the wiring conductor 23 on the side of the land conductor 22. Thus, the surface resin layer also functions as a protective layer for the wiring conductor 23.

  The wiring conductor 24 is formed inside the resin substrate 21. The wiring conductor 23 and the wiring conductor 24 are connected by an interlayer connection conductor 25. The external connection conductor 26 is formed on the back surface 21RF of the resin substrate 21. The external connection conductor 26 is connected to the wiring conductors 23 and 24 directly or indirectly using a conductor pattern (not shown). The patterns of the shapes and arrangement of the wiring conductors 23 and 24, the interlayer connection conductor 25, and the external connection conductor 26 may be determined as appropriate according to the electric circuit realized by the circuit board 20.

  A protrusion 210 is formed in the recess 220. The protrusion 210 is connected to the side wall surface 221 of the recess 220.

  The protrusion 210 is formed at a location where the interval between adjacent land conductors 22 is wider than other portions. Specifically, in the example of FIG. 2A, there is a place where the land conductors 22 are not arranged in the middle in places where the plurality of land conductors 22 are aligned. A protrusion 210 is formed at this location. In addition, a plurality of land conductors 22 are arranged in directions orthogonal to each other, and there is a place where there are no land conductors 22 at the corners. A protrusion 210 is formed at this location. That is, when the land conductors 22 and the bumps 32 are disposed at some corners and the land conductors 22 and the bumps 32 are not disposed at the other corners, the protrusions 210 are formed at these positions. The protrusions 210 are preferably formed at equal intervals from the two land conductors 22 that are spaced apart.

  The planar shape of the protruding portion 210 is preferably substantially the same as the planar shape of the land conductor 22. By adopting such a shape, the flow of the underfill material 40 is not hindered when the underfill material 40 described later is filled. Therefore, it is easy to stably fill the underfill material 40 to the entire back surface of the electronic component 30.

  The height of the protruding portion 210 is set so that the protruding portion 210 contacts the back surface of the electronic component 30 in a state where the bump 32 of the electronic component 30 is bonded to the land conductor 22.

  As shown in FIG. 1A, the underfill material 40 is disposed so as to fill a space between the electronic component 30 and the circuit board 20. In the example of FIG. 1A, the underfill material 40 is disposed so as to fill the recess 220. The underfill material 40 is made of an insulating resin material. By using such an underfill material 40, the reliability of bonding between the bump 32 and the land conductor 22 can be improved.

  By using the configuration as described above, when the electronic component 30 is mounted on the circuit board 20, the electronic component 30 is held by the protrusion 210 at a portion where the interval between the bumps 32 in the electronic component 30 is wide. Therefore, the electronic component 30 can be stably mounted on the circuit board 20. Thereby, the reliability of bonding between the bump 32 and the land conductor 22 can be improved.

  The component mounting board 10 having such a configuration is manufactured by the following manufacturing method. FIG. 4 is a flowchart showing a first aspect of the method for manufacturing the component mounting board according to the first embodiment of the present invention.

  First, a conductor is patterned in the resin layers 201, 202, 203, and 204 in which a conductor (for example, copper (Cu)) is arranged on one side (S101). For example, in the shape of FIG. 3, the land conductor 22 and the wiring conductor 23 are formed on the resin layer 201, the wiring conductor 24 is formed on the resin layers 202 and 203, and the external connection conductor 26 is formed on the resin layer 204. In addition, a through hole is formed in the resin layer 201, and the through hole is filled with a conductive paste that becomes the interlayer connection conductor 25.

  Next, the opening part 211 which has the projection part 210 connected to the side wall surface 221 is formed in the resin layer 200 in which the conductor pattern used as the surface layer of a resin substrate is not formed (S102). Thus, the projection part 210 can be easily formed by making it the shape which the side wall surface 221 of the opening part 211 and the projection part 210 connect. Further, since the protruding portion 210 is connected to the other portion made of the resin layer 200, the protruding portion 210 is less likely to be crushed than the shape in which the protruding portion 210 is not connected to the other portion made of the resin layer 200. Therefore, the electronic component 30 can be more stably mounted on the circuit board 20. Moreover, since the protrusion part 210 is connected with the other part which consists of the resin layer 200, since the resin layer 200 is not parted, the handling property in the process of the resin layer 200 is not inhibited.

  Next, the resin layer 200 in which the conductor pattern is not formed and the resin layers 201, 202, 203, and 204 in which the conductor pattern is formed are stacked and heated and pressed (S103). Thereby, the plurality of resin layers 200, 201, 202, 203, and 204 are joined, and the conductive paste is solidified to form the interlayer connection conductor 25. As a result, the resin substrate 21 is formed. By using a plurality of resin layers 200, 201, 202, 203, and 204 as a thermoplastic resin, the resin substrate 21 can be formed only by a heating press, and an adhesive or the like is not required between the layers, and the manufacturing process is simplified. . In addition, since a material different from the resin layer is not disposed between the resin layers, when the resin substrate 21 is bent, interface peeling hardly occurs, and the reliability of bonding between layers is improved. Thereby, the highly reliable resin substrate 21 is formed.

  As shown in FIG. 2, the resin substrate 21 includes a recess 220 having a depth corresponding to the thickness of the resin layer 200 on the surface 21SF side. Therefore, by setting the thickness of the resin layer 200 so that the back surface of the electronic component 30 contacts the top surface of the protruding portion 210 when the electronic component 30 is mounted on the circuit board 20, the protrusion having a desired height is formed. The part 210 can be easily formed.

  Next, the electronic component 30 is mounted on the surface 21 SF side of the circuit board 20. Specifically, the electronic component 30 is disposed in the recess 220, the plurality of bumps 32 and the land conductor 22 are brought into contact with each other, and ultrasonic bonding is performed (S104). Thereby, the electronic component 30 is mounted on the circuit board 20.

  During the ultrasonic bonding, the electronic component 30 is pushed toward the circuit board 20. When the protrusions 210 are pushed, the portions where the bumps 32 are wide in the electronic component 30 are held by the protrusions 210, thereby enabling stable ultrasonic bonding. In addition, since the resin layer, that is, the resin substrate 21 has flexibility, even if the electronic component 30 pushes in the protruding portion 210, the protruding portion 210 relieves the pressing stress and suppresses damage to the protruding portion 210 and the electronic component 30. be able to.

  Next, the underfill material 40 is filled between the circuit board 20 and the electronic component 30 and solidified (S105). Here, since the planar shape of the protruding portion 210 is approximately the same as that of the land conductor 22 as described above, the flow of the underfill material 40 is not easily inhibited by the protruding portion 210. Thereby, the underfill material 40 can be stably filled between the electronic component 30 and the circuit board 20 without a gap.

  Further, in the configuration of the present embodiment, since the electronic component 30 is disposed in the recess 220 of the circuit board 20, the flow of the underfill material 40 can be suppressed by the side wall surface 221 of the recess 220. Thereby, it is possible to reliably fill the underfill material 40 only in a desired portion. Note that the underfill material 40 may not be filled.

  Thus, by using the above-described manufacturing method, the component mounting board 10 with high reliability can be manufactured in an easy process.

  In addition, the component mounting board 10 according to the present embodiment may use the following manufacturing method. FIGS. 5A, 5 </ b> B, and 5 </ b> C are side cross-sectional views illustrating the shape of each step of the second aspect of the method for manufacturing the component mounting board according to the first embodiment of the present invention. FIG. 6 is a flowchart showing a second mode of the component mounting board manufacturing method according to the first embodiment of the present invention.

  First, as shown in FIG. 5A, a conductor is patterned on resin layers 201, 202, 203, and 204 in which a conductor (for example, copper (Cu)) is disposed on one side (S101). Next, a plurality of resin layers 200, 201, 202, 203, and 204 are stacked and heated and pressed (S103). Thereby, the plurality of resin layers 200, 201, 202, 203, and 204 are joined, and the conductive paste is solidified to form the interlayer connection conductor 25. As a result, as shown in FIG. 5B, a resin substrate 21 having no recess is formed.

  Next, etching is performed with a laser or the like from the surface 21SF side of the resin substrate 21 to form a recess 220 including a protrusion 210 connected to the side wall surface 221 (S111). By this etching, the land conductor 22 is exposed on the surface 21 SF side of the resin substrate 21.

  Next, the electronic component 30 is mounted on the surface 21 SF side of the circuit board 20. Specifically, the electronic component 30 is disposed in the recess 220, the plurality of bumps 32 and the land conductor 22 are brought into contact with each other, and ultrasonic bonding is performed (S104). Thereby, the electronic component 30 is mounted on the circuit board 20.

  Next, the underfill material 40 is filled between the circuit board 20 and the electronic component 30 and solidified (S105). Note that the underfill material 40 may not be filled.

  Even with such a manufacturing method, the component mounting board 10 with high reliability can be manufactured in an easy process. In addition, when the manufacturing method shown in FIG. 6 is used, a shape in which the protrusion 210 is not connected to the side wall surface of the recess 220 can also be realized. Thereby, the freedom degree of the formation position of the projection part 210 improves. Moreover, the planar shape of the protrusion 210 can be made the same as that of the land conductor 22, and the flow of the underfill material 40 can be further ensured.

  In addition, it is preferable that the elastic modulus of the resin layers 200, 201, 202, 203, and 204 constituting the resin substrate 21 is 3 GPa or less. By adopting a resin layer having such an elastic modulus, the effect of alleviating the indentation stress by the protrusions 210 when the electronic component 30 and the circuit board 20 are joined can be further enhanced.

  Next, a component mounting board according to a second embodiment will be described with reference to the drawings. FIG. 7 is a side sectional view showing a configuration of a component mounting board according to the second embodiment of the present invention.

  As illustrated in FIG. 7, the component mounting board 10 </ b> B in this embodiment is obtained by adding a circuit conductor 27 and a mounting component 50 to the component mounting board 10 according to the first embodiment. Other configurations of the component mounting board 10B are the same as those of the component mounting board 10 according to the first embodiment, and the description of the same portions is omitted.

  The circuit board 20B includes a circuit conductor 27 and a mounting component 50 together with the configuration of the circuit board 20 according to the first embodiment.

  The circuit conductor 27 is formed on the surface of the resin substrate 21. At this time, the circuit conductor 27 is disposed on the surface of the resin substrate 21 at a position different from the concave portion 220, that is, a position not overlapping the electronic component 30. The mounting component 50 is mounted on the circuit conductor 27. Note that the mounting component 50 can be omitted, and a predetermined electric circuit can be formed by the circuit conductor 27 alone.

  In such a configuration, the resin layer 200 used as the projecting portion 210 can be used as a part of an electric circuit or used for forming an electrode for mounting other components, and the density of the circuit configuration of the circuit board 20B is improved. To do. Therefore, a more multifunctional circuit can be realized without substantially increasing the shape of the circuit board 20B.

  Further, in such a configuration, even if the height dimension of the electronic component 30 is larger than the height dimension of the mounting component 50, the electronic component 30 is partially embedded in the concave portion 220. The height dimension as 10B can be made small. Therefore, a multifunctional and low-profile component mounting board 10B can be realized.

10, 10B: Component mounting boards 20, 20B: Circuit board 21: Resin board 21BF: Bottom face 21RF: Back face 21SF: Front face 22: Land conductor 23, 24: Wiring conductor 25: Interlayer connection conductor 26: External connection conductor 27: Circuit conductor 30: Electronic component 31: Chip body 32: Bump 40: Underfill material 50: Mounting component 200, 201, 202, 203, 204: Resin layer 210: Projection 211: Opening 220: Recess 221: Side wall surface

Claims (15)

An electronic component in which a plurality of bumps are arranged; and a circuit board having a resin substrate in which a plurality of resin layers are stacked and a plurality of land conductors are formed. A component mounting board joined to the land conductor of
The electronic component has a portion where the interval between adjacent bumps is wide,
The circuit board has a protruding portion made of a part of the resin layer at a location facing a location where the interval between the bumps is wide.
The protrusion is in contact with a bump forming surface of the electronic component;
Component mounting board. The resin layer is made of a flexible resin.
The component mounting board according to claim 1. The elastic modulus of the resin layer is 3 GPa or less.
The component mounting board according to claim 2. The resin layer forming the surface of the resin substrate on the side where the electronic component is mounted and the protrusion are integrally formed.
The component mounting board according to claim 1. The resin layer that forms the surface has a shape that covers the entire area of the portion that does not overlap the electronic component by enclosing the electronic component in a plan view of the mounting surface of the electronic component.
The component mounting board according to claim 4. The resin layer is made of a thermoplastic resin.
The component mounting board according to claim 4 or 5. An underfill material is formed between the electronic component and the circuit board.
The component mounting board according to claim 1. The bump and the land conductor are ultrasonically bonded,
The component mounting board according to claim 1. On the surface of the resin layer forming the surface on which the electronic component is mounted on the resin substrate, a circuit conductor is formed at a position that does not overlap the electronic component.
The component mounting board according to claim 1. A second mounting component is mounted on the circuit conductor on the surface of the resin layer that forms the surface on which the electronic component is mounted on the resin substrate.
The component mounting board according to claim 9. A circuit board having an electronic component formed with a plurality of bumps arranged and having a wide interval between adjacent bumps, and a resin substrate formed by laminating a plurality of resin layers and having a plurality of land conductors formed thereon; And a method for manufacturing a component mounting board formed by bonding the plurality of bumps to the plurality of land conductors,
A step of providing a protrusion made of a part of the resin layer at a location of the resin substrate corresponding to a location where the interval between the bumps of the electronic component is wide when the electronic component is superimposed on the circuit board;
Bringing the protrusions into contact with the bump formation surface of the electronic component and bonding the plurality of bumps and the plurality of land conductors;
A method for manufacturing a component mounting board. The step of providing the protruding portion includes
Providing a through-hole having a shape in which a side wall surface partially protrudes in a shape in which the plurality of land conductors are exposed, in a resin layer of a surface layer of the resin substrate;
Laminating a plurality of resin layers including the resin layer of the surface layer to form the resin substrate;
Having
The manufacturing method of the component mounting board | substrate of Claim 11. The step of providing the protruding portion includes
Forming a resin substrate by laminating a plurality of resin layers including a surface resin layer;
Etching the resin substrate from the surface layer side to form a recess having a shape in which a side wall surface partially protrudes in a shape in which the plurality of land conductors are exposed;
Having
The manufacturing method of the component mounting board | substrate of Claim 11. The step of bonding the plurality of bumps and the plurality of land conductors is ultrasonic bonding.
The manufacturing method of the component mounting board | substrate in any one of Claim 11 thru | or 13.   The method for manufacturing a component mounting board according to claim 11, further comprising a step of filling an underfill material between the electronic component and the resin substrate.

Images