JP2017125782A - 薄膜付ウェーハの膜厚分布の測定方法 - Google Patents

薄膜付ウェーハの膜厚分布の測定方法 Download PDF

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Publication number
JP2017125782A
JP2017125782A JP2016005617A JP2016005617A JP2017125782A JP 2017125782 A JP2017125782 A JP 2017125782A JP 2016005617 A JP2016005617 A JP 2016005617A JP 2016005617 A JP2016005617 A JP 2016005617A JP 2017125782 A JP2017125782 A JP 2017125782A
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JP
Japan
Prior art keywords
thin film
film thickness
wafer
wavelength
thickness distribution
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016005617A
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English (en)
Japanese (ja)
Inventor
登 桑原
Noboru Kuwabara
登 桑原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Handotai Co Ltd
Original Assignee
Shin Etsu Handotai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Handotai Co Ltd filed Critical Shin Etsu Handotai Co Ltd
Priority to JP2016005617A priority Critical patent/JP2017125782A/ja
Priority to PCT/JP2016/005126 priority patent/WO2017122248A1/ja
Priority to TW105141816A priority patent/TW201736799A/zh
Publication of JP2017125782A publication Critical patent/JP2017125782A/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2016005617A 2016-01-14 2016-01-14 薄膜付ウェーハの膜厚分布の測定方法 Pending JP2017125782A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2016005617A JP2017125782A (ja) 2016-01-14 2016-01-14 薄膜付ウェーハの膜厚分布の測定方法
PCT/JP2016/005126 WO2017122248A1 (ja) 2016-01-14 2016-12-14 薄膜付ウェーハの膜厚分布の測定方法
TW105141816A TW201736799A (zh) 2016-01-14 2016-12-16 帶薄膜晶圓的膜厚度分布檢測方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016005617A JP2017125782A (ja) 2016-01-14 2016-01-14 薄膜付ウェーハの膜厚分布の測定方法

Publications (1)

Publication Number Publication Date
JP2017125782A true JP2017125782A (ja) 2017-07-20

Family

ID=59312004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016005617A Pending JP2017125782A (ja) 2016-01-14 2016-01-14 薄膜付ウェーハの膜厚分布の測定方法

Country Status (3)

Country Link
JP (1) JP2017125782A (zh)
TW (1) TW201736799A (zh)
WO (1) WO2017122248A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110783216A (zh) * 2018-07-30 2020-02-11 台湾积体电路制造股份有限公司 半导体制造方法
WO2021065499A1 (ja) 2019-10-03 2021-04-08 信越半導体株式会社 薄膜付ウェーハの膜厚分布の測定方法
WO2022172532A1 (ja) * 2021-02-09 2022-08-18 浜松ホトニクス株式会社 膜厚測定装置及び膜厚測定方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102023106815B3 (de) * 2023-03-17 2024-05-23 Confovis Gmbh Verfahren zum Erstellen eines Schichtdickenvariationsprofils einer Oberflächenschicht eines Substrates

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1076464A (ja) * 1996-08-30 1998-03-24 Canon Inc 研磨方法及びそれを用いた研磨装置
JP2011249621A (ja) * 2010-05-28 2011-12-08 Shin Etsu Handotai Co Ltd 薄膜付ウェーハの評価方法
JP2013137205A (ja) * 2011-12-28 2013-07-11 Shin Etsu Handotai Co Ltd 膜厚分布測定方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016114506A (ja) * 2014-12-16 2016-06-23 信越半導体株式会社 薄膜付ウェーハの評価方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1076464A (ja) * 1996-08-30 1998-03-24 Canon Inc 研磨方法及びそれを用いた研磨装置
JP2011249621A (ja) * 2010-05-28 2011-12-08 Shin Etsu Handotai Co Ltd 薄膜付ウェーハの評価方法
JP2013137205A (ja) * 2011-12-28 2013-07-11 Shin Etsu Handotai Co Ltd 膜厚分布測定方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110783216A (zh) * 2018-07-30 2020-02-11 台湾积体电路制造股份有限公司 半导体制造方法
WO2021065499A1 (ja) 2019-10-03 2021-04-08 信越半導体株式会社 薄膜付ウェーハの膜厚分布の測定方法
KR20220054654A (ko) 2019-10-03 2022-05-03 신에쯔 한도타이 가부시키가이샤 박막부착 웨이퍼의 막두께분포의 측정방법
US11965730B2 (en) 2019-10-03 2024-04-23 Shin-Etsu Handotai Co., Ltd. Method for measuring film thickness distribution of wafer with thin films
KR102679254B1 (ko) 2019-10-03 2024-06-27 신에쯔 한도타이 가부시키가이샤 박막부착 웨이퍼의 막두께분포의 측정방법
WO2022172532A1 (ja) * 2021-02-09 2022-08-18 浜松ホトニクス株式会社 膜厚測定装置及び膜厚測定方法

Also Published As

Publication number Publication date
WO2017122248A1 (ja) 2017-07-20
TW201736799A (zh) 2017-10-16

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