JP2017117992A - Bandsaw cutting device and cutting method of silicon crystal by bandsaw cutting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a bandsaw cutting device excellent in the cutting accuracy when cutting a workpiece such as a silicon crystal, and capable of prolonging the life of the bandsaw.SOLUTION: A bandsaw cutting device including a biaxial bandsaw pulley, and a bandsaw rotary driven by the bandsaw pulley has a groove provided in the outer peripheral surface of the bandsaw pulley, and an O-ring housed in the groove, where the outer peripheral part of the O-ring is projecting from the outer peripheral surface of the bandsaw pulley.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a band saw cutting apparatus and a silicon crystal cutting method using a band saw cutting apparatus.

  When the silicon crystal (ingot) produced by the Czochralski (CZ) method, etc. is cut into cone-shaped ends (top portion and tail portion) to make a block, or when a wafer sample is taken from the block A band saw cutting device or the like is used for cutting processing.

  Here, FIG. 5 shows an outline of an example of a conventional general band saw cutting device. As shown in FIG. 5, the band saw cutting apparatus 101 includes an endless belt-shaped band saw (blade) 102 composed of a blade abrasive grain portion 105 formed by gluing diamond abrasive grains to the end of a thin base metal 106. It is stretched between the band saw pulleys 103 and 103 ′. The band saw 102 is driven by the rotation of the band saw pulleys 103 and 103 ′, and the ingot 108 is cut by the blade abrasive grain portion 105 of the band saw 102. Usually, mechanisms (static pressure pads 104, 104 ') for guiding the traveling direction of the band saw are provided at both ends of the band saw pulleys 103, 103'.

  In such a band saw cutting apparatus, in order to obtain a good sharpness and a high cutting accuracy, it is necessary to suppress the fluctuation of the base metal during the ingot cutting. Therefore, in Patent Document 1, a base plate having a concave pattern provided on one surface of the two surfaces of the base metal and a convex pattern provided at a position corresponding to the concave pattern is provided on the other surface. Used. According to the uneven pattern, the base metal has excellent rigidity and the vibration is reduced. In Patent Document 1, the depth and height of the unevenness are both about 5 to 500 μm.

  However, as shown in Patent Document 2, the distance between the static pressure pad and the band saw is adjusted to 10 μm to 50 μm. It is difficult to adjust the gap between the pressure pad and the band saw. For this reason, it is difficult to sufficiently adjust the static pressure pad, and it is difficult to obtain a straight running stability at the time of cutting the silicon crystal. Here, the straightness is a property that the traveling direction of the band saw is maintained when cutting a work such as silicon crystal, and if the straightness is good, high cutting accuracy can be realized.

JP 2006-320983 A JP 2009-154346 A Japanese Patent No. 2681106 JP 2004-160579 A

  Band saws (electrodeposited band saws) are made of thin steel, such as SUS, and are placed into the endless band by cutting into a predetermined length after joining, back-staking, etc., and joining the ends by plasma welding. ing. Further, a curvature is given in the longitudinal direction of the band saw. Waisting is performed to remove distortion of the base metal, but it is difficult to averagely stabilize the base metal having the entire circumference of 2000 mm to 6000 mm. For this reason, the conventional electrodeposition band saw processing is used for cutting small workpieces, and there is a problem that cutting accuracy cannot be obtained with large workpieces (see Patent Documents 3 and 4). ).

  Therefore, the relationship between cutting accuracy and band saw shape was investigated for the purpose of application to large workpieces. First, an unused band saw 102 is set in the band saw cutting apparatus 101, and the shape of the base metal 106 of the band saw 102 is measured with a measuring instrument (measuring element) such as a pick gauge without the static pressure pads 104 and 104 ′. Measured up and down along the base metal (measured without being affected by the static pressure pad). FIG. 6 shows a band saw cutting apparatus without a static pressure pad, and FIG. 7 shows a shape measuring portion of the band saw 102 in the vertical direction. After measuring the base metal shape of the band saw without the static pressure pad, the static pressure pads 104 and 104 'were set and the ingot 108 was cut, and the displacement of the band saw 102 at the time of cutting was measured.

  In a situation where no static pressure pad is provided, the measurement surface for measuring the shape of the base metal 106 of the band saw 102 is outside the ring of the band saw 102 as shown in FIG. As a result of the measurement, it was found that the shape of the base metal 106 of the band saw 102 has two types as shown in FIGS. With reference to the rear surface 115 of the hydrostatic pad, the shape shown in FIG. 8 is a concave shape (concave surface), and the shape shown in FIG. 9 is a convex shape (convex surface).

  The static pressure pads 104 and 104 ′ were attached to the band saw cutting device 101 to adjust the gap between the static pressure pad and the band saw 102 for each of the case where the base metal 106 of the band saw 102 was concave and convex. Furthermore, as shown in FIG. 10, a blade sensor (displacement sensor) 30 is attached to position the band saw 102 and the blade sensor 30, and the distance L between the band saw 102 and the blade sensor 30 when the ingot 108 is cut is determined by the blade sensor 30. Measured with Then, the interval in the state where positioning was performed was set to displacement = 0, and the increase / decrease in the interval during ingot cutting was expressed as blade displacement.

  First, FIG. 11 shows an outline of the relationship between the number of cuttings of the ingot 108 and the blade displacement when the shape of the base metal 106 of the band saw 102 is concave. 11 to 15, one peak or valley represents the blade displacement during one cutting. FIG. 12 schematically shows blade displacement at each stage of the life of the band saw 102. As shown in FIG. 12, the blade displacement is relatively small at the beginning of life, and it is possible to correct the blade displacement direction (positive or negative) by performing blade edge dressing, but the displacement amount gradually increases, At the end of life, blade displacement increases, cutting accuracy deteriorates, and eventually the band saw breaks.

  Next, FIG. 13 shows an outline of the relationship between the number of cuttings of the ingot 108 and the blade displacement when the shape of the base metal 106 of the band saw 102 is a convex shape. FIG. 14 schematically shows the blade displacement at each stage of the life of the band saw 102. As shown in FIG. 13, when the shape of the base metal 106 of the band saw 102 is a convex shape, it has been found that the blade displacement is relatively small as compared to the concave shape. Furthermore, as shown in FIG. 14, the blade displacement is not negative in all stages of life, but the blade displacement is maintained almost positive.

  However, even if the shape of the base metal 106 of the band saw 102 is initially a convex shape, it tends to become a concave shape during the life, and once it becomes a concave shape, the concave shape is likely to be maintained thereafter. This is shown in FIG. In b3 of FIG. 15, the base metal 106 has a concave shape, and as a result, the blade displacement also becomes negative.

  Then, comparing the case of the concave shape and the convex shape, it was found that the convex shape has better straightness at the time of cutting the ingot and the life of the band saw 102 is extended. On the other hand, in the concave shape, the straightness at the time of cutting the ingot is poor, and the cut sample tends to be thick. Further, it was found that even in the case of the convex band saw 102 in the initial stage, when the number of times of cutting increases, it becomes easy to form a concave shape, and the straightness at the time of ingot cutting also deteriorates.

  These are shown schematically in FIG. 16 (in the case of a concave shape) and FIG. 17 (in the case of a convex shape). In the case of the convex shape shown in FIG. 17, when the distance between the front surface 114 and the rear surface 115 of the static pressure pad 104 is appropriately adjusted, the shape of the band saw 102 is convex as shown in FIGS. 17 (a) and 17 (b). The cutting edge becomes a substantially linear state, the cutting edge is also directed in the direction of zero displacement (FIG. 17C), and the ingot can be cut with high cutting accuracy. In addition, the life of the band saw is extended.

  On the other hand, in the case of the concave shape shown in FIG. 16, even if the static pressure pad is appropriately adjusted, as shown in FIGS. 16 (a) and 16 (b), the cutting edge is directed in the negative displacement direction. (FIG. 16C), ingot cutting is likely to become unstable, cutting accuracy is lowered, and the life of the band saw is also shortened.

  From these facts, it was found that a means for controlling the shape of the band saw to a convex shape is necessary in a state where the band saw 102 is set on the band saw pulleys 103 and 103 '. In addition, in this specification, the shape of a band saw and the shape of a base metal are consent.

  The present invention has been made in view of the above-mentioned problems, and is a band saw cutting device that has excellent cutting accuracy when cutting a workpiece such as a silicon crystal and can extend the life of the band saw, and so on. An object of the present invention is to provide a silicon crystal cutting method using a simple band saw cutting device.

In order to achieve the above object, the present invention is a band saw cutting device comprising a biaxial band saw pulley and a band saw driven by the band saw pulley.
A groove provided on the outer peripheral surface of the band saw pulley;
An O-ring housed in the groove,
There is provided a band saw cutting device characterized in that an outer peripheral portion of the O-ring protrudes from an outer peripheral surface of the band saw pulley.

  In this way, the outer peripheral portion of the O-ring protrudes from the outer peripheral surface of the band saw pulley, and by deforming the band saw in the outer peripheral direction into a convex shape, the cutting accuracy when cutting silicon crystals and the like is improved, The life of the band saw can be extended.

  At this time, it is preferable that the groove part of the outer peripheral surface of the band saw pulley has a width of 4 mm to 10 mm and a depth of 1 mm to 5 mm.

  With such a groove shape, an appropriate O-ring can be accommodated, the cutting accuracy can be further improved, and the life of the band saw can be extended.

  At this time, it is preferable that the height of the outer peripheral portion of the O-ring protruding from the outer peripheral surface of the band saw pulley is 1 mm or more and 4 mm or less.

  By setting the height protruding from such an outer peripheral surface, the band saw can be more reliably formed into a convex shape, the cutting accuracy can be further improved, and the life of the band saw can be extended.

  At this time, it is preferable that the band saw pulley is provided with a blade abrasive grain relief step having a width of 6 mm to 10 mm and a depth of 100 μm to 800 μm on the outer peripheral surface.

  By providing the blade abrasive grain relief step having such a shape, the vertical swing of the band saw can be suppressed, and the cutting accuracy and the life of the band saw can be further improved.

  At this time, the O-ring is preferably made of nitrile rubber or silicon rubber, and has a Shore hardness in the range of A40 to A70.

  By using such an O-ring, the band saw can be more reliably formed into a convex shape, and the cutting accuracy and the life of the band saw can be further improved.

  At this time, it is preferable to have a mechanism for tilting the rotation axis of the band saw pulley outward or inward from the vertical direction.

  By providing such a mechanism, it is possible to easily adjust the tip of the blade portion of the band saw and the bottom of the bottom surface of the band saw pulley to coincide with each other. Thereby, the up-and-down swing of the band saw can be suppressed, the life of the band saw can be extended, and the cutting accuracy is further improved.

In order to achieve the above object, the present invention is a silicon crystal cutting method using a band saw cutting device including a biaxial band saw pulley and a band saw driven by the band saw pulley.
Forming a groove on the outer peripheral surface of the band saw pulley;
The O-ring is accommodated in the formed groove portion, and the outer peripheral portion of the O-ring projects from the outer peripheral surface of the band saw pulley,
A band saw cutting device characterized in that the band saw is stretched on the outer peripheral surface of the band saw pulley, and the silicon crystal is cut by deforming the band saw in the outer peripheral direction by an O-ring protruding from the outer peripheral surface of the band saw pulley. A method of cutting a silicon crystal is provided.

  In this way, by projecting the O-ring from the outer peripheral surface of the band saw pulley and deforming the band saw in the outer peripheral direction into a convex shape, the cutting accuracy when cutting the silicon crystal is improved and the life of the band saw is extended. be able to.

  At this time, it is preferable to form the groove part of the outer peripheral surface of the band saw pulley with a width of 4 mm to 10 mm and a depth of 1 mm to 5 mm.

  By forming such a groove portion, an appropriate O-ring can be accommodated, the cutting accuracy can be further improved, and the life of the band saw can be extended.

  At this time, it is preferable that the height of the outer peripheral portion of the O-ring to protrude from the outer peripheral surface of the band saw pulley is 1 mm or more and 4 mm or less.

  By setting the height to project, the cutting accuracy can be further improved and the life of the band saw can be extended.

  At this time, it is preferable to cut the silicon crystal by forming a blade abrasive relief step having a width of 6 mm to 10 mm and a depth of 100 μm to 800 μm on the outer peripheral surface of the band saw pulley.

  By forming such a blade abrasive grain relief step, the vertical swing of the band saw can be suppressed, and the cutting accuracy and the life of the band saw can be further improved.

  At this time, the material of the O-ring is preferably nitrile rubber or silicon rubber, and the Shore hardness of the O-ring is preferably in the range of A40 to A70.

  By using such an O-ring, the cutting accuracy and the life of the band saw can be further improved.

  At this time, it is preferable to adjust the band saw pulley so that the tip of the blade portion of the band saw and the bottom of the bottom surface of the band saw pulley coincide with each other by inclining the rotation axis of the band saw pulley outward or inward from the vertical direction. .

  In this way, by adjusting the tip of the band saw blade and the bottom of the bottom of the band saw pulley so as to match, the vertical swing of the band saw is suppressed, and the life of the band saw can be further extended and cut. The accuracy is also improved.

  As described above, according to the band saw cutting device and the silicon crystal cutting method of the present invention, the outer peripheral portion of the O-ring protrudes from the outer peripheral surface of the band saw pulley, and the band saw is deformed in the outer peripheral direction. By doing so, the displacement at the time of cutting the band saw is stabilized, the cutting accuracy is improved, and the life of the band saw can be extended. Furthermore, since the displacement at the time of cutting the band saw is stabilized, a thinner blade can be used than before, and the loss of the sample per cut can be greatly reduced.

It is the schematic which shows an example of the band saw cutting device of this invention. It is a cross-sectional schematic diagram which shows the outer peripheral part of the band saw pulley of the band saw cutting device of this invention. It is the schematic which shows the band saw pulley inclined outside. It is the schematic which shows adjusting a band saw to convex shape. It is the schematic which shows an example of the conventional band saw cutting device. It is the schematic which shows the band saw cutting device which has not provided the static pressure pad. It is a figure which shows the shape measurement location of a band saw. It is the schematic which shows the shape (concave shape) of the measured base metal. It is the schematic which shows the shape (convex shape) of the measured base metal. It is the schematic which shows a blade sensor and the blade displacement L. It is a figure which shows the relationship between the frequency | count of cutting of an ingot, and a blade displacement in case a base metal is concave shape. It is a figure which shows the blade displacement in each stage of a life in case a base metal is concave shape. It is a figure which shows the relationship between the frequency | count of cutting of an ingot, and a blade displacement in case a base metal is convex shape. It is a figure which shows the blade displacement in each stage of a life in case a base metal is convex shape. It is a figure which shows the blade displacement in each stage of a life including the case where a base metal changes from a convex shape to a concave shape. It is a schematic diagram which shows the cutting | disconnection direction in case a base metal is concave shape. It is a schematic diagram which shows the cutting | disconnection direction in case a base metal is convex shape.

  As described above, in a band saw cutting apparatus, an apparatus having a long band saw life and high cutting accuracy is required.

  As a result of intensive studies to achieve the above object, the inventors of the present invention are a band saw cutting device including a biaxial band saw pulley and a band saw driven by a band saw pulley. As described above, the shape of the band saw has the groove portion provided and the O-ring accommodated in the groove portion, and the outer peripheral portion of the O-ring protrudes from the outer peripheral surface of the band saw pulley. It has been found that the above can be solved stably and can solve the above problems, and the present invention has been completed.

  Hereinafter, the present invention will be described in detail as an example of an embodiment with reference to the drawings, but the present invention is not limited thereto.

  First, the band saw cutting device of the present invention will be described with reference to FIGS.

  As shown in FIG. 1, the band saw cutting apparatus 1 of the present invention has an endless belt-shaped band saw 2 composed of a blade abrasive grain portion 5 formed by gluing diamond abrasive grains to the end of a thin base metal 6. It is stretched between the band saw pulleys 3 and 3 '. The band saw 2 is driven around by the rotation of the band saw pulleys 3 and 3 ′, and the ingot 8 is cut by the blade abrasive grain portion 5 of the band saw 2. In addition, static pressure pads 4, 4 'for guiding the traveling direction of the band saw are provided at the ends of the band saw pulleys 3, 3'. The above is substantially the same as the conventional band saw cutting device. In the band saw cutting device 1 of the present invention, a groove is formed on the outer peripheral surface of the band saw pulleys 3 and 3 ′, and O-rings 10 and 10 ′ are accommodated in the groove. Further, the outer peripheral portions of the accommodated O-rings 10 and 10 ′ protrude from the outer peripheral surfaces of the band saw pulleys 3 and 3 ′.

  The diameter of the band saw pulleys 3 and 3 ′ can be set to, for example, 500 mm to 700 mm. The band saw pulleys 3 and 3 ′ may be installed in parallel to the floor surface on which the band saw cutting device 1 is installed. The thickness of the base metal 6 of the band saw 2 can be 0.2 mm to 0.5 mm, the width of the band saw 2 can be 50 to 80 mm, and the thickness of the blade abrasive grain portion 5 can be 0.50 to 1.20 mm.

  Next, the band saw cutting device 1 of the present invention will be further described with reference to FIG. 2 which is a sectional view of the outer peripheral portion of the band saw pulley 3. As described above, the groove 16 is formed on the outer peripheral surface of the band saw pulley 3 (and 3 '), and the O-ring 10 is accommodated in the groove 16. Here, the groove 16 preferably has a width of 4 mm to 10 mm and a depth of 1 mm to 5 mm. With such a shape (size) of the groove 16, the shape of the band saw 2 can be reliably made convex by accommodating an appropriate O-ring. A pulley rubber 12 may be provided on the outer peripheral portion of the band saw pulley 3, and the groove 16 can be formed in the pulley rubber 12.

  Further, the height of the outer peripheral portion of the O-ring 10 protruding from the outer peripheral surface of the band saw pulley 3 (O-ring cueing) can be 1 mm or more and 4 mm or less. By adjusting the O-ring cue and further adjusting the tension pressure (tension) applied to the band saw 2, the shape of the band saw 2 can be more reliably made convex.

  Further, the band saw pulley preferably includes a blade abrasive relief step 18 having a width of 6 mm to 10 mm and a depth of 100 μm to 800 μm on the outer peripheral surface. The blade abrasive relief 18 is generally formed for relief of the cutting edge (abrasive grain). And by setting it as the above-mentioned shape (size), even if it raises and rotates the band saw 2 to a normal driving speed, a shake does not generate | occur | produce up and down. For this reason, the cutting accuracy and the life of the band saw 2 are improved. In addition, if the thickness of the abrasive grain portion is increased, there is no meaning of thinning the blade, and therefore the depth of the blade abrasive grain relief step 18 is preferably 800 μm or less.

  The O-ring is preferably made of nitrile rubber or silicon rubber, and preferably has a Shore hardness in the range of A40 to A70. If the Shore hardness is A40 or more, the shape of the band saw 2 can be made more reliably convex, and if it is A70 or less, the straightness at the time of cutting is good.

  Furthermore, the band saw cutting device 1 may include a mechanism for tilting the rotation axis of the band saw pulleys 3 and 3 ′ outward or inward from the vertical direction. Thus, by providing a mechanism for tilting the rotation axis of the band saw pulleys 3 and 3 ′, the tip of the blade part (blade abrasive grain part 5) of the band saw 2 and the bottom of the bottom surface of the band saw pulleys 3 and 3 ′ are aligned. Adjustments can be made. FIG. 3 is a schematic diagram showing a band saw pulley inclined outward, which shows this. Adjustment can be performed so that the position of the line connecting the bottoms of the bottom surfaces of the band saw pulleys 3 and 3 ′ shown in the lower diagram of FIG. 3 coincides with the tip of the blade portion of the band saw 2. By adjusting in this way, it is possible to suppress vertical deflection when the band saw is run.

  With the band saw cutting device 1 having the above-described configuration, the band saw 2 is formed into a convex shape, and, as shown in FIG. 2 is adjusted so as to float (see the floating height in FIG. 4). This adjustment can be performed by changing the amount of cueing of the O-ring or the tension pressure applied to the band saw depending on the shape of the groove, the material and thickness of the O-ring.

  Next, a silicon crystal cutting method using the band saw cutting apparatus of the present invention will be described with reference to FIGS.

  In the silicon crystal cutting method of the present invention, as shown in FIGS. 1 and 2, in the band saw cutting apparatus, the groove portion 16 is formed on the outer peripheral surface of the band saw pulleys 3 and 3 ′, and the O-ring 10 is formed in the formed groove portion 16. 10 'is accommodated, the outer peripheral part of these O-rings is projected from the outer peripheral surface of the band saw pulleys 3 and 3', the band saw 2 is stretched on the outer peripheral surface of the band saw pulleys 3 and 3 ', and the band saw 2 is The silicon crystal 8 is cut by being deformed in the outer peripheral direction by the O-rings 10 and 10 ′ protruding from the outer peripheral surfaces of the band saw pulleys 3 and 3 ′. By using such a silicon crystal cutting method, the cutting accuracy and the life of the band saw can be improved.

  Further, the groove 16 on the outer peripheral surface of the band saw pulleys 3 and 3 ′ can be formed with a width of 4 mm to 10 mm and a depth of 1 mm to 5 mm. By setting it as the groove part 16 of such a shape, a suitable O-ring can be accommodated and the above-mentioned effect can be acquired more reliably.

  Moreover, the height which protrudes from the outer peripheral surface of the band saw pulleys 3 and 3 'of the outer peripheral part of O-ring 10 and 10' can be 1 mm or more and 4 mm or less. Thereby, the shape of the band saw 2 can be made into a convex shape more reliably.

  In addition, the silicon crystal 8 can be cut by forming a blade abrasive relief step 18 having a width of 6 mm or more and 10 mm or less and a depth of 100 μm or more and 800 μm or less on the outer peripheral surface of the band saw pulleys 3 and 3 ′. By forming such a blade abrasive relief 18, the cutting accuracy and the life of the band saw are further improved.

  Further, the material of the O-ring 10, 10 'can be nitrile rubber or silicon rubber, and the Shore hardness can be in the range of A40 to A70. If such an O-ring is used, the cutting accuracy and the life of the band saw can be further improved.

  Further, by tilting the rotation axis of the band saw pulleys 3 and 3 ′ from the vertical direction to the outside or the inside, the tip of the band saw blade part (blade abrasive grain part 5) and the bottom part of the bottom surface of the band saw pulleys 3 and 3 ′ are arranged. The position can be adjusted to match. By adjusting in this way, the vertical swing of the band saw 2 is suppressed, and the cutting accuracy and the life of the band saw are further improved.

  Note that the convex shape of the band saw 2 means that the outer peripheral surface of the band saw pulleys 3 and 3 ′ is formed into a convex shape by grinding the resin portion (pulley rubber 12) on the outer peripheral portions of the band saw pulleys 3 and 3 ′. However, it is difficult to precisely process a large-diameter (large-diameter) band saw pulley, and a large cost is required. On the other hand, if it is a band saw cutting device of the present invention, the convex shape of a band saw can be easily realized at low cost.

  EXAMPLES Hereinafter, although an Example is shown and this invention is demonstrated more concretely, this invention is not limited to these.

Example 1
Using the band saw cutting apparatus 1 of the present invention described above, a number of silicon ingots having a diameter of about 300 mm manufactured by the CZ method were cut, and the life of the band saw 2 and straight cutting performance were examined. Here, straight cutting performance represents cutting accuracy. The band saw pulleys 3 and 3 ′ had a diameter of 700 mm, a pulley rubber 12 made of urethane rubber on the outer peripheral portion, and a groove portion 16 having a width of 3 to 12 mm and a depth of 1 to 6 mm. The thickness of the base metal 6 was 0.3 mm. The material of the O-ring was nitrile rubber. The results (conditions 1 to 5) are shown in Table 1. In the following table, the life of the band saw is shown as a relative value, assuming that the life of a conventional band saw cutting device is 1.0.

  In any of the conditions 1 to 5, the use of the band saw cutting device 1 of the present invention improved the life of the band saw and straight cutting performance. In particular, at the level where the width of the groove 16 is 4 mm or more and 10 mm or less and the depth is 1 mm or more and 5 mm or less (conditions 2, 3, and 4), the life of the band saw is greatly improved to 1.8 and the straightness of cutting is extremely good. Met. Incidentally, “with improvement” in the straightness of cutting means an improvement over the conventional apparatus, but it is not as high as the level indicated as “good”. Further, in conditions 1 and 5, a slight vibration of the band saw 2 was observed.

(Example 2)
Using the band saw cutting apparatus 1 of the present invention, a number of silicon ingots having a diameter of about 300 mm manufactured by the CZ method were cut, and the life of the band saw 2 and straight cutting performance were evaluated. The band saw pulleys 3 and 3 ′ had a diameter of 700 mm, an outer peripheral portion provided with a pulley rubber 12 made of urethane rubber, a groove portion 16 having a width of 6 mm and a depth of 1 mm. The thickness of the O-ring was changed to change the height protruding from the outer peripheral surface of the band saw pulley. The thickness of the base metal 6 was 0.3 mm. The material of the O-ring was nitrile rubber. The results (conditions 6 to 10) are shown in Table 2.

  In any of the conditions 6 to 10, the use of the band saw cutting device 1 of the present invention improved the life of the band saw and the straightness of cutting. In particular, when the protruding amount was 1 mm or more and 4 mm or less (conditions 6, 7, 8, and 9), the life of the band saw was greatly improved to 1.8 and the straight cutting performance was extremely good.

(Example 3)
Using the band saw cutting apparatus 1 of the present invention, a number of silicon ingots having a diameter of about 300 mm manufactured by the CZ method were cut, and the life of the band saw 2 and straight cutting performance were examined. The band saw pulleys 3 and 3 'have a diameter of 700 mm, a pulley rubber 12 made of urethane rubber on the outer periphery, a groove 16 having a width of 6 mm, a depth of 3 mm, an O-ring thickness of 6 mm, and a protruding amount of 3 mm. . And the shape (size) of the blade abrasive grain relief step 18 provided on the outer peripheral surface of the band saw pulleys 3 and 3 ′ was changed. The thickness of the base metal 6 was 0.3 mm. The material of the O-ring was nitrile rubber. The results (conditions 11 to 15) are shown in Table 3.

  In any of the conditions 11 to 15, by using the band saw cutting device 1 of the present invention, the life of the band saw and the straight cutting performance were improved. In particular, when the width of the blade abrasive grain relief step 18 was 6 mm or more and 10 mm or less (conditions 12, 13, and 14), the life of the band saw was greatly improved to 1.8 and the straightness of cutting was extremely good.

Example 4
Using the band saw cutting apparatus 1 of the present invention, a number of silicon ingots having a diameter of about 300 mm manufactured by the CZ method were cut, and the life of the band saw 2 and straight cutting performance were evaluated. The band saw pulleys 3 and 3 ′ had a diameter of 700 mm, an outer peripheral portion provided with a pulley rubber 12 made of urethane rubber, and a groove 16 having a width of 6 mm and a depth of 3 mm. The material of the O-ring was nitrile rubber, and the Shore hardness of the O-ring was changed. The thickness of the base metal 6 was 0.3 mm. Table 4 shows the results (conditions 16 to 20).

  In any of the conditions 16 to 20, by using the band saw cutting device 1 of the present invention, the life of the band saw and the straight cutting performance were improved. In particular, when the Shore hardness of the O-ring was within the range of A40 to A70 (conditions 17, 18, and 19), the life of the band saw was greatly improved to 1.8, and the straightness of cutting was extremely good.

  As described above, by cutting the silicon crystal using the band saw cutting apparatus of the present invention, the life of the band saw and the straightness of cutting can be improved compared to the case of using the conventional band saw cutting apparatus. It was. In addition, the blade displacement is stable, the straightness of cutting is improved, and the cutting accuracy is improved, so that the sample loss at the time of cutting the sample is improved. Furthermore, a thinner blade can be used than before, and the cutting loss of silicon crystal per cut can be reduced by 24% compared to the case of using a conventional band saw that is not a thin blade.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

DESCRIPTION OF SYMBOLS 1 ... Band saw cutting device of this invention, 2 ... Band saw,
3, 3 '... band saw pulley with groove, 4, 4' ... static pressure pad,
5 ... Blade abrasive part, 6 ... Base metal, 8 ... Ingot (silicon crystal),
10, 10 '... O-ring, 12 ... pulley rubber, 16 ... groove,
18 ... Blade grain relief step, 25 ... Rear surface of static pressure pad,
30 ... Blade sensor 101 ... Conventional band saw cutting device,
102 ... Band saw 103, 103 '... Band saw pulley,
104, 104 '... static pressure pad, 105 ... blade abrasive grain part, 106 ... base metal,
108: Ingot (silicon crystal) 114: Front surface of static pressure pad,
115: Rear surface of static pressure pad, L: Distance between band saw and blade sensor.

Claims (12)

A band saw cutting device comprising a biaxial band saw pulley and a band saw driven by the band saw pulley.
A groove provided on the outer peripheral surface of the band saw pulley;
An O-ring housed in the groove,
A band saw cutting device, wherein an outer peripheral portion of the O-ring protrudes from an outer peripheral surface of the band saw pulley.   The band saw cutting device according to claim 1, wherein the groove portion on the outer peripheral surface of the band saw pulley has a width of 4 mm to 10 mm and a depth of 1 mm to 5 mm.   The band saw cutting device according to claim 1 or 2, wherein a height of an outer peripheral portion of the O-ring protruding from an outer peripheral surface of the band saw pulley is 1 mm or more and 4 mm or less.   4. The blade saw pulley has a blade abrasive relief step having a width of 6 mm or more and 10 mm or less and a depth of 100 μm or more and 800 μm or less on an outer peripheral surface. 5. A band saw cutting device according to claim 1.   The band saw cutting device according to any one of claims 1 to 4, wherein the O-ring is made of nitrile rubber or silicon rubber, and has a Shore hardness within a range of A40 to A70. .   The band saw cutting device according to any one of claims 1 to 5, further comprising a mechanism for tilting a rotation axis of the band saw pulley outward or inward from a vertical direction. A silicon crystal cutting method by a band saw cutting device comprising a biaxial band saw pulley and a band saw driven by the band saw pulley,
Forming a groove on the outer peripheral surface of the band saw pulley;
The O-ring is accommodated in the formed groove portion, and the outer peripheral portion of the O-ring projects from the outer peripheral surface of the band saw pulley,
A band saw cutting device characterized in that the band saw is stretched on the outer peripheral surface of the band saw pulley, and the silicon crystal is cut by deforming the band saw in the outer peripheral direction by an O-ring protruding from the outer peripheral surface of the band saw pulley. Method for cutting silicon crystal.   8. The method for cutting a silicon crystal with a band saw cutting apparatus according to claim 7, wherein the groove portion on the outer peripheral surface of the band saw pulley is formed with a width of 4 mm to 10 mm and a depth of 1 mm to 5 mm.   The height of the outer peripheral portion of the O-ring that protrudes from the outer peripheral surface of the band saw pulley is 1 mm or more and 4 mm or less, and the silicon crystal is cut by the band saw cutting device according to claim 7 or 8. Method.   10. The silicon crystal is cut by forming a blade abrasive grain relief step having a width of 6 mm or more and 10 mm or less and a depth of 100 μm or more and 800 μm or less on an outer peripheral surface of the band saw pulley. A silicon crystal cutting method using the band saw cutting device according to any one of the above.   The material of the O-ring is nitrile rubber or silicon rubber, and the Shore hardness of the O-ring is within a range of A40 to A70. Cutting method of silicon crystal using a band saw cutting apparatus. The tip of the band saw blade and the bottom of the bottom of the band saw pulley are adjusted to coincide with each other by tilting the rotation axis of the band saw pulley outward or inward from the vertical direction. A silicon crystal cutting method using the band saw cutting device according to any one of claims 7 to 11.

Images